CN105247094B - 具有含特定显微组织的ZnAlMg涂层的金属板以及相应制造方法 - Google Patents

具有含特定显微组织的ZnAlMg涂层的金属板以及相应制造方法 Download PDF

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CN105247094B
CN105247094B CN201380072424.2A CN201380072424A CN105247094B CN 105247094 B CN105247094 B CN 105247094B CN 201380072424 A CN201380072424 A CN 201380072424A CN 105247094 B CN105247094 B CN 105247094B
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coating
metallic plate
less
mgzn
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克里斯蒂安·阿勒利
卢克·迭斯
蒂亚戈·马沙多阿莫里姆
让-米歇尔·马泰格纳
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Abstract

本发明涉及一种金属板,其包含至少一面(5)涂覆有金属涂层(7)的基板(3),该金属涂层(7)具有在3.6%与3.8%之间的铝重量含量tAl和在2.7%与3.3%之间的镁重量含量tMg。该涂层具有下述显微组织,其包含Zn/Al/MgZn2三元共晶体层状基体以及任选地包含:‑累计表面含量小于或等于5.0%的Zn枝晶;‑累计表面含量小于或等于15.0%的Zn/MgZn2二元共晶体花朵;累计表面含量小于或等于1.0%的Zn/Al二元共晶体枝晶;以及累计表面含量小于1.0%的MgZn2岛。

