HK1206381A1 - Anisotropic conductive film, connection method, and connected body - Google Patents

Anisotropic conductive film, connection method, and connected body

Info

Publication number
HK1206381A1
HK1206381A1 HK15107085.4A HK15107085A HK1206381A1 HK 1206381 A1 HK1206381 A1 HK 1206381A1 HK 15107085 A HK15107085 A HK 15107085A HK 1206381 A1 HK1206381 A1 HK 1206381A1
Authority
HK
Hong Kong
Prior art keywords
conductive film
anisotropic conductive
connection method
connected body
anisotropic
Prior art date
Application number
HK15107085.4A
Other languages
Chinese (zh)
Inventor
深谷達朗
伊藤將太
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Publication of HK1206381A1 publication Critical patent/HK1206381A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/41—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the carrier layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Adhesive Tapes (AREA)
  • Inorganic Chemistry (AREA)
HK15107085.4A 2012-09-21 2015-07-24 Anisotropic conductive film, connection method, and connected body HK1206381A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012208156A JP6002518B2 (en) 2012-09-21 2012-09-21 Anisotropic conductive film, connection method, and joined body
PCT/JP2013/074877 WO2014046053A1 (en) 2012-09-21 2013-09-13 Anisotropic conductive film, connection method, and connected body

Publications (1)

Publication Number Publication Date
HK1206381A1 true HK1206381A1 (en) 2016-01-08

Family

ID=50341366

Family Applications (1)

Application Number Title Priority Date Filing Date
HK15107085.4A HK1206381A1 (en) 2012-09-21 2015-07-24 Anisotropic conductive film, connection method, and connected body

Country Status (6)

Country Link
JP (1) JP6002518B2 (en)
KR (1) KR102114802B1 (en)
CN (1) CN104603218B (en)
HK (1) HK1206381A1 (en)
TW (1) TWI615072B (en)
WO (1) WO2014046053A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016076398A1 (en) * 2014-11-12 2016-05-19 デクセリアルズ株式会社 Photocurable anisotropic conductive adhesive agent, method for manufacturing connected body, and method for connecting electronic part
JP6510846B2 (en) 2015-03-24 2019-05-08 デクセリアルズ株式会社 Anisotropic conductive film, connection method, and joined body
EP3170877B1 (en) * 2015-11-19 2020-11-18 3M Innovative Properties Company Structural adhesive with improved failure mode
JP2018039959A (en) * 2016-09-09 2018-03-15 タツタ電線株式会社 Conductive adhesive composition

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3589422B2 (en) * 2000-11-24 2004-11-17 旭化成エレクトロニクス株式会社 Anisotropic conductive film
JP4201519B2 (en) * 2002-04-01 2008-12-24 スリーエム イノベイティブ プロパティズ カンパニー Cationic polymerizable adhesive composition and anisotropic conductive adhesive composition
JP2006199778A (en) * 2005-01-19 2006-08-03 Hitachi Chem Co Ltd Adhesive composition, adhesive for use in circuit connection, method for connecting circuits using the same, and connected body
JP5226562B2 (en) * 2008-03-27 2013-07-03 デクセリアルズ株式会社 Anisotropic conductive film, joined body and method for producing the same
JP4897778B2 (en) * 2008-11-20 2012-03-14 ソニーケミカル＆インフォメーションデバイス株式会社 CONNECTION FILM, CONNECTED BODY, AND MANUFACTURING METHOD THEREOF
JP2011111556A (en) 2009-11-27 2011-06-09 Hitachi Chem Co Ltd Adhesive composition, circuit connecting material, connector and connection method of circuit member, and semiconductor device
JP5690637B2 (en) * 2011-04-12 2015-03-25 デクセリアルズ株式会社 Anisotropic conductive film, connection method and connection structure
JP2013105636A (en) * 2011-11-14 2013-05-30 Dexerials Corp Anisotropic conductive film, connection method, and connected body

Also Published As

Publication number Publication date
CN104603218A (en) 2015-05-06
KR102114802B1 (en) 2020-05-26
TW201417657A (en) 2014-05-01
WO2014046053A1 (en) 2014-03-27
JP6002518B2 (en) 2016-10-05
JP2014062184A (en) 2014-04-10
KR20150060683A (en) 2015-06-03
CN104603218B (en) 2016-10-19
TWI615072B (en) 2018-02-11

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