JP2017175015A - Method of manufacturing connection body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress poor connection of a connection body by preventing misalignment in an electronic component connecting process.SOLUTION: A method of manufacturing a connection body comprises: step (A) of arranging a photocurable anisotropic conductive film 1 on a first electronic component 12; step (B) of arranging a second electronic component 18 on the first electronic component 12 via the anisotropic conductive film 1; step (C) of performing light irradiation from the second electronic component 18 side; and step (D) of connecting the first electronic component 12 and the second electronic component 18 from the second electronic component 18 side with a heating tool.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a method for manufacturing a connection body in which a second electronic component is connected to a first electronic component via a photocurable anisotropic conductive film.

  Conventionally, a liquid crystal display device has been widely used as various display means such as a television, a PC monitor, a mobile phone, a portable game machine, a tablet PC, or an in-vehicle monitor. In recent years, in such liquid crystal display devices, so-called COG (chip on glass) in which a liquid crystal driving IC is directly mounted on a substrate of a liquid crystal display panel or a liquid crystal driving circuit from the viewpoints of fine pitch, light weight, and thinning. So-called FOG (film on glass) is used in which a flexible substrate on which is formed is directly mounted on a substrate of a liquid crystal display panel (see, for example, Patent Documents 1 and 2).

  For example, a connection method using a thermosetting anisotropic conductive film generally has a high heat-pressing temperature, and tends to have a large thermal shock to an electronic component such as a liquid crystal driving IC or a transparent substrate. Thus, when the thermal shock with respect to a transparent substrate becomes large, curvature may arise in the terminal part of a transparent substrate, for example. Further, even when the temperature is lowered to room temperature after the anisotropic conductive film is connected, the binder contracts due to the temperature difference, and the terminal portion of the transparent substrate may be warped. As a result of the warping of the terminal portion of the transparent substrate, display unevenness and poor connection of the liquid crystal driving IC may occur.

  A connection method using an ultraviolet curable anisotropic conductive film instead of the thermosetting anisotropic conductive film is also conceivable. The connection method using the ultraviolet curable anisotropic conductive film does not require high heat to cure the binder resin as compared with the thermosetting anisotropic conductive film, and can be used for liquid crystal driving ICs and transparent Problems due to thermal shock on the substrate can be suppressed. In order to perform low-temperature connection using an ultraviolet curable anisotropic conductive film, it is necessary to reduce the viscosity of the binder resin of the ultraviolet curable anisotropic conductive film.

  When the viscosity of the binder resin is lowered, the liquid crystal driving IC is misaligned when an electronic component such as a liquid crystal driving IC is mounted and pressed by the thermocompression bonding means or when the thermocompression bonding means is separated from the liquid crystal driving IC. There are concerns about the occurrence. Due to this misalignment, the pitch between the electrode terminal of the liquid crystal driving IC and the terminal part adjacent to the terminal part of the transparent substrate connected to this electrode terminal is narrowed, and as a result, a short circuit occurs through the conductive particles. For example, connection failure tends to occur. In addition, this misalignment may occur when an electronic component is mounted. For this reason, occurrence of misalignment even at the time of connection is required to be avoided from the point of occurrence of a short circuit.

JP 2012-155936 A JP2015-167187A

  The present invention solves the above-described problems, and an object of the present invention is to provide a method for manufacturing a connection body that can prevent misalignment in a connection process of electronic components and suppress poor connection.

  In order to solve the above-described problems, a method for manufacturing a connection body according to the present invention includes a step (A) of disposing a photocurable anisotropic conductive film on a first electronic component, and an anisotropic conductive film. A step (B) of disposing the second electronic component on the first electronic component via the film, a step (C) of irradiating light from the second electronic component side, and a heating tool, A step (D) of connecting the first electronic component and the second electronic component from the electronic component side.

  ADVANTAGE OF THE INVENTION According to this invention, the alignment shift | offset | difference in the connection process of an electronic component can be prevented, and the connection defect of a connection body can be suppressed.

