CN105793931B - Thermohardening type electrocondution slurry constituent - Google Patents
Thermohardening type electrocondution slurry constituent Download PDFInfo
- Publication number
- CN105793931B CN105793931B CN201480064513.7A CN201480064513A CN105793931B CN 105793931 B CN105793931 B CN 105793931B CN 201480064513 A CN201480064513 A CN 201480064513A CN 105793931 B CN105793931 B CN 105793931B
- Authority
- CN
- China
- Prior art keywords
- thermohardening type
- electrocondution slurry
- copper
- copper alloy
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000002002 slurry Substances 0.000 title claims abstract description 77
- 239000000470 constituent Substances 0.000 title claims abstract description 53
- 239000000843 powder Substances 0.000 claims abstract description 109
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- 229910052802 copper Inorganic materials 0.000 claims abstract description 46
- 239000010949 copper Substances 0.000 claims abstract description 46
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 41
- 150000001875 compounds Chemical class 0.000 claims abstract description 36
- 229920005989 resin Polymers 0.000 claims abstract description 31
- 239000011347 resin Substances 0.000 claims abstract description 31
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000003822 epoxy resin Substances 0.000 claims abstract description 17
- 229910001410 inorganic ion Inorganic materials 0.000 claims abstract description 17
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 17
- 229910052709 silver Inorganic materials 0.000 claims abstract description 14
- 239000004332 silver Substances 0.000 claims abstract description 14
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 13
- 239000004020 conductor Substances 0.000 claims description 17
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 16
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 12
- 239000004411 aluminium Substances 0.000 claims description 10
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 8
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- 239000010931 gold Substances 0.000 claims description 8
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- 239000011133 lead Substances 0.000 claims description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- 229910052799 carbon Inorganic materials 0.000 claims description 6
- 229910052763 palladium Inorganic materials 0.000 claims description 6
- 238000002360 preparation method Methods 0.000 claims description 6
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 3
- 229910052787 antimony Inorganic materials 0.000 claims description 3
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 3
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- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 3
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- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 description 2
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- 238000005349 anion exchange Methods 0.000 description 2
- KPTLPIAOSCGETM-UHFFFAOYSA-N benzene 1,2-diisocyanatoethane Chemical compound O=C=NCCN=C=O.c1ccccc1 KPTLPIAOSCGETM-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 229940106691 bisphenol a Drugs 0.000 description 2
- 150000001768 cations Chemical class 0.000 description 2
- 229910001431 copper ion Inorganic materials 0.000 description 2
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- 239000012948 isocyanate Substances 0.000 description 2
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- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
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- 238000007254 oxidation reaction Methods 0.000 description 1
- 150000002923 oximes Chemical class 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 125000000466 oxiranyl group Chemical group 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- VENBJVSTINLYEU-UHFFFAOYSA-N phenol;trifluoroborane Chemical compound FB(F)F.OC1=CC=CC=C1 VENBJVSTINLYEU-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920005906 polyester polyol Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 150000008442 polyphenolic compounds Chemical class 0.000 description 1
- 235000013824 polyphenols Nutrition 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000010079 rubber tapping Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 229940014800 succinic anhydride Drugs 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- VPYJNCGUESNPMV-UHFFFAOYSA-N triallylamine Chemical compound C=CCN(CC=C)CC=C VPYJNCGUESNPMV-UHFFFAOYSA-N 0.000 description 1
- 229960001124 trientine Drugs 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
- C09D175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/58—Epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Conductive Materials (AREA)
- Paints Or Removers (AREA)
Abstract
In the case that even if the present invention provides a kind of wicker copper alloy obtained in the wicker copper obtained using copper, copper alloy, silver-colored coated copper or silver cladding copper alloy as electroconductive powder, increase prevented also from viscosity caused by preservation and electric conductivity reduction, the thermohardening type electrocondution slurry constituent with excellent storage stability.The present invention provides a kind of thermohardening type electrocondution slurry constituent, be containing（A）Electroconductive powder,（B）Thermohardening type resin,（C）Curing agent and（D）The thermohardening type electrocondution slurry constituent of inorganic ion exchanger；（A）Electroconductive powder uses at least one selected from the group being made of copper, copper alloy, wicker copper and wicker copper alloy；（B）Thermohardening type resin contains blocked polyisocyanate compound, or contains blocked polyisocyanate compound and epoxy resin.
Description
Technical field
The present invention relates to thermohardening type electrocondution slurry constituents, in particular, relating to by film, substrate, electronics member
The thermohardening type for coating or printing on the base materials such as part, be heating and curing and form the film for having excellent adhesiveness and electric conductivity
Electrocondution slurry constituent.
Background technology
In the past, as the side for forming electrode or electric wiring (wiring) etc. on the base materials such as film, substrate, electronic component
One of method, it is known that the method for utilizing thermohardening type electrocondution slurry.In this method, conductive pattern is formed at a lower temperature
When, use the thermohardening type electrocondution slurry containing conductive metal powder (electroconductive powder) and thermohardening type resin.Moreover,
It coats with defined conductive pattern on base material or prints the thermohardening type electrocondution slurry constituent, then heated so that base material
On conductive pattern dry solidification, on base material formed as defined in conductive pattern electrode and wiring etc..
In thermohardening type electrocondution slurry constituent, using epoxy resin, blocked polyisocyanate compound etc. as
Thermohardening type resin, in addition, main that silver is used to be used as electroconductive powder.
For example, patent document 1 is disclosed containing silver powder, blocked polyisocyanate compound, epoxy resin and solidification
The thermohardening type electrocondution slurry constituent of agent.
