KR101717463B1 - 모방 장치 - Google Patents

모방 장치 Download PDF

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Publication number
KR101717463B1
KR101717463B1 KR1020140193361A KR20140193361A KR101717463B1 KR 101717463 B1 KR101717463 B1 KR 101717463B1 KR 1020140193361 A KR1020140193361 A KR 1020140193361A KR 20140193361 A KR20140193361 A KR 20140193361A KR 101717463 B1 KR101717463 B1 KR 101717463B1
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KR
South Korea
Prior art keywords
imitation
spherical surface
pair
device base
concave spherical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
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KR1020140193361A
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English (en)
Korean (ko)
Other versions
KR20160026617A (ko
Inventor
히데카즈 이토
Original Assignee
시케이디 가부시키가이샤
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Publication date
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Publication of KR20160026617A publication Critical patent/KR20160026617A/ko
Application granted granted Critical
Publication of KR101717463B1 publication Critical patent/KR101717463B1/ko
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Magnetic Bearings And Hydrostatic Bearings (AREA)
  • Automatic Assembly (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Hooks, Suction Cups, And Attachment By Adhesive Means (AREA)
  • Toys (AREA)
  • Manipulator (AREA)
KR1020140193361A 2014-09-01 2014-12-30 모방 장치 Active KR101717463B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014177387A JP6385760B2 (ja) 2014-09-01 2014-09-01 倣い装置
JPJP-P-2014-177387 2014-09-01

Publications (2)

Publication Number Publication Date
KR20160026617A KR20160026617A (ko) 2016-03-09
KR101717463B1 true KR101717463B1 (ko) 2017-03-17

Family

ID=55367517

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140193361A Active KR101717463B1 (ko) 2014-09-01 2014-12-30 모방 장치

Country Status (4)

Country Link
JP (1) JP6385760B2 (https=)
KR (1) KR101717463B1 (https=)
CN (1) CN105364634B (https=)
TW (1) TWI598205B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107116385B (zh) * 2017-06-19 2023-08-08 苏州赛腾精密电子股份有限公司 一种手机壳公模治具
JP7107675B2 (ja) * 2017-12-14 2022-07-27 三星電子株式会社 半導体実装装置および半導体実装方法
JP7325705B2 (ja) * 2019-04-25 2023-08-15 Smc株式会社 倣い装置
JP7722291B2 (ja) * 2021-10-12 2025-08-13 株式会社デンソー フローティング当接装置
JP7792381B2 (ja) * 2023-08-30 2025-12-25 Ckd株式会社 傾き調整装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4081226B2 (ja) 1999-08-25 2008-04-23 シーケーディ株式会社 回り止め装置、同装置に対する加圧流体の供給方法、及び倣い装置
JP4098949B2 (ja) 1999-08-25 2008-06-11 シーケーディ株式会社 倣い装置
JP2010027988A (ja) * 2008-07-23 2010-02-04 Ckd Corp 倣い装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000306979A (ja) * 1999-04-19 2000-11-02 Ckd Corp 倣い装置
JP4547652B2 (ja) * 2000-04-03 2010-09-22 Ｓｍｃ株式会社 自動調芯押付け装置
JP2002280397A (ja) * 2001-03-19 2002-09-27 Furukawa Electric Co Ltd:The 面合わせ機構および面合わせ方法
JP4081247B2 (ja) * 2001-05-31 2008-04-23 シーケーディ株式会社 倣い装置及び倣い装置における倣い状態保持方法
EP1777035A3 (en) * 2004-11-09 2007-05-16 Seiko Epson Corporation Elastic polishing tool and lens polishing method using this tool
TWI380944B (zh) * 2004-11-24 2013-01-01 Ｃｋｄ股份有限公司 A floating unit having a tilting function, and a floating device
CN100484713C (zh) * 2006-09-30 2009-05-06 中国地质大学（武汉） 光学二次非球面凹面零件仿形加工方法及装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4081226B2 (ja) 1999-08-25 2008-04-23 シーケーディ株式会社 回り止め装置、同装置に対する加圧流体の供給方法、及び倣い装置
JP4098949B2 (ja) 1999-08-25 2008-06-11 シーケーディ株式会社 倣い装置
JP2010027988A (ja) * 2008-07-23 2010-02-04 Ckd Corp 倣い装置

Also Published As

Publication number Publication date
JP6385760B2 (ja) 2018-09-05
JP2016051857A (ja) 2016-04-11
CN105364634A (zh) 2016-03-02
TWI598205B (zh) 2017-09-11
CN105364634B (zh) 2017-11-24
KR20160026617A (ko) 2016-03-09
TW201609339A (zh) 2016-03-16

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