JP6259177B2 - Method for bonding anisotropic conductive film - Google Patents

Description

  The present invention relates to an adhesion method in which an anisotropic conductive film is heated and adhered to a liquid crystal display substrate or the like.

  In recent years, FPDs (flat panel displays) that are compact and require a small installation space are often used for display units of flat-screen televisions, mobile phones (including smartphones), mobile information terminals, computer terminals, and the like.

  A substrate such as a liquid crystal display or a light emitting diode that constitutes the FPD and a driver IC that sends an image signal to the substrate must be electrically connected and mechanically coupled by electrodes provided on both sides. In recent years, the distance between the electrode on the substrate side and the electrode on the driver IC side tends to be narrow, particularly in FPDs that are becoming denser and more compact. An anisotropic conductive film is used to connect such closely spaced electrodes together (for example, see Patent Documents 1 to 3).

  An anisotropic conductive film is a film-type adhesive member in which conductive fine particles composed of metal particles such as metal-plated plastic particles and nickel of several μm to several tens μm are uniformly dispersed in an adhesive. By sandwiching this anisotropic conductive film between substrates and simultaneously performing heating and pressurization, several hundred electrodes arranged in a gap of 100 μm or less are electrically connected together and mechanically coupled. It becomes possible.

  There are multiple types of substrate connection methods. For example, for output connection, an anisotropic conductive film is provided between a glass substrate and a COF (Chip On Film) component in which a copper foil electrode is bonded to a polyimide film. It is sandwiched and heated from the COF component side by a pressure-bonding head to perform electrical connection and mechanical coupling.

  In addition, in the connection for input, an anisotropic conductive film is sandwiched between a COF component and a PWB (Printed Wiring Board) component, and heating is performed with a crimping head from the COF component side to perform electrical connection and mechanical coupling. Yes.

  In addition, there is COG (Chip On Glass) mounting in which a driver IC for driving a liquid crystal display is directly flip-flop mounted on the liquid crystal panel. In this case, an anisotropic conductive film is sandwiched between the driver IC and the glass substrate. Thus, the electrical connection and the mechanical coupling are performed by heating from the driver IC side with the crimping head.

JP 2011-159486 A JP 2011-142103 A JP 2009-54377 A

  As described above, there are various electrode connection methods, but there are problems as described below.

  That is, when connecting a COF component for input and a PWB component, warpage may occur in the PWB component due to an increase in the size of the liquid crystal display and a difference in thermal expansion coefficient between connected members. is there.

  In addition, in order to enlarge the display screen, the PWB parts of the frame are made smaller, so-called liquid crystal display substrates may be narrowed. However, in this case, the polarizing plate or the like is damaged by heat at the time of connection. The bimetallic thermal deformation at the connection part of the COG component due to heat may adversely affect the liquid crystal display.

  In addition, in the case of COG parts used in mobile information terminals, the driver IC is heated by the crimping head from the side of the driver IC, so there is a risk that the driver IC will be thermally damaged, and the driver IC is temporarily hot and the glass substrate is However, when both of them return to room temperature after that, the thermal contraction of the driver IC increases, and the liquid crystal display may be deformed into a convex shape, resulting in uneven brightness of the liquid crystal display.

  In order to avoid these problems, for example, as disclosed in Patent Documents 1 to 3, there is a method of approaching from the anisotropic conductive film side. The anisotropic conductive films of these patent documents include an adhesive that cures even at low temperatures (Patent Documents 1 and 2), and lowers the elasticity of the adhesive layer after curing (Patent Document 3). However, it is considered insufficient to solve the above problem.

  The present invention has been made in view of such points, and the object of the present invention is to prevent adverse effects of heat on a substrate, a driver IC, and the like as much as possible when heating and bonding an anisotropic conductive film. However, it is to ensure electrical connection and mechanical coupling between the electrodes.

  In order to achieve the above object, the present inventors have conducted various studies on the bonding technique, and as a result, have found that it is effective to heat the anisotropic conductive film using laser light.

