CN105379431A - 电子部件以及电子部件的制造方法 - Google Patents

电子部件以及电子部件的制造方法 Download PDF

Info

Publication number
CN105379431A
CN105379431A CN201480040475.1A CN201480040475A CN105379431A CN 105379431 A CN105379431 A CN 105379431A CN 201480040475 A CN201480040475 A CN 201480040475A CN 105379431 A CN105379431 A CN 105379431A
Authority
CN
China
Prior art keywords
conductibility
patch panel
flexible printing
electronic unit
metallic plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201480040475.1A
Other languages
English (en)
Chinese (zh)
Inventor
木谷聪志
内田淑文
木村道广
山本正道
桥爪佳世
上原澄人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Sumitomo Electric Printed Circuits Inc
Original Assignee
Sumitomo Electric Industries Ltd
Sumitomo Electric Printed Circuits Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2013148047A external-priority patent/JP6239884B2/ja
Priority claimed from JP2014014748A external-priority patent/JP2015142051A/ja
Application filed by Sumitomo Electric Industries Ltd, Sumitomo Electric Printed Circuits Inc filed Critical Sumitomo Electric Industries Ltd
Publication of CN105379431A publication Critical patent/CN105379431A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Laminated Bodies (AREA)
CN201480040475.1A 2013-07-16 2014-07-09 电子部件以及电子部件的制造方法 Pending CN105379431A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2013148047A JP6239884B2 (ja) 2013-07-16 2013-07-16 電子部品及びその製造方法
JP2013-148047 2013-07-16
JP2014-014748 2014-01-29
JP2014014748A JP2015142051A (ja) 2014-01-29 2014-01-29 電子部品及び電子部品の製造方法
PCT/JP2014/068257 WO2015008671A1 (ja) 2013-07-16 2014-07-09 電子部品及び電子部品の製造方法

Publications (1)

Publication Number Publication Date
CN105379431A true CN105379431A (zh) 2016-03-02

Family

ID=52346136

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480040475.1A Pending CN105379431A (zh) 2013-07-16 2014-07-09 电子部件以及电子部件的制造方法

Country Status (2)

Country Link
CN (1) CN105379431A (ja)
WO (1) WO2015008671A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6449111B2 (ja) * 2015-06-17 2019-01-09 住友電工プリントサーキット株式会社 シールド材、電子部品及び接着シート

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54144970A (en) * 1978-05-01 1979-11-12 Nitto Electric Ind Co Adhesive tape for electric circuit components
JPH05117606A (ja) * 1991-04-12 1993-05-14 Minnesota Mining & Mfg Co <3M> 導電性接着テープ
JPH1076608A (ja) * 1996-09-05 1998-03-24 Kyodo Printing Co Ltd 化粧紙
CN1744375A (zh) * 2004-08-05 2006-03-08 精工爱普生株式会社 连接用基板、连接结构、连接方法和电子仪器
JP2006298954A (ja) * 2005-04-15 2006-11-02 Tatsuta System Electronics Kk 導電性接着シート及び回路基板
US20070254117A1 (en) * 2006-05-01 2007-11-01 Bhret Graydon Conductive Stiffener for a Flexible Substrate
CN101225284A (zh) * 2007-01-17 2008-07-23 卓英社有限公司 传导压敏胶带
CN202549824U (zh) * 2012-02-22 2012-11-21 苏州晶方半导体科技股份有限公司 芯片封装结构
JP2013026322A (ja) * 2011-07-19 2013-02-04 Shin Etsu Polymer Co Ltd プリント配線板
CN102933024A (zh) * 2011-08-11 2013-02-13 大自达电线股份有限公司 印刷电路板及印刷电路板的制造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH064579Y2 (ja) * 1987-10-15 1994-02-02 株式会社フジクラ フレキシブルプリント配線板
JP4922465B2 (ja) * 2011-06-16 2012-04-25 株式会社東芝 電子機器

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54144970A (en) * 1978-05-01 1979-11-12 Nitto Electric Ind Co Adhesive tape for electric circuit components
JPH05117606A (ja) * 1991-04-12 1993-05-14 Minnesota Mining & Mfg Co <3M> 導電性接着テープ
JPH1076608A (ja) * 1996-09-05 1998-03-24 Kyodo Printing Co Ltd 化粧紙
CN1744375A (zh) * 2004-08-05 2006-03-08 精工爱普生株式会社 连接用基板、连接结构、连接方法和电子仪器
JP2006298954A (ja) * 2005-04-15 2006-11-02 Tatsuta System Electronics Kk 導電性接着シート及び回路基板
US20070254117A1 (en) * 2006-05-01 2007-11-01 Bhret Graydon Conductive Stiffener for a Flexible Substrate
CN101225284A (zh) * 2007-01-17 2008-07-23 卓英社有限公司 传导压敏胶带
JP2013026322A (ja) * 2011-07-19 2013-02-04 Shin Etsu Polymer Co Ltd プリント配線板
CN102933024A (zh) * 2011-08-11 2013-02-13 大自达电线股份有限公司 印刷电路板及印刷电路板的制造方法
CN202549824U (zh) * 2012-02-22 2012-11-21 苏州晶方半导体科技股份有限公司 芯片封装结构

Also Published As

Publication number Publication date
WO2015008671A1 (ja) 2015-01-22

Similar Documents

Publication Publication Date Title
TWI538579B (zh) Multi - layer circuit board and multilayer circuit board manufacturing method
KR100616796B1 (ko) 반도체소자의 실장방법
CN105826418A (zh) 连接结构的制造方法以及太阳能电池模块的制造方法
CN103748978A (zh) 电路板
JPWO2008047918A1 (ja) 電子機器のパッケージ構造及びパッケージ製造方法
CN103748977A (zh) 部件安装印刷电路基板及其制造方法
CN113690209A (zh) 多层基板
KR20120049144A (ko) 전자부품을 가진 배선기판 및 그 제조방법
KR102477543B1 (ko) 전자파 차폐 시트 및 전자부품 탑재 기판
JP2017045932A (ja) 電子部品モジュールの製造方法
JP2011049175A (ja) 電子部品の接続方法及び接続構造体
CN105008475B (zh) 粘接片及粘接片的制造方法
CN105379431A (zh) 电子部件以及电子部件的制造方法
KR20180089886A (ko) 반도체 칩의 제조 방법
JP6568436B2 (ja) 電子部品、接着シート及び電子部品の製造方法
WO2016185827A1 (ja) 電子部品、接着シート及び電子部品の製造方法
JP6377905B2 (ja) 接着シート及び接着シートの製造方法
KR20120085208A (ko) 전자부품 실장용 배선기판의 제조방법, 전자부품 실장용 배선기판, 및 전자부품을 가진 배선기판의 제조방법
JP2011211245A (ja) 接続構造体の製造方法及び接続構造体並びに接続方法
JP2008112732A (ja) 電極の接続方法
JP4670859B2 (ja) 接続部材及びこれを用いた電極の接続構造
JP6262552B2 (ja) 電子部品の製造方法
JP2007027483A (ja) 回路装置および表示装置および異方性導電膜
CN114787975A (zh) 电子零件的制造方法
JP2008103347A (ja) 接続部材及びこれを用いた電極の接続構造

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20160302

WD01 Invention patent application deemed withdrawn after publication