On the other hand, since silver is expensive, also develop using more cheap copper, copper alloy, silver-colored coated copper or
The thermohardening type electrocondution slurry as electroconductive powder such as wicker copper that copper alloy obtains or wicker copper alloy, 2 He of patent document
Patent document 3 disclose make to be equal to silver powder, it is cheap, mechanically force the silver-copper obtained by silver powder and copper powder compound
Powder is scattered in synthetic resin solvent and manufactured conductive coating paint.
Existing technical literature
Patent document：
Patent document 1：Special open 2002-161123 bulletins
Patent document 2：Tekiaki 56-155259 bulletins
Patent document 3：Tekiaki 60-017392 bulletins.
Invention content
Problems to be solved by the invention：
Present inventors studied develop thermohardening type electrocondution slurry as described below：As will disclosed in patent document 1 it is hot
Silver powder in curing type electrocondution slurry constituent is replaced with such as patent document 2 and silver-copper composite powder disclosed Patent Document 3
And the thermohardening type electrocondution slurry formed, use blocked polyisocyanate compound or blocked polyisocyanate compound
The wicker copper obtained with epoxy resin as thermohardening type resin and using copper, copper alloy, silver-colored coated copper or silver-colored coated copper
The wicker copper alloy that alloy obtains is as electroconductive powder.
However, with using only silver as electroconductive powder the case where compared with, have the following problems：Thermohardening type electrocondution slurry
Preservation cause viscosity to increase over time, electric conductivity reduces at any time.
The present invention is to be formed to solve the above-mentioned problems, it is therefore an objective to provide one kind prevent preserve caused by viscosity increase and
Electric conductivity reduces and the thermohardening type electrocondution slurry constituent with excellent storage stability.
The means solved the problems, such as：
To solve the above problems, thermohardening type electrocondution slurry constituent according to the present invention, is formed as following composition：Contain
(A) electroconductive powder, (B) thermohardening type resin, (C) curing agent and (D) inorganic ion exchanger, (A) electroconductive powder use
At least one selected from the group being made of copper, copper alloy, wicker copper and wicker copper alloy, (B) thermohardening type resin contain
Blocked polyisocyanate compound, or contain blocked polyisocyanate compound and epoxy resin.
In the composition, (D) inorganic ion exchanger can be with arbitrary in zirconium, magnesium, aluminium, silicon, antimony and bismuth
One kind is principal component.
Also, in the composition, the content of (D) inorganic ion exchanger can be relative to (A) electric conductivity
Powder is 0.01~3 mass %.
Also, in the composition, (A) electroconductive powder may be used from by copper, copper alloy, wicker copper and Yin Bao
At least one and silver selected in the group that copper alloy is constituted, are constituted from by copper, copper alloy, wicker copper and wicker copper alloy
Group in at least one and silver-colored allotment ratio selected can be mass ratio 100:0~1:99(100:Except 0).
In addition, in the composition, (A) electroconductive powder, can also contain from by gold, palladium, nickel, aluminium, lead and
At least one selected in the group that carbon is constituted.
Invention effect：
It is constituted according to above, the present invention plays following effect：Even if being capable of providing one kind electroconductive powder to close using copper, copper
Gold, silver copper-clad and wicker copper alloy are also possible to prevent viscosity caused by preserving and increase with electric conductivity reduction, with excellent
The thermohardening type electrocondution slurry constituent of storage stability.
Description of the drawings
Fig. 1 be show for the characteristic (conductor resistance) to heat-curing type electrocondution slurry constituent according to the present invention into
The vertical view of the shape of the conductive pattern of row evaluation.
Specific implementation mode
Hereinafter, an example of the preferred implementation form that the present invention will be described in detail.
[(A) electroconductive powder]
(A) electroconductive powder in thermohardening type electrocondution slurry constituent according to the present invention, using from by copper, copper conjunction
At least one selected in the group that gold, silver copper-clad and wicker copper alloy are constituted, and its specific allotment type and allotment ratio
Example is not particularly limited, according to the present invention it is possible to which preventing viscosity caused by preserving from increasing reduces with electric conductivity, realizes excellent guarantor
Deposit stability.
Copper alloy in the present invention be based on copper, be added to various elements (silver, zinc, nickel, cobalt, tin, lead, aluminium, chromium,
Cadmium, beryllium, tellurium etc.) alloy, wicker copper or wicker copper alloy are by reduction plating method, displacement plating method etc. in copper or copper alloy
Particle obtained from the coating silver of particle surface.
Also, referring to the copper containing 50 weight % or more in alloy based on copper.
(A) electroconductive powder, in addition to what is selected from the group being made of copper, copper alloy, wicker copper and wicker copper alloy
Except at least one, silver can also be contained.
At this point, at least one selected from the group being made of copper, copper alloy, wicker copper and wicker copper alloy and silver
Allotment ratio, be arranged to mass ratio 100:0~1:99(100:Except 0) range.
Also, (A) electroconductive powder, can also contain selected from the group being made of gold, palladium, nickel, aluminium, lead and carbon to
Few one kind.
In the present invention, the upper limit of the alkali metal ion content measured preferably contained by (A) electroconductive powder is prescribed.Specifically
, sodium ions content and potassium content preferably contained by (A) electroconductive powder are respectively less than 200ppm, more preferably less than
100ppm, more preferably less than 10ppm.In the present invention, preferably at least sodium ions content is less than 200ppm.These ion concentrations are more than
When 200ppm, formed in the electronic component or electronic device of electrode or wiring by thermohardening type electrocondution slurry, electrical characteristic
It is easy to happen problem with reliability.On the other hand, the lower the lower limit of these ions the better.
