KR20150060683A - Anisotropic conductive film, connection method, and connected body - Google Patents

Abstract

A conductive particle-containing layer containing conductive particles, a filler and a cationic curing agent, and a conductive particle-containing layer containing a cationic curing agent and containing no filler Wherein the conductive particles are at least one of metal particles and metal coated resin particles, and the filler is at least one of a metal hydroxide and a metal oxide.

Description

TECHNICAL FIELD [0001] The present invention relates to an anisotropic conductive film, an anisotropic conductive film, a connection method,

The present invention relates to an anisotropic conductive film, a connection method and a junction body.

Conventionally, as a means for connecting electronic components, a tape-shaped connection material (for example, anisotropic conductive film (ACF)) in which a curable resin in which conductive particles are dispersed is applied to a release film is used.

The anisotropic conductive film is used for connecting terminals of a flexible printed circuit board (FPC) or an IC chip and an ITO (Indium Tin Oxide) electrode formed on a glass substrate of an LCD panel, Are used for bonding together and electrically connecting each other.

In recent years, in anisotropic conductive connection between electronic parts using the anisotropic conductive film, in order to cope with high densification of a junction body obtained by connection, low cost of connection, suppression of warpage of a substrate due to high temperature connection, An anisotropic conductive film using a cationic curing agent capable of rapid curing has been used.

However, in the anisotropic conductive film using the cationic curing agent, there is a problem that the wiring formed in the electronic component is corroded by the acid generated when the cationic curing agent is used. Further, there is a problem that the adhesion is not sufficient.

It is known that a metal hydroxide or a metal oxide can be used for the connection material in order to prevent corrosion of the wiring (see, for example, paragraph [0040] of Patent Document 1). However, corrosion of the wiring can not be prevented simply by adding a metal hydroxide or a metal oxide to the anisotropic conductive film using the cationic curing agent. Further, adhesion is not sufficient.

Therefore, it is possible to achieve low-temperature curing and fast curing while satisfying the prevention of shot in an electronic component, an excellent particle trapping rate, and a low connection resistance, which are required for an anisotropic conductive film and which are required for an anisotropic conductive film, It is a further object of the present invention to provide an anisotropic conductive film using a cationic curing agent excellent in adhesion and a connection method using the anisotropic conductive film and a junction body obtained by the connection method.

Japanese Patent Application Laid-Open No. 2011-111556

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned conventional problems and to achieve the following objects. That is, the present invention relates to an anisotropic conductive film which is capable of achieving low-temperature curing and fast curing while satisfying a shot preventing property, an excellent particle trapping rate and a low connection resistance in an electronic component in an obtained bonded body, And an object of the present invention is to provide an anisotropic conductive film using a cationic curing agent which prevents corrosion and is also excellent in adhesion, a connection method using the anisotropic conductive film, and a junction body obtained by the connection method.

Means for solving the above problems are as follows. In other words,

≪ 1 > An anisotropic conductive film for anisotropic conductive connection between a terminal of a first electronic component and a terminal of a second electronic component,

A conductive particle-containing layer containing conductive particles, a filler and a cationic curing agent,

An insulating adhesive layer containing a cationic curing agent and containing no filler,

Wherein the conductive particles are at least one of metal particles and metal-coated resin particles,

Wherein the filler is at least one of a metal hydroxide and a metal oxide.

<2> The anisotropic conductive film according to <1>, wherein at least one of metal hydroxide and metal oxide is at least one of aluminum hydroxide, magnesium hydroxide and aluminum oxide.

<3> The anisotropic conductive film according to any one of <1> to <2>, wherein the conductive particle-containing layer contains a film-forming resin and a curable resin.

<4> The anisotropic conductive film according to the item <3>, wherein the content of the filler in the conductive particle-containing layer is 0.20 parts by mass to 90 parts by mass based on 100 parts by mass of the total amount of the film forming resin, the curable resin and the cationic curing agent.

<5> The anisotropic conductive film according to any one of <1> to <4>, wherein the filler is particulate and the average particle diameter of the filler is 0.5 μm to 3.5 μm.

<6> The anisotropic conductive film according to any one of <1> to <5>, wherein the filler is in a non-spherical particle shape.

&Lt; 7 > A connection method for anisotropic conductive connection between a terminal of a first electronic component and a terminal of a second electronic component,

A first arranging step of disposing the anisotropic conductive film described in any one of < 1 > to < 6 > on a terminal of the second electronic component;

A second disposing step of disposing the first electronic component on the anisotropic conductive film and the terminal of the first electronic component in contact with the anisotropic conductive film;

And a heating and pressing step of heating and pressing the first electronic component with a heating and pressing member.

