KR20160068762A - 열전도성 전기 절연 입자 및 조성물 - Google Patents
열전도성 전기 절연 입자 및 조성물 Download PDFInfo
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- KR20160068762A KR20160068762A KR1020167008836A KR20167008836A KR20160068762A KR 20160068762 A KR20160068762 A KR 20160068762A KR 1020167008836 A KR1020167008836 A KR 1020167008836A KR 20167008836 A KR20167008836 A KR 20167008836A KR 20160068762 A KR20160068762 A KR 20160068762A
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Images
Classifications
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- H01B3/12—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances ceramics
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/08—Ingredients agglomerated by treatment with a binding agent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
- H01B3/04—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances mica
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
- H01B3/10—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances metallic oxides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/002—Inhomogeneous material in general
- H01B3/004—Inhomogeneous material in general with conductive additives or conductive layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (3)
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| JP2013209304 | 2013-10-04 | ||
| JPJP-P-2013-209304 | 2013-10-04 | ||
| PCT/US2014/059239 WO2015051354A1 (en) | 2013-10-04 | 2014-10-06 | Thermally conductive electrically insulating particles and compositions |
Publications (1)
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| KR20160068762A true KR20160068762A (ko) | 2016-06-15 |
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Family Applications (1)
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| JP (1) | JP6654562B2 (enrdf_load_stackoverflow) |
| KR (1) | KR20160068762A (enrdf_load_stackoverflow) |
| CN (1) | CN105764969B (enrdf_load_stackoverflow) |
| WO (1) | WO2015051354A1 (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10593482B2 (en) | 2016-12-28 | 2020-03-17 | Samsung Electro-Mechanics Co., Ltd. | Dielectric powder and multilayer capacitor using the same |
| KR20220075556A (ko) * | 2020-11-30 | 2022-06-08 | 한국과학기술연구원 | 고절연성 및 고내열성을 갖는 필러 복합 소재, 및 건식 입자-입자 복합화를 통한 제조 방법 |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107445520A (zh) * | 2017-07-27 | 2017-12-08 | 泾县信达工贸有限公司 | 一种电饭锅加热盘用耐高温导热绝缘材料 |
| JP7236211B2 (ja) * | 2017-12-15 | 2023-03-09 | 株式会社フジミインコーポレーテッド | フィラー及びフィラーの製造方法、並びに成形体の製造方法 |
| CN111725160A (zh) * | 2020-06-16 | 2020-09-29 | 杰群电子科技（东莞）有限公司 | 一种高功率半导体模组、封装方法及电子产品 |
| CN111725145A (zh) * | 2020-06-16 | 2020-09-29 | 杰群电子科技（东莞）有限公司 | 一种半导体封装结构、封装方法及电子产品 |
| CN111725159A (zh) * | 2020-06-16 | 2020-09-29 | 杰群电子科技（东莞）有限公司 | 一种高散热半导体产品、封装方法及电子产品 |
| US12176125B2 (en) * | 2020-07-15 | 2024-12-24 | Ge Aviation Systems Llc | Method of making an insulated conductive component |
| JP2023047361A (ja) * | 2021-09-27 | 2023-04-06 | 東特塗料株式会社 | 電気絶縁電線 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US6620497B2 (en) * | 2000-01-11 | 2003-09-16 | Cool Options, Inc. | Polymer composition with boron nitride coated carbon flakes |
| WO2008133172A1 (ja) * | 2007-04-17 | 2008-11-06 | Hitachi High-Technologies Corporation | 樹脂混合用複合フィラー |
| CN101149995A (zh) * | 2007-10-29 | 2008-03-26 | 苏州巨峰绝缘材料有限公司 | C级高导热柔软复合绝缘材料 |
| JP2012124449A (ja) * | 2010-11-19 | 2012-06-28 | Bando Chem Ind Ltd | 熱伝導性複合粒子、熱伝導性シート及びこれらの製造方法 |
| US8552101B2 (en) * | 2011-02-25 | 2013-10-08 | Sabic Innovative Plastics Ip B.V. | Thermally conductive and electrically insulative polymer compositions containing a low thermally conductive filler and uses thereof |
| US8741998B2 (en) * | 2011-02-25 | 2014-06-03 | Sabic Innovative Plastics Ip B.V. | Thermally conductive and electrically insulative polymer compositions containing a thermally insulative filler and uses thereof |
| JP5660324B2 (ja) * | 2011-06-20 | 2015-01-28 | 株式会社豊田中央研究所 | 樹脂組成物およびその製造方法 |
| JP2013122003A (ja) * | 2011-12-09 | 2013-06-20 | Sato Research Co Ltd | 熱伝導フィラー及びその製造方法 |
| CN102615873A (zh) * | 2012-03-07 | 2012-08-01 | 华中科技大学 | 低温制备非瓷质绝缘导热材料的方法 |
| JP5263429B1 (ja) * | 2012-05-21 | 2013-08-14 | 東洋インキＳｃホールディングス株式会社 | 熱伝導性易変形性凝集体およびその製造方法 |
| JP2014065769A (ja) * | 2012-09-25 | 2014-04-17 | Tokai Rubber Ind Ltd | エラストマー成形体およびその製造方法 |
| CN103013411B (zh) * | 2012-12-26 | 2013-11-13 | 赛伦（厦门）新材料科技有限公司 | 一种绝缘导热薄膜粘结剂及其制备方法 |
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2014
- 2014-10-06 JP JP2016519996A patent/JP6654562B2/ja active Active
- 2014-10-06 KR KR1020167008836A patent/KR20160068762A/ko not_active Withdrawn
- 2014-10-06 CN CN201480065537.4A patent/CN105764969B/zh not_active Expired - Fee Related
- 2014-10-06 WO PCT/US2014/059239 patent/WO2015051354A1/en active Application Filing
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10593482B2 (en) | 2016-12-28 | 2020-03-17 | Samsung Electro-Mechanics Co., Ltd. | Dielectric powder and multilayer capacitor using the same |
| US10903013B2 (en) | 2016-12-28 | 2021-01-26 | Samsung Electro-Mechanics Co., Ltd. | Dielectric powder and multilayer capacitor using the same |
| US11574775B2 (en) | 2016-12-28 | 2023-02-07 | Samsung Electro-Mechanics Co., Ltd. | Dielectric powder and multilayer capacitor using the same |
| KR20220075556A (ko) * | 2020-11-30 | 2022-06-08 | 한국과학기술연구원 | 고절연성 및 고내열성을 갖는 필러 복합 소재, 및 건식 입자-입자 복합화를 통한 제조 방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6654562B2 (ja) | 2020-02-26 |
| CN105764969A (zh) | 2016-07-13 |
| WO2015051354A1 (en) | 2015-04-09 |
| CN105764969B (zh) | 2018-03-30 |
| JP2017504177A (ja) | 2017-02-02 |
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