WO2009044678A1 - Circuit connecting material, circuit connection structure, and method for producing the same - Google Patents

Circuit connecting material, circuit connection structure, and method for producing the same Download PDF

Info

Publication number
WO2009044678A1
WO2009044678A1 PCT/JP2008/067491 JP2008067491W WO2009044678A1 WO 2009044678 A1 WO2009044678 A1 WO 2009044678A1 JP 2008067491 W JP2008067491 W JP 2008067491W WO 2009044678 A1 WO2009044678 A1 WO 2009044678A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit
connecting material
producing
same
connection structure
Prior art date
Application number
PCT/JP2008/067491
Other languages
French (fr)
Japanese (ja)
Inventor
Yukihisa Hirosawa
Yu Kubota
Original Assignee
Hitachi Chemical Company, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2008026731A external-priority patent/JP4978493B2/en
Application filed by Hitachi Chemical Company, Ltd. filed Critical Hitachi Chemical Company, Ltd.
Priority to CN2008801101981A priority Critical patent/CN101816221B/en
Publication of WO2009044678A1 publication Critical patent/WO2009044678A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0112—Absorbing light, e.g. dielectric layer with carbon filler for laser processing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

Disclosed is a circuit connecting material for connecting a first circuit member obtained by forming a first circuit electrode on a major surface of a first substrate with a second circuit member obtained by forming a second circuit electrode on a major surface of a second substrate in such a manner that the first circuit electrode and the second circuit electrode face each other. This circuit connecting material contains an adhesive composition having a maximum light absorption wavelength within the range of 800-1200 nm.
PCT/JP2008/067491 2007-10-05 2008-09-26 Circuit connecting material, circuit connection structure, and method for producing the same WO2009044678A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2008801101981A CN101816221B (en) 2007-10-05 2008-09-26 Circuit connecting material, circuit connection structure, and method for producing the same

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007261994 2007-10-05
JP2007-261994 2007-10-05
JP2008026731A JP4978493B2 (en) 2007-10-05 2008-02-06 Circuit connection material, connection structure and manufacturing method thereof
JP2008-026731 2008-02-06

Publications (1)

Publication Number Publication Date
WO2009044678A1 true WO2009044678A1 (en) 2009-04-09

Family

ID=40526107

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/067491 WO2009044678A1 (en) 2007-10-05 2008-09-26 Circuit connecting material, circuit connection structure, and method for producing the same

Country Status (1)

Country Link
WO (1) WO2009044678A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011150975A (en) * 2010-01-25 2011-08-04 Hitachi Chem Co Ltd Anisotropic conductive film

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05206220A (en) * 1992-01-29 1993-08-13 Hitachi Ltd Connection method of tape carrier package and circuit board
JP2000182691A (en) * 1998-12-17 2000-06-30 Hitachi Chem Co Ltd Circuit connecting member and connection method using therewith
JP2002249751A (en) * 2001-02-13 2002-09-06 Internatl Business Mach Corp <Ibm> Joining method and joining device
JP2006237451A (en) * 2005-02-28 2006-09-07 Jettech Ltd Apparatus and method for bonding anisotropic conductive film by using laser
WO2007023834A1 (en) * 2005-08-23 2007-03-01 Bridgestone Corporation Adhesive composition

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05206220A (en) * 1992-01-29 1993-08-13 Hitachi Ltd Connection method of tape carrier package and circuit board
JP2000182691A (en) * 1998-12-17 2000-06-30 Hitachi Chem Co Ltd Circuit connecting member and connection method using therewith
JP2002249751A (en) * 2001-02-13 2002-09-06 Internatl Business Mach Corp <Ibm> Joining method and joining device
JP2006237451A (en) * 2005-02-28 2006-09-07 Jettech Ltd Apparatus and method for bonding anisotropic conductive film by using laser
WO2007023834A1 (en) * 2005-08-23 2007-03-01 Bridgestone Corporation Adhesive composition

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011150975A (en) * 2010-01-25 2011-08-04 Hitachi Chem Co Ltd Anisotropic conductive film

Similar Documents

Publication Publication Date Title
WO2009121944A3 (en) Method for assembling two surfaces, or one surface, with a molecule of interest
TW200727461A (en) Semiconductor device and production method thereof
WO2010139342A8 (en) Lens and method for manufacturing same
WO2006077136A3 (en) Electro-optical element comprising a controlled, in particular, uniform functionality distribution
WO2009029436A3 (en) Polymer gel structure and method for producing same
WO2010041815A3 (en) Method for preparing an abrasive sheet using an embossed substrate
WO2008108255A1 (en) Transparent conductive film with adhesive layer and method for producing the same
WO2009120311A3 (en) Biolaminate composite assembly and related methods
WO2009102617A3 (en) Device having power generating black mask and method of fabricating the same
WO2009057376A1 (en) Circuit connecting material, connection structure and method for producing the same
WO2008009575A3 (en) Method of bonding
WO2010015380A3 (en) Method for producing a composite part by transmission laser welding
WO2009080931A8 (en) Improvements to elements capable of collecting light
WO2008067496A3 (en) Sinterable powder
TW200730583A (en) Siloxane resin composition and the method for manufacturing the same
WO2009005311A3 (en) Light emitting device and method of fabricating the same
WO2007025628A8 (en) Methods for structuring substrate surfaces
WO2007121739A3 (en) Optoelectronic semiconductor component
MX2010003678A (en) Method of maintaining a color of a cured film formed from a coating composition.
WO2009031856A3 (en) Lighting emitting device package and method of fabricating the same
WO2008021791A3 (en) Nano structured phased hydrophobic layers on substrates
WO2009078368A1 (en) Method for manufacturing light guide plate, light guide plate, and light emitting advertising display using the light guide plate
WO2007019014A3 (en) Architectural fabric
WO2006081427A3 (en) Apparatus having a photonic crystal
WO2009119161A3 (en) Solar cell and method for manufacturing metal electrode layer to be used in the solar cell

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880110198.1

Country of ref document: CN

WWE Wipo information: entry into national phase

Ref document number: 1020087029026

Country of ref document: KR

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08836015

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08836015

Country of ref document: EP

Kind code of ref document: A1