CN105764969B - 导热电绝缘颗粒和组合物 - Google Patents
导热电绝缘颗粒和组合物 Download PDFInfo
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- CN105764969B CN105764969B CN201480065537.4A CN201480065537A CN105764969B CN 105764969 B CN105764969 B CN 105764969B CN 201480065537 A CN201480065537 A CN 201480065537A CN 105764969 B CN105764969 B CN 105764969B
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
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- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
- H01B3/12—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances ceramics
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- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
- H01B3/04—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances mica
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- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
- H01B3/10—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances metallic oxides
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- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
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- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/002—Inhomogeneous material in general
- H01B3/004—Inhomogeneous material in general with conductive additives or conductive layers
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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| JP2013-209304 | 2013-10-04 | ||
| PCT/US2014/059239 WO2015051354A1 (en) | 2013-10-04 | 2014-10-06 | Thermally conductive electrically insulating particles and compositions |
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| CN107445520A (zh) * | 2017-07-27 | 2017-12-08 | 泾县信达工贸有限公司 | 一种电饭锅加热盘用耐高温导热绝缘材料 |
| JP7236211B2 (ja) * | 2017-12-15 | 2023-03-09 | 株式会社フジミインコーポレーテッド | フィラー及びフィラーの製造方法、並びに成形体の製造方法 |
| CN111725160A (zh) * | 2020-06-16 | 2020-09-29 | 杰群电子科技（东莞）有限公司 | 一种高功率半导体模组、封装方法及电子产品 |
| CN111725145A (zh) * | 2020-06-16 | 2020-09-29 | 杰群电子科技（东莞）有限公司 | 一种半导体封装结构、封装方法及电子产品 |
| CN111725159A (zh) * | 2020-06-16 | 2020-09-29 | 杰群电子科技（东莞）有限公司 | 一种高散热半导体产品、封装方法及电子产品 |
| US12176125B2 (en) * | 2020-07-15 | 2024-12-24 | Ge Aviation Systems Llc | Method of making an insulated conductive component |
| KR102411685B1 (ko) * | 2020-11-30 | 2022-06-22 | 한국과학기술연구원 | 고절연성 및 고내열성을 갖는 필러 복합 소재, 및 건식 입자-입자 복합화를 통한 제조 방법 |
| JP2023047361A (ja) * | 2021-09-27 | 2023-04-06 | 東特塗料株式会社 | 電気絶縁電線 |
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| CN101149995A (zh) * | 2007-10-29 | 2008-03-26 | 苏州巨峰绝缘材料有限公司 | C级高导热柔软复合绝缘材料 |
| CN102615873A (zh) * | 2012-03-07 | 2012-08-01 | 华中科技大学 | 低温制备非瓷质绝缘导热材料的方法 |
| CN103013411A (zh) * | 2012-12-26 | 2013-04-03 | 赛伦（厦门）新材料科技有限公司 | 一种绝缘导热薄膜粘结剂及其制备方法 |
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| US6620497B2 (en) * | 2000-01-11 | 2003-09-16 | Cool Options, Inc. | Polymer composition with boron nitride coated carbon flakes |
| WO2008133172A1 (ja) * | 2007-04-17 | 2008-11-06 | Hitachi High-Technologies Corporation | 樹脂混合用複合フィラー |
| JP2012124449A (ja) * | 2010-11-19 | 2012-06-28 | Bando Chem Ind Ltd | 熱伝導性複合粒子、熱伝導性シート及びこれらの製造方法 |
| US8552101B2 (en) * | 2011-02-25 | 2013-10-08 | Sabic Innovative Plastics Ip B.V. | Thermally conductive and electrically insulative polymer compositions containing a low thermally conductive filler and uses thereof |
| US8741998B2 (en) * | 2011-02-25 | 2014-06-03 | Sabic Innovative Plastics Ip B.V. | Thermally conductive and electrically insulative polymer compositions containing a thermally insulative filler and uses thereof |
| JP5660324B2 (ja) * | 2011-06-20 | 2015-01-28 | 株式会社豊田中央研究所 | 樹脂組成物およびその製造方法 |
| JP2013122003A (ja) * | 2011-12-09 | 2013-06-20 | Sato Research Co Ltd | 熱伝導フィラー及びその製造方法 |
| JP5263429B1 (ja) * | 2012-05-21 | 2013-08-14 | 東洋インキＳｃホールディングス株式会社 | 熱伝導性易変形性凝集体およびその製造方法 |
| JP2014065769A (ja) * | 2012-09-25 | 2014-04-17 | Tokai Rubber Ind Ltd | エラストマー成形体およびその製造方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101149995A (zh) * | 2007-10-29 | 2008-03-26 | 苏州巨峰绝缘材料有限公司 | C级高导热柔软复合绝缘材料 |
| CN102615873A (zh) * | 2012-03-07 | 2012-08-01 | 华中科技大学 | 低温制备非瓷质绝缘导热材料的方法 |
| CN103013411A (zh) * | 2012-12-26 | 2013-04-03 | 赛伦（厦门）新材料科技有限公司 | 一种绝缘导热薄膜粘结剂及其制备方法 |
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| Publication number | Publication date |
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| JP6654562B2 (ja) | 2020-02-26 |
| KR20160068762A (ko) | 2016-06-15 |
| CN105764969A (zh) | 2016-07-13 |
| WO2015051354A1 (en) | 2015-04-09 |
| JP2017504177A (ja) | 2017-02-02 |
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