The first invention is a method of bonding the anisotropic conductive film for bonding the first electrode and the second electrode via an anisotropic conductive film is hardened and epoxy resin, and conductive fine particles, the epoxy resin The anisotropic conductive film including a partition wall-disintegrating latent curing agent in which a curing agent for encapsulating is encapsulated in a microcapsule, and a laser light absorber that generates heat by absorbing laser light, the first electrode and the second After being arranged between the electrodes, the anisotropic conductive film is heated by a laser beam having a wavelength range of 800 nm to 1500 nm, and the wall of the microcapsule is collapsed by the heat of the laser beam, and an internal curing agent is used. By curing the epoxy resin , the first electrode and the second electrode are bonded together.

  According to this method, only the portion to be connected, that is, only the portion to be bonded by the anisotropic conductive film is irradiated with the laser beam, so that the necessary minimum is narrow compared to the case of using the conventional crimping head. The range can be heated to melt or soften the adhesive component of the anisotropic conductive film. Thereby, it is possible to make it difficult to adversely affect other components such as a driver IC and a polarizing plate due to heat.

  Then, the adhesive component of the anisotropic conductive film is cured, whereby the first electrode and the second electrode are electrically connected and mechanically coupled.

  Further, when the anisotropic conductive film is irradiated with laser light, the anisotropic conductive film can be reliably heated and melted or softened.

  According to a second invention, in the first invention, the laser light absorber is at least one of an organic pigment, an inorganic pigment, and an organic dye that ensures electrical insulation between the first electrode and the second electrode. It is characterized by including one.

  According to this structure, since conduction | electrical_connection is ensured only with the electroconductive fine particles of an anisotropic conductive film, and other parts do not conduct electricity, it becomes possible to fully exhibit the function of an anisotropic conductive film.

  According to the first invention, since the anisotropic conductive film is cured after being heated by the laser beam, the first electrode and the second electrode are electrically connected by heating a necessary minimum narrow range. Can be connected and mechanically coupled. Thereby, it is possible to prevent adverse effects due to heat on other components such as the driver IC.

  Moreover, since the laser light absorber is included in the anisotropic conductive film, the anisotropic conductive film can be reliably heated and bonded.

  According to the second aspect of the invention, since the laser light absorber has electrical insulation, the function of the anisotropic conductive film can be sufficiently exerted to ensure conduction as intended.

It is sectional drawing of the board | substrate in the case of performing the connection for an output. It is sectional drawing of a board | substrate in the case of performing input connection.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. It should be noted that the following description of the preferred embodiment is merely illustrative in nature, and is not intended to limit the present invention, its application, or its use.

  In this embodiment, the anisotropic conductive film is heated and adhered by laser light. Prior to the description of the method for adhering the anisotropic conductive film, first, the composition of the anisotropic conductive film will be described.

  The anisotropic conductive film contains a resin composition, a laser light absorber, and conductive fine particles.

<Resin composition>
The composition of the anisotropic conductive film can use, for example, various epoxy resins, acrylate resins such as epoxy group-containing (meth) acrylates and urethane-modified (meth) acrylates as thermosetting resin compositions. . Here, examples of the epoxy resin include bisphenol A (BPA) type epoxy resin, bisphenol F (BPF) type epoxy resin, and novolac type epoxy resin. Among these thermosetting resins, bisphenol A (BPA) type epoxy resins and bisphenol F (BPF) type epoxy resins are suitable.

  A curing agent is added to the thermosetting resin. The curing agent may be selected according to the type of thermosetting resin. For example, when the thermosetting resin is an epoxy resin, the potential of imidazole, polyamine, polyaminoureido, and amine adducts A curing agent is suitable.

  Although there are many kinds of curing agents for curing the thermosetting resin, the curing agent of this embodiment is a latent curing agent having initiation reactivity. When curing a thermosetting resin, in general, a two-component mixing type in which a thermosetting resin and a curing agent are mixed just before use is common, but by using a latent curing agent, so-called It can be a one-component type. That is, even if the latent curing agent is mixed with a thermosetting resin, it can be stored for a long time without causing a curing reaction in an environment lower than a predetermined temperature, for example. It is a curing agent capable of causing a curing reaction.

  As a trigger for the reaction start of the latent curing agent, in addition to temperature, for example, pressure, humidity, light, etc. can be used as a trigger for the reaction start, but in this embodiment, the trigger for the reaction start is a type. That is, a type in which the reaction is started by heating to a predetermined temperature or higher is used.