(A) electroconductive powder in thermohardening type electrocondution slurry constituent according to the present invention, using from by copper, copper conjunction
At least one selected in the group that gold, silver copper-clad and wicker copper alloy are constituted, and the shape for being somebody's turn to do (A) electroconductive powder can be with
Using flakelike powder and globular powder.
Flakelike powder in the present invention, even if part has concave-convex, visible deformation, as long as being to connect when from the point of view of as a whole
The powder of the shape of the cuboid of nearly tablet or thinner thickness.In addition, sheet is properly termed as flake or squama in other words
Sheet.Also, the globular powder in the present invention, even if part has concave-convex, visible deformation, as long as being ratio when from the point of view of as a whole
Powder of the cuboid close to cubical three-dimensional shape.In addition, it is spherical be properly termed as in other words it is granular.
Preferred structure about flakelike powder in the electroconductive powder of the present invention is described in detail.Flakelike powder is averaged
Grain size D50 is preferably in the range of 2~20 μm, and BET specific surface area is preferably 0.1~1m2In the range of/g, tap density is preferred
For 3~7g/cm3In the range of, aspect ratio is preferably in the range of 5~15.
More specifically, in the range of preferably 2~20 μm as above of the average grain diameter D50 of flakelike powder, more preferable 2~12 μm
In the range of, in the range of further preferred 6~10 μm.When the average grain diameter D50 of flakelike powder is less than 2 μm, electroconductive powder
Mutual contact resistance has bigger tendency, there is the worry that cannot get sufficient conductivity.On the other hand, average grain diameter D50
When more than 20 μm, although the mutual contact resistance of electroconductive powder becomes smaller, when using screen printing conductive pattern, exist
Sieve occurs to block or be difficult to form the worry of fine pitch wirings.
Also, the BET specific surface area of flakelike powder is as above preferably 0.1~1m2In the range of/g, more preferably 0.2~
0.8m2In the range of/g, further preferably 0.2~0.5m2In the range of/g.The BET specific surface area of flakelike powder is less than
0.1m2When/g, due to piece thickness excessively thickens and the shape of flakelike powder is close to spherical shape, electroconductive powder is mutual to be connect
Contacting surface product has the tendency that becoming smaller, and there is the worry that cannot get sufficient conductivity.On the other hand, the BET specific surface area of flakelike powder
More than 1m2When/g, although the mutual contact area of electroconductive powder becomes larger, since slurry viscosity increases, cause in distress
With the tendency of high fillingization (i.e., it is difficult to increase the electroconductive powder content in electrocondution slurry constituent), thus exists and cannot get
The worry of sufficient conductivity.
Also, the tap density of flakelike powder is as above preferably 3~7g/cm3In the range of, more preferably 3~6g/cm3Model
In enclosing, further preferably 3.5~5.5g/cm3In the range of.The tap density of flakelike powder is less than 3g/cm3When, flakelike powder
Volume becomes larger, and has the tendency that being difficult to high fillingization, accordingly, there exist the worries that cannot get sufficient conductivity.On the other hand, vibration density
Degree is more than 7g/cm3When, it is generally difficult to industrially produce flakelike powder.
Also, in the range of the aspect ratio of flakelike powder as above preferably 5~15, in the range of more preferably 6~12, into one
In the range of step preferably 6~10.When the aspect ratio of flakelike powder is less than 5, flaking is insufficient to cause electroconductive powder mutual
Contact area have the tendency that becoming smaller, there is the worry that cannot get sufficient conductivity.On the other hand, when aspect ratio is more than 15, though
The right mutual contact area of electroconductive powder becomes larger, but has the tendency that being difficult to high fillingization, thus existing cannot be abundant
The worry of electric conductivity.
The manufacturing method of the flakelike powder is not particularly limited, and well known method may be used.Can be specifically：Example
Such as, (aftermentioned) for original powder with the globular powder manufactured by well known method, well known mechanical treatment is implemented to the original powder, is made with this
Make flakelike powder.The physical properties such as the grain size and agglutination degree of original powder, can be according to the use purpose (electrode of electrocondution slurry constituent
With the type of wiring etc. or have the electronic component of these electrodes and wiring etc. or the type of electronic device etc.) make it is appropriate
Selection.
Next, the preferred structure about globular powder in (A) electroconductive powder of the present invention is described in detail.It is spherical
The average grain diameter D50 of powder is preferably in the range of 0.1~10 μm, and BET specific surface area is preferably 0.5~1.7m2The range of/g
Interior, tap density is preferably 1.5~5g/cm3, agglutination degree D50/DSEM is preferably in the range of 2~15.
More specifically, in the range of preferably 0.1~10 μm as above of the average grain diameter D50 of globular powder, more preferable 1~5 μ
In the range of m, in the range of further preferred 1~3 μm.When the average grain diameter D50 of globular powder is less than 0.1 μm, there are thermosettings
Change type electrocondution slurry occurs high viscosity, is difficult to slurried worry.On the other hand, when average grain diameter D50 is more than 10 μm, with piece
The case where sprills, is identical, when using screen printing conductive pattern, exists and sieve blocking occurs or is difficult to form fine pitch wirings
Worry.
Also, the BET specific surface area of globular powder is as above preferably 0.5~1.7m2In the range of/g, more preferably 0.6~
1.6m2In the range of/g, further preferably 0.9~1.6m2In the range of/g.The BET specific surface area of globular powder is less than
0.5m2When/g, the mutual contact area of (A) electroconductive powder has the tendency that becoming smaller, and there is the load that cannot get sufficient conductivity
Sorrow.On the other hand, BET specific surface area is more than 1.7m2When/g, although the mutual contact area of (A) electroconductive powder becomes larger,
But since slurry viscosity increases, have the tendency that being difficult to high fillingization, thus there is the worry that cannot get sufficient conductivity.