<8> A bonded body obtained by the connection method described in <7> above.

According to the present invention, it is possible to solve the above-mentioned problems in the related art and to achieve the above objects, and to provide a method for preventing shot in an electronic component, an excellent particle capture rate, and a low connection resistance in an obtained bonded body required for an anisotropic conductive film An anisotropic conductive film using a cationic curing agent which is capable of low-temperature curing and quick curing and which is capable of preventing corrosion of wiring of electronic components and having excellent adhesiveness, and a connection method using the anisotropic conductive film and a connection method Can be obtained.

(Anisotropic conductive film)

The anisotropic conductive film of the present invention has at least a conductive particle-containing layer and an insulating adhesive layer, and has other layers as required.

The anisotropic conductive film is an anisotropic conductive film that anisotropically conductively connects the terminal of the first electronic component and the terminal of the second electronic component.

The structure of the anisotropic conductive film is not particularly limited and may be appropriately selected in accordance with the purpose, but a two-layer structure including the conductive particle-containing layer and the insulating adhesive layer is preferable.

<First Electronic Component and Second Electronic Component>

The first electronic component and the second electronic component are not particularly limited and may be appropriately selected in accordance with the purpose as long as they are electronic components having terminals to be subjected to anisotropic conductive connection using the anisotropic conductive film. A glass substrate, a flexible substrate, a rigid substrate, an IC (integrated circuit) chip, TAB (tape automated bonding), and a liquid crystal panel. Examples of the glass substrate include an Al wiring-forming glass substrate and an ITO wiring-forming glass substrate. Examples of the IC chip include a liquid crystal screen control IC chip in a flat panel display (FPD).

<Conductive Particle Containing Layer>

The conductive particle-containing layer contains at least conductive particles, a filler, and a cationic curing agent, preferably a film-forming resin, a curable resin, and optionally other components.

- conductive particles -

The conductive particles are not particularly limited as long as they are at least one of metal particles and metal-coated resin particles, and can be appropriately selected according to the purpose.

The metal particles are not particularly limited and may be appropriately selected according to the purpose. Examples thereof include nickel, cobalt, silver, copper, gold, and palladium. These may be used alone or in combination of two or more.

Of these, nickel, silver and copper are preferable. For the purpose of preventing surface oxidation, these metal particles may be subjected to gold or palladium on their surfaces. It is also possible to use an insulating film having a metal protrusion or an organic material on its surface.

The metal-coated resin particle is not particularly limited as long as the surface of the resin particle is coated with a metal, and can be appropriately selected in accordance with the purpose. For example, the surface of the resin particle is coated with at least either of nickel, And particles coated with one metal. It is also possible to use an insulating film having a metal protrusion or an organic material on its surface.

The method of coating the metal particles with the resin particles is not particularly limited and can be appropriately selected according to the purpose, and examples thereof include an electroless plating method and a sputtering method.

The material of the resin particles is not particularly limited and may be appropriately selected according to the purpose. Examples thereof include styrene-divinylbenzene copolymer, benzoguanamine resin, crosslinked polystyrene resin, acrylic resin, styrene- .

The conductive particles may have conductivity at the time of anisotropic conductive connection. For example, even when the surface of the metal particles is coated with an insulating film, the metal particles function as the conductive particles if the particles are deformed during the anisotropic conductive connection to expose the metal particles.

The content of the conductive particles in the conductive particle-containing layer is not particularly limited and can be appropriately adjusted by the wiring pitch of the circuit member, the connection area, and the like.

- Filler -

The filler is not particularly limited as long as it is at least one of a metal hydroxide and a metal oxide, and can be appropriately selected according to the purpose.

The metal hydroxide and the metal oxide are used for preventing corrosion of wiring, improvement of adhesion, and improvement of insulation.

Examples of the metal hydroxide include aluminum hydroxide, magnesium hydroxide, calcium hydroxide and the like.

Examples of the metal oxide include aluminum oxide, silicon oxide, magnesium oxide, antimony oxide, tin oxide, titanium oxide, manganese oxide, and zirconium oxide.

Among them, at least one of aluminum hydroxide, magnesium hydroxide and aluminum oxide is preferable from the viewpoint of corrosion resistance and adhesion, and at least one of aluminum hydroxide and magnesium hydroxide is more preferable.

In addition, prevention of corrosion of metal hydroxide and metal oxide and improvement of adhesion are known as described in JP-A-2004-523661 and JP-A-2011-111556.

The filler is preferably in a particulate form.

