CN1052375C - 镀铜膜层叠板用铜箔 - Google Patents
镀铜膜层叠板用铜箔 Download PDFInfo
- Publication number
- CN1052375C CN1052375C CN95101968A CN95101968A CN1052375C CN 1052375 C CN1052375 C CN 1052375C CN 95101968 A CN95101968 A CN 95101968A CN 95101968 A CN95101968 A CN 95101968A CN 1052375 C CN1052375 C CN 1052375C
- Authority
- CN
- China
- Prior art keywords
- resin
- weight
- epoxy resin
- copper foil
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 60
- 239000011889 copper foil Substances 0.000 title claims abstract description 46
- 229910052802 copper Inorganic materials 0.000 title claims description 14
- 239000010949 copper Substances 0.000 title claims description 14
- 239000000853 adhesive Substances 0.000 claims abstract description 54
- 230000001070 adhesive effect Effects 0.000 claims abstract description 54
- 239000003822 epoxy resin Substances 0.000 claims abstract description 51
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 51
- 229920005989 resin Polymers 0.000 claims abstract description 41
- 239000011347 resin Substances 0.000 claims abstract description 41
- 239000007787 solid Substances 0.000 claims abstract description 27
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 10
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 8
- 238000004519 manufacturing process Methods 0.000 claims abstract description 4
- 239000000203 mixture Substances 0.000 claims description 13
- 239000005011 phenolic resin Substances 0.000 claims description 10
- 229920001568 phenolic resin Polymers 0.000 claims description 9
- 229920002554 vinyl polymer Polymers 0.000 claims description 9
- DHKHKXVYLBGOIT-UHFFFAOYSA-N 1,1-Diethoxyethane Chemical compound CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 claims description 8
- 239000011354 acetal resin Substances 0.000 claims description 7
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 claims description 7
- 238000007747 plating Methods 0.000 claims description 7
- 239000011120 plywood Substances 0.000 claims description 7
- 229920006324 polyoxymethylene Polymers 0.000 claims description 7
- 239000004593 Epoxy Substances 0.000 claims description 5
- 229920003180 amino resin Polymers 0.000 claims description 5
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 3
- 229920000178 Acrylic resin Polymers 0.000 claims description 2
- 239000004925 Acrylic resin Substances 0.000 claims description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 claims description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 2
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 abstract description 13
- 239000007788 liquid Substances 0.000 abstract description 4
- 239000012790 adhesive layer Substances 0.000 abstract 3
- 125000003700 epoxy group Chemical group 0.000 abstract 1
- 239000011342 resin composition Substances 0.000 abstract 1
- 239000004922 lacquer Substances 0.000 description 11
- 239000000463 material Substances 0.000 description 9
- 238000001035 drying Methods 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 5
- 229920000877 Melamine resin Polymers 0.000 description 4
- 239000004640 Melamine resin Substances 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 4
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 4
- 239000012948 isocyanate Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 150000002513 isocyanates Chemical class 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 2
- 239000005711 Benzoic acid Substances 0.000 description 2
- 229920000459 Nitrile rubber Polymers 0.000 description 2
- 235000010233 benzoic acid Nutrition 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000003814 drug Substances 0.000 description 2
- 229940079593 drug Drugs 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 229920002521 macromolecule Polymers 0.000 description 2
- 150000002924 oxiranes Chemical class 0.000 description 2
- -1 poly glycidyl ester Chemical class 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- WDDQLILWHJKCBR-UHFFFAOYSA-N 2-(oxiran-2-ylmethyl)aniline Chemical compound NC1=CC=CC=C1CC1OC1 WDDQLILWHJKCBR-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- QUOVZGRIHBIRGF-UHFFFAOYSA-N C(C=1C(C(=O)OCCCCCCCC)=CC=CC1)(=O)OCCCCCCCC.C1CCC=CC1 Chemical compound C(C=1C(C(=O)OCCCCCCCC)=CC=CC1)(=O)OCCCCCCCC.C1CCC=CC1 QUOVZGRIHBIRGF-UHFFFAOYSA-N 0.000 description 1
- 206010013786 Dry skin Diseases 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- CTKINSOISVBQLD-UHFFFAOYSA-N Glycidol Chemical compound OCC1CO1 CTKINSOISVBQLD-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 150000001241 acetals Chemical class 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000006266 etherification reaction Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 230000036651 mood Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 150000002923 oximes Chemical class 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP82704/94 | 1994-03-30 | ||
| JP08270494A JP3319650B2 (ja) | 1994-03-30 | 1994-03-30 | 銅張積層板用銅箔 |
| JP82704/1994 | 1994-03-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1113071A CN1113071A (zh) | 1995-12-06 |
| CN1052375C true CN1052375C (zh) | 2000-05-10 |
Family
ID=13781796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN95101968A Expired - Lifetime CN1052375C (zh) | 1994-03-30 | 1995-02-15 | 镀铜膜层叠板用铜箔 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP3319650B2 (ja) |
| CN (1) | CN1052375C (ja) |
| MY (1) | MY123003A (ja) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998044017A1 (fr) * | 1997-03-27 | 1998-10-08 | Mitsubishi Rayon Co., Ltd. | Composition de resine epoxyde pour plastique renforce de fibre de verre, preimpregne et moulage tubulaire produit au moyen de cette composition |
| CN1081128C (zh) * | 1999-08-18 | 2002-03-20 | 湖北省化学研究所 | 软性印刷电路板专用的高分子塑料薄膜双面复合金属板的制造方法 |
| JP2003096423A (ja) * | 2001-09-20 | 2003-04-03 | Toyo Chem Co Ltd | 熱硬化型粘接着剤組成物及び粘接着シート |
| CN102732197A (zh) * | 2011-04-12 | 2012-10-17 | 佛冈建滔实业有限公司 | 一种适用于涂胶铜箔的胶粘剂制备工艺 |
| JP5935339B2 (ja) * | 2012-01-17 | 2016-06-15 | 東レ株式会社 | 電子機器用接着剤組成物 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1055322A (zh) * | 1990-03-29 | 1991-10-16 | 古尔德有限公司 | 改进的防护导电箔层组件和用静电力制备这个层组的方法 |
| CN1070868A (zh) * | 1991-10-01 | 1993-04-14 | 古尔德有限公司 | 改进的防护导电箔层组件和用静电力制备这个层组的方法 |
-
1994
- 1994-03-30 JP JP08270494A patent/JP3319650B2/ja not_active Expired - Lifetime
-
1995
- 1995-02-15 CN CN95101968A patent/CN1052375C/zh not_active Expired - Lifetime
- 1995-03-22 MY MYPI9500715 patent/MY123003A/en unknown
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1055322A (zh) * | 1990-03-29 | 1991-10-16 | 古尔德有限公司 | 改进的防护导电箔层组件和用静电力制备这个层组的方法 |
| CN1070868A (zh) * | 1991-10-01 | 1993-04-14 | 古尔德有限公司 | 改进的防护导电箔层组件和用静电力制备这个层组的方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1113071A (zh) | 1995-12-06 |
| JPH07266492A (ja) | 1995-10-17 |
| MY123003A (en) | 2006-05-31 |
| JP3319650B2 (ja) | 2002-09-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |
Expiration termination date: 20150215 Granted publication date: 20000510 |