Also, the tap density of globular powder is as above preferably 1.5~5g/cm3In the range of, more preferably 2~5g/cm3's
In range, further preferably 3~4g/cm3In the range of.The tap density of globular powder is less than 1.5g/cm3When, (A) is conductive
Property powder volume become larger, have the tendency that being difficult to high fillingization, accordingly, there exist the worries that cannot get sufficient conductivity.On the other hand,
Tap density is more than 5g/cm3When, the dispersibility of spherical powder is excessively good, resin component be easy to move into (A) electroconductive powder it
Between, therefore the mutual interface resistance of (A) electroconductive powder has bigger tendency, there is the worry that cannot get sufficient conductivity.
Also, in the range of the agglutination degree D50/DSEM of globular powder as above preferably 2~15, more preferably 3~11 model
In enclosing, in the range of further preferably 3~7.5.When agglutination degree D50/DSEM is less than 2, the dispersibility of globular powder is excessively good
Good, resin component is easy to move between (A) electroconductive powder, and therefore the mutual interface resistance of (A) electroconductive powder, which has, becomes larger
Tendency, there is the worry that cannot get sufficient conductivity.On the other hand, when agglutination degree D50/DSEM is more than 15, (A) electric conductivity powder
Opisthosoma product becomes larger, and has the tendency that being difficult to high fillingization, accordingly, there exist the worries that cannot get sufficient conductivity.
The manufacturing method of the globular powder is not particularly limited, in this embodiment, for example, can properly use by
Globular powder made from wet-type reduction method can also use spherical made from the other methods well known to electrolysis, atomization etc.
Powder.
[(B) thermohardening type resin]
(B) thermohardening type resin, can suitably make used in thermohardening type electrocondution slurry constituent according to the present invention
With well known ingredient in heat-curing type electrocondution slurry constituent field.It is representative, can enumerate (B1) epoxy resin and
(B2) blocked polyisocyanate compound.In order to realize good conductor resistance, (B) thermohardening type resin preferably comprises (B2)
Blocked polyisocyanate compound, or contain (B1) epoxy resin and (B2) blocked polyisocyanate compound.
As (B) thermohardening type resin, (B1) epoxy resin and (B2) blocked polyisocyanate compound are used
In the case of, as described below, preferably compares according to the allotment of regulation and be used cooperatively.
(B1) the specific type and structure of epoxy resin are not particularly limited, but preferably have in arbitrary 1 molecule 2 with
The polynary epoxy resin of upper oxirane ring (epoxy group).It can enumerate：For example, making epoxychloropropane and phenol novolac tree
The polyphenol such as the phenolic resin such as fat, cresol novolac resin, bisphenol-A, hydrogenated bisphenol A, Bisphenol F, bisphenol-A D, resorcinol, second two
Obtained by the polyol reactions such as alcohol, neopentyl glycol, glycerine, trihydroxymethyl propane, pentaerythrite, triethylene-glycol, polypropylene glycol
Diglycidyl ether type；The glycidyl amine of gained is reacted with multiamino compounds such as ethylenediamine, trien, aniline
Type；The glycidyl ester type that gained is reacted with polycarboxylic compounds such as adipic acid, phthalic acid, M-phthalic acids, by alkene
Alicyclic ring type synthesized by oxidation of hydrocarbon etc. etc..These epoxy resin may be used alone, can also be used in combination.
Also, (B2) blocked polyisocyanate compound can properly use in thermohardening type electrocondution slurry field it is well known
Compound.
Specifically, can enumerate：For example, toluene di-isocyanate(TDI), '-diphenylmethane diisocyanate, polymethylene polyphenyl
The aromatic series isocyanides such as polyisocyanates, dimethyl diphenyl diisocyanate, benzene dimethylene diisocyanate, naphthalene diisocyanate
Acid esters；Hexamethylene diisocyanate, isophorone diisocyanate, hydrogenation benzene dimethylene diisocyanate, dicyclohexyl
Aliphatic polyisocyantes such as methane diisocyanate, two isocyano group octanes, trimethyl hexamethylene diisocyanate etc..These
One kind can be used only in polyisocyanate compound, can also appropriately combined two or more uses.Also, these polyisocyanic acid are esterified
It closes in object, more preferably using the poly methylene poly phenyl poly isocyanate of more than three nucleomes (tri-or more nuclear).
Also, in this implementation form, also can suitably using by well known method make well known polyisocyanates with it is known
Polyol reaction and the polyisocyanate compound of the compound for containing terminal isocyanate group that synthesizes as the present invention.It is this
In the case of used polyalcohol be not particularly limited, can properly use general polyether polyols alcohols, polyester polyols alcohols,
Polycarbonate polyol class etc..
(B2) blocked polyisocyanate compound of the present invention, by being closed to above-mentioned polyisocyanate compound
It is obtained after change, the sealer about polyisocyanate compound is also not particularly limited, and can properly use imidazoles, phenol
Class, oximes etc..
In thermohardening type electrocondution slurry according to the present invention, while using (B1) epoxy resin and (B2) enclosed type more
As in the case of (B) thermohardening type resin, their mixing ratio (allotment ratio) is not particularly limited isocyanate compound, excellent
It is selected in mass ratio B1：B2=0:100~90:10(0:Except 100) in the range of allocated, more preferably 10:90~80:20
In the range of allocated.