Examples of the particulate filler include spherical fillers and non-spherical fillers. Of these, non-spherical fillers are preferable from the viewpoint of insulating properties, and amorphous fillers are more preferable.

The non-spherical shape is a shape other than the spherical shape.

The irregular shape means that the shape is non-spherical, and not only one kind of shape but also shapes having various shapes are mixed. Examples of the various forms include concavities, convexities, and projections.

The average particle diameter of the filler when the filler is in a particulate form is not particularly limited and may be appropriately selected according to the purpose, but is preferably from 0.5 mu m to 3.5 mu m, more preferably from 0.5 mu m to 2.0 mu m. When the average particle diameter is within the more preferable range, it is advantageous in that the insulating property, the particle trapping rate, and the connection resistance are better.

The average particle diameter is an arithmetic mean of the particle diameters, optionally measured for ten fillers.

When the filler is non-spherical, the maximum length of the particles is the particle diameter.

The particle diameter can be determined, for example, by observation using a scanning electron microscope or by a particle size distribution meter.

The ratio (A / B) of the average particle diameter (A) of the filler to the average particle (B) of the conductive particles when the filler is in a particulate form is not particularly limited and may be appropriately selected depending on the purpose. / 10 to 2/3, and more preferably 1/10 to 1/2. If the above ratio is within the more preferable range, it is advantageous in that the insulating property, the particle trapping rate, and the connection resistance are better.

The method for measuring the average particle diameter of the conductive particles is the same as the method for measuring the average particle diameter of the filler.

The content of the filler is not particularly limited and may be appropriately selected according to the purpose. It is preferably 0.20 parts by mass to 90 parts by mass with respect to 100 parts by mass of the total amount of the film forming resin, the curable resin and the cationic curing agent, More preferably 4.0 parts by mass to 30 parts by mass. When the content is within the more preferable range, it is advantageous in that it is excellent in corrosion resistance, adhesion, and insulation while maintaining low-temperature curing and fast curing.

- Cationic curing agent -

The cationic curing agent is not particularly limited as long as it is a curing agent that generates a cationic species, and can be appropriately selected in accordance with the purpose. Examples thereof include onium salts and the like.

Examples of the onium salt include a sulfonium salt and an iodonium salt.

Examples of the sulfonium salt include triarylsulfonium salts and the like.

The counter anion in the onium salt is not particularly limited and may be appropriately selected according to the purpose. Examples thereof include SbF ₆ ^- , AsF ₆ ^- , PF ₆ ^- , BF ₄ ^- , CH ₃ SO ₃ ^- , CF ₃ SO ₃ ^- , and the like.

The cationic curing agent may be a commercially available product. Examples of commercially available products include ADEKA OPTOMER SP-172 (manufactured by ADEKA), ADEKA OPTOMER SP-170 (manufactured by Adeka Kabushiki Kaisha), Adeka Optomer SP-152 (Trade name, manufactured by Shin-Etsu Chemical Co., Ltd.), ADEKA OPTOMER SP-150 (ADEKA KABUSHIKI CO., LTD.), Sun Aid SI-60L CPI-100P (manufactured by San-Aro Kasei K.K.), CPI-100P (available from Shin-Etsu Chemical Co., Ltd.), Sun Aid SI- (Manufactured by BASF), IRGACURE 250 (manufactured by BASF), and the like can be given.

The content of the cationic curing agent in the conductive particle-containing layer is not particularly limited and may be appropriately selected in accordance with the intended use. It is preferably 10 parts by mass to 50 parts by mass per 100 parts by mass of the film forming resin and the curing resin More preferably 20 parts by mass to 40 parts by mass.

- film forming resin -

The film-forming resin is not particularly limited and may be appropriately selected according to the purpose. Examples of the film-forming resin include a phenoxy resin, an unsaturated polyester resin, a saturated polyester resin, a urethane resin, a butadiene resin, a polyimide resin, Polyolefin resins and the like. These film-forming resins may be used alone or in combination of two or more. Of these, phenoxy resins are preferable from the viewpoints of film formability, workability, and connection reliability.

Examples of the phenoxy resin include resins synthesized with bisphenol A and epichlorohydrin.

The phenoxy resin may be appropriately synthesized, or a commercially available phenoxy resin may be used.

The content of the film-forming resin in the conductive particle-containing layer is not particularly limited and may be appropriately selected depending on the purpose.

- Curable resin -

The curable resin is not particularly limited as long as it is a resin that is cured by the action of a cationic curing agent. The resin can be appropriately selected in accordance with the purpose, and examples thereof include an epoxy resin.

The epoxy resin is not particularly limited and may be appropriately selected according to the purpose. Examples thereof include bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolak type epoxy resin, and modified epoxy resins thereof.