Description

具有含特定显微组织的ZnAlMg涂层的金属板以及相应制造 方法
本发明涉及一种金属板,其包含至少一面涂覆有金属涂层的基板,该金属涂层含有Al和Mg,该金属涂层的余量为Zn、不可避免的杂质以及可能的选自Si、Sb、Pb、Ti、Ca、Mn、Sn、La、Ce、Cr、Ni或Bi中的一种或更多种附加元素,其中在金属涂层中每种附加元素按重量计的含量小于0.3%。
基本上由锌和0.1wt%至0.4wt%的铝组成的金属镀锌涂层由于其良好的腐蚀防护而在传统上被使用。
现在,这些金属涂层尤其受到含有锌、镁和铝的涂层的挑战,添加的镁和铝分别为最高达10wt%和最高达20wt%。
在本文中将这样的金属涂层统称为铝锌镁涂层或ZnAlMg。
镁的添加显著增加了这些涂层的耐红锈腐蚀性,这使得能够减小涂层的厚度或者在恒定厚度下提高长时间的腐蚀防护的保障。
例如,这些板旨在用于汽车、电器或建筑领域。
这些领域中的用户可以在这些板的精加工(finishing)之前或之后将这些板加到漆中。当在精加工之前对它们上漆时,将它们称为“预涂漆”板,其中预涂漆板特别旨在用于电器或建筑领域。
就预涂漆板而言,整个板金属制造方法由钢铁制造商完成,从而降低了在用户处与上漆有关的成本和限制。
然而,值得注意的是,已知的金属涂层可能容易引起漆层的脱落问题,导致板的局部腐蚀。
本发明的一个目的是提供一种涂覆板,在该涂覆板被上漆时,其耐腐蚀性得以提高。
为此,本发明首先涉及根据权利要求1所述的板。
该板还可以单独地或组合地包括权利要求2至12所述的特征。
本发明还涉及根据权利要求13所述的方法。
该方法还可以单独地或组合地包括权利要求14和15所述的特征。
现在将参照附图通过实例来对本发明进行说明,给出所述实例仅用于提供信息,而非进行限制,其中:
-图1示出说明根据本发明的板在上漆之后的结构的示意性剖视图;
-图2至图4为示出图1的板的未经处理的金属涂层的表面的显微组织的示意图;
-图5为示出在与没有根据本发明的板对比的情况下对根据本发明的试样板进行的脱落试验的结果的示意图;以及
-图6为示出各种相的电流密度曲线和腐蚀电位的示意图。
图1的板1包括钢基板3,该钢基板3的两个面5中的每一面上均覆盖有金属涂层7,该金属涂层7本身覆盖有漆膜9、11。
要指出的是,为了便于呈现,在图1中不考虑基板3以及覆盖其的各个层的相对厚度。
存在于两个面5上的涂层7是类似的,因而下文中将仅详细描述一个涂层。或者,(未示出),只有一个面5具有涂层7。
涂层7通常具有小于或等于25μm的厚度并且旨在保护基板3免受腐蚀。
涂层7含有锌、铝和镁。金属涂层7的按重量计的铝含量tAl在3.6%与3.8%之间。金属涂层7的按重量计的镁含量tMg在2.7%与3.3%之间。
优选地,镁含量tMg在2.9%与3.1%之间。
优选地,重量比Al/(Al+Mg)大于或等于0.45,或者甚至大于或等于0.50,或者甚至大于或等于0.55。
如图2至图4中所示,涂层7具有特定的显微组织,其具有三元共晶体Zn/Al/MgZn2的层状基体13。如图3中所示,层状基体13形成由接缝19分开的晶粒。
在本发明的一个优选形式中,三元共晶体构成涂层的整个显微组织。
层状基体13的层间距离可以在其晶粒中相当显著地变化,尤其是靠近可能被该基体涵盖的组织处,现在将描述该基体的组织。
除以上提到的层状基体13之外,在表面处以及在截面中的显微组织可能包含少量的Zn枝晶15和二元共晶体Zn/MgZn2的花朵17,这些枝晶和花朵没有过于有害以致于不能改进根据本发明得到的耐脱落性。
为了实现这一点,Zn枝晶15和二元共晶体Zn/MgZn2的花朵17的累计表面含量被限制至呈未加工状态的外表面21。
优选地,在呈未加工状态的外表面21处Zn枝晶15的累计表面含量小于5.0%、或甚至小于3.0%、或甚至小于2.0%、或甚至小于1.0%、并且最优选地为零;同时在呈未加工状态的外表面21处的二元共晶体Zn/MgZn2的花朵17的累计表面含量小于15.0%、或甚至小于10.0%、或甚至小于5.0%、或甚至小于3.0%、以及理想地为零。
显微组织还可以以非常少的量包括二元共晶体Zn/Al的枝晶或MgZn2小岛,原因是这些组织使根据本发明而涂覆的板的耐脱落性显著劣化。
在任何情况下,在呈未加工状态的外表面21处二元共晶体Zn/Al的枝晶的累计表面含量小于1.0%,同时在呈未加工状态的外表面21处MgZn2小岛的累计表面含量小于1.0%,并且优选地二者总含量为零。
类似地,二元共晶体Zn/Al的枝晶以及MgZn2小岛在截面中的各自的累计含量优选地为零。
因而,通常,显微组织包含三元共晶体的层状基体13,可能包含Zn枝晶15、二元共晶体Zn/MgZn2的花朵17、二元共晶体Zn/Al的枝晶以及MgZn2小岛。然而,取决于下面所述的任选附加元素,显微组织还可以包含少量的被涵盖在三元共晶体的层状基体13中的其它组织。
例如,使用扫描电子显微镜在使呈未加工状态(即,未抛光,但任选地通过有机溶剂脱脂)的外表面21放大1000倍的情况下取至少30帧来测量各组织的累计表面含量。
对于这些帧中的每一帧,提取待测量其含量的组织的轮廓,然后利用例如来自Olympus Soft Imaging Solutions GmbH的软件AnalySIS Docu 5.0计算分析中的组织对外表面21的占用率。计算该占用率作为该分析中的组织的累计表面含量。