With (B1) epoxy resin and when adding up to 100 mass parts of (B2) blocked polyisocyanate compound, (B1) ring
When oxygen resin is 90 below mass part, i.e., when (B2) blocked polyisocyanate compound is 10 mass parts or more, (B2) closing
Promote the significant effect of the mutual contact of (A) electroconductive powder caused by the cure shrinkage of type polyisocyanate compound,
Sufficient electric conductivity can be obtained, therefore more satisfactory.
(B) content of thermohardening type resin is not particularly limited, in this embodiment, preferably with respect to 100 mass parts
(A) electroconductive powder is in the range of 1~40 mass parts, more preferably in the range of 1~30 mass parts, further preferably 1
In the range of~20 mass parts.(B) good with the adherence of substrate when the content of thermohardening type resin is 1 mass parts or more, 40
When below mass part, sufficient electric conductivity can be obtained, therefore more satisfactory.
Also, thermohardening type electrocondution slurry according to the present invention, (B) thermohardening type resin in addition to (B1) epoxy resin and
(B2) can also include as other resins well known to binder resin other than blocked polyisocyanate compound.As can
Other resins as binder resin, it can be cited for example that phenolic resin, polyester resin, polyurethane resin, acrylic resin, three
Melamine-formaldehyde resin, polyimide resin, organic siliconresin etc., but not limited thereto.
[(C) curing agent]
(C) used in thermohardening type electrocondution slurry according to the present invention as long as curing agent can make (B) thermohardening type
The compound of resin solidification, is not particularly limited.In this embodiment, (B) thermohardening type resin preferably comprises (B2)
Blocked polyisocyanate compound contains (B1) epoxy resin and (B2) blocked polyisocyanate compound, therefore,
(C) as long as curing agent at least makes the compound of (B1) epoxy resin or (B2) blocked polyisocyanate compound cures i.e.
Can, type is not particularly limited, and can enumerate well known various compounds in thermohardening type electrocondution slurry field.
It can specifically enumerate：For example, phthalic anhydride, trimellitic anhydride, pyromellitic dianhydride, maleic acid
Acid anhydride, tetrabydrophthalic anhydride, methyl tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methylhexahydrophthaacid acid
The anhydrides such as acid anhydride, succinic anhydride；Imidazoles, 2-methylimidazole, 2-ethyl-4-methylimidazole, 2- undecyl imidazoles, 2- heptadecanes
Base imidazoles, 1 benzyl 2 methyl imidazole, 2- phenyl -4-methylimidazole, 1- 1-cyanoethyl-2-methylimidazoles, 1- aminoethyl -2- first
The imidazoles such as base imidazoles, 1- methylimidazoles, 2- ethyl imidazol(e)s；Dimethyl octylame, dimethyldodecyl amide, dimethyl lauryl amine, 14
It is alkyl dimethyl tertiary amide, hexadecyldimethyl benzyl ammonium tertiary amine, octadecyldimethyl tertiary amine, docosyl dimethyl tertiary amine, double
Dodecyl ethamine, methyl didecylamine, two oleyl amine of methyl, triallylamine, triisopropanolamine, triethylamine, 3- (dibutyl amines
Base) propylamine, trioctylamine, 2,4,6- tri- (dimethylamino methyl) phenol, triethanolamine, methyl diethanolamine, diazabicyclo ten
The three-levels amine such as one alkene；Boron trifluoride ether, boron trifluoride phenol, piperidines boron trifluoride, boron trifluoride acetic acid, boron trifluoride list
Ethamine, boron trifluoride-triethanolamine, boron trifluoride monoethanolamine etc. contain the lewis acid of boron fluoride or its compound；It is purchased from
AJICURE Series Ps N-23 or MY-24 of aginomoto fine chemistry Co., Ltd. etc., purchased from chemical conversion industry Co., Ltd. of Fuji
The amine additives such as FUJICURE series FXR-1020 or FXR-1030；Dicyandiamide etc..One kind can be used only in these compounds,
It can be with appropriately combined two or more uses.
(C) additive amount of curing agent is not particularly limited, in this embodiment, preferably with respect to 100 mass parts (B) heat
Gel-type resin is in the range of 1~30 mass parts, more preferably in the range of 1~15 mass parts, further preferably 1~10
In the range of mass parts.(C) when the additive amount of curing agent is less than 1 mass parts, there is generation (B) thermohardening type resin solidification and do not fill
The worry divided, in addition, there are the worries that solidfied material (electrode and wiring etc.) cannot get satisfactory electrical conductivity.On the other hand, more than 30 matter
When measuring part, there are the worries that slurry viscosity is got higher, also, also undesirable in cost.
[(D) inorganic ion exchanger]
(C) inorganic ion exchanger used in thermohardening type electrocondution slurry constituent according to the present invention, as long as can catch
Grasp the copper ion in thermohardening type electrocondution slurry constituent, be not particularly limited, preferably with zirconium, magnesium, aluminium, silicon, antimony, with
And any one in bismuth is principal component.
The principal component that (D) inorganic ions of the present invention exchanges, refers to containing in the ingredient of composition (D) inorganic ion exchanger
There is the ingredient of 50 mass % or more.
Such (D) inorganic ion exchanger, can specifically enumerate：For example, the IXEPLAS purchased from Toagosei Co., Ltd
Series, IXE series cation exchange or cation and anion exchange type (IXEPLAS A-1, A-2, B-1, IXE-100,300,
600,633,6107,6136 etc.), or purchased from Kyowa Chemical Industry Co., Ltd KYOWAAD series cation exchange or
Cation and anion exchange type (KYOWAAD 600,700,1000,2000 etc.).One kind can be used only in they, can also be appropriate group
Close two or more uses.
