CN105607365A - 一种coa基板及其制作方法 - Google Patents
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Abstract
本发明提供了一种COA基板,包括衬底基板,以及依次设置在衬底基板上的栅极、栅绝缘层、有源层、源极和漏极、第一钝化层、色阻层、第二钝化层、以及透明导电层,其中所述色阻层设置有贯通的第一过孔,以使所述第一钝化层暴露,所述第二钝化层设置在所述色阻层上和所述第一过孔内,且所述第一过孔内设有贯通所述第二钝化层和所述第一钝化层的第二过孔,以使所述源极和漏极暴露,所述第一过孔和第二过孔内设置导电填充层。本发明通过设置导电填充层填充过孔,使接触过孔内部填满导电填充材料,增大了像素开口率,降低了出现气泡不良的风险,同时防止了像素电极爬坡断线,提高了液晶面板的显示品质。本发明还提供了该COA基板的制作方法。
Description
技术领域
本发明涉及液晶显示技术领域,特别是涉及一种COA基板及其制作方法。
背景技术
TFT-LCD,薄膜晶体管液晶显示器由于具有体积小、功耗低、无辐射等特点而备受关注,在平板显示领域中占据了主导地位,被广泛地应用到各行各业中。该液晶显示器通常由彩膜基板和阵列基板对盒而成,其R、G、B色阻位于彩膜基板上。而COA(ColorFilteronArray)基板是一种将彩膜基板制作于阵列基板上的结构,该结构可有效地减少由于对盒偏差导致的漏光问题,并且降低信号线与像素电极间的耦合电容,从而有效地提高像素开口率。因此,目前在液晶显示领域被广泛应用。
然而现有的COA基板结构中,由于彩色滤光片(ColorFilter)较厚,通常会有几个微米的厚度,这就使得联通信号线与像素电极的接触过孔需要做很大才能保证有效接触。由于接触过孔的坡脚距离较大,且过孔较深,所以在制造过程中容易隐藏多余的气体,使得在后期液晶面板中出现气泡(Bubble)不良。而且在过孔位置处,液晶分子会出现不规则排列,而导致漏光现象。通常为了避免漏光现象,会增加此处的遮挡而使得开口率下降。同时,由于过孔坡度较大,将可能引起像素电极的爬坡断线,导致像素电极无法充电,进而影响液晶面板的显示品质。
因此,有必要提供一种新型的COA基板及其制作方法以解决上述方面的不足。
发明内容
本发明的目的在于提供一种COA基板及其制作方法,以解决现有COA基板由于接触过孔过大、过深引起的气泡不良,像素开口率下降,像素电极爬坡断线等问题。
为解决上述问题,本发明第一方面提供了一种COA基板,包括:
衬底基板;
栅极,设于所述衬底基板上;
栅绝缘层,设于所述栅极和所述衬底基板上,覆盖所述衬底基板和所述栅极;
有源层,位于所述栅极上方设于所述栅绝缘层上,用于形成沟道;
源极和漏极,设于所述栅绝缘层上并分别与所述有源层的两端相接触;
第一钝化层,覆盖所述源极、漏极、所述栅绝缘层以及所述有源层;
色阻层,设于所述第一钝化层上,所述色阻层设置有贯通的第一过孔,以使所述第一钝化层暴露;
第二钝化层,设于所述色阻层上和所述第一过孔内,所述第一过孔内设有贯通所述第二钝化层和所述第一钝化层的第二过孔,以使所述源极和漏极暴露;
导电填充层,所述导电填充层充满所述第一过孔和所述第二过孔,所述导电填充层的导电填充材料包括有机导电材料;
以及透明导电层,设于所述第二钝化层及所述导电填充层上。
在本发明COA基板中,所述有机导电材料为聚对苯(PPP)、聚吡咯(PPY)、聚噻吩(PTH)、聚苯基乙炔(PPV)、聚苯胺(PANI)中的一种或多种。
在本发明COA基板中,所述导电填充层通过采用喷墨打印的方法获得。
在本发明COA基板中,所述导电填充层通过涂覆所述有机导电材料,再涂覆光刻胶,然后经光刻工艺获得。
在本发明COA基板中,所述导电填充层的表面与所述第二钝化层的表面齐平。
本发明第二方面提供了一种COA基板的制作方法,包括以下步骤:
提供衬底基板,在所述衬底基板上形成栅极;
在所述栅极及未被所述栅极覆盖的衬底基板上形成栅绝缘层;
在所述栅极上方所述栅绝缘层上形成有源层;
在所述栅绝缘层上形成分别与所述有源层的两端相接触的源极和漏极;
在所述源极和漏极上形成覆盖所述源极、漏极、所述栅绝缘层以及所述有源层的第一钝化层;