例如,漆膜9和漆膜11是基于聚合物的。这些聚合物可以为聚酯或卤代乙烯聚合物,例如塑溶胶、PVDF等。
膜9和膜11的厚度通常在1μm与200μm之间。
为了制造板1,例如可以采取下述步骤。
所使用的设备可以包括单条生产线,或者,为了分别进行金属涂覆以及上漆,可以包括两条不同的生产线。在使用两条不同的生产线的情况下,可以使这两条生产线位于同一位点上或位于不同位点上。在下面的描述中,通过示例的方式,考虑其中使用两条分开的生产线的变化方案。
在实施金属涂层7的第一生产线中,使用例如通过依次热层压、然后冷层压而得到的基板3。基板3为带的形式,使该带卷曲穿过浴以通过热浸来沉积涂层7。
该浴为含有镁和铝的熔融锌的浴。该浴还可以包含最高达0.3wt%的诸如Si、Sb、Pb、Ti、Ca、Mn、Sn、La、Ce、Cr、Ni或Bi的任选附加元素。
这些附加元素尤其能够改进在基板3上的涂层7的延性和粘附性。知道其对涂层7的特性的影响的本领域技术人员将根据所追求的目标来使用上述附加元素。最后,所述浴可能包含来自供应锭或者由于基板3在浴中通过而导致的残余元素,例如量最高达0.5wt%以及通常在0.1wt%与0.4wt%之间的铁。
浴的温度Tb在360℃与480℃之间,优选地在420℃与460℃之间。
在浴的进口处,基板3的浸入温度Ti使得:
(2.34×tAl+0.655×tMg–10.1)x10-6≤exp(-10584/Ti)
其中Ti表示为开尔文温度。
这样的浸入温度Ti使得能够得到上述显微组织,该显微组织具有很少或没有涵盖在层状基体13中的组织。
通常,该温度Ti以下述方式现场确定:在浴上游几米处通过高温技术进行测量,然后应用热模型来计算温度Ti。
为了改变Ti并满足上式,修改用于冷却在浴上游的基板3的条件。该冷却可以通过借助其气体压力可被调节的冷却室将惰性冷却气体吹在基板3的两个表面5上来实现。例如,还可以调节基板3在冷却区中的卷起速度或者甚至可以调节基板3在该区的入口处的温度。
在沉积涂层7之后,例如通过喷嘴来使基板3脱水,所述喷嘴将气体喷在基板3的任一侧上。
然后使得涂层7以受控的方式冷却,使得涂层7固化。
或者,可以进行刷洗以去除沉积在表面5上的涂层,使得板1的面5中的仅一个面将最终涂覆有涂层7。
在固化开始(即,在涂层7的温度刚下降到低于液相线温度时)与固化结束(即,在涂层7达到固相线温度时)之间,以较高速率或优选地等于15℃/秒提供涂层7或各涂层7的受控冷却。更优选地,在固化开始与固化结束之间,涂层7或各涂层7的冷却速率高于或等于20℃/秒。
然后可以使经如此处理的带经受所谓的光整冷轧步骤,该步骤使得该带能够被加工硬化并且使其具有有利于其后续精加工的粗糙度。
该带可以任选地在被传输至预涂漆线之前进行卷绕。
可以使涂层7的外表面21经受脱脂步骤以及任选的表面处理步骤,以便增加漆粘附性和耐腐蚀性。
任何脱脂步骤和表面处理步骤均可以包括诸如冲洗、干燥等的其他子步骤。
然后可以通过下述方式来执行上漆过程:例如,通过沉积两个相继的漆层(即,通常作为实现上膜9的情形的初始层和终饰层),或者通过沉积单个漆层(通常作为实现下膜11的情形)。在一些变化方案中可以使用其他数量的层。
漆层的沉积可以例如通过辊涂机来进行。
通常在漆层的每一次沉积之后,在烘箱中进行烘烤步骤。
在切割、可能的精加工以及用户使其与其他板1或其他项目进行组装之前,可以将如此得到的板1再次卷绕。
试验1
通过改变样品的Ti浸入温度以及tAl和tMg来准备根据本发明的样品板1以及非根据本发明的样品板。对相应的显微组织进行分析以测定存在的组织及其累计表面含量。
*根据本发明
试验2
使根据本发明的样品板1以及非根据本发明的板经受脱落试验以测量其在有漆情况下的耐腐蚀性。
更准确地,所试验的板的涂层厚度为8μm。
根据本发明的板1的涂层7的组成具有3.7%的tAl含量和3.0%的tMg含量。如图5的横坐标轴所示,所测试的其他涂层组成具有0.3%、1.5%、6.0%及11.0%的tAl值以及1.0%、1.5%、3.0及3.0%的tMg值。
根据本发明的板的显微组织仅由三元共晶体组成,并且通过浸没在温度Tb=460℃的涂覆浴中获得,其中条带的温度Ti=480℃。
腐蚀测试根据VDA 621-415进行(10个循环)。
更准确地,所试验的板被磷酸盐化,涂覆有电泳层并且利用1mm宽的刀刃划至基板。
在图5的纵坐标上给出了在针对各个试验板的腐蚀试验之后测量的单位为mm的最大脱落宽度Ud。
可以看到,对于根据本发明的板,脱落宽度是最优的。
完全出人意料地,发现使铝和镁的相关含量增加超过本发明的值会使耐脱落性劣化,从而使耐腐蚀性劣化。
目前本发明人认为在上漆情况下该良好的耐腐蚀性是由于涂层7的特殊显微组织所致,该特殊显微组织限制了其不同组织与层状基体13之间的电耦联的风险。
由于很少存在涵盖在各涂层7的外表面21上的层状基体13中的组织,所以实际上这些相的选择性溶解的风险得以降低。
在图6中,横坐标上示出了相对于在KCl中饱和的参比甘汞电极的腐蚀电位并且在纵坐标上示出了电流密度。曲线23对应于如下组成:其含有3.7wt%的Al和3.0质量%的Mg,其中余量为Zn。该曲线是层状基体13的代表。
图6示出层状基体13的腐蚀性耦联的风险随着含有Al(曲线25)、Mg(曲线27)和Zn(曲线29)的组织而更大。
通常,根据本发明的板1不一定以上漆的形式(“预涂漆”板)出售,和/或可以涂覆有至少油层。