  Specifically, the curing agent is confined in the microcapsule, and when the wall of the microcapsule is heated to a predetermined temperature or more, the wall collapses and the internal curing agent starts to react with the thermosetting resin. It is a partition collapse type latent curing agent. Examples of this type of curing agent include trade names NovaCure HX3741 and NovaCure HX3921HP manufactured by Asahi Kasei Corporation. In addition, as the latent curing agent, trade names Amicure PN-23 manufactured by Ajinomoto Co., Inc., trade names ACR Hardener H-3615, H-3366S, H-3549S, H-4070S, Fuji manufactured by ACR Co., Ltd., Fuji Examples include trade name Fuji Cure FXE-1000 manufactured by Kasei Co., Ltd.

  When NovaCure is used as a curing agent, the curing reaction does not start even when heated from room temperature to about 40 ° C. to 50 ° C., which is excellent in handling. And if it heats to about 70-80 degreeC, the wall of a microcapsule will collapse and hardening reaction will occur. Since the temperature at which the curing reaction starts is a low temperature of 100 ° C. or lower, there is an advantage that the heating condition by the laser light can be set to the low temperature side.

  In addition, once the curing reaction begins, it proceeds even if it is left at room temperature, so it simply gives the amount of heat that triggers the curing reaction, and then the thermosetting resin is completely cured even if it is left to stand. Can be made. The trigger for the curing reaction is referred to as initiation, and the initiation reactivity means that the curing reaction is triggered and then the curing reaction is continuously performed.

  Since the latent curing agent is microencapsulated, it can be uniformly dispersed in the thermosetting resin. The content of the latent curing agent in the thermosetting resin may be 1% by weight to 70% by weight, and more preferably 5% by weight to 30% by weight. If the amount of the curing agent is small, it is difficult to uniformly exist the curing agent in the thermosetting resin, and it is not preferable, and if the amount of the curing agent is more than 70% by weight, the amount of the thermosetting resin that is the main adhesive component decreases. This is not preferable because the adhesive strength is lowered.

  Moreover, the reaction start temperature (detonation temperature) of the latent curing agent may be 50 ° C. or more and 200 ° C. or less, and more preferably 70 ° C. or more and 160 ° C. or less. A lower reaction start temperature is preferred because the adverse effect of heat on the polyimide film, PWB parts, IC driver, etc. can be reduced.

  In addition, a thermoplastic resin composition can also be used. In this case, examples of the resin composition include polyethylene (PE), polypropylene (PP), polyvinyl chloride (PVC), and polyvinylidene chloride (PVDC). , Polystyrene (PS), Polyvinyl acetate (PVAC), ABS resin (Acrylonitrile butadiene styrene resin), Acrylonitrile styrene resin (AS resin), Acrylic resin (PMMA), etc. You can also.

  As the thermoplastic elastomer, styrene-based, acrylic-based, urethane-based, polyester-based, and polyolefin-based elastomers can be used alone or appropriately mixed with other resins or elastomers. In this case, it is not necessary to use a curing agent or the like.

<Laser light absorber>
Next, the laser light absorber will be described. As the laser light absorber, one that absorbs the irradiated laser light and generates heat and has low conductivity so as to ensure electrical insulation when placed between the electrodes is preferable.

  In the case where the laser light absorber is monodispersed, carbon black, titanium black, metal oxide and the like having low conductivity can be used. Other examples of laser light absorbers include non-conductive organic pigments, inorganic pigments, organic dyes, and inorganic dyes. Basically, when formed into an anisotropic conductive film, the electrical insulating properties are as described above. Can be widely used as long as it can sufficiently absorb the light having the wavelength of the laser beam to be irradiated and efficiently convert the laser beam into heat. Moreover, you may mix and use the above-mentioned multiple types of laser beam absorber.

  The addition amount of the laser light absorber is such an addition amount that the laser light absorption is 40% or more, preferably 50% or more, and more preferably 60% or more when formed as an anisotropic conductive film.

  When the laser light absorptance is lower than 40%, the amount of heat generated by the anisotropic conductive film is low, and a large amount of laser light energy is required, which deteriorates efficiency. In addition, if the laser light absorption rate of the anisotropic conductive film is lower than 40%, the amount of laser light transmitted through the anisotropic conductive film increases, and the transmitted laser light passes through the IC chip or PWB component. It is not preferable because it may be damaged by heating.