FIG. 1 is a cross-sectional view showing an example of the step (A) of disposing an anisotropic conductive film on the first electronic component. FIG. 2 is a cross-sectional view showing an example of the anisotropic conductive film. FIG. 3 is a cross-sectional view showing an example of a step (B) of arranging the second electronic component on the first electronic component via the anisotropic conductive film. FIG. 4 is a cross-sectional view illustrating an example of a step (C) in which light irradiation is performed from the second electronic component side. FIG. 5 is a cross-sectional view showing an example of a step (D) for connecting the first electronic component and the second electronic component. FIG. 6 is a cross-sectional view illustrating an example of a connection body in which the second electronic component is connected to the first electronic component. FIG. 7: is sectional drawing which shows an example of the process (E) which irradiates light with respect to the anisotropic conductive film whole surface arrange | positioned on a 1st electronic component between a process (A) and a process (B). It is. FIG. 8 is a cross-sectional view illustrating an example in which light irradiation is used together when connecting the first electronic component and the second electronic component with the heating tool in the step (D).

  Hereinafter, a method for manufacturing a connection body to which the present invention is applied will be described in detail with reference to the drawings.

[Manufacturing method of connected body]
This manufacturing method includes the following steps (A), (B), (C), and (D).
Step (A): A photocurable anisotropic conductive film is disposed on the first electronic component.
Process (B): A 2nd electronic component is arrange | positioned on a 1st electronic component through an anisotropic conductive film.
Step (C): light irradiation is performed from the second electronic component side.
Process (D): A 1st electronic component and a 2nd electronic component are connected from a 2nd electronic component side with a heating tool.

[Step (A)]
In the step (A), as shown in FIG. 1, the photocurable anisotropic conductive film 1 is disposed (temporarily pasted) on the first electronic component 12. The first electronic component 12 has an electrode 12a connected to the second electronic component. Examples of the first electronic component 12 include glass substrates and printed wiring boards for flat panel displays such as LCD panels and organic EL (OLED), touch panel applications, and the like. The material of the printed wiring board is not particularly limited. The material of the printed wiring board may be, for example, plastic such as thermoplastic resin or ceramic. The glass substrate is not particularly limited as long as it is highly transparent, and may be a plastic substrate such as a thermoplastic resin. The second electronic component is not particularly limited. However, it is preferable that the second electronic component does not transmit the light irradiation light because it is suitable for immobilization before the second electronic component is connected.

  In the step (A), for example, as shown in FIG. 1, the anisotropic conductive film is formed on the electrode 12a of the first electronic component 12 so that the binder resin layer 3 of the anisotropic conductive film 1 is on the electrode 12a side. 1 is placed. After the binder resin layer 3 is disposed on the electrode 12a, the binder resin layer 3 is heated and pressed with, for example, a thermocompression tool from the release film 2 side, the thermocompression tool is separated from the release film 2, and the release film 2 is removed from the binder resin layer. Peel from 3. Temporary sticking of the anisotropic conductive film 1 may be performed by pressurization and light irradiation using a thermocompression bonding tool, or may be performed using both heat pressurization and light irradiation.

  In the anisotropic conductive film 1, for example, as shown in FIG. 2, for example, a binder resin layer (adhesive layer) 3 containing conductive particles is usually formed on a release film 2 serving as a substrate. An anisotropic conductive film is excellent in handleability compared with a paste-like anisotropic conductive adhesive. The anisotropic conductive film 1 has the electrode 12a of the first electronic component 12 by interposing the binder resin layer 3 between the electrode 12a formed on the first electronic component 12 and the second electronic component 18. And the electrode 18a of the second electronic component 18 are used. The polymerization type of the anisotropic conductive film may be any of a cationic polymerization type, an anion polymerization type, or a radical polymerization type. In addition, for example, a cationic polymerization type and a radical polymerization type may be used in combination, as long as there is no problem. Moreover, you may use a heat | fever and light together for superposition | polymerization of an anisotropic conductive film.

  As the release film 2, a substrate generally used in anisotropic conductive films, such as a polyethylene terephthalate film, can be used.