Claims (15)

1.一种金属板(1),其包含至少一面(5)涂覆有金属涂层(7)的基板(3),所述金属涂层(7)含有Al和Mg,所述金属涂层(7)的余量为Zn、不可避免的杂质以及任选的选自Si、Sb、Pb、Ti、Ca、Mn、Sn、La、Ce、Cr或Bi中的一种或更多种附加元素,其中在所述金属涂层(7)中每种附加元素按重量计的含量小于0.3%,所述金属涂层(7)具有按重量计在3.6%与3.8%之间的铝含量tAl和按重量计在2.7%与3.3%之间的镁含量tMg
金属涂层(7)具有由如下组成的显微组织:Zn/Al/MgZn2三元共晶体的层状基体(13)以及:
-在所述涂层(7)的呈未加工状态的外表面(21)处累计表面含量小于或等于5.0%的Zn枝晶(15);
-在所述涂层(7)的呈未加工状态的外表面(21)处累计表面含量小于或等于15.0%的Zn/MgZn2二元共晶体的花朵(17);
-在所述涂层(7)的呈未加工状态的外表面(21)处累计表面含量小于或等于1.0%的Zn/Al二元共晶体的枝晶;
-在所述涂层(7)的呈未加工状态的外表面(21)处累计表面含量小于或等于1.0%的MgZn2小岛。
2.根据权利要求1所述的金属板,其中所述镁含量tMg在2.9%与3.1%之间。
3.根据权利要求1或2所述的金属板,其中重量比Al/(Al+Mg)大于或等于0.45。
4.根据权利要求1或2所述的金属板,其中所述显微组织不含二元共晶体Zn/Al的枝晶。
5.根据权利要求1或2所述的金属板,其中所述显微组织不含MgZn2小岛。
6.根据权利要求1或2所述的金属板,其中在所述涂层(7)的呈未加工状态的外表面(21)处的二元共晶体Zn/MgZn2的花朵(17)的累计表面含量小于10.0%。
7.根据权利要求6所述的金属板,其中在所述涂层(7)的呈未加工状态的外表面(21)处的二元共晶体Zn/MgZn2的花朵(17)的累计表面含量小于5.0%。
8.根据权利要求1或2所述的金属板,其中在所述涂层(7)的呈未加工状态的外表面(21)处的二元共晶体Zn/MgZn2的花朵(17)的累计表面含量小于3.0%。
9.根据权利要求8所述的金属板,其中在所述涂层(7)的呈未加工状态的外表面(21)处的Zn枝晶(15)的累计表面含量小于2.0%。
10.根据权利要求9所述的金属板,其中在所述涂层(7)的呈未加工状态的外表面(21)处的Zn枝晶(15)的累计表面含量小于1.0%。
11.根据权利要求10所述的金属板,其中所述显微组织仅由三元共晶体(13)组成。
12.根据权利要求1或2所述的金属板,其中所述金属涂层(7)至少覆盖有漆层和/或油层。
13.一种制造根据权利要求1至12中任一项所述的金属板(1)的方法,其中所述方法至少包括以下步骤:
-提供钢基板(3);
-通过将所述基板(3)在浴中淬火而在至少一个面(5)上沉积金属涂层(7),其中所述基板在所述浴中具有浸入入口温度Ti使得:
(2.34×tAl+0.655×tMg-10.1)x 10-6≤exp(-10584/Ti)
其中T为开尔文温度;以及
-固化所述金属涂层(7)。
14.根据权利要求13所述的制造方法,其中在固化开始与固化结束之间冷却所述涂层(7)的速率高于或等于15℃/秒。
15.根据权利要求14所述的制造方法,其中在固化开始与固化结束之间冷却所述涂层(7)的速率高于或等于20℃/秒。
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