The content of the curable resin in the conductive particle-containing layer is not particularly limited and may be appropriately selected depending on the purpose.

- Other ingredients -

The other components are not particularly limited and can be appropriately selected according to the purpose, and examples thereof include a silane coupling agent and the like.

The silane coupling agent is not particularly limited and may be appropriately selected according to the purpose. Examples thereof include an epoxy silane coupling agent, an acrylic silane coupling agent, a thiol silane coupling agent, and an amine silane coupling agent.

The content of the silane coupling agent in the conductive particle-containing layer is not particularly limited and may be appropriately selected depending on the purpose.

The average thickness of the conductive particle-containing layer is not particularly limited and may be appropriately selected according to the purpose, but is preferably from 3 탆 to 30 탆, more preferably from 4 탆 to 20 탆, and particularly preferably from 4 탆 to 10 탆 .

The method for producing the conductive particle-containing layer is not particularly limited and may be appropriately selected depending on the purpose. For example, the conductive particle-containing layer may contain the conductive particles, the filler, and the cationic curing agent, , A method in which the blend containing the curable resin is mixed so as to be uniform, and the blended mixture is applied on a peeled polyethylene terephthalate (PET) film.

<Insulating Adhesive Layer>

The insulating adhesive layer contains at least a cationic curing agent, does not contain a filler, and contains other components as necessary.

- Cationic curing agent -

The cationic curing agent is not particularly limited and can be appropriately selected in accordance with the purpose. Examples of the cationic curing agent include the cationic curing agent exemplified in the explanation of the conductive particle-containing layer. The same is true of the preferred form.

The content of the cationic curing agent in the insulating adhesive layer is not particularly limited and may be appropriately selected in accordance with the intended use. The content of the cationic curing agent in the insulating adhesive layer is preferably 10 parts by mass to 50 parts by mass relative to 100 parts by mass of the total amount of the film forming resin and the curable resin More preferably 20 parts by mass to 40 parts by mass.

- Filler -

The filler is not particularly limited as long as it is at least one of a metal hydroxide and a metal oxide. The filler can be appropriately selected according to the purpose, and examples thereof include the fillers exemplified in the explanation of the conductive particle-containing layer.

- Other ingredients -

The other components are not particularly limited and can be appropriately selected according to the purpose, and examples thereof include a film forming resin, a curable resin, and a silane coupling agent.

The film-forming resin, the curing resin and the silane coupling agent are not particularly limited and can be appropriately selected in accordance with the purpose. For example, the film-forming resin, the curing resin and the curing resin exemplified in the explanation of the conductive particle- And the silane coupling agents described above. The same is true of the preferred form.

The average thickness of the insulating adhesive layer is not particularly limited and may be appropriately selected according to the purpose. The thickness is preferably 3 占 퐉 to 30 占 퐉, more preferably 5 占 퐉 to 20 占 퐉, and particularly preferably 7 占 퐉 to 15 占 퐉.

The method for producing the insulating adhesive layer is not particularly limited and may be appropriately selected in accordance with the purpose. For example, the insulating adhesive layer may contain the cationic curing agent and, if necessary, a combination of the film forming resin and the curable resin And then the mixture is applied on a peeled polyethylene terephthalate (PET) film.

The method for producing the anisotropic conductive film is not particularly limited and can be appropriately selected in accordance with the purpose. For example, the conductive particle-containing layer produced by the above-mentioned method for producing a conductive particle-containing layer and the above- , And a method of laminating the insulating adhesive layer using a roll laminator or the like.

(Connection method and junction body)

The connection method of the present invention includes at least a first batch process, a second batch process, and a heating and pressurizing process, and includes other processes as required.

The connection method is a method of anisotropic conductive connection between the terminal of the first electronic component and the terminal of the second electronic component.

The joined body of the present invention is obtained by the connecting method of the present invention.

The first electronic component and the second electronic component are not particularly limited and may be appropriately selected according to the purpose. For example, the first electronic component and the second electronic component, which are exemplified in the description of the anisotropic conductive film of the present invention, And electronic components, respectively.

&Lt; First batch process >

The first disposing step is not particularly limited as long as the step of disposing the anisotropic conductive film of the present invention on the terminal of the second electronic component can be appropriately selected according to the purpose.

The second electronic component is a substrate such as a glass substrate or a flexible substrate and the first electronic component is an IC chip, TAB, or the like. In the first arrangement step, for example, The anisotropic conductive film is disposed so that the terminal and the conductive particle-containing layer of the anisotropic conductive film are in contact with each other.

