CN105364634B - 仿形装置 - Google Patents

仿形装置 Download PDF

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Publication number
CN105364634B
CN105364634B CN201410811991.1A CN201410811991A CN105364634B CN 105364634 B CN105364634 B CN 105364634B CN 201410811991 A CN201410811991 A CN 201410811991A CN 105364634 B CN105364634 B CN 105364634B
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CN
China
Prior art keywords
profiling
pair
base station
device base
sphere
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201410811991.1A
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English (en)
Chinese (zh)
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CN105364634A (zh
Inventor
伊藤秀和
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CKD Corp
Original Assignee
CKD Corp
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Filing date
Publication date
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Publication of CN105364634A publication Critical patent/CN105364634A/zh
Application granted granted Critical
Publication of CN105364634B publication Critical patent/CN105364634B/zh
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Magnetic Bearings And Hydrostatic Bearings (AREA)
  • Automatic Assembly (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Hooks, Suction Cups, And Attachment By Adhesive Means (AREA)
  • Toys (AREA)
  • Manipulator (AREA)
CN201410811991.1A 2014-09-01 2014-12-19 仿形装置 Active CN105364634B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-177387 2014-09-01
JP2014177387A JP6385760B2 (ja) 2014-09-01 2014-09-01 倣い装置

Publications (2)

Publication Number Publication Date
CN105364634A CN105364634A (zh) 2016-03-02
CN105364634B true CN105364634B (zh) 2017-11-24

Family

ID=55367517

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410811991.1A Active CN105364634B (zh) 2014-09-01 2014-12-19 仿形装置

Country Status (4)

Country Link
JP (1) JP6385760B2 (https=)
KR (1) KR101717463B1 (https=)
CN (1) CN105364634B (https=)
TW (1) TWI598205B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107116385B (zh) * 2017-06-19 2023-08-08 苏州赛腾精密电子股份有限公司 一种手机壳公模治具
JP7107675B2 (ja) * 2017-12-14 2022-07-27 三星電子株式会社 半導体実装装置および半導体実装方法
JP7325705B2 (ja) * 2019-04-25 2023-08-15 Smc株式会社 倣い装置
JP7722291B2 (ja) * 2021-10-12 2025-08-13 株式会社デンソー フローティング当接装置
JP7792381B2 (ja) * 2023-08-30 2025-12-25 Ckd株式会社 傾き調整装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002280397A (ja) * 2001-03-19 2002-09-27 Furukawa Electric Co Ltd:The 面合わせ機構および面合わせ方法
JP2002359263A (ja) * 2001-05-31 2002-12-13 Ckd Corp 倣い装置及び倣い装置における倣い状態保持方法
CN1772436A (zh) * 2004-11-09 2006-05-17 精工爱普生株式会社 弹性研磨工具及镜片研磨方法
CN1947942A (zh) * 2006-09-30 2007-04-18 中国地质大学（武汉） 光学二次非球面凹面零件仿形加工方法及装置
JP4098949B2 (ja) * 1999-08-25 2008-06-11 シーケーディ株式会社 倣い装置
JP2010027988A (ja) * 2008-07-23 2010-02-04 Ckd Corp 倣い装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000306979A (ja) * 1999-04-19 2000-11-02 Ckd Corp 倣い装置
JP4081226B2 (ja) * 1999-08-25 2008-04-23 シーケーディ株式会社 回り止め装置、同装置に対する加圧流体の供給方法、及び倣い装置
JP4547652B2 (ja) * 2000-04-03 2010-09-22 Ｓｍｃ株式会社 自動調芯押付け装置
TWI380944B (zh) * 2004-11-24 2013-01-01 Ｃｋｄ股份有限公司 A floating unit having a tilting function, and a floating device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4098949B2 (ja) * 1999-08-25 2008-06-11 シーケーディ株式会社 倣い装置
JP2002280397A (ja) * 2001-03-19 2002-09-27 Furukawa Electric Co Ltd:The 面合わせ機構および面合わせ方法
JP2002359263A (ja) * 2001-05-31 2002-12-13 Ckd Corp 倣い装置及び倣い装置における倣い状態保持方法
CN1772436A (zh) * 2004-11-09 2006-05-17 精工爱普生株式会社 弹性研磨工具及镜片研磨方法
CN1947942A (zh) * 2006-09-30 2007-04-18 中国地质大学（武汉） 光学二次非球面凹面零件仿形加工方法及装置
JP2010027988A (ja) * 2008-07-23 2010-02-04 Ckd Corp 倣い装置

Also Published As

Publication number Publication date
JP6385760B2 (ja) 2018-09-05
JP2016051857A (ja) 2016-04-11
KR101717463B1 (ko) 2017-03-17
CN105364634A (zh) 2016-03-02
TWI598205B (zh) 2017-09-11
KR20160026617A (ko) 2016-03-09
TW201609339A (zh) 2016-03-16

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