In the present invention, it is preferred to, relative to (A) electroconductive powder, (D) inorganic ion exchanger contains 0.01~3 matter
Measure the amount of %, the further preferably amount of 0.02~2 mass %, the further preferably amount of 0.03~1 mass %.(D) inorganic
When the content of ion exchanger is 0.01 mass % or more, copper ion can be fully captured, there is superior storage stability,
When content is 3 mass % or less, sufficient electric conductivity can be obtained, therefore more satisfactory.
[manufacture of thermohardening type electrocondution slurry constituent]
The manufacturing method of thermohardening type electrocondution slurry constituent according to the present invention is not particularly limited, and can properly use
Well known method in thermohardening type electrocondution slurry field.As a representative example, can enumerate by above-mentioned each ingredient according to
Defined allotment ratio (quality criteria) is allocated, and slurried method is carried out using well known mixing arrangement.Mixing arrangement can
To enumerate such as three-roll grinder.
In addition, in the thermohardening type electrocondution slurry of the present invention, as needed, above-mentioned each ingredient ((A) electric conductivity powder is removed
End, (B) thermohardening type resin, (C) curing agent and (D) inorganic ion exchanger) other than, thermohardening type conductive paste can also be contained
Well known various additives in material field.The additive is not particularly limited, and can specifically enumerate：For example, dispersant, homogenizing
Agent, antioxidant, ultra-violet absorber, silane coupling agent, antifoaming agent, viscosity modifier etc..It can not interfere the present invention's
These additives are added in the range of function and effect.
Also, be not particularly limited by the method that the thermohardening type electrocondution slurry constituent of the present invention forms conductive pattern,
Well known various methods can be properly used.It is representative, shown in embodiment as be described hereinafter, silk screen print method etc. can be enumerated, in particular,
Although can suitably by the silk screen print method formed conductive pattern, however, the present invention is not limited thereto, ink-jet method and cloth arching pushing etc. its
His printing process is also applicable；
[purposes of thermohardening type electrocondution slurry constituent]
Thermohardening type electrocondution slurry according to the present invention is widely available in the electrode for forming fine and wiring etc..Specifically
It may be suitably used to following purposes：For example, the collecting electrodes of solar cell；The external electrode of electronic element；RFID (nothings
Line Radio Frequency Identification Technology Radio Frequency Identification), electromagnetic wave shielding, oscillator bonding, thin film switch or
The electrode of device or wiring etc. used in electroluminescent etc..One of especially preferred purposes on the way, Ke Yiju are used as these
The collecting electrodes of sunny energy battery.
Embodiment
Based on embodiment, comparative example and reference example, the present invention is described in more detail, but present invention is not limited to this.
Those skilled in the art can make various changes on the basis of not departing from the scope of the present invention, change and change.In addition,
The evaluation of measuring of various synthetic reactions and physical property in following embodiment is carried out according to following the description.
(measuring and evaluating method)
[evaluation method of electroconductive powder]
(1) average grain diameter D50
The average grain diameter D50 of flakelike powder and globular powder is evaluated by laser diffractometry.Weigh 0.3g sheets
Powder or globular powder sample are in 50ml beakers, and after 30ml isopropanols are added, by ultrasonic cleaner, (sub- speed is prosperous
(ASONE) Co., Ltd. manufacture USM-1) processing 5 minutes so that its disperse, using micro- diameter particle size distribution device (day machine fill
Micro- diameter particle size distribution device 9320-HRA X-100 of Co., Ltd.'s manufacture) it measures and evaluates average grain diameter D50.
(2) evaluation of BET specific surface area
The BET specific surface area of flakelike powder or globular powder is measured and is evaluated by the following method：It is flowed with direct-reading dynamic
Method specific surface area analysis instrument MONOSORB (manufacture of Kang Ta (Quanta Chrome) company) carries out nitrogen adsorption to 1g samples
BET single-point methods.In addition, in BET specific surface area measurement, the exhaust conditions before measurement are set as：60 DEG C, 10 minutes.
(3) evaluation of tap density
The tap density of flakelike powder or globular powder uses tap density measurement device (Co., Ltd.'s bavin mountain instruments for scientific research
Make manufactured heap density measuring device SS-DA-2), it weighs 15g samples and is added in 20ml test tubes, touched with 20mm drops
1000 times, tap density is calculated according to following formula and is evaluated.
Sample accommodating (cm after tap density=sample quality (15g)/tapping3)
[measurement of slurry viscosity]
The DV-III viscosimeters that the slurry viscosity of thermohardening type electrocondution slurry constituent is manufactured using Brookfield companies
It measures.Using CP-52 as the cone (cone) when measuring, the slurry viscosity (η of (shear rate 2s-1) when measuring 1rpm rotations
1rpm)。
[measurement of conductor resistance]
Using aluminum oxide substrate as base material.Also, as shown in Figure 1, on the surface of the aluminum oxide substrate, use embodiment
Or the thermohardening type electrocondution slurry constituent of comparative example, screen printing, which brushes out both ends, has terminal 11a and 11b and wiring portion
11c is in the curved conductive pattern 11 of Curved Continuous.Then, aluminum oxide substrate is heated 60 minutes in 180 DEG C of air drier,
Conductive pattern 11 (thermohardening type electrocondution slurry constituent) is set to cure.Thus conductor resistance sample for evaluation is made.
About each embodiment or the conductor resistance sample for evaluation of comparative example, with talysurf (Co., Ltd.'s Tokyo essence
Close manufacture SURFCOM480A) measure conductive pattern 11 film thickness, with digital multimeter (Advantest Corp
(Advantest) R6551 is manufactured) resistance is measured, conductor electricity is calculated based on the aspect ratio of the film thickness and resistance and wiring pattern
It hinders and is evaluated.