  The binder resin layer 3 is formed by dispersing conductive particles 4 in a binder. The binder contains a film-forming resin, a curable resin, a curing agent, a silane coupling agent, and the like, and a binder used for a normal anisotropic conductive film can be used.

  As the film forming resin, for example, a resin having an average molecular weight of about 10,000 to 80,000 is preferable. Examples of the film-forming resin include various resins such as phenoxy resin, epoxy resin, modified epoxy resin, and urethane resin. Among these, phenoxy resin is particularly preferable from the viewpoint of film formation state, connection reliability, and the like.

  It does not specifically limit as curable resin, An epoxy resin, an acrylic resin, etc. are mentioned. There is no restriction | limiting in particular as an epoxy resin, According to the objective, it can select suitably. As specific examples, for example, naphthalene type epoxy resin, biphenyl type epoxy resin, phenol novolac type epoxy resin, bisphenol type epoxy resin, stilbene type epoxy resin, triphenolmethane type epoxy resin, phenol aralkyl type epoxy resin, naphthol type epoxy resin, A dicyclopentadiene type epoxy resin, a triphenylmethane type epoxy resin, etc. are mentioned. These may be used alone or in combination of two or more. For example, an epoxy resin and an acrylic resin may be used in combination as the curable resin.

  There is no restriction | limiting in particular as an acrylic resin, According to the objective, it can select suitably, For example, methyl acrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, epoxy acrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, for example , Trimethylolpropane triacrylate, dimethyloltricyclodecane diacrylate, tetramethylene glycol tetraacrylate, 2-hydroxy-1,3-diaacryloxypropane, 2,2-bis [4- (acryloxymethoxy) phenyl] propane 2,2-bis [4- (acryloxyethoxy) phenyl] propane, dicyclopentenyl acrylate, tricyclodecanyl acrylate, tris (acryloxyethyl) ) Isocyanurate, urethane acrylate. These may be used alone or in combination of two or more.

  The curing agent is not particularly limited as long as it is a photo-curing type, and can be appropriately selected according to the purpose. However, when the curable resin is an epoxy resin, a cationic curing agent is preferable, and an anionic curing agent is used. May be. When the curable resin is an acrylic resin, a radical curing agent is preferable.

  There is no restriction | limiting in particular as a cationic hardening | curing agent, According to the objective, it can select suitably, For example, a sulfonium salt, onium salt, etc. can be mentioned, Among these, an aromatic sulfonium salt is preferable. There is no restriction | limiting in particular as a radical type hardening | curing agent, According to the objective, it can select suitably, For example, an organic peroxide can be mentioned.

  Examples of the silane coupling agent include epoxy-based, amino-based, mercapto-sulfide-based, and ureido-based agents. By adding the silane coupling agent, the adhesion at the interface between the organic material and the inorganic material is improved.

  Examples of the conductive particles 4 include any known conductive particles used in anisotropic conductive films. Examples of the conductive particles 4 include particles of various metals and metal alloys such as nickel, iron, copper, aluminum, tin, lead, chromium, cobalt, silver, gold, metal oxide, carbon, graphite, glass, ceramic, Examples thereof include those in which the surface of particles such as plastic is coated with metal, or those in which the surface of these particles is further coated with an insulating thin film. In the case where the surface of the resin particle is coated with metal, examples of the resin particle include an epoxy resin, a phenol resin, an acrylic resin, an acrylonitrile / styrene (AS) resin, a benzoguanamine resin, a divinylbenzene resin, a styrene resin, and the like. Can be mentioned. Conductive particles may be used alone or in combination of two or more.

[Step (B)]
In the step (B), as shown in FIG. 3, the second electronic component 18 is disposed on the first electronic component 12 via the anisotropic conductive film 1. The second electronic component 18 has an electrode 18 a formed on the surface facing the first electronic component 12. The electrodes 18 a are formed at intervals corresponding to the electrodes 12 a of the first electronic component 12. The electrode 18a is made of, for example, a metal material. Examples of the second electronic component 18 include a flexible substrate, a tape carrier package substrate, and an IC. Further, it may be a COF (Chip On Film) in which an IC is mounted on a flexible substrate.

