JP6654562B2 - 熱伝導性電気絶縁粒子および組成物 - Google Patents
熱伝導性電気絶縁粒子および組成物 Download PDFInfo
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- JP6654562B2 JP6654562B2 JP2016519996A JP2016519996A JP6654562B2 JP 6654562 B2 JP6654562 B2 JP 6654562B2 JP 2016519996 A JP2016519996 A JP 2016519996A JP 2016519996 A JP2016519996 A JP 2016519996A JP 6654562 B2 JP6654562 B2 JP 6654562B2
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
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- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
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- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
- H01B3/12—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances ceramics
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| JP2013209304 | 2013-10-04 | ||
| PCT/US2014/059239 WO2015051354A1 (en) | 2013-10-04 | 2014-10-06 | Thermally conductive electrically insulating particles and compositions |
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| JP2017504177A JP2017504177A (ja) | 2017-02-02 |
| JP2017504177A5 JP2017504177A5 (enrdf_load_stackoverflow) | 2017-08-31 |
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| CN107445520A (zh) * | 2017-07-27 | 2017-12-08 | 泾县信达工贸有限公司 | 一种电饭锅加热盘用耐高温导热绝缘材料 |
| JP7236211B2 (ja) * | 2017-12-15 | 2023-03-09 | 株式会社フジミインコーポレーテッド | フィラー及びフィラーの製造方法、並びに成形体の製造方法 |
| CN111725160A (zh) * | 2020-06-16 | 2020-09-29 | 杰群电子科技（东莞）有限公司 | 一种高功率半导体模组、封装方法及电子产品 |
| CN111725145A (zh) * | 2020-06-16 | 2020-09-29 | 杰群电子科技（东莞）有限公司 | 一种半导体封装结构、封装方法及电子产品 |
| CN111725159A (zh) * | 2020-06-16 | 2020-09-29 | 杰群电子科技（东莞）有限公司 | 一种高散热半导体产品、封装方法及电子产品 |
| US12176125B2 (en) * | 2020-07-15 | 2024-12-24 | Ge Aviation Systems Llc | Method of making an insulated conductive component |
| KR102411685B1 (ko) * | 2020-11-30 | 2022-06-22 | 한국과학기술연구원 | 고절연성 및 고내열성을 갖는 필러 복합 소재, 및 건식 입자-입자 복합화를 통한 제조 방법 |
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| JP2012124449A (ja) * | 2010-11-19 | 2012-06-28 | Bando Chem Ind Ltd | 熱伝導性複合粒子、熱伝導性シート及びこれらの製造方法 |
| US8552101B2 (en) * | 2011-02-25 | 2013-10-08 | Sabic Innovative Plastics Ip B.V. | Thermally conductive and electrically insulative polymer compositions containing a low thermally conductive filler and uses thereof |
| US8741998B2 (en) * | 2011-02-25 | 2014-06-03 | Sabic Innovative Plastics Ip B.V. | Thermally conductive and electrically insulative polymer compositions containing a thermally insulative filler and uses thereof |
| JP5660324B2 (ja) * | 2011-06-20 | 2015-01-28 | 株式会社豊田中央研究所 | 樹脂組成物およびその製造方法 |
| JP2013122003A (ja) * | 2011-12-09 | 2013-06-20 | Sato Research Co Ltd | 熱伝導フィラー及びその製造方法 |
| CN102615873A (zh) * | 2012-03-07 | 2012-08-01 | 华中科技大学 | 低温制备非瓷质绝缘导热材料的方法 |
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| JP2014065769A (ja) * | 2012-09-25 | 2014-04-17 | Tokai Rubber Ind Ltd | エラストマー成形体およびその製造方法 |
| CN103013411B (zh) * | 2012-12-26 | 2013-11-13 | 赛伦（厦门）新材料科技有限公司 | 一种绝缘导热薄膜粘结剂及其制备方法 |
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| KR20160068762A (ko) | 2016-06-15 |
| CN105764969A (zh) | 2016-07-13 |
| WO2015051354A1 (en) | 2015-04-09 |
| CN105764969B (zh) | 2018-03-30 |
| JP2017504177A (ja) | 2017-02-02 |
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