<Second Arrangement Process>

The second disposing step is not particularly limited as long as it is a step of disposing the first electronic part on the anisotropic conductive film and the terminal of the first electronic part in contact with the anisotropic conductive film. .

<Heating and pressing step>

The heating and pressing step is not particularly limited as long as the step of heating and pressing the electronic component with a heating and pressing member can be appropriately selected according to the purpose.

Examples of the heating and pressing member include a pressing member having a heating mechanism. As a pressing member having the heating mechanism, for example, a heat tool or the like can be mentioned.

The temperature for the heating is not particularly limited and may be appropriately selected according to the purpose, and is preferably 120 ° C to 200 ° C.

The pressure for the pressurization is not particularly limited and can be appropriately selected according to the purpose, but it is preferably 0.1 MPa to 100 MPa.

The time for heating and pressurizing is not particularly limited and may be appropriately selected according to the purpose, but is preferably 0.5 seconds to 120 seconds.

Example

Hereinafter, the embodiments of the present invention will be described, but the present invention is not limited to these embodiments at all.

(Production example)

&Lt; Preparation of filler &

Each of the aluminum hydroxide used in the following Examples and Comparative Examples was prepared by appropriately adjusting with reference to the aluminum hydroxide production method described in paragraphs [0019] to [0023] of Japanese Patent Application Laid-Open No. 2005-162606 .

Magnesium hydroxide, aluminum oxide and magnesium oxide were also produced by the same method as in the production of aluminum hydroxide.

(Example 1)

&Lt; Fabrication of anisotropic conductive film &

- Preparation of conductive particle-containing layer -

, 10 parts by mass of an epoxy resin (EP1001, manufactured by Mitsubishi Chemical Corporation), 10 parts by mass of a cationic curing agent (SI-60L, manufactured by Shinkin Chemical Industry Co., Ltd.), 10 parts by mass of a phenoxy resin (PKHH, manufactured by Tomoe Kogyo K.K. 2 parts by mass of a silane coupling agent (A-187, manufactured by Momentive Performance Materials Co., Ltd.), 10 parts by mass of a conductive particle (AUL704, manufactured by Sekisui Chemical Co., 30 parts by mass of a metal-coated resin particle having an Ni / Au plated coating on its surface, an average particle diameter of 4.0 占 퐉) and 0.1 part by mass of aluminum hydroxide (irregularly shaped, average particle diameter of 0.7 占 퐉) were mixed with a stirring device (Awatori Rentaro), Synth. Co., Ltd.). The mixture after the mixing was coated on the peeled PET film so that the average thickness after drying was 10 占 퐉 to prepare a conductive particle-containing layer.

- Preparation of insulating adhesive layer -

, 10 parts by mass of an epoxy resin (EP1001, manufactured by Mitsubishi Chemical Corporation), 10 parts by mass of a cationic curing agent (SI-60L, manufactured by Shingo Kagaku Kogyo Kabushiki Kaisha), 25 parts by mass of a phenoxy resin (PKHH, 2 parts by mass of a silane coupling agent (A-187, manufactured by Momentive Performance Materials Co., Ltd.) and 10 parts by mass of a silane coupling agent (a sulfonium salt type cationic curing agent) To make them uniform. The mixture after the mixing was coated on the exfoliated PET film so that the average thickness after drying was 10 占 퐉 to prepare an insulating adhesive layer.

The conductive particle-containing layer and the insulating adhesive layer obtained above were laminated at a roll temperature of 45 캜 using a roll laminator to obtain an anisotropic conductive film.

&Lt; Preparation of the conjugate and evaluation of the conjugate &

A bonded body was produced by the following method, and the evaluation shown below was carried out. The results are shown in Table 2-1.

The anisotropic conductive film obtained above was disposed on the second electronic component such that the conductive particle-containing layer was in contact with the second electronic component. Subsequently, the first electronic component was disposed on the insulating adhesive layer of the anisotropic conductive film. Subsequently, the first electronic component was heated and pressed by a heating tool under the conditions of 170 DEG C, 60 MPa, and 5 seconds using a Teflon (registered trademark) sheet having an average thickness of 50 mu m as a buffer material.

<< Evaluation of corrosion resistance >>

- Test IC chip and glass substrate -

As the first electronic component, a test IC chip (size 1.8 mm x 20 mm, thickness 0.5 mm, size of gold plated bump 30 占 퐉 占 85 占 퐉, bump height 15 占 퐉) was used.

As the second electronic component, a 0.7 mm-thick glass substrate on which Al interdigital wiring was formed was used.

