CN105384339A - 无铅低熔点玻璃组合物以及使用组合物的玻璃材料和元件 - Google Patents

无铅低熔点玻璃组合物以及使用组合物的玻璃材料和元件 Download PDF

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Publication number
CN105384339A
CN105384339A CN201510532989.5A CN201510532989A CN105384339A CN 105384339 A CN105384339 A CN 105384339A CN 201510532989 A CN201510532989 A CN 201510532989A CN 105384339 A CN105384339 A CN 105384339A
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China
Prior art keywords
lead
low
content
glass
free low
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Pending
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CN201510532989.5A
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English (en)
Chinese (zh)
Inventor
内藤孝
立园信一
吉村圭
桥场裕司
青柳拓也
小野寺大刚
三宅龙也
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Resonac Corp
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Hitachi Chemical Co Ltd
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Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to CN202010185171.1A priority Critical patent/CN111362573A/zh
Priority to CN202011042109.3A priority patent/CN112174522A/zh
Publication of CN105384339A publication Critical patent/CN105384339A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B23/00—Re-forming shaped glass
    • C03B23/20—Uniting glass pieces by fusing without substantial reshaping
    • C03B23/203—Uniting glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/12—Silica-free oxide glass compositions
    • C03C3/122—Silica-free oxide glass compositions containing oxides of As, Sb, Bi, Mo, W, V, Te as glass formers
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/12—Silica-free oxide glass compositions
    • C03C3/14—Silica-free oxide glass compositions containing boron
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/12—Silica-free oxide glass compositions
    • C03C3/16—Silica-free oxide glass compositions containing phosphorus
    • C03C3/21—Silica-free oxide glass compositions containing phosphorus containing titanium, zirconium, vanadium, tungsten or molybdenum
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/08—Frit compositions, i.e. in a powdered or comminuted form containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C03C8/16—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions with vehicle or suspending agents, e.g. slip
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C03C8/18—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions containing free metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F10/00—Individual photovoltaic cells, e.g. solar cells
    • H10F10/10—Individual photovoltaic cells, e.g. solar cells having potential barriers
    • H10F10/14—Photovoltaic cells having only PN homojunction potential barriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/20—Electrodes
    • H10F77/206—Electrodes for devices having potential barriers
    • H10F77/211—Electrodes for devices having potential barriers for photovoltaic cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/30—Coatings
    • H10F77/306—Coatings for devices having potential barriers
    • H10F77/311—Coatings for devices having potential barriers for photovoltaic cells
    • H10F77/315—Coatings for devices having potential barriers for photovoltaic cells the coatings being antireflective or having enhancing optical properties
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1126—Firing, i.e. heating a powder or paste above the melting temperature of at least one of its constituents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/547—Monocrystalline silicon PV cells

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Physics & Mathematics (AREA)
  • Sustainable Development (AREA)
  • Glass Compositions (AREA)
  • Optics & Photonics (AREA)
  • Sustainable Energy (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Photovoltaic Devices (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Electroluminescent Light Sources (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Acoustics & Sound (AREA)
  • Microelectronics & Electronic Packaging (AREA)
CN201510532989.5A 2014-08-29 2015-08-27 无铅低熔点玻璃组合物以及使用组合物的玻璃材料和元件 Pending CN105384339A (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202010185171.1A CN111362573A (zh) 2014-08-29 2015-08-27 无铅低熔点玻璃组合物以及使用组合物的玻璃材料和元件
CN202011042109.3A CN112174522A (zh) 2014-08-29 2015-08-27 无铅低熔点玻璃组合物以及使用组合物的玻璃材料和元件

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-175642 2014-08-29
JP2014175642A JP6350127B2 (ja) 2014-08-29 2014-08-29 無鉛低融点ガラス組成物並びにこれを含む低温封止用ガラスフリット、低温封止用ガラスペースト、導電性材料及び導電性ガラスペースト並びにこれらを利用したガラス封止部品及び電気電子部品

Related Child Applications (2)

Application Number Title Priority Date Filing Date
CN202011042109.3A Division CN112174522A (zh) 2014-08-29 2015-08-27 无铅低熔点玻璃组合物以及使用组合物的玻璃材料和元件
CN202010185171.1A Division CN111362573A (zh) 2014-08-29 2015-08-27 无铅低熔点玻璃组合物以及使用组合物的玻璃材料和元件

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CN105384339A true CN105384339A (zh) 2016-03-09

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CN201510532989.5A Pending CN105384339A (zh) 2014-08-29 2015-08-27 无铅低熔点玻璃组合物以及使用组合物的玻璃材料和元件
CN202011042109.3A Pending CN112174522A (zh) 2014-08-29 2015-08-27 无铅低熔点玻璃组合物以及使用组合物的玻璃材料和元件
CN202010185171.1A Pending CN111362573A (zh) 2014-08-29 2015-08-27 无铅低熔点玻璃组合物以及使用组合物的玻璃材料和元件