Moreover, since it is necessary to give insulation other than the electroconductive fine particles connected to the electrode, the volume resistivity of the composition of the anisotropic conductive film to which the laser light absorber is added is 10 ¹³ Ωcm or more, More preferably, it is 10 ¹⁴ Ωcm or more.

<Conductive fine particles>
Next, the conductive fine particles will be described. The conductive fine particles only need to exhibit good conductivity in a state sandwiched between the first electrode and the second electrode to be connected. Examples of the conductive fine particles include those made of a simple metal, and those obtained by conducting conductive plating on the surface of plastic fine particles. As fine particles of a single metal, fine particles made of nickel, aluminum, silver, or the like can be used. In the case of plastic fine particles, nickel, silver, gold or a composite electroless plating thereof is preferably applied as the conductive plating.

  When plastic fine particles are used and the resin composition of the anisotropic conductive film is thermosetting, the conduction reliability is the presence or absence of so-called indentations on the electrode surface due to the conductive plated fine particles after compression hardening. And inspect by number. Further, even after the resin composition is compression-cured, it is necessary that the conductive fine particles are repelled to some extent to always ensure conduction. For the above reasons, the recovery rate of the conductive fine particles after compression should be high to some extent. Accordingly, plastic fine particles having a somewhat high crosslinking density are preferred.

  On the other hand, when the resin composition of the anisotropic conductive film is thermoplastic, if it is repelled too much, the peeling force acts on the adhesive layer (resin composition layer) that has been solidified after melting, so the compression recovery of the conductive fine particles Since the rate is low and it is desired to plastically deform to some extent, it is desirable to use a monofunctional monomer in combination.

  In the case of plating plastic fine particles, a plating thickness of 0.05 μm or more is preferable from the viewpoint of ensuring conduction reliability, and a plating thickness of 0.1 μm or more is more preferable. If the plating thickness is less than 0.05 μm, sufficient conduction may not be obtained due to uneven plating. On the other hand, if the plating is thicker than 0.5 μm, it is not economically preferable to use a noble metal, and it is not preferable because the compression characteristics of plastic cannot be used. Therefore, the most preferable upper limit of the plating thickness is 0.5 μm or less.

  The size of the conductive fine particles that ensure conduction between the electrodes may be determined by the distance between adjacent connection electrodes, but is generally about 2 μm to 30 μm. The amount of conductive fine particles to be added varies depending on the size and specific gravity of the fine particles, but is about 1% to 20% by weight, more preferably 5% to 10% by weight.

  When the resin composition of the anisotropic conductive film is thermosetting, generally conductive fine particles having a small particle diameter can be used, and when the resin composition is thermoplastic, it is generally preferable to use large conductive fine particles.

<Method for producing anisotropic conductive film>
In order to produce an anisotropic conductive film having the above composition, first, a resin composition and a laser light absorbing material are mixed, and the laser light absorbent is sufficiently dispersed or dissolved in the resin composition. When using, for example, carbon black or titanium black as a laser light absorbent, when they are dispersed in the resin composition, if the dispersion is insufficient and remains as an aggregate, the part exhibits conductivity. Can be considered. In this case, the aggregates result in short-circuiting between adjacent electrodes, which may lead to short-circuiting of the anisotropic conductive film. Therefore, it is necessary to disperse with great care so as not to remain as aggregates.

  When the resin composition is thermosetting, a latent curing agent is dispersed in the resin composition. When the resin composition is thermoplastic, it is not necessary to add a curing agent.

  An organic solvent can be appropriately used to facilitate the dispersion and dissolution of the laser light absorber and the latent curing agent.

  Next, the conductive fine particles are monodispersed in the resin composition. Also in this case, if the dispersion of the conductive fine particles is insufficient and the aggregate of the conductive fine particles remains, there is a possibility that the portion may show conductivity, which leads to short-circuiting of the anisotropic conductive film, so that it is sufficiently dispersed. It is necessary to pay attention to. In the case of dispersing the conductive fine particles, the conductive fine particles are more effectively dispersed by adopting a method in which the conductive fine particles are sufficiently dispersed in a solvent in advance using ultrasonic waves or the like and then dispersed in the resin composition. Can be dispersed.