-evaluation-

DC 5 V was applied to the Al interdigital wiring of the obtained bonded body for 12 hours. The twelve pairs of Al comb-like wirings after the application were observed by a metallurgical microscope and evaluated by the following evaluation criteria.

〔Evaluation standard〕

○: No corrosion is observed.

?: One to four corrosion sites were observed.

X: At least five corrosion sites were observed.

<< Evaluation of adhesion >>

- Test IC chip and glass substrate -

As the first electronic component, a test IC chip (size 1.8 mm x 20 mm, thickness 0.5 mm, size of gold plated bump 30 占 퐉 占 85 占 퐉, bump height 15 占 퐉) was used.

As the second electronic component, a glass substrate having a thickness of 0.5 mm on which an ITO film was formed on the entire surface was used.

-evaluation-

The degree of lifting of the anisotropic conductive film on the glass substrate after the pressure cooker test (PCT) was visually observed and evaluated according to the following evaluation criteria. The PCT was conducted under the conditions of 121 占 폚, 2 atm, and 5 hours.

〔Evaluation standard〕

○: Excrement is not observed.

[Delta]: Excursions exceeding 0% and less than 10% were observed with respect to the area of compression.

X: More than 10% excitation was observed with respect to the area of compression.

<< Insulation Evaluation >>

- Test IC chip and glass substrate -

As a first electronic component, a test IC chip (size 1.5 mm x 300 mm, thickness 0.5 mm, gold-plated bump inter-bump space 10 m, bump height 15 m) was used.

As the second electronic component, a glass substrate having a thickness of 0.5 mm and provided with a comb-like ITO wiring pattern was used.

-evaluation-

The number of shorts between the bumps at arbitrary 16 places (total of 160 places) per one set of ITO comb-shaped wires was counted by the two-terminal method, and evaluated by the following evaluation criteria. Further, when the resistance value measured by the two-terminal method was 10 ⁸ Ω or less, it was judged as a short circuit.

〔Evaluation standard〕

○: There was no shot.

?: There was one shot or two shot.

X: There were three or more shorts.

<< Evaluation of particle capture rate >>

- Test IC chip and glass substrate -

As the first electronic component, a test IC chip (size 1.8 mm x 20 mm, thickness 0.5 mm, size of gold plated bump 30 占 퐉 占 85 占 퐉, bump height 15 占 퐉) was used.

As the second electronic component, a glass substrate having a thickness of 0.7 mm on which an ITO wiring was formed was used.

-evaluation-

The particle trapping rate was determined by the following method, and the evaluation was carried out.

The number of conductive particles (the number of particles before connection) on the bumps (terminals) of the first electronic component before connection of the first electronic component and the second electronic component was calculated by the following equation (1).

&Quot; (1) &quot;

Particle number before connection = particle (surface) density of conductive particles in conductive particle-containing layer (number / mm 2) × area of terminal (mm 2)

Further, the number of conductive particles (number of particles after connection) on the terminal after connection was measured by counting with a metal microscope. Then, the particle trapping rate of the conductive particles was calculated by the following formula (2). Then, evaluation was made according to the following evaluation criteria.

&Quot; (2) &quot;

Particle picking rate (%) = (number of particles after connection / number of particles before connection) × 100

〔Evaluation standard〕

O: 20% or more particle capture rate

DELTA: particle capture ratio of not less than 17% and less than 20%

X: particle capture ratio less than 17%

<< Evaluation of connection resistance >>

- Test IC chip and glass substrate -

As the first electronic component, a test IC chip (size 1.8 mm x 20 mm, thickness 0.5 mm, size of gold plated bump 30 占 퐉 占 85 占 퐉, bump height 15 占 퐉) was used.

As the second electronic component, a glass substrate having a thickness of 0.7 mm on which an ITO wiring was formed was used.

-evaluation-

The initial resistance value of the obtained bonded body was measured and evaluated in the following manner.

The connection resistance was measured when a current of 1 mA was passed through a 4-terminal method using a digital multimeter (product number: Digital Multimeter 7555, manufactured by Yokogawa Electric KK). The obtained resistance value was evaluated by the following evaluation criteria.

〔Evaluation standard〕

○: Initial resistance value is less than 1 Ω

△: initial resistance value is 1 Ω or more and less than 3 Ω

×: Initial resistance value is 3 Ω or more

(Examples 2 to 6)

An anisotropic conductive film and a bonded body were produced in the same manner as in Example 1, except that the mixing amount of aluminum hydroxide (filler) in the preparation of the conductive particle-containing layer in Example 1 was changed to the mixing amount shown in Table 1 below.

The obtained bonded body was evaluated in the same manner as in Example 1. The results are shown in Table 2-1.