在所述第一钝化层上形成色阻层,所述色阻层设置有贯通的第一过孔,以使所述第一钝化层暴露;
在所述色阻层上和所述第一过孔内形成第二钝化层,所述第一过孔内设有贯通所述第二钝化层和所述第一钝化层的第二过孔,以使所述源极和漏极暴露;
在所述第一过孔和所述第二过孔内填充导电填充材料形成导电填充层,所述导电填充层的导电填充材料包括有机导电材料;
在所述第二钝化层及所述导电填充层上形成透明导电层,再将所述透明导电层进行图案化处理形成像素电极。
在本发明COA基板的制作方法中,所述有机导电材料为聚对苯(PPP)、聚吡咯(PPY)、聚噻吩(PTH)、聚苯基乙炔(PPV)、聚苯胺(PANI)中的一种或多种。
在本发明COA基板的制作方法中,所述在所述第一过孔和所述第二过孔内填充导电填充材料形成导电填充层的具体操作为:采用喷墨打印的方法将所述有机导电材料填充在所述第一过孔和所述第二过孔内。
在本发明COA基板的制作方法中,所述在所述第一过孔和所述第二过孔内填充导电填充材料形成导电填充层的具体操作为:在所述第一过孔和所述第二过孔内涂覆所述有机导电材料,再涂覆光刻胶,然后经光刻工艺获得。
在本发明COA基板的制作方法中,在填充导电填充材料之后,对所述导电填充层进行平坦化处理,以使所述导电填充层的表面与所述第二钝化层的表面齐平。
本发明的有益效果:本发明通过利用导电填充材料填充过孔的方法,使接触过孔内部填满导电填充材料,减小了地形断差,防止液晶倒向错乱,进一步增大像素开口率;更重要的是,减小了接触过孔内藏匿气体的可能,降低了后期出现Bubble不良的风险;同时,也防止了像素电极爬坡断线的问题,提高了液晶面板的显示品质。
本发明实施例的优点将会在下面的说明书中部分阐明,一部分根据说明书是显而易见的,或者可以通过本发明实施例的实施而获知。
附图说明
图1为现有技术的COA基板的结构示意图;
图2为本发明COA基板的结构示意图;
图3为本发明COA基板的制作方法流程图。
具体实施方式
以下所述是本发明实施例的优选实施方式,应当指出,对于本技术领域的普通技术人员来说,在不脱离本发明实施例原理的前提下,还可以做出若干改进和润饰,这些改进和润饰也视为本发明实施例的保护范围。
请参阅图1,图1为现有技术的COA基板的结构示意图。如图1所示,现有技术的COA基板包括衬底基板11、栅极12、栅绝缘层13、有源层14、源极和漏极15、第一钝化层16、色阻层17、第二钝化层18、以及透明导电层19。
请参阅图2,图2为本发明COA基板的结构示意图。如图2所示,本发明COA基板包括衬底基板21、栅极22、栅绝缘层23、有源层24、源极和漏极25、第一钝化层26、色阻层27、第二钝化层28、导电填充层29、以及透明导电层30。
所述栅极22,设于所述衬底基板21上;
所述栅绝缘层23,设于所述栅极22和衬底基板21上,覆盖所述衬底基板21和栅极22;
所述有源层24,位于所述栅极22上方设于所述栅绝缘层23上,用于形成沟道;
所述源极和漏极25,设于所述栅绝缘层23上并分别与有源层24的两端相接触;
所述第一钝化层26,覆盖所述源极和漏极25、栅绝缘层23以及有源层24;
所述色阻层27,设于所述第一钝化层26上,色阻层27设置有贯通的第一过孔30,以使所述第一钝化层26暴露;
所述第二钝化层28,设于所述色阻层27上和所述第一过孔201内,所述第一过孔201内设有贯通所述第二钝化层28和所述第一钝化层26的第二过孔202,以使所述源极和漏极25暴露;
所述导电填充层29,所述导电填充层29充满所述第一过孔201和所述第二过孔202,所述导电填充层29的导电填充材料包括有机导电材料;
所述透明导电层30,设于所述第二钝化层28及所述导电填充层29上。
本发明实施方式中,所述导电填充层29的有机导电材料可以为聚对苯(PPP)、聚吡咯(PPY)、聚噻吩(PTH)、聚苯基乙炔(PPV)、聚苯胺(PANI)中的一种或多种。
本发明一实施方式中,所述导电填充层通过采用喷墨打印的方法获得。
本发明另一实施方式中,所述导电填充层通过涂覆所述有机导电材料,再涂覆光刻胶,然后经正常的光刻工艺:曝光、显影、刻蚀、strip完后形成过孔填充图案。所述光刻胶可为本领域内光刻工艺常用种类。
