KR102114802B1 - 이방성 도전 필름, 접속 방법 및 접합체 - Google Patents

이방성 도전 필름, 접속 방법 및 접합체 Download PDF

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Publication number
KR102114802B1
KR102114802B1 KR1020157005550A KR20157005550A KR102114802B1 KR 102114802 B1 KR102114802 B1 KR 102114802B1 KR 1020157005550 A KR1020157005550 A KR 1020157005550A KR 20157005550 A KR20157005550 A KR 20157005550A KR 102114802 B1 KR102114802 B1 KR 102114802B1
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KR
South Korea
Prior art keywords
anisotropic conductive
conductive film
electronic component
filler
particles
Prior art date
Application number
KR1020157005550A
Other languages
English (en)
Korean (ko)
Other versions
KR20150060683A (ko
Inventor
다쯔로 후까야
마사히로 이또
Original Assignee
데쿠세리아루즈 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by 데쿠세리아루즈 가부시키가이샤 filed Critical 데쿠세리아루즈 가부시키가이샤
Publication of KR20150060683A publication Critical patent/KR20150060683A/ko
Application granted granted Critical
Publication of KR102114802B1 publication Critical patent/KR102114802B1/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C09J2201/602—
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C09J2205/106—
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/41—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the carrier layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Inorganic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Adhesive Tapes (AREA)
KR1020157005550A 2012-09-21 2013-09-13 이방성 도전 필름, 접속 방법 및 접합체 KR102114802B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012208156A JP6002518B2 (ja) 2012-09-21 2012-09-21 異方性導電フィルム、接続方法、及び接合体
JPJP-P-2012-208156 2012-09-21
PCT/JP2013/074877 WO2014046053A1 (ja) 2012-09-21 2013-09-13 異方性導電フィルム、接続方法、及び接合体

Publications (2)

Publication Number Publication Date
KR20150060683A KR20150060683A (ko) 2015-06-03
KR102114802B1 true KR102114802B1 (ko) 2020-05-26

Family

ID=50341366

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157005550A KR102114802B1 (ko) 2012-09-21 2013-09-13 이방성 도전 필름, 접속 방법 및 접합체

Country Status (6)

Country Link
JP (1) JP6002518B2 (zh)
KR (1) KR102114802B1 (zh)
CN (1) CN104603218B (zh)
HK (1) HK1206381A1 (zh)
TW (1) TWI615072B (zh)
WO (1) WO2014046053A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107001865B (zh) * 2014-11-12 2020-08-21 迪睿合株式会社 光固化类各向异性导电粘接剂、连接体的制造方法及电子部件的连接方法
JP6510846B2 (ja) * 2015-03-24 2019-05-08 デクセリアルズ株式会社 異方性導電フィルム、接続方法、及び接合体
EP3170877B1 (en) * 2015-11-19 2020-11-18 3M Innovative Properties Company Structural adhesive with improved failure mode
JP2018039959A (ja) * 2016-09-09 2018-03-15 タツタ電線株式会社 導電性接着剤組成物

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011111556A (ja) * 2009-11-27 2011-06-09 Hitachi Chem Co Ltd 接着剤組成物、回路接続材料、接続体及び回路部材の接続方法、並びに半導体装置
JP2011142103A (ja) 2011-04-12 2011-07-21 Sony Chemical & Information Device Corp 異方性導電フィルム、接続方法及び接続構造体
KR101085722B1 (ko) * 2008-11-20 2011-11-21 소니 케미카루 앤드 인포메이션 디바이스 가부시키가이샤 접속 필름, 및 접합체 및 그 제조 방법

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3589422B2 (ja) * 2000-11-24 2004-11-17 旭化成エレクトロニクス株式会社 異方導電性フィルム
JP4201519B2 (ja) * 2002-04-01 2008-12-24 スリーエム イノベイティブ プロパティズ カンパニー カチオン重合性接着剤組成物及び異方導電性接着剤組成物
JP2006199778A (ja) * 2005-01-19 2006-08-03 Hitachi Chem Co Ltd 接着剤組成物、回路接続用接着剤及びこれを用いた回路接続方法、接続体
JP5226562B2 (ja) * 2008-03-27 2013-07-03 デクセリアルズ株式会社 異方性導電フィルム、並びに、接合体及びその製造方法
JP2013105636A (ja) * 2011-11-14 2013-05-30 Dexerials Corp 異方性導電フィルム、接続方法、及び接合体

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101085722B1 (ko) * 2008-11-20 2011-11-21 소니 케미카루 앤드 인포메이션 디바이스 가부시키가이샤 접속 필름, 및 접합체 및 그 제조 방법
JP2011111556A (ja) * 2009-11-27 2011-06-09 Hitachi Chem Co Ltd 接着剤組成物、回路接続材料、接続体及び回路部材の接続方法、並びに半導体装置
JP2011142103A (ja) 2011-04-12 2011-07-21 Sony Chemical & Information Device Corp 異方性導電フィルム、接続方法及び接続構造体

Also Published As

Publication number Publication date
WO2014046053A1 (ja) 2014-03-27
TW201417657A (zh) 2014-05-01
TWI615072B (zh) 2018-02-11
CN104603218B (zh) 2016-10-19
JP2014062184A (ja) 2014-04-10
KR20150060683A (ko) 2015-06-03
JP6002518B2 (ja) 2016-10-05
HK1206381A1 (zh) 2016-01-08
CN104603218A (zh) 2015-05-06

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