  As described above, a laser light absorbent and conductive fine particles are dispersed in the resin composition to obtain an anisotropic conductive film material, which is then formed into a film to obtain an anisotropic conductive film. As this forming method, there is a method in which a raw material is applied to a film-like substrate so as to have a uniform thickness to form a film made of the raw material. As a base material, general films, such as PET (polyethylene terephthalate), PE (polyethylene), PP (polypropylene), PTFE (polytetrafluoroethylene), and the above-mentioned film subjected to release treatment can be used. The thickness of the substrate is 10 μm to 100 μm, preferably 20 μm to 80 μm.

  As a method of forming a film made of a raw material on a base material, for example, a general comma coater, a curtain coater, a roll coater, a reverse coater or the like is used to apply the raw material to the base material, or extrusion molding is performed with a T die or the like Although there are methods, etc., it is possible to mold using methods other than these.

  When a solvent is used at the time of manufacturing the raw material, the solvent is evaporated on the substrate.

  The thickness of the anisotropic conductive film obtained as described above varies depending on the size of the conductive fine particles to be added, but is preferably set to 1.5 to 5 times the particle diameter, more preferably 2 Double to triple. The anisotropic conductive film thus produced is wound up and cut into a predetermined size for use.

<Adhesion method of anisotropic conductive film>
Next, the adhesion method of the anisotropic conductive film concerning this invention is demonstrated based on FIG.1 and FIG.2.

  FIG. 1 shows the case of connection for output. The anisotropic conductive film 1 obtained as described above is sandwiched between the driver IC 2 and the glass substrate 3 and clamped in the thickness direction to apply pressure. The clamping pressure at this time is preferably in a range of 1 MPa to 300 MPa, and after the anisotropic conductive film 1 is heated by the laser light L described later, the pressure is continuously applied until the anisotropic conductive film 1 is cooled. Is preferred.

  The clamping pressure is preferably 2 MPa to 6 MPa in the case of a TAB (Tape Automated Bonding) tape, 20 MPa to 120 MPa in the case of a driver IC, and 2 MPa to 6 MPa in the case of a COF component. If it is 1 MPa or less, it becomes difficult to hold all the conductive fine particles with the electrode. Conversely, if it is 300 MPa or more, the conductive fine particles may be destroyed.

  As a material for a clamp member (not shown) located on the side irradiated with the laser beam L (lower side in FIG. 1), a material that transmits the laser beam L (laser beam transparency) is necessary. Transparent materials such as acrylic resin plates and polycarbonate plates are preferred.

  Next, the laser beam L is irradiated. As this laser beam L, for example, any of a gas laser, a solid laser, a semiconductor laser, a fiber laser, and the like may be used. The type of the laser beam is not limited, but a semiconductor laser is particularly preferable in terms of safety and ease of handling.

  The wavelength of the laser beam L to be outputted is not limited as long as the adhesive layer containing the resin composition of the anisotropic conductive film 1 and the laser beam absorber can absorb the laser beam L and be cured after melting or cooled and solidified after melting. Although not particularly limited, a semiconductor laser having a wavelength region of 800 nm to 1500 nm used for general resin processing is particularly preferable.

  By adjusting the output of the laser beam L and the scanning speed, the anisotropic conductive film 1 can efficiently absorb the laser beam L and generate heat. Since the anisotropic conductive film 1 can be melted by the output and the scanning speed at this time and then cured or adhered, it is preferable to grasp appropriate conditions in advance.

  However, if the scanning speed is faster than 100 mm / second, it becomes difficult to generate heat and melt the entire anisotropic conductive film 1 in the thickness direction. Therefore, the scanning speed is preferably 100 mm / second or less.

  In the case of output connection, the laser beam L is irradiated from the glass substrate 3 side. Since the glass substrate 3 has laser beam transparency, the laser beam L reaches the anisotropic conductive film 1. The anisotropic conductive film 1 absorbs the laser beam L, generates heat, and melts or softens.

