HK1206381A1 - 各向異性導電膜、連接方法及接合體 - Google Patents

各向異性導電膜、連接方法及接合體

Info

Publication number
HK1206381A1
HK1206381A1 HK15107085.4A HK15107085A HK1206381A1 HK 1206381 A1 HK1206381 A1 HK 1206381A1 HK 15107085 A HK15107085 A HK 15107085A HK 1206381 A1 HK1206381 A1 HK 1206381A1
Authority
HK
Hong Kong
Prior art keywords
conductive film
anisotropic conductive
connection method
connected body
anisotropic
Prior art date
Application number
HK15107085.4A
Other languages
English (en)
Inventor
深谷達朗
伊藤將太
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Publication of HK1206381A1 publication Critical patent/HK1206381A1/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/41—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the carrier layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Insulated Conductors (AREA)
  • Inorganic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Adhesive Tapes (AREA)
HK15107085.4A 2012-09-21 2015-07-24 各向異性導電膜、連接方法及接合體 HK1206381A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012208156A JP6002518B2 (ja) 2012-09-21 2012-09-21 異方性導電フィルム、接続方法、及び接合体
PCT/JP2013/074877 WO2014046053A1 (ja) 2012-09-21 2013-09-13 異方性導電フィルム、接続方法、及び接合体

Publications (1)

Publication Number Publication Date
HK1206381A1 true HK1206381A1 (zh) 2016-01-08

Family

ID=50341366

Family Applications (1)

Application Number Title Priority Date Filing Date
HK15107085.4A HK1206381A1 (zh) 2012-09-21 2015-07-24 各向異性導電膜、連接方法及接合體

Country Status (6)

Country Link
JP (1) JP6002518B2 (zh)
KR (1) KR102114802B1 (zh)
CN (1) CN104603218B (zh)
HK (1) HK1206381A1 (zh)
TW (1) TWI615072B (zh)
WO (1) WO2014046053A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI715542B (zh) * 2014-11-12 2021-01-11 日商迪睿合股份有限公司 光硬化系異向性導電接著劑、連接體之製造方法及電子零件之連接方法
JP6510846B2 (ja) 2015-03-24 2019-05-08 デクセリアルズ株式会社 異方性導電フィルム、接続方法、及び接合体
EP3170877B1 (en) * 2015-11-19 2020-11-18 3M Innovative Properties Company Structural adhesive with improved failure mode
JP2018039959A (ja) * 2016-09-09 2018-03-15 タツタ電線株式会社 導電性接着剤組成物

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3589422B2 (ja) * 2000-11-24 2004-11-17 旭化成エレクトロニクス株式会社 異方導電性フィルム
JP4201519B2 (ja) * 2002-04-01 2008-12-24 スリーエム イノベイティブ プロパティズ カンパニー カチオン重合性接着剤組成物及び異方導電性接着剤組成物
JP2006199778A (ja) * 2005-01-19 2006-08-03 Hitachi Chem Co Ltd 接着剤組成物、回路接続用接着剤及びこれを用いた回路接続方法、接続体
JP5226562B2 (ja) * 2008-03-27 2013-07-03 デクセリアルズ株式会社 異方性導電フィルム、並びに、接合体及びその製造方法
JP4897778B2 (ja) * 2008-11-20 2012-03-14 ソニーケミカル＆インフォメーションデバイス株式会社 接続フィルム、並びに、接合体及びその製造方法
JP2011111556A (ja) 2009-11-27 2011-06-09 Hitachi Chem Co Ltd 接着剤組成物、回路接続材料、接続体及び回路部材の接続方法、並びに半導体装置
JP5690637B2 (ja) * 2011-04-12 2015-03-25 デクセリアルズ株式会社 異方性導電フィルム、接続方法及び接続構造体
JP2013105636A (ja) * 2011-11-14 2013-05-30 Dexerials Corp 異方性導電フィルム、接続方法、及び接合体

Also Published As

Publication number Publication date
TWI615072B (zh) 2018-02-11
KR20150060683A (ko) 2015-06-03
WO2014046053A1 (ja) 2014-03-27
JP6002518B2 (ja) 2016-10-05
CN104603218B (zh) 2016-10-19
JP2014062184A (ja) 2014-04-10
KR102114802B1 (ko) 2020-05-26
CN104603218A (zh) 2015-05-06
TW201417657A (zh) 2014-05-01

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