MY123003A - Copper foil for copper-clad laminate - Google Patents

Copper foil for copper-clad laminate

Info

Publication number
MY123003A
MY123003A MYPI9500715A MY123003A MY 123003 A MY123003 A MY 123003A MY PI9500715 A MYPI9500715 A MY PI9500715A MY 123003 A MY123003 A MY 123003A
Authority
MY
Malaysia
Prior art keywords
copper
clad laminate
resin
room temperature
copper foil
Prior art date
Application number
Other languages
English (en)
Inventor
Teturoh Satoh
Yuji Kageyama
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of MY123003A publication Critical patent/MY123003A/en

Links

Landscapes

  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Manufacturing Of Printed Wiring (AREA)
MYPI9500715 1994-03-30 1995-03-22 Copper foil for copper-clad laminate MY123003A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP08270494A JP3319650B2 (ja) 1994-03-30 1994-03-30 銅張積層板用銅箔

Publications (1)

Publication Number Publication Date
MY123003A true MY123003A (en) 2006-05-31

Family

ID=13781796

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI9500715 MY123003A (en) 1994-03-30 1995-03-22 Copper foil for copper-clad laminate

Country Status (3)

Country Link
JP (1) JP3319650B2 (ja)
CN (1) CN1052375C (ja)
MY (1) MY123003A (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998044017A1 (fr) * 1997-03-27 1998-10-08 Mitsubishi Rayon Co., Ltd. Composition de resine epoxyde pour plastique renforce de fibre de verre, preimpregne et moulage tubulaire produit au moyen de cette composition
CN1081128C (zh) * 1999-08-18 2002-03-20 湖北省化学研究所 软性印刷电路板专用的高分子塑料薄膜双面复合金属板的制造方法
JP2003096423A (ja) * 2001-09-20 2003-04-03 Toyo Chem Co Ltd 熱硬化型粘接着剤組成物及び粘接着シート
CN102732197A (zh) * 2011-04-12 2012-10-17 佛冈建滔实业有限公司 一种适用于涂胶铜箔的胶粘剂制备工艺
JP5935339B2 (ja) * 2012-01-17 2016-06-15 東レ株式会社 電子機器用接着剤組成物

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5167997A (en) * 1989-05-05 1992-12-01 Gould Inc. Protected conductive foil assemblage and procedure for preparing same using static electrical forces
CA2078955A1 (en) * 1991-10-01 1993-04-02 Jamie H. Chamberlain Protected conductive foil assemblage and procedure for preparing same using static electrical forces

Also Published As

Publication number Publication date
CN1113071A (zh) 1995-12-06
JPH07266492A (ja) 1995-10-17
JP3319650B2 (ja) 2002-09-03
CN1052375C (zh) 2000-05-10

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