  In the step (B), the second electronic component 18 and the first electronic component 12 are preferably aligned. For example, as shown in FIG. 3, the second electronic component 18 is arranged so that each electrode 12 a and each electrode 18 a face each other with the binder resin layer 3 interposed therebetween.

  When the first electronic component 12 is mounted on the second electronic component 18, in general, there is a tendency that an alignment shift derived from the apparatus occurs. Therefore, it is desired to avoid further alignment misalignment during connection. The alignment deviation when mounting such an electronic component is, for example, 5 to 10% with respect to the short side (width) of the electrode 12a of the first electronic component 12 or the electrode 18a of the second electronic component 18. preferable. Further, in the step (D), that is, the step of connecting the first electronic component 12 and the second electronic component 18, it is required to prevent further misalignment. The alignment deviation in the connecting step is required to be zero, but it is practically preferable to be within 50% of the conductive particle diameter. The connection body is preferably an alignment deviation within 10% of the short side of the electrode and within 50% of the conductive particle diameter, and with an alignment deviation within 5% of the short side of the electrode and within 50% of the conductive particle diameter. More preferably. In this manufacturing method, by having the following step (C), misalignment in the connecting step of the electronic component is prevented.

[Step (C)]
In the step (C), light irradiation is performed from the second electronic component 18 side. Examples of the light irradiation method include a method of irradiating ultraviolet rays from an ultraviolet irradiator 31 arranged on the second electronic component 18 side as shown in FIG. As the ultraviolet irradiator 31, an LED lamp, a mercury lamp, a metal halide lamp, or the like can be used. By irradiating the second electronic component 18 and the binder resin layer 3 with ultraviolet rays, curing of the binder resin layer 3 at the peripheral edge of the second electronic component 18 is started, so that at least the second electronic component 18 The peripheral edge portion and the binder resin layer 3 can be temporarily bonded. Thereby, the alignment shift | offset | difference of the 2nd electronic component 18 in the process (D) mentioned later can be suppressed, for example.

Cumulative amount of light to be irradiated in the step (C) is preferably to be from the viewpoint of suppressing misalignment of the second electronic component 18, for example, 200 mJ / cm ² or more, and more preferably to 300~700mJ / cm ² .

[Step (D)]
In the step (D), the first electronic component 12 and the second electronic component 18 are connected from the second electronic component 18 side with a heating tool (main pressure bonding step). In the step (D), for example, as shown in FIG. 5, the conductive particle 4 is sandwiched between the electrode 18 a and the electrode 12 a of the second electronic component 18 while being heated by the thermocompression bonding tool 30 through the buffer material 32. Pressurize at such a pressure as to make it possible. The heat pressing temperature by the thermocompression bonding tool 30 is a temperature of ± 10 to 20 ° C. (for example, around 80 ° C.) with respect to a predetermined temperature indicating the viscosity (minimum melt viscosity) when the binder resin layer is melted before the start of curing. It is preferable to set to. Thereby, the curvature of the 1st electronic component 12 can be suppressed and the damage of the 2nd electronic component 18 by heat can be suppressed.

  In the main compression bonding process, the binder resin flows out from between the electrode 18a and the electrode 12a of the second electronic component 18, and the conductive particles 4 are sandwiched between the electrode 18a and the electrode 12a. Then, the binder resin is cured by heating, and the connection body 10 in which the second electronic component 18 is connected to the first electronic component 12 as shown in FIG. 6 is obtained.

  In the present manufacturing method, by performing light irradiation from the second electronic component 18 side before the main crimping step, curing of the binder resin layer 3 at the peripheral edge of the second electronic component 18 is started, and the second electronic component 18 is cured. The peripheral edge of the component 18 and the binder resin layer 3 can be temporarily bonded. Moreover, the viscosity of the binder resin of the anisotropic conductive film 1 is increased to some extent before the main pressure bonding step. For this reason, for example, misalignment of the second electronic component 18 can be suppressed at the time of heat pressing in the main pressure bonding step or at the time of separation of the heat pressure bonding tool. Therefore, a short-circuit between terminals due to misalignment, for example, a short-circuit between terminals short-circuited via the conductive particles 4 due to a narrow pitch between the electrode 18a and the electrode adjacent to the electrode 12a connected to the electrode 18a. Can be suppressed. In particular, the same effect can be obtained when an electronic component having a fine pitch is used.