  At this time, since the pressure by the clamp is applied as described above, the conductive fine particles come into contact with the electrode 2a (first electrode) on the driver IC 2 side and the electrode 3a (second electrode) of the glass substrate 3, and thus the first In addition, conduction between the second electrodes 2a and 3a is ensured. The anisotropic conductive film 1 is cured in this state, whereby the first electrode 2a and the second electrode 3a are electrically connected and mechanically coupled.

  In the case of input connection, as shown in FIG. 2, the anisotropic conductive film 1 is sandwiched between the PWB component 4 and the COF component 5 and clamped in the same manner as the output side connection. Further, the irradiation condition of the laser beam L is set in the same manner as in the case of the output side connection.

  In the case of input connection, the laser beam L is irradiated from the COF component 5 side. Since the polyimide film constituting the COF component 5 has laser beam transparency, the laser beam L reaches the anisotropic conductive film 1. The anisotropic conductive film 1 absorbs laser light and generates heat, and melts or softens. As a result, as in the case of the output side connection, the first electrode 5a on the COF component 5 side and the second electrode 4a on the PWB component 4 side are electrically connected and mechanically coupled.

  As described above, according to the method for adhering the anisotropic conductive film 1 according to this embodiment, the anisotropic conductive film 1 is heated by the laser light L and then cured. The first electrode 2a (5a) and the second electrode 3a (4a) can be electrically connected and mechanically coupled by heating a narrow range. Thereby, it is possible to prevent adverse effects due to heat on other components such as a driver IC and a polarizing plate.

  Moreover, since the laser beam absorber was included in the anisotropic conductive film 1, the anisotropic conductive film 1 can be reliably heated and bonded.

  In addition, since the laser light absorber has electrical insulation, the function of the anisotropic conductive film 1 can be sufficiently exerted to ensure conduction as intended.

  Hereinafter, the present invention will be specifically described with reference to examples, but the present invention is not limited to the examples.

Example 1
<Preparation of anisotropic conductive film>
In Example 1, an anisotropic conductive film including a thermosetting resin composition is used.

  The resin composition was liquid epoxy resin EP828 (manufactured by Yuka Shell Epoxy Co., Ltd.). The laser light absorber was carbon black PRINTEK 35 (manufactured by Degussa), and 0.8% by weight thereof was added. Carbon black was sufficiently dispersed in the resin composition using a three roll mill. 70 wt% of a latent curing agent NovaCure HX3941HP (manufactured by Asahi Kasei Co., Ltd.) was added to 30 wt% of this dispersion and mixed well to obtain a thermosetting resin. Novacure HX3941HP is an imidazole compound and is a mixture of imidazole curing agent: liquid epoxy = 1: 2.

  In a separate glass container, take 50 g of ethyl acetate, and add 20 g of nickel / gold plated fine particle BRIGHT RGH-4.0 (manufactured by Nippon Chemical Industry Co., Ltd.), which are plastic conductive fine particles, into the glass container. Fully dispersed using ultrasound. The plated conductive fine particles are obtained by performing electroless plating of 0.18 μm with nickel on the surface of plastic fine particles and then electroless plating with gold of 0.02 μm.

  17.5 g of a conductive fine particle dispersion liquid dispersed in ethyl acetate was added to 50 g of the thermosetting resin prepared as described above, and the mixture was sufficiently stirred to obtain a material for an anisotropic conductive film.

  This raw material was applied to a PET film having a side release treatment of 38 microns using an applicator and dried in an atmosphere at 50 ° C. to obtain a 12 μm thick anisotropic conductive film.

Further, the laser light absorptance of the anisotropic conductive film at a wavelength of 940 nm was 60%. Further, the volume resistivity of only the anisotropic conductive film was 8.2 × 10 ¹⁴ Ωcm, which was a sufficient insulating property.

<Adhesion method of anisotropic conductive film>
Using anisotropic conductive film, COF parts (38 μm polyimide film substrate, 8 μm copper electrode 200 μm pitch line space = 1: 1) and PWB parts (glass epoxy substrate 35 μm copper 200 μm pitch line space = 1: 1) Gluing was performed.

