CN105793931B - 热固化型导电浆料组成物 - Google Patents
热固化型导电浆料组成物 Download PDFInfo
- Publication number
- CN105793931B CN105793931B CN201480064513.7A CN201480064513A CN105793931B CN 105793931 B CN105793931 B CN 105793931B CN 201480064513 A CN201480064513 A CN 201480064513A CN 105793931 B CN105793931 B CN 105793931B
- Authority
- CN
- China
- Prior art keywords
- thermohardening type
- electrocondution slurry
- copper
- copper alloy
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 229910052802 copper Inorganic materials 0.000 claims abstract description 46
- 239000010949 copper Substances 0.000 claims abstract description 46
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 41
- 150000001875 compounds Chemical class 0.000 claims abstract description 36
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- 229910052709 silver Inorganic materials 0.000 claims abstract description 14
- 239000004332 silver Substances 0.000 claims abstract description 14
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 13
- 239000004020 conductor Substances 0.000 claims description 17
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 16
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 12
- 239000004411 aluminium Substances 0.000 claims description 10
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- 238000002360 preparation method Methods 0.000 claims description 6
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 3
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- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 3
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- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 125000000466 oxiranyl group Chemical group 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- VENBJVSTINLYEU-UHFFFAOYSA-N phenol;trifluoroborane Chemical compound FB(F)F.OC1=CC=CC=C1 VENBJVSTINLYEU-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920005906 polyester polyol Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 150000008442 polyphenolic compounds Chemical class 0.000 description 1
- 235000013824 polyphenols Nutrition 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000010079 rubber tapping Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 229940014800 succinic anhydride Drugs 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- VPYJNCGUESNPMV-UHFFFAOYSA-N triallylamine Chemical compound C=CCN(CC=C)CC=C VPYJNCGUESNPMV-UHFFFAOYSA-N 0.000 description 1
- 229960001124 trientine Drugs 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
- C09D175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/58—Epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Inorganic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Conductive Materials (AREA)
- Paints Or Removers (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013251243A JP6259270B2 (ja) | 2013-12-04 | 2013-12-04 | 熱硬化型導電性ペースト組成物 |
| JP2013-251243 | 2013-12-04 | ||
| PCT/JP2014/005777 WO2015083332A1 (ja) | 2013-12-04 | 2014-11-18 | 熱硬化型導電性ペースト組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105793931A CN105793931A (zh) | 2016-07-20 |
| CN105793931B true CN105793931B (zh) | 2018-09-28 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480064513.7A Expired - Fee Related CN105793931B (zh) | 2013-12-04 | 2014-11-18 | 热固化型导电浆料组成物 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6259270B2 (ja) |
| CN (1) | CN105793931B (ja) |
| WO (1) | WO2015083332A1 (ja) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6383183B2 (ja) * | 2014-06-03 | 2018-08-29 | 太陽インキ製造株式会社 | 導電性接着剤およびそれを用いた電子部品 |
| WO2017115462A1 (ja) * | 2015-12-28 | 2017-07-06 | Ｄｏｗａエレクトロニクス株式会社 | 銀合金粉末およびその製造方法 |
| JP6804286B2 (ja) * | 2015-12-28 | 2020-12-23 | Ｄｏｗａエレクトロニクス株式会社 | 銀合金粉末およびその製造方法 |
| CN110012617A (zh) * | 2019-04-03 | 2019-07-12 | 东莞塘厦裕华电路板有限公司 | 一种电路板导通孔制作方法 |
| CN113066600B (zh) * | 2021-03-24 | 2023-03-14 | 北京梦之墨科技有限公司 | 一种导电浆料及电子器件 |
| CN113782252B (zh) * | 2021-11-15 | 2022-03-01 | 西安宏星电子浆料科技股份有限公司 | 一种uv加热双重固化导电浆料及其制备方法 |
| CN116913576B (zh) * | 2023-07-10 | 2024-05-28 | 乐凯胶片股份有限公司 | 导电浆料和异质结太阳能电池 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6345702A (ja) * | 1986-08-11 | 1988-02-26 | 東亞合成株式会社 | 金属含有ペ−スト |
| JP3010843B2 (ja) * | 1991-10-28 | 2000-02-21 | 日立化成工業株式会社 | 導電性樹脂ペースト組成物およびこの組成物を用いた半導体装置 |
| JPH10330611A (ja) * | 1997-06-02 | 1998-12-15 | Asahi Chem Ind Co Ltd | 樹脂組成物 |
| JP3558593B2 (ja) * | 2000-11-24 | 2004-08-25 | 京都エレックス株式会社 | 加熱硬化型導電性ペースト組成物 |
| JP2002294145A (ja) * | 2001-03-28 | 2002-10-09 | Nippon Paint Co Ltd | 無鉛性カチオン電着塗料組成物 |
| JP4089368B2 (ja) * | 2002-09-18 | 2008-05-28 | 住友電気工業株式会社 | 導電性ペースト |
| JP4481734B2 (ja) * | 2004-06-10 | 2010-06-16 | 三菱樹脂株式会社 | 多層配線基板用導電性ペースト組成物 |
| JP5402350B2 (ja) * | 2009-07-24 | 2014-01-29 | 藤倉化成株式会社 | 導電性ペーストの製造方法および導電性ペースト |
| JP2011086397A (ja) * | 2009-10-13 | 2011-04-28 | Asahi Kasei E-Materials Corp | 導電性ペースト及び半導体装置 |
| KR20140079268A (ko) * | 2012-12-18 | 2014-06-26 | 솔브레인 주식회사 | 전도성 페이스트 조성물, 이를 이용하여 제조한 전도층, 상기 전도층을 포함하는 전자 소자 또는 디스플레이 |
| WO2014104053A1 (ja) * | 2012-12-27 | 2014-07-03 | 荒川化学工業株式会社 | スクリーン印刷用導電性ペースト、並びに配線の製造方法及び電極の製造方法 |
| WO2014112433A1 (ja) * | 2013-01-18 | 2014-07-24 | 東洋紡株式会社 | 導電性ペースト、導電性膜、電気回路及びタッチパネル |
-
2013
- 2013-12-04 JP JP2013251243A patent/JP6259270B2/ja active Active
-
2014
- 2014-11-18 WO PCT/JP2014/005777 patent/WO2015083332A1/ja active Application Filing
- 2014-11-18 CN CN201480064513.7A patent/CN105793931B/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015109195A (ja) | 2015-06-11 |
| CN105793931A (zh) | 2016-07-20 |
| JP6259270B2 (ja) | 2018-01-10 |
| WO2015083332A1 (ja) | 2015-06-11 |
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