In addition, this manufacturing method may further have the process (E) shown below and the process (F). In the present manufacturing method, for example, as shown in FIG. 7 between the step (A) and the step (B), light (preferably, the entire surface of the anisotropic conductive film 1 disposed on the first electronic component 12 is preferable. May further have a step (E) of performing ultraviolet irradiation. It is preferable that the integrated light quantity irradiated in the step (E) is not too large from the viewpoint of suppressing misalignment of the second electronic component 18 and improving the connectivity in the step (D). Integrated light intensity in step (E) is preferably, for example be less than 100 mJ / cm ^2, and more preferably a 10~50mJ / cm ^2.

  In addition, the manufacturing method may further include a step (F) of pressing the second electronic component 18 before and after the step (C). This pressing may be performed when the second electronic component 18 is disposed on the anisotropic conductive film 1 in the step (B), or ultraviolet irradiation from the second electronic component 18 side in the step (C). You may go with it. The pressing is preferably performed at a lower temperature and a lower pressure than in the step (D) with a thermocompression bonding tool in which the upper surface of the second electronic component 18 is heated to a predetermined heating temperature via a cushioning material.

Moreover, this manufacturing method uses light irradiation together in the process (D) when connecting the 1st electronic component 12 and the 2nd electronic component 18 with a heating tool, for example, as shown in FIG. Also good. The light irradiation can be performed using, for example, an ultraviolet irradiator 31 arranged on the first electronic component 12 side. Thereby, the binder resin layer 3 can be hardened more effectively. When using light irradiation together in a process (D), it is preferable that the integrated light quantity in a process (D) shall be 300-1200 mJ / cm < ² >, for example.

  Moreover, this manufacturing method may start the light irradiation in a process (C) from the time of arrange | positioning a process (A), ie, the anisotropic conductive film 1. FIG.

  Next, examples of the present technology will be described. In this example, a connected body sample in which an IC for evaluation and an ITO coating glass were connected via a photocurable anisotropic conductive film was obtained. And about the obtained connection body sample, the conduction | electrical_connection resistance value after a connection initial stage and a reliability test, and the amount of misalignment of evaluation IC were measured. The present invention is not limited to the following examples.

As an evaluation element, an evaluation IC under the following conditions was used.
Outline: 1.8mm x 20mm
Bump height: 15 μm
Bump size: 30 × 60μm (Minimum bump space 10μm)

  An ITO coating glass having a thickness of 0.5 mm was used as an evaluation substrate to which an evaluation IC was connected.

The photocurable anisotropic conductive film used was obtained by the following method. A mixed solution is prepared so that each of the following components has a solid content of 50% with ethyl acetate and toluene, and conductive particles (AUL 704: average particle size 4 μm, manufactured by Sekisui Chemical Co., Ltd.) have a particle density of about 50,000. It was dispersed so as to be pieces / mm ² .
Phenoxy resin (YP-50: manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.); 45 parts by mass isocyanuric acid EO-modified diacrylate (M-215: manufactured by Toagosei Co., Ltd.); 45 parts by mass of silane coupling agent (KBM-403: Shin-Etsu Chemical) Manufactured by Kogyo Co., Ltd.); 2 parts by mass photoradical generator (Irgacure 369: manufactured by BASF Japan Ltd.); 8 parts by mass

  The obtained mixed solution was applied onto a PET film having a thickness of 50 μm, dried in an oven at 70 ° C. for 5 minutes, and formed into a film having a thickness of 20 μm. As a result, a photocurable anisotropic conductive film was obtained.