A PWB component, an anisotropic conductive film, and a COF component were superposed in this order on an iron plate laid with silicone rubber. The COF component has the polyimide film side up. Further, a 10 mm thick transparent glass was placed on the COF component, and a clamp pressure of 3 MPa was applied. Semiconductor laser light with a wavelength of 940 nm was irradiated from the polyimide film side under the following conditions.
Focal diameter 3mm
Output 30W
Scanning speed 10mm / sec
Scanning distance 10mm

  After the laser light irradiation, it was confirmed that the anisotropic conductive film was cooled by the heat of the anisotropic conductive film, and the following test was performed.

<Measurement of adhesive strength>
A 90 degree peel test was performed at a speed of 50 mm / min using Autograph AG-IS (manufactured by Shimadzu Corporation). The result was 10 N / cm, and it was confirmed that the adhesive strength was sufficient as the adhesive strength by the anisotropic conductive film.

<Measurement of conductive resistance>
The voltage when a constant current of 1 mA was passed was measured by a four-terminal method, and the conduction resistance was measured.

  The result was 0.035Ω, and it was confirmed that the film had sufficient conductivity as an anisotropic conductive film.

(Example 2)
<Preparation of anisotropic conductive film>
In Example 2, an anisotropic conductive film containing a thermoplastic resin composition is used.

  First, Tuftec M1913 (manufactured by Asahi Kasei Chemicals Corporation), which is a styrene elastomer, was dissolved in toluene to obtain a 45% by weight resin solution. To 100 g of this solution, 0.5% by weight of e-color IR-915 (manufactured by Nippon Shokubai Co., Ltd.) was added as a laser light absorber and dissolved by sufficiently stirring to obtain a thermoplastic resin solution.

  In another glass container, 50 g of toluene was taken, and 20 g of nickel / gold-plated fine particle bright RGH-15.0 (manufactured by Nippon Chemical Industry Co., Ltd.) 15 g was added and sufficiently dispersed by ultrasonic waves.

  100 g of the above thermoplastic resin solution is taken, and 31.4 g of a dispersion of conductive fine particles dispersed in toluene is added to this solution, followed by sufficient stirring to obtain a thermoplastic resin composition solution for anisotropic conductive films. It was.

  This solution was applied to a 38 μm double-sided release PET film with an applicator and dried in an atmosphere at 80 ° C. to obtain an anisotropic conductive film having a thickness of 30 μm.

Moreover, the absorption factor of the wavelength in 940 nm of this film was 70%, and the volume resistivity of only the film was 1.1 * 10 < ¹⁵ > (omega | ohm) cm, and was sufficient insulation.

  The method for adhering the anisotropic conductive film is the same as in Example 1. Similarly, measurement of adhesive strength and measurement of conductive resistance were performed. The adhesive strength was 8 N / cm, and it was confirmed that the adhesive strength was sufficient as the adhesive strength by the anisotropic conductive film. Moreover, the conductive resistance was 0.024Ω, and it was confirmed that the conductive resistance was sufficient as an anisotropic conductive film.

  From Examples 1 and 2, it can be seen that the method for bonding an anisotropic conductive film using laser light according to the present invention is very excellent.

  As described above, the method for bonding an anisotropic conductive film according to the present invention can be used, for example, when a flat panel display is manufactured.

1 Anisotropic conductive film 2 Driver IC
2a First electrode 3 Glass substrate 3a Second electrode 4 PWB component 4a Second electrode 5 COF component 5a First electrode L Laser light

Claims (2)

In the anisotropic conductive film bonding method of bonding the first electrode and the second electrode through the anisotropic conductive film,
An epoxy resin , conductive fine particles, a partition wall-disintegrating latent curing agent in which a curing agent for curing the epoxy resin is confined in a microcapsule, and a laser light absorber that generates heat by absorbing laser light After disposing the anisotropic conductive film between the first electrode and the second electrode,
The anisotropic conductive film is heated with a laser beam having a wavelength range of 800 nm to 1500 nm, the wall of the microcapsule is collapsed by the heat of the laser beam, and the epoxy resin is cured by an internal curing agent, A method for adhering an anisotropic conductive film, comprising adhering the first electrode and the second electrode. In the adhesion method of the anisotropic conductive film according to claim 1,
The laser light absorbent contains at least one of an organic pigment, an inorganic pigment, and an organic dye that ensures electrical insulation between the first electrode and the second electrode. Of conductive conductive film.

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