本发明实施方式中,所述第一过孔201和所述第二过孔202内都填满导电填充材料,并与所述源极和漏极25(即SD电极)有电连接。在本发明一优选实施方式中,所述导电填充层29的表面与所述第二钝化层28的表面齐平。
本发明实施方式中,衬底基板21、栅极22、栅绝缘层23、有源层24、源极和漏极25、第一钝化层26、色阻层27、第二钝化层28、以及透明导电层30的材质均为行业内现有常规材料,其具体设置方式也均为业界现有方式,本发明不作特殊限定。
与现有技术相比,本发明实施例提供的COA基板增设了导电填充层用来填充过孔,从而使接触过孔内部填满导电填充材料,减小了地形断差,防止液晶倒向错乱,进一步增大像素开口率;更重要的是,减小了接触过孔内藏匿气体的可能,降低了后期出现Bubble不良的风险;同时,也防止了像素电极爬坡断线的问题,提高了液晶面板的显示品质。本发明实施例提供的COA基板可应用于各种显示模式下的COA型液晶显示面板。
请参阅图3,图3为本发明COA基板的制作方法流程图。如图3所示,本发明COA基板的制作方法,包括以下步骤:
S01、提供一衬底基板21,在所述衬底基板21上形成栅极22;
S02、在所述栅极22及未被所述栅极22覆盖的衬底基板21上形成栅绝缘层13;
S03、在所述栅极22上方所述栅绝缘层23上形成有源层24;
S04、在所述栅绝缘层23上形成分别与所述有源层24的两端相接触的源极和漏极25;
S05、在所述源极和漏极25上形成覆盖所述源极和漏极25、所述栅绝缘层23以及所述有源层24的第一钝化层26;
S06、在所述第一钝化层26上形成色阻层27,所述色阻层27设置有贯通的第一过孔201,以使所述第一钝化层26暴露;
S07、在所述色阻层27上和所述第一过孔201内形成第二钝化层28,所述第一过孔201内设有贯通所述第二钝化层28和所述第一钝化层26的第二过孔202,以使所述源极和漏极25暴露;
S08、在所述第一过孔201和所述第二过孔202内填充导电填充材料形成导电填充层29,所述导电填充层的导电填充材料包括有机导电材料;
S09、在所述第二钝化层28及所述导电填充层29上形成透明导电层30,再将所述透明导电层30进行图案化处理形成像素电极。
本发明实施方式中,步骤S08中,所述有机导电材料可以为聚对苯(PPP)、聚吡咯(PPY)、聚噻吩(PTH)、聚苯基乙炔(PPV)、聚苯胺(PANI)中的一种或多种。
本发明一实施方式中,所述在所述第一过孔和所述第二过孔内填充导电填充材料形成导电填充层的具体操作为:采用喷墨打印的方法将所述有机导电材料填充在所述第一过孔和所述第二过孔内。
本发明另一实施方式中,所述在所述第一过孔和所述第二过孔内填充导电填充材料形成导电填充层的具体操作为:在所述第一过孔和所述第二过孔内涂覆所述有机导电材料,再涂覆光刻胶,然后经正常的光刻工艺:曝光、显影、刻蚀、strip完后形成过孔填充图案。所述光刻胶可为本领域内光刻工艺常用种类。
本发明实施方式中,步骤S08中,在填充导电填充材料之后,对所述导电填充层29进行平坦化处理,以使所述导电填充层29的表面与所述第二钝化层28的表面齐平。具体地,通过曝光、显影的方式,去除掉第一过孔201以外多余的导电填充材料,尽量保证只有接触过孔(指第一过孔201和第二过孔202)里面有,并且刚好填平。
本发明实施方式中,各层的具体制作方式不作特殊限定,可实现本发明即可。具体地,本发明实施方式中,可先按传统制程采用PVD(或CVD)成膜、曝光、显影、刻蚀等工艺连续制作出栅极22、栅绝缘层23、有源层24、源极和漏极25、第一钝化层26,再在第一钝化层26上涂布上RGB色阻形成色阻层27,并通过曝光显影等操作形成色阻层27上面的第一过孔201;再在色阻层27上和所述第一过孔201内沉积一层第二钝化层28,并通过曝光、显影、刻蚀形成所述第二过孔202,将与像素电极连接的SD电极25暴露出来;接着在第一过孔201和第二过孔202内填充导电填充材料形成导电填充层29,使得第一过孔201和第二过孔202内都填满导电填充材料,并与SD电极25有电连接;最后在第二钝化层28及所述导电填充层29上形成透明导电层30,再将所述透明导电层30通过曝光、显影、刻蚀,形成像素电极图案。所述透明导电层30的材质可以为ITO、IZO或薄层金属。