[table 1]
[table 2]
[table 3]
(embodiment 1~19) (comparative example 1~5) (reference example 1~2)
[thermohardening type electrocondution slurry constituent preparation method]
Utilize (B) thermohardening type resin, (C) curing agent and (D) nothing shown in (A) electroconductive powder, table 2 shown in table 1
Machine ion exchanger, (A) electroconductive powder/(B) thermohardening type resin/(C) curing agent with the ratio of mass ratio 90/10/0.5 into
Row allotment, (D) inorganic ion exchanger is relative to (A) electroconductive powder, according to allotment shown in table 3 than adding and being ground with three rollers
After grinding machine mixing, it is 100Pas (1rpm) that butyl acetate, which is added, and adjusts the viscosity of slurry, and thermohardening type is made
Electrocondution slurry constituent.
In table 1, copper alloy is the alloy for being added to nickel and zinc.
About the thermohardening type electrocondution slurry constituent of gained, after measuring the conductor resistance at its initial stage, preserving 3 days at 30 DEG C
And the viscosity after being preserved 3 months at 0 DEG C and conductor resistance.The results are shown in Table 4.
Shown in table 4 through regulation preserve during after viscosity and conductor resistance, show by and then thermohardening type conduction
Viscosity and conductor resistance after the preparation of slurry constituent are set as relative value when 1.0.
[table 4]
The result of embodiment 1~19 and comparative example 1~5 is compared, it is known that：The viscosity of embodiment 1~19 and
Conductor resistance is 1.0 or 1.1, and the viscosity of comparative example 1~5 is 1.4 or more, and conductor resistance is 1.2 or more, by containing
(D) inorganic ion exchanger, the thermohardening type using copper, wicker copper, copper alloy or wicker copper alloy as (A) electroconductive powder
Viscosity and the conductor resistance variation of electrocondution slurry are small, can obtain good result.
According to present invention as described above, by (D) inorganic ion exchanger is used, can provide even if electroconductive powder
Using copper, copper alloy, wicker copper and wicker copper alloy, increases prevented also from viscosity caused by preservation and electric conductivity reduces, has
There is the thermohardening type electrocondution slurry constituent of excellent storage stability.
In addition, the present invention is not limited to the record of above-mentioned implementation form, it can be within the scope of the claims
It makes various changes, carries out appropriately combined to the technological means disclosed in different embodiments and multiple variations respectively and obtain
Implementation form be also contained in the present invention technical scope within.
Industrial applicability
The present invention may be suitably used to the manufacturing field of various e-machines and electronic component, in particular, may be suitably used to：
The collecting electrodes of solar cell, the external electrode of electronic element, RFID, electromagnetic wave shielding, oscillator bonding, thin film switch
Or the electrode of device or wiring etc. used in electroluminescent etc. seek to be formed the electrode of more fine and the field of wiring.
Symbol description：
11 conductive patterns
11a terminals
11b terminals
11c wiring portions.
Claims (9)
1. a kind of thermohardening type electrocondution slurry constituent, which is characterized in that the thermohardening type electrocondution slurry constituent contains（A）
Electroconductive powder,（B）Thermohardening type resin,（C）Curing agent and（D）Inorganic ion exchanger；
（A）Electroconductive powder uses at least one selected from the group being made of copper, copper alloy, wicker copper and wicker copper alloy
Kind；
（B）Thermohardening type resin contains blocked polyisocyanate compound, or contains blocked polyisocyanate compound
And epoxy resin；
Viscosity after the thermohardening type electrocondution slurry constituent preserves 3 days at 30 DEG C is and then thermohardening type electrocondution slurry
1.0 or 1.1 times of viscosity after the preparation of constituent,
Conductor resistance after the thermohardening type electrocondution slurry constituent preserves 3 days at 30 DEG C is that and then thermohardening type is conductive
1.0 times of conductor resistance after the preparation of slurry constituent,
Viscosity after being preserved 3 months at 0 DEG C of the thermohardening type electrocondution slurry constituent is and then thermohardening type electrocondution slurry
1.0 times of viscosity after the preparation of constituent,
Conductor resistance after being preserved 3 months at 0 DEG C of the thermohardening type electrocondution slurry constituent is that and then thermohardening type is conductive
1.0 times of conductor resistance after the preparation of slurry constituent.
2. thermohardening type electrocondution slurry constituent according to claim 1, which is characterized in that described（D）Inorganic ions is handed over
Body is changed using any one in zirconium, magnesium, aluminium, silicon, antimony and bismuth as principal component.
3. thermohardening type electrocondution slurry constituent according to claim 1 or 2, which is characterized in that described（D）Inorganic ions
The content of permutoid is relative to described（A）Electroconductive powder is 0.01~3 mass %.
4. thermohardening type electrocondution slurry constituent according to claim 1 or 2, which is characterized in that described（A）Electric conductivity powder
End is using at least one and silver selected from the group being made of copper, copper alloy, wicker copper and wicker copper alloy；
At least one and silver-colored allotment ratio selected from the group being made of copper, copper alloy, wicker copper and wicker copper alloy
For mass ratio 100:0~1:99, and 100:Except 0.
5. thermohardening type electrocondution slurry constituent according to claim 3, which is characterized in that described（A）Electroconductive powder
Using at least one and silver selected from the group being made of copper, copper alloy, wicker copper and wicker copper alloy；
At least one and silver-colored allotment ratio selected from the group being made of copper, copper alloy, wicker copper and wicker copper alloy
For mass ratio 100:0~1:99, and 100:Except 0.