<Table 1>

(Example 7)

An anisotropic conductive film and a bonded body were produced in the same manner as in Example 4 except that aluminum hydroxide in Example 4 was replaced with magnesium hydroxide (amorphous type, average particle diameter: 0.7 mu m).

The obtained bonded body was evaluated in the same manner as in Example 1. The results are shown in Table 2-1.

(Example 8)

An anisotropic conductive film and a bonded body were produced in the same manner as in Example 4 except that aluminum hydroxide was replaced with aluminum oxide (irregular type, average particle diameter: 0.7 mu m).

The obtained bonded body was evaluated in the same manner as in Example 1. The results are shown in Table 2-2.

(Example 9)

An anisotropic conductive film and a bonded body were produced in the same manner as in Example 4 except that the amorphous aluminum hydroxide in Example 4 was replaced with spherical aluminum hydroxide (average particle diameter: 0.7 mu m).

The obtained bonded body was evaluated in the same manner as in Example 1. The results are shown in Table 2-2.

(Example 10)

An anisotropic conductive film and a bonded body were produced in the same manner as in Example 4 except that aluminum hydroxide having an average particle diameter of 0.7 占 퐉 was replaced with aluminum hydroxide having an average particle diameter of 0.5 占 퐉 (indeterminate).

The obtained bonded body was evaluated in the same manner as in Example 1. The results are shown in Table 2-2.

(Example 11)

An anisotropic conductive film and a bonded body were produced in the same manner as in Example 4 except that aluminum hydroxide having an average particle diameter of 0.7 占 퐉 in Example 4 was replaced with aluminum hydroxide (irregular) having an average particle diameter of 2.0 占 퐉.

The obtained bonded body was evaluated in the same manner as in Example 1. The results are shown in Table 2-2.

(Example 12)

An anisotropic conductive film and a bonded body were produced in the same manner as in Example 4 except that aluminum hydroxide having an average particle diameter of 0.7 占 퐉 was replaced with aluminum hydroxide (unshaped) having an average particle diameter of 3.5 占 퐉.

The obtained bonded body was evaluated in the same manner as in Example 1. The results are shown in Table 2-2.

(Example 13)

An anisotropic conductive film and a bonded body were produced in the same manner as in Example 4 except that aluminum hydroxide was replaced with magnesium oxide (irregular type, average particle diameter: 0.7 mu m).

The obtained bonded body was evaluated in the same manner as in Example 1. The results are shown in Table 2-2.

(Example 14)

Except that 10 parts by mass of aluminum hydroxide in Example 4 was replaced by 5 parts by mass of aluminum hydroxide (amorphous type, average particle diameter 0.7 mu m) and 5 parts by mass of aluminum oxide (amorphous type, average particle diameter 0.7 mu m) , An anisotropic conductive film and a bonded body were produced.

The obtained bonded body was evaluated in the same manner as in Example 1. The results are shown in Table 2-2.

(Comparative Example 1)

An anisotropic conductive film and a bonded body were produced in the same manner as in Example 1, except that 10 parts by mass of aluminum hydroxide (amorphous type, average particle diameter: 0.7 mu m) was added at the time of manufacturing the insulating adhesive layer in Example 4.

The obtained bonded body was evaluated in the same manner as in Example 1. The results are shown in Table 2-3.

(Comparative Example 2)

In the same manner as in Example 1 except that aluminum hydroxide was not contained in the conductive particle-containing layer in Example 1, and 10 parts by mass of aluminum hydroxide (irregular type, average particle diameter 0.7 탆) was added at the time of manufacturing the insulating adhesive layer Thus, an anisotropic conductive film and a bonded body were produced.

The obtained bonded body was evaluated in the same manner as in Example 1. The results are shown in Table 2-3.

(Comparative Example 3)

An anisotropic conductive film and a bonded body were produced in the same manner as in Example 1 except that aluminum hydroxide was not contained in the conductive particle containing layer in Example 1.

The obtained bonded body was evaluated in the same manner as in Example 1. The results are shown in Table 2-3.

(Comparative Example 4)

, 10 parts by mass of an epoxy resin (EP1001, manufactured by Mitsubishi Chemical Corporation), 10 parts by mass of a cationic curing agent (SI-60L, manufactured by Shingo Kagaku Kogyo Kabushiki Kaisha), 25 parts by mass of a phenoxy resin (PKHH, 2 parts by mass of a silane coupling agent (A-187, manufactured by Momentive Performance Materials Co., Ltd.), 30 parts by mass of conductive particles (AUL704, manufactured by Sekisui Chemical Co., Ltd.) And 10 parts by mass of aluminum hydroxide (amorphous type, average particle diameter: 0.7 mu m) were uniformly mixed using a stirring device (revolving mixer, Awatoliren Taro, Shin-Keitai K.K.). The mixture after the mixing was coated on the peeled PET so that the average thickness after drying was 20 占 퐉 to prepare an anisotropic conductive film.

