TWI598205B - 仿形裝置 - Google Patents

仿形裝置 Download PDF

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Publication number
TWI598205B
TWI598205B TW103143619A TW103143619A TWI598205B TW I598205 B TWI598205 B TW I598205B TW 103143619 A TW103143619 A TW 103143619A TW 103143619 A TW103143619 A TW 103143619A TW I598205 B TWI598205 B TW I598205B
Authority
TW
Taiwan
Prior art keywords
spherical surface
pair
base
porous body
concave spherical
Prior art date
Application number
TW103143619A
Other languages
English (en)
Chinese (zh)
Other versions
TW201609339A (zh
Inventor
伊藤秀和
Original Assignee
喜開理股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 喜開理股份有限公司 filed Critical 喜開理股份有限公司
Publication of TW201609339A publication Critical patent/TW201609339A/zh
Application granted granted Critical
Publication of TWI598205B publication Critical patent/TWI598205B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Magnetic Bearings And Hydrostatic Bearings (AREA)
  • Automatic Assembly (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Hooks, Suction Cups, And Attachment By Adhesive Means (AREA)
  • Toys (AREA)
  • Manipulator (AREA)
TW103143619A 2014-09-01 2014-12-15 仿形裝置 TWI598205B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014177387A JP6385760B2 (ja) 2014-09-01 2014-09-01 倣い装置

Publications (2)

Publication Number Publication Date
TW201609339A TW201609339A (zh) 2016-03-16
TWI598205B true TWI598205B (zh) 2017-09-11

Family

ID=55367517

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103143619A TWI598205B (zh) 2014-09-01 2014-12-15 仿形裝置

Country Status (4)

Country Link
JP (1) JP6385760B2 (https=)
KR (1) KR101717463B1 (https=)
CN (1) CN105364634B (https=)
TW (1) TWI598205B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107116385B (zh) * 2017-06-19 2023-08-08 苏州赛腾精密电子股份有限公司 一种手机壳公模治具
JP7107675B2 (ja) * 2017-12-14 2022-07-27 三星電子株式会社 半導体実装装置および半導体実装方法
JP7325705B2 (ja) * 2019-04-25 2023-08-15 Smc株式会社 倣い装置
JP7722291B2 (ja) * 2021-10-12 2025-08-13 株式会社デンソー フローティング当接装置
JP7792381B2 (ja) * 2023-08-30 2025-12-25 Ckd株式会社 傾き調整装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000306979A (ja) * 1999-04-19 2000-11-02 Ckd Corp 倣い装置
JP4098949B2 (ja) * 1999-08-25 2008-06-11 シーケーディ株式会社 倣い装置
JP4081226B2 (ja) * 1999-08-25 2008-04-23 シーケーディ株式会社 回り止め装置、同装置に対する加圧流体の供給方法、及び倣い装置
JP4547652B2 (ja) * 2000-04-03 2010-09-22 Ｓｍｃ株式会社 自動調芯押付け装置
JP2002280397A (ja) * 2001-03-19 2002-09-27 Furukawa Electric Co Ltd:The 面合わせ機構および面合わせ方法
JP4081247B2 (ja) * 2001-05-31 2008-04-23 シーケーディ株式会社 倣い装置及び倣い装置における倣い状態保持方法
EP1777035A3 (en) * 2004-11-09 2007-05-16 Seiko Epson Corporation Elastic polishing tool and lens polishing method using this tool
TWI380944B (zh) * 2004-11-24 2013-01-01 Ｃｋｄ股份有限公司 A floating unit having a tilting function, and a floating device
CN100484713C (zh) * 2006-09-30 2009-05-06 中国地质大学（武汉） 光学二次非球面凹面零件仿形加工方法及装置
JP5053949B2 (ja) * 2008-07-23 2012-10-24 Ｃｋｄ株式会社 倣い装置

Also Published As

Publication number Publication date
JP6385760B2 (ja) 2018-09-05
JP2016051857A (ja) 2016-04-11
KR101717463B1 (ko) 2017-03-17
CN105364634A (zh) 2016-03-02
CN105364634B (zh) 2017-11-24
KR20160026617A (ko) 2016-03-09
TW201609339A (zh) 2016-03-16

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