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CN202011042109.3A Pending CN112174522A (zh) 2014-08-29 2015-08-27 无铅低熔点玻璃组合物以及使用组合物的玻璃材料和元件
CN202010185171.1A Pending CN111362573A (zh) 2014-08-29 2015-08-27 无铅低熔点玻璃组合物以及使用组合物的玻璃材料和元件

Country Status (3)

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US (2) US9670090B2 (cg-RX-API-DMAC7.html)
JP (1) JP6350127B2 (cg-RX-API-DMAC7.html)
CN (3) CN105384339A (cg-RX-API-DMAC7.html)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106683748A (zh) * 2016-12-09 2017-05-17 东莞珂洛赫慕电子材料科技有限公司 一种环保型低温烧结高导热介质浆料及其制备方法
CN107893611A (zh) * 2016-10-03 2018-04-10 日立化成株式会社 真空绝热部件、密封材料和真空绝热部件的制造方法
CN107919401A (zh) * 2016-10-10 2018-04-17 三星Sdi株式会社 用于太阳能电池电极的组合物及使用此组合物制造的电极
CN111556856A (zh) * 2017-11-28 2020-08-18 日立化成株式会社 密封材料和使用其的多层玻璃面板
CN112909103A (zh) * 2021-03-29 2021-06-04 通威太阳能（安徽）有限公司 一种隔离材料、电池背场背极及制备方法、太阳能电池及制备方法
CN113348520A (zh) * 2019-10-24 2021-09-03 博思有限公司 玻璃料及包括其的太阳能电池电极用浆料组合物
CN113470864A (zh) * 2021-09-01 2021-10-01 西安宏星电子浆料科技股份有限公司 一种低尺寸效应的厚膜电阻浆料
CN114031298A (zh) * 2021-11-30 2022-02-11 深圳市绚图新材科技有限公司 一种导电浆料用的低熔点无铅玻璃粉及其制备方法
WO2022041537A1 (zh) * 2020-08-26 2022-03-03 南通天盛新能源股份有限公司 一种玻璃粉及含该玻璃粉的银浆

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6350127B2 (ja) * 2014-08-29 2018-07-04 日立化成株式会社 無鉛低融点ガラス組成物並びにこれを含む低温封止用ガラスフリット、低温封止用ガラスペースト、導電性材料及び導電性ガラスペースト並びにこれらを利用したガラス封止部品及び電気電子部品
DE102014014322B4 (de) * 2014-10-01 2017-11-23 Ferro Gmbh Tellurat-Fügeglas mit Verarbeitungstemperaturen ≦ 400 °C
JP6681413B2 (ja) * 2016-01-18 2020-04-15 株式会社日立製作所 無鉛ガラス組成物、ガラス複合材料、ガラスペースト、封止構造体、電気電子部品及び塗装部品
US10531555B1 (en) * 2016-03-22 2020-01-07 The United States Of America As Represented By The Secretary Of The Army Tungsten oxide thermal shield
DE102016109414A1 (de) * 2016-05-23 2017-11-23 Ferro Gmbh Niedertemperatur-Telluritglasmischungen für Vakuumverdichtung bei Temperaturen ≤450 °C
JP6690607B2 (ja) * 2016-08-03 2020-04-28 信越化学工業株式会社 合成石英ガラスリッド及び光学素子用パッケージ
JP2020073418A (ja) * 2017-01-30 2020-05-14 株式会社日立製作所 接合材及び接合体
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GB201806411D0 (en) 2018-04-19 2018-06-06 Johnson Matthey Plc Kit, particle mixture, paste and methods
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MX2021005461A (es) 2018-11-26 2021-06-18 Owens Corning Intellectual Capital Llc Composicion de fibra de vidrio de alto rendimiento con modulo de elasticidad mejorado.
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JP2022124435A (ja) * 2021-02-15 2022-08-25 日立グローバルライフソリューションズ株式会社 真空断熱パネルおよびその製造方法
WO2022172542A1 (ja) * 2021-02-15 2022-08-18 日立グローバルライフソリューションズ株式会社 真空断熱パネルおよびその製造方法
KR102527089B1 (ko) * 2021-05-21 2023-05-03 한국원자력연구원 방사성 요오드의 흡착 및 고화용 유리 조성물 및 이를 이용한 방사성 요오드의 흡착 및 고화 방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3798114A (en) * 1971-05-11 1974-03-19 Owens Illinois Inc Glasses with high content of silver oxide
US4945071A (en) * 1989-04-19 1990-07-31 National Starch And Chemical Investment Holding Company Low softening point metallic oxide glasses suitable for use in electronic applications
CN103648999A (zh) * 2011-07-04 2014-03-19 株式会社日立制作所 玻璃组合物、包含其的玻璃料、包含其的玻璃膏、及利用其的电气电子零件