[Example 1]
An anisotropic conductive film was disposed on the evaluation substrate, and an evaluation IC was disposed on the evaluation substrate through the anisotropic conductive film. From the arranged IC for evaluation, ultraviolet rays were irradiated with an ultraviolet irradiator (ZUV-C30H: manufactured by OMRON Corporation) (step (C)), and temporary pressure bonding was performed. After provisional pressure bonding, thermal pressure was applied from the evaluation IC side with a thermocompression bonding tool and ultraviolet light was irradiated with an ultraviolet irradiator (step (D)) to perform main pressure bonding, thereby obtaining a connected body sample.

The amount of ultraviolet irradiation at the time of temporary pressure bonding was set to 200 mJ / cm ² . Further, the main pressing condition was 100 ° C., 80 MPa, 5 seconds, and a Teflon (registered trademark) sheet having a thickness of 50 μm was interposed as a buffer material between the thermocompression bonding tool and the evaluation IC during pressing. Further, the ultraviolet irradiation was started 2 seconds after the heating and pressing with the thermocompression bonding tool, the irradiation time was 3 seconds, and the illuminance was 100 mW / cm ² . Ultraviolet irradiation at the time of main press-bonding was performed from the glass substrate side.

  About the obtained connection body sample, the initial conduction resistance value ((ohm)) and the conduction resistance value (ohm) after a reliability test were measured. The conditions of the reliability test are a temperature of 85 ° C., a relative humidity of 85%, and 500 hours. The conduction resistance value was measured by connecting a digital multimeter to the wiring of the evaluation substrate connected to the bump of the evaluation IC, and measuring the resistance value when a current of 2 mA was passed by the four-terminal method.

  Further, the amount of misalignment (bump arrangement direction, that is, the short direction of the bump) of the obtained connected sample was measured using a stereomicroscope. The amount of alignment deviation when the evaluation IC was mounted was within 1 μm. The amount of misalignment at the time of connection was determined by checking before and after connection. The allowable range of misalignment during connection was set to be within 50% of the conductive particle diameter in the short direction of the bump.

[Example 2]
A connected body sample was obtained under the same conditions as in Example 1 except that the amount of ultraviolet irradiation at the time of temporary pressure bonding was changed to 600 mJ / cm ² .

[Example 3]
A connected body sample was obtained under the same conditions as in Example 1, except that the ultraviolet illuminance and the irradiation time at the time of temporary pressure bonding were changed and that only the thermal pressing was performed without performing ultraviolet irradiation at the time of the final pressure bonding.

[Example 4]
Example, except that the ultraviolet illuminance and irradiation time at the time of provisional pressure bonding were changed, and that heat pressure was applied with a thermocompression bonding tool from the evaluation IC side at the time of provisional pressure bonding, and then ultraviolet rays were irradiated from the evaluation IC side. A connector sample was obtained under the same conditions as in 1. The heat-pressing condition at the time of pre-bonding was 80 ° C., 2 MPa, 2 seconds, and at the time of pressing, a Teflon (registered trademark) sheet having a thickness of 50 μm was interposed as a buffer material between the thermo-compression tool and the evaluation IC.

[Example 5]
Example, except that the ultraviolet illuminance and irradiation time at the time of provisional pressure bonding were changed, and that heat pressure was applied with a thermocompression bonding tool from the evaluation IC side at the time of provisional pressure bonding, and then ultraviolet rays were irradiated from the evaluation IC side. A connected body sample was obtained under the same conditions as in No. 3. The heat-pressing condition at the time of pre-bonding was 80 ° C., 2 MPa, 2 seconds, and at the time of pressing, a Teflon (registered trademark) sheet having a thickness of 50 μm was interposed as a buffer material between the thermo-compression tool and the evaluation IC.

[Example 6]
A connected body sample was obtained under the same conditions as in Example 1 except that ultraviolet light was applied from the evaluation IC side during temporary pressure bonding and then heat pressing was performed from the evaluation IC side with a thermocompression bonding tool. The heat-pressing condition at the time of pre-bonding was 80 ° C., 2 MPa, 2 seconds, and at the time of pressing, a Teflon (registered trademark) sheet having a thickness of 50 μm was interposed as a buffer material between the thermo-compression tool and the evaluation IC.