本发明实施例提供的COA基板的制作方法,在像素电极ITOSputter之前,将由于COA制程所形成的过孔通过导电填充材料Coating制程进行填充,然后进行平坦化处理。之后,再次进行ITO的Sputter制程,最后对ITO进行图案化制程。该制作方法不仅可以有效地消除接触过孔处的地形断差,减少COA液晶面板出现气泡的风险;并且由于ITO在整个像素区几乎无地形断差,避免像素电极出现爬坡断线的可能;同时,由于接触过孔处的液晶也能有效控制,对于像素的开口率也会有一定程度的改善,从而提升了整个液晶面板的显示品质。
Claims (10)
1.一种COA基板,其特征在于,包括:
衬底基板;
栅极,设于所述衬底基板上;
栅绝缘层,设于所述栅极和所述衬底基板上,覆盖所述衬底基板和所述栅极;
有源层,位于所述栅极上方设于所述栅绝缘层上,用于形成沟道;
源极和漏极,设于所述栅绝缘层上并分别与所述有源层的两端相接触;
第一钝化层,覆盖所述源极、漏极、所述栅绝缘层以及所述有源层;
色阻层,设于所述第一钝化层上,所述色阻层设置有贯通的第一过孔,以使所述第一钝化层暴露;
第二钝化层,设于所述色阻层上和所述第一过孔内,所述第一过孔内设有贯通所述第二钝化层和所述第一钝化层的第二过孔,以使所述源极和漏极暴露;
导电填充层,所述导电填充层充满所述第一过孔和所述第二过孔,所述导电填充层的导电填充材料包括有机导电材料;
以及透明导电层,设于所述第二钝化层及所述导电填充层上。
2.如权利要求1所述的COA基板,其特征在于,所述有机导电材料为聚对苯、聚吡咯、聚噻吩、聚苯基乙炔和聚苯胺中的一种或多种。
3.如权利要求1所述的COA基板,其特征在于,所述导电填充层通过采用喷墨打印的方法获得。
4.如权利要求1所述的COA基板,其特征在于,所述导电填充层通过涂覆所述有机导电材料,再涂覆光刻胶,然后经光刻工艺获得。
5.如权利要求1所述的COA基板,其特征在于,所述导电填充层的表面与所述第二钝化层的表面齐平。
6.一种COA基板的制作方法,其特征在于,包括以下步骤:
提供衬底基板,在所述衬底基板上形成栅极;
在所述栅极及未被所述栅极覆盖的衬底基板上形成栅绝缘层;
在所述栅极上方所述栅绝缘层上形成有源层;
在所述栅绝缘层上形成分别与所述有源层的两端相接触的源极和漏极;
在所述源极和漏极上形成覆盖所述源极、漏极、所述栅绝缘层以及所述有源层的第一钝化层;
在所述第一钝化层上形成色阻层,所述色阻层设置有贯通的第一过孔,以使所述第一钝化层暴露;
在所述色阻层上和所述第一过孔内形成第二钝化层,所述第一过孔内设有贯通所述第二钝化层和所述第一钝化层的第二过孔,以使所述源极和漏极暴露;
在所述第一过孔和所述第二过孔内填充导电填充材料形成导电填充层,所述导电填充层的导电填充材料包括有机导电材料;
在所述第二钝化层及所述导电填充层上形成透明导电层,再将所述透明导电层进行图案化处理形成像素电极。
7.如权利要求6所述的COA基板的制作方法,其特征在于,所述有机导电材料为聚对苯、聚吡咯、聚噻吩、聚苯基乙炔和聚苯胺中的一种或多种。
8.如权利要求6所述的COA基板的制作方法,其特征在于,所述在所述第一过孔和所述第二过孔内填充导电填充材料形成导电填充层的具体操作为:采用喷墨打印的方法将所述有机导电材料填充在所述第一过孔和所述第二过孔内。
9.如权利要求6所述的COA基板的制作方法,其特征在于,所述在所述第一过孔和所述第二过孔内填充导电填充材料形成导电填充层的具体操作为:在所述第一过孔和所述第二过孔内涂覆所述有机导电材料,再涂覆光刻胶,然后经光刻工艺获得。
10.如权利要求6所述的COA基板的制作方法,其特征在于,在填充导电填充材料之后,对所述导电填充层进行平坦化处理,以使所述导电填充层的表面与所述第二钝化层的表面齐平。
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US20180052373A1 (en) | 2018-02-22 |
US10007157B2 (en) | 2018-06-26 |
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