6. thermohardening type electrocondution slurry constituent according to claim 1 or 2, which is characterized in that described（A）Electric conductivity powder
Also contain at least one selected from the group being made of gold, palladium, nickel, aluminium, lead and carbon in end.
7. thermohardening type electrocondution slurry constituent according to claim 3, which is characterized in that described（A）Electroconductive powder
Also contain at least one selected from the group being made of gold, palladium, nickel, aluminium, lead and carbon.
8. thermohardening type electrocondution slurry constituent according to claim 4, which is characterized in that described（A）Electroconductive powder
Also contain at least one selected from the group being made of gold, palladium, nickel, aluminium, lead and carbon.
9. thermohardening type electrocondution slurry constituent according to claim 5, which is characterized in that described（A）Electroconductive powder
Also contain at least one selected from the group being made of gold, palladium, nickel, aluminium, lead and carbon.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013251243A JP6259270B2 (en) | 2013-12-04 | 2013-12-04 | Thermosetting conductive paste composition |
| JP2013-251243 | 2013-12-04 | ||
| PCT/JP2014/005777 WO2015083332A1 (en) | 2013-12-04 | 2014-11-18 | Heat-cured conductive paste composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105793931A CN105793931A (en) | 2016-07-20 |
| CN105793931B true CN105793931B (en) | 2018-09-28 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480064513.7A Expired - Fee Related CN105793931B (en) | 2013-12-04 | 2014-11-18 | Thermohardening type electrocondution slurry constituent |
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| Country | Link |
|---|---|
| JP (1) | JP6259270B2 (en) |
| CN (1) | CN105793931B (en) |
| WO (1) | WO2015083332A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP6383183B2 (en) * | 2014-06-03 | 2018-08-29 | 太陽インキ製造株式会社 | Conductive adhesive and electronic component using the same |
| JP6804286B2 (en) * | 2015-12-28 | 2020-12-23 | Ｄｏｗａエレクトロニクス株式会社 | Silver alloy powder and its manufacturing method |
| WO2017115462A1 (en) * | 2015-12-28 | 2017-07-06 | Ｄｏｗａエレクトロニクス株式会社 | Silver alloy powder and method for producing same |
| CN110012617A (en) * | 2019-04-03 | 2019-07-12 | 东莞塘厦裕华电路板有限公司 | A kind of via-hole of circuit board production method |
| CN113066600B (en) * | 2021-03-24 | 2023-03-14 | 北京梦之墨科技有限公司 | Conductive paste and electronic device |
| CN113782252B (en) * | 2021-11-15 | 2022-03-01 | 西安宏星电子浆料科技股份有限公司 | UV heating dual-curing conductive slurry and preparation method thereof |
| CN114188066A (en) * | 2021-11-30 | 2022-03-15 | 苏州市贝特利高分子材料股份有限公司 | High-crystallization silver powder and low-cost heterojunction silver paste as well as preparation method and application thereof |
| CN116913576B (en) * | 2023-07-10 | 2024-05-28 | 乐凯胶片股份有限公司 | Conductive paste and heterojunction solar cell |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6345702A (en) * | 1986-08-11 | 1988-02-26 | 東亞合成株式会社 | Paste containing metal |
| JP3010843B2 (en) * | 1991-10-28 | 2000-02-21 | 日立化成工業株式会社 | Conductive resin paste composition and semiconductor device using this composition |
| JPH10330611A (en) * | 1997-06-02 | 1998-12-15 | Asahi Chem Ind Co Ltd | Resin composition |
| JP3558593B2 (en) * | 2000-11-24 | 2004-08-25 | 京都エレックス株式会社 | Heat-curable conductive paste composition |
| JP2002294145A (en) * | 2001-03-28 | 2002-10-09 | Nippon Paint Co Ltd | Non-lead cationic electrodeposition coating material composition |
| JP4089368B2 (en) * | 2002-09-18 | 2008-05-28 | 住友電気工業株式会社 | Conductive paste |
| JP4481734B2 (en) * | 2004-06-10 | 2010-06-16 | 三菱樹脂株式会社 | Conductive paste composition for multilayer wiring board |
| JP5402350B2 (en) * | 2009-07-24 | 2014-01-29 | 藤倉化成株式会社 | Method for producing conductive paste and conductive paste |
| JP2011086397A (en) * | 2009-10-13 | 2011-04-28 | Asahi Kasei E-Materials Corp | Conductive paste and semiconductor device |
| KR20140079268A (en) * | 2012-12-18 | 2014-06-26 | 솔브레인 주식회사 | Conductive paste composition, conductive layer prepared by using the same, electronic device and display comprising the conductive layer |
| WO2014104053A1 (en) * | 2012-12-27 | 2014-07-03 | 荒川化学工業株式会社 | Conductive paste for screen printing, method for producing wiring line, and method for producing electrode |
| WO2014112433A1 (en) * | 2013-01-18 | 2014-07-24 | 東洋紡株式会社 | Conductive paste, conductive film, electrical circuit and touch panel |
-
2013
- 2013-12-04 JP JP2013251243A patent/JP6259270B2/en active Active
-
2014
- 2014-11-18 CN CN201480064513.7A patent/CN105793931B/en not_active Expired - Fee Related
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Also Published As
| Publication number | Publication date |
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| JP2015109195A (en) | 2015-06-11 |
| WO2015083332A1 (en) | 2015-06-11 |
| CN105793931A (en) | 2016-07-20 |
| JP6259270B2 (en) | 2018-01-10 |
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