[Example 7]
Example except that the ultraviolet illuminance and the irradiation time at the time of temporary pressure bonding were changed, and that heat pressure was applied from the evaluation IC side with a thermocompression bonding tool after the ultraviolet light was irradiated from the evaluation IC side at the time of temporary pressure bonding. A connected body sample was obtained under the same conditions as in No. 3. The heat-pressing condition at the time of pre-bonding was 80 ° C., 2 MPa, 2 seconds, and at the time of pressing, a Teflon (registered trademark) sheet having a thickness of 50 μm was interposed as a buffer material between the thermo-compression tool and the evaluation IC.

[Example 8]
From the side of the anisotropic conductive film placed on the evaluation substrate, the entire surface of the anisotropic conductive film is irradiated with ultraviolet rays with an ultraviolet irradiator (step (E)), and evaluated through the anisotropic conductive film after ultraviolet irradiation. A connected body sample was obtained under the same conditions as in Example 1 except that the evaluation IC was placed on the substrate.

[Example 9]
From the side of the anisotropic conductive film placed on the evaluation substrate, the entire surface of the anisotropic conductive film is irradiated with ultraviolet rays with an ultraviolet irradiator, and the evaluation substrate is used for evaluation via the anisotropic conductive film after the ultraviolet irradiation. A connected body sample was obtained under the same conditions as in Example 3 except that the IC was arranged.

[Comparative Example 1]
It was performed under the same conditions as in Example 8 except that the ultraviolet irradiation time was changed so that the integrated light amount when the entire surface of the anisotropic conductive film was irradiated with ultraviolet rays was 100 mJ / cm ² .

[Comparative Example 2]
It was performed under the same conditions as in Example 8 except that the ultraviolet irradiation time was changed so that the integrated light amount when the entire surface of the anisotropic conductive film was irradiated with ultraviolet rays was 200 mJ / cm ² .

  From the results of the examples, it was found that misalignment in the connection process of the electronic component can be prevented, and poor connection of the connection body can be suppressed.

  In Comparative Examples 1 and 2, the overrange was displayed when the initial conduction resistance value of the obtained connection body sample was measured. This is considered to be because the anisotropic conductive film was fully cured due to the process (E), that is, the amount of accumulated light when the entire surface of the anisotropic conductive film was irradiated with ultraviolet rays, resulting in poor connection.

DESCRIPTION OF SYMBOLS 1 Anisotropic conductive film, 2 Release film, 3 Binder resin layer, 4 Conductive particle, 10 Connection body, 12 1st electronic component, 18 2nd electronic component, 30 Thermocompression bonding tool, 31 Ultraviolet irradiation device, 32 Cushioning material

Claims (8)

A step (A) of disposing a photocurable anisotropic conductive film on the first electronic component;
A step (B) of disposing a second electronic component on the first electronic component via the anisotropic conductive film;
(C) performing light irradiation from the second electronic component side;
The manufacturing method of a connection body which has the process (D) which connects a said 1st electronic component and a said 2nd electronic component from a said 2nd electronic component side with a heating tool.   The method further comprises a step (E) of performing light irradiation on the entire surface of the anisotropic conductive film disposed on the first electronic component between the step (A) and the step (B). The manufacturing method of the connection body of description.   The manufacturing method of the connection body of Claim 1 or 2 which further has the process (F) which presses the said 2nd electronic component before and behind the said process (C). The manufacturing method of the connection body of any one of Claims 1-3 whose integrated light quantity in the said process (C) is 300 mJ / cm < ² > or more.   The manufacturing method of the connection body of any one of Claims 1-4 which light-irradiates to the said anisotropic conductive film from the said 1st electronic component side at the said process (D). The manufacturing method of the connection body of Claim 5 whose integrated light quantity in the said process (D) is 300-1200mJ / cm < ² >. The manufacturing method of the connection body of Claim ² whose integrated light quantity in the said process (E) is less than 100 mJ / cm < ² >.   The method for manufacturing a connection body according to claim 1, wherein the first electronic component is a transparent substrate.

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