CN105196162B - 搬送装置 - Google Patents

搬送装置 Download PDF

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Publication number
CN105196162B
CN105196162B CN201510297363.0A CN201510297363A CN105196162B CN 105196162 B CN105196162 B CN 105196162B CN 201510297363 A CN201510297363 A CN 201510297363A CN 105196162 B CN105196162 B CN 105196162B
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CN
China
Prior art keywords
chip
machined object
press section
chuck table
holding unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201510297363.0A
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English (en)
Chinese (zh)
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CN105196162A (zh
Inventor
凑浩吉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
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Disco Corp
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Publication of CN105196162A publication Critical patent/CN105196162A/zh
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Publication of CN105196162B publication Critical patent/CN105196162B/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Jigs For Machine Tools (AREA)
CN201510297363.0A 2014-06-17 2015-06-03 搬送装置 Active CN105196162B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014124362A JP6335672B2 (ja) 2014-06-17 2014-06-17 搬送装置
JP2014-124362 2014-06-17

Publications (2)

Publication Number Publication Date
CN105196162A CN105196162A (zh) 2015-12-30
CN105196162B true CN105196162B (zh) 2019-03-08

Family

ID=54944289

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510297363.0A Active CN105196162B (zh) 2014-06-17 2015-06-03 搬送装置

Country Status (4)

Country Link
JP (1) JP6335672B2 (ko)
KR (1) KR102214368B1 (ko)
CN (1) CN105196162B (ko)
TW (1) TWI649157B (ko)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6761271B2 (ja) * 2016-04-05 2020-09-23 キヤノン株式会社 処理装置及び物品の製造方法
JP6685857B2 (ja) * 2016-07-04 2020-04-22 株式会社ディスコ 加工装置
JP6696851B2 (ja) * 2016-07-13 2020-05-20 株式会社ディスコ チャックテーブル機構
KR20180045666A (ko) * 2016-10-26 2018-05-04 삼성전자주식회사 기판 제조 장치
JP6866115B2 (ja) * 2016-11-04 2021-04-28 株式会社東京精密 ウエハの搬送保持装置
JP6855217B2 (ja) * 2016-11-04 2021-04-07 株式会社東京精密 ウエハの搬送保持装置
CN108615697B (zh) * 2016-12-09 2020-11-03 矽电半导体设备(深圳)股份有限公司 自动上下芯片装置
JP2018126830A (ja) * 2017-02-09 2018-08-16 株式会社ディスコ 加工装置
JP7166065B2 (ja) * 2018-03-02 2022-11-07 株式会社東京精密 ウエハ搬送保持装置
JP7108467B2 (ja) * 2018-03-30 2022-07-28 株式会社岡本工作機械製作所 基板吸着装置
TWI647782B (zh) * 2018-05-16 2019-01-11 力成科技股份有限公司 面板級扇出型封裝之真空定位設備
JP2020009827A (ja) * 2018-07-04 2020-01-16 株式会社ディスコ デバイスチップの検査方法
JP7256685B2 (ja) * 2019-05-16 2023-04-12 株式会社ディスコ 研削装置
JP7216613B2 (ja) * 2019-05-16 2023-02-01 株式会社ディスコ 加工装置
JP7396815B2 (ja) * 2019-06-12 2023-12-12 株式会社ディスコ ロボットハンド
CN111584416A (zh) * 2020-04-30 2020-08-25 南通通富微电子有限公司 一种晶圆搬运装置及晶圆减薄设备
US11533577B2 (en) 2021-05-20 2022-12-20 Apple Inc. Method and system for detecting sound event liveness using a microphone array

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102117758A (zh) * 2009-11-27 2011-07-06 株式会社迪思科 搬送机构
CN102456600A (zh) * 2010-10-18 2012-05-16 株式会社迪思科 晶片搬送机构

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE454960T1 (de) * 2003-01-29 2010-01-15 Mitsuboshi Diamond Ind Co Ltd Vakuum saugkopf
JP2005109057A (ja) 2003-09-30 2005-04-21 Okamoto Machine Tool Works Ltd 基板搬送器具
JP2006019566A (ja) 2004-07-02 2006-01-19 Toshiba Corp 半導体基板吸着ハンド及びその操作方法
JP5180557B2 (ja) * 2007-10-31 2013-04-10 株式会社ディスコ 加工装置
JP2010153419A (ja) * 2008-12-24 2010-07-08 Ushio Inc ワークステージおよびこのワークステージを使った露光装置
JP5368200B2 (ja) * 2009-07-15 2013-12-18 株式会社ディスコ 加工装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102117758A (zh) * 2009-11-27 2011-07-06 株式会社迪思科 搬送机构
CN102456600A (zh) * 2010-10-18 2012-05-16 株式会社迪思科 晶片搬送机构

Also Published As

Publication number Publication date
KR102214368B1 (ko) 2021-02-08
TWI649157B (zh) 2019-02-01
JP6335672B2 (ja) 2018-05-30
JP2016004909A (ja) 2016-01-12
KR20150144713A (ko) 2015-12-28
TW201603947A (zh) 2016-02-01
CN105196162A (zh) 2015-12-30

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