Using the resulting anisotropic conductive film, a bonded body was produced in the same manner as in Example 1. [

The obtained bonded body was evaluated in the same manner as in Example 1. The results are shown in Table 2-3.

The results of the above Examples and Comparative Examples are summarized in Tables 2-1 to 2-3 below.

The content of the filler is the content of the filler relative to the total amount of 100 parts by mass of the phenoxy resin, the epoxy resin and the cationic curing agent in each layer.

<Table 2-1>

<Table 2-2>

<Table 2-3>

In Examples 1 to 14, since only the conductive particle-containing layer contains the filler (at least any one of metal hydroxide and metal oxide), corrosion of the wiring can be suppressed and the corrosion resistance is good. In addition, adhesion was excellent, and insulation, particle-trapping rate, and connection resistance were also good.

Particularly, when the content of the filler in the conductive particle-containing layer is 4.0 parts by mass to 30 parts by mass based on 100 parts by mass of the total amount of the film forming resin, the curable resin and the cationic curing agent, the corrosion resistance and the adhesion (For example, Examples 3 and 4).

Further, in the case where the filler is aluminum hydroxide, which is a metal hydroxide, or magnesium hydroxide, the corrosion resistance and the adhesion property are superior (for example, Examples 4 and 7).

When the filler is amorphous, the result is more excellent in insulation than in the case of spherical (for example, Examples 4 and 9).

When the average particle diameter of the filler is 0.5 mu m to 2.0 mu m, the insulating property, the particle trapping rate, and the connection resistance are superior (for example, Examples 4, 10, and 11).

On the other hand, in the case where not only the conductive particle-containing layer but also the insulating adhesive layer contains a filler, the insulating property and the particle trapping rate are insufficient (Comparative Example 1).

When the filler was contained only in the insulating adhesive layer, the corrosion resistance and adhesion were lowered as compared with Comparative Example 1 (Comparative Example 2).

When the filler was not contained in either of the conductive particle-containing layer and the insulating adhesive layer, the corrosion resistance, adhesion and insulation were insufficient (Comparative Example 3).

When the anisotropic conductive film had a single-layer structure of only the conductive particle-containing layer and the conductive particle-containing layer contained the filler, the corrosion resistance, adhesion, insulation and particle-trapping rate were insufficient (Comparative Example 4).

Since the anisotropic conductive film of the present invention is excellent in corrosion resistance and adhesiveness, low-temperature curing using a cationic curing agent can be suitably used for manufacturing a bonded body by fast curing connection.

Claims (8)

An anisotropic conductive film for anisotropic conductive connection between a terminal of a first electronic component and a terminal of a second electronic component,
A conductive particle-containing layer containing conductive particles, a filler and a cationic curing agent,
An insulating adhesive layer containing a cationic curing agent and containing no filler,
Wherein the conductive particles are at least one of metal particles and metal-coated resin particles,
Wherein the filler is at least one of a metal hydroxide and a metal oxide. The anisotropic conductive film according to claim 1, wherein at least one of the metal hydroxide and the metal oxide is at least one of aluminum hydroxide, magnesium hydroxide, and aluminum oxide. The anisotropic conductive film according to any one of claims 1 to 2, wherein the conductive particle-containing layer contains a film-forming resin and a curable resin. The anisotropic conductive film according to claim 3, wherein the content of the filler in the conductive particle-containing layer is 0.20 parts by mass to 90 parts by mass relative to 100 parts by mass of the total amount of the film forming resin, the curable resin and the cationic curing agent. The anisotropic conductive film according to any one of claims 1 to 4, wherein the filler is in a particulate form, and the filler has an average particle diameter of 0.5 mu m to 3.5 mu m. The anisotropic conductive film according to any one of claims 1 to 5, wherein the filler is in a non-spherical particle shape. A connection method for anisotropic conductive connection between a terminal of a first electronic component and a terminal of a second electronic component,
A first disposing step of disposing the anisotropic conductive film according to any one of claims 1 to 6 on a terminal of the second electronic component;
A second disposing step of disposing the first electronic component on the anisotropic conductive film and the terminal of the first electronic component in contact with the anisotropic conductive film;
And a heating and pressing step of heating and pressing the first electronic component by a heating and pressing member. A bonded body obtained by the connecting method according to claim 7.