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9015072D0 (en) * 1990-07-09 1990-08-29 Cookson Group Plc Glass composition
JPH05170481A (ja) * 1991-12-20 1993-07-09 Nippon Electric Glass Co Ltd 低融点封着組成物
US5334558A (en) * 1992-10-19 1994-08-02 Diemat, Inc. Low temperature glass with improved thermal stress properties and method of use
JPH06171975A (ja) * 1992-12-11 1994-06-21 Nippon Electric Glass Co Ltd 低融点封着組成物
CN101164943A (zh) * 2006-10-19 2008-04-23 北京印刷学院 一种用作电子浆料组成中粘接相的无铅碲酸盐低熔玻璃
CN101164942A (zh) * 2006-10-19 2008-04-23 北京印刷学院 一种无铅碲酸盐低熔封接玻璃
JP4974058B2 (ja) * 2007-01-30 2012-07-11 日本電気硝子株式会社 平面表示装置
CN102947001B (zh) * 2010-03-12 2014-12-03 株式会社小原 光催化剂、浆液状混合物、成型材料及涂料、涂膜形成材料、烧结体、玻璃陶瓷复合体、玻璃、建材及净化材料
JP5712123B2 (ja) * 2011-12-26 2015-05-07 株式会社日立製作所 複合材料
JP6391926B2 (ja) * 2012-10-10 2018-09-19 株式会社オハラ 結晶化ガラス及びその製造方法
JP5853106B2 (ja) * 2012-11-09 2016-02-09 株式会社日立製作所 接合構造体とその製造方法
JP6350127B2 (ja) * 2014-08-29 2018-07-04 日立化成株式会社 無鉛低融点ガラス組成物並びにこれを含む低温封止用ガラスフリット、低温封止用ガラスペースト、導電性材料及び導電性ガラスペースト並びにこれらを利用したガラス封止部品及び電気電子部品

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3798114A (en) * 1971-05-11 1974-03-19 Owens Illinois Inc Glasses with high content of silver oxide
US4945071A (en) * 1989-04-19 1990-07-31 National Starch And Chemical Investment Holding Company Low softening point metallic oxide glasses suitable for use in electronic applications
EP0393416A1 (en) * 1989-04-19 1990-10-24 National Starch and Chemical Investment Holding Corporation Low softening point metallic oxide glasses suitable for use in electronic applications
CN103648999A (zh) * 2011-07-04 2014-03-19 株式会社日立制作所 玻璃组合物、包含其的玻璃料、包含其的玻璃膏、及利用其的电气电子零件

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107893611A (zh) * 2016-10-03 2018-04-10 日立化成株式会社 真空绝热部件、密封材料和真空绝热部件的制造方法
CN107919401A (zh) * 2016-10-10 2018-04-17 三星Sdi株式会社 用于太阳能电池电极的组合物及使用此组合物制造的电极
CN107919401B (zh) * 2016-10-10 2019-08-13 三星Sdi株式会社 用于太阳能电池电极的组合物及使用此组合物制造的电极
CN106683748A (zh) * 2016-12-09 2017-05-17 东莞珂洛赫慕电子材料科技有限公司 一种环保型低温烧结高导热介质浆料及其制备方法
CN111556856A (zh) * 2017-11-28 2020-08-18 日立化成株式会社 密封材料和使用其的多层玻璃面板
CN111556856B (zh) * 2017-11-28 2023-07-28 株式会社力森诺科 密封材料和使用其的多层玻璃面板
CN113348520A (zh) * 2019-10-24 2021-09-03 博思有限公司 玻璃料及包括其的太阳能电池电极用浆料组合物
WO2022041537A1 (zh) * 2020-08-26 2022-03-03 南通天盛新能源股份有限公司 一种玻璃粉及含该玻璃粉的银浆
CN112909103A (zh) * 2021-03-29 2021-06-04 通威太阳能（安徽）有限公司 一种隔离材料、电池背场背极及制备方法、太阳能电池及制备方法
CN113470864A (zh) * 2021-09-01 2021-10-01 西安宏星电子浆料科技股份有限公司 一种低尺寸效应的厚膜电阻浆料
CN114031298A (zh) * 2021-11-30 2022-02-11 深圳市绚图新材科技有限公司 一种导电浆料用的低熔点无铅玻璃粉及其制备方法

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