JP7396815B2 - ロボットハンド - Google Patents
ロボットハンド Download PDFInfo
- Publication number
- JP7396815B2 JP7396815B2 JP2019109423A JP2019109423A JP7396815B2 JP 7396815 B2 JP7396815 B2 JP 7396815B2 JP 2019109423 A JP2019109423 A JP 2019109423A JP 2019109423 A JP2019109423 A JP 2019109423A JP 7396815 B2 JP7396815 B2 JP 7396815B2
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- JP
- Japan
- Prior art keywords
- wafer
- suction
- robot hand
- base
- suction cup
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 235000012431 wafers Nutrition 0.000 description 93
- 230000002093 peripheral effect Effects 0.000 description 12
- 230000032258 transport Effects 0.000 description 8
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 230000003028 elevating effect Effects 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Description
また、中凹み状に湾曲したウェーハWの一例としては、表面Waが樹脂封止されたウェーハ等がある。
例えば、基台60の一面60aの吸引路603の開口の周囲には、円環状のOリング収容溝605が形成されている。
例えば剛性を有する素材からなる嵩上げブロック66には、基台60の一面60aに形成された雌ねじ穴601に対応する2つのブロック馬鹿穴660と、基台60の一面60aに形成された吸引路603の開口に対応する1つのブロック吸引孔661とがそれぞれ厚み方向(Z軸方向)に貫通形成されている。なお、ブロック馬鹿穴660は、雌ねじ穴であってもよい。
例えば、嵩上げブロック66のブロック吸引孔661の周囲には、円環状のOリング収容溝664が形成されている。
まず、図1に示すロボット1が昇降機構35によってZ軸方向に移動されて、ロボットハンド6とカセット4内の狙いのウェーハWとのZ軸方向における位置合わせが行われる。また、図示しないモータがスピンドル70を回転させ、ロボットハンド6の吸盤61が上側を向いた状態にセットされる。
なお、仮置きテーブルに搬送されたウェーハWを位置決めさせ、研削装置等の加工装置のチャックテーブルに搬送手段で搬送させ、加工手段でウェーハWを加工させる。そのため、搬送手段は、ウェーハWの表面Waの凹み中央Wfを吸引保持してチャックテーブルに搬送させる。また、チャックテーブルでは、ウェーハWの湾曲を平坦化させ、チャックテーブルの保持面を吸引源に連通させウェーハWを倣わせて保持させる。
なお、例えば研削され湾曲していない平坦化されたウェーハWを、本ロボットハンド6で保持させカセット4に湾曲していないウェーハWを収容させてもよい。
4:カセット 40:棚部
1:ロボット
3:駆動部 30:第1のアーム 31:第2のアーム 32:ロボットハンド連結部
33:第1のアーム連結部 34:ロボットハンド旋回手段 35:昇降機構
70:スピンドル 71:ハウジング 73:ホルダ 730:ホルダ吸引路
6:ロボットハンド
60:基台 60a:基台の一面 600:切り欠き部 601:雌ねじ穴 603:吸引路 605:Oリング収容溝
61:吸盤 610:吸盤基部 610a:吸盤馬鹿穴 610b:吸盤吸引孔 610d:吸着面 611:変形部
62:連通路
66:嵩上げブロック 660:ブロック馬鹿穴 661:ブロック吸引孔 664:Oリング収容溝
69:吸引源 690:樹脂チューブ
Claims (1)
- ロボットに取り付け、中凹み状に湾曲したウェーハの凹み中央を吸引保持するロボットハンドであって、
長尺平板状の基台と、該基台に配設されウェーハの凹み中央を吸引保持する吸盤と、ウェーハを吸引保持する該吸盤の吸着面を吸引源に連通させる連通路と、該連通路を構成するブロック吸引孔を備え該吸盤を該基台の一面に対して嵩上げする一又は複数の嵩上げブロックとを備え、
該吸着面でウェーハを吸引保持した際に、ウェーハの外周部分が該吸盤が装着された該基台の該一面に接触しないように、該一又は複数の嵩上げブロックによって該吸盤を該一面に対して嵩上げしているロボットハンド。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019109423A JP7396815B2 (ja) | 2019-06-12 | 2019-06-12 | ロボットハンド |
KR1020200063071A KR20200142454A (ko) | 2019-06-12 | 2020-05-26 | 로봇 핸드 |
CN202010493080.4A CN112077830A (zh) | 2019-06-12 | 2020-06-03 | 机器人手臂 |
TW109119422A TWI836093B (zh) | 2019-06-12 | 2020-06-10 | 機器手臂 |
Applications Claiming Priority (1)
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---|---|---|---|
JP2019109423A JP7396815B2 (ja) | 2019-06-12 | 2019-06-12 | ロボットハンド |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020202324A JP2020202324A (ja) | 2020-12-17 |
JP7396815B2 true JP7396815B2 (ja) | 2023-12-12 |
Family
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JP2019109423A Active JP7396815B2 (ja) | 2019-06-12 | 2019-06-12 | ロボットハンド |
Country Status (3)
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JP (1) | JP7396815B2 (ja) |
KR (1) | KR20200142454A (ja) |
CN (1) | CN112077830A (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2023085799A (ja) | 2021-12-09 | 2023-06-21 | 株式会社ディスコ | ロボットハンド |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001319960A (ja) | 2000-05-10 | 2001-11-16 | Seiko Epson Corp | 搬送装置、基板搬送方法、および電気光学装置の製造方法 |
JP2007324169A (ja) | 2006-05-30 | 2007-12-13 | Nikon Corp | 搬送アーム、基板搬送装置及び基板検査装置 |
US20150155196A1 (en) | 2013-12-04 | 2015-06-04 | Taiwan Semiconductor Manufacturing Co., Ltd. | Transfer Module for Bowed Wafers |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH077068A (ja) * | 1993-06-18 | 1995-01-10 | Hitachi Electron Eng Co Ltd | ウエハ載置台とチャックハンドの構造 |
JPH08236597A (ja) * | 1995-02-27 | 1996-09-13 | Hitachi Ltd | 移載装置 |
JP4748901B2 (ja) * | 2001-09-06 | 2011-08-17 | 日東電工株式会社 | 半導体ウエハのマウント方法およびこれに用いるカセット |
TW200303593A (en) * | 2002-02-19 | 2003-09-01 | Olympus Optical Co | Substrate sucking apparatus |
JP2004055833A (ja) * | 2002-07-19 | 2004-02-19 | Fujitsu Ltd | 薄板状部材の吸着装置 |
JP5989416B2 (ja) | 2012-06-20 | 2016-09-07 | 株式会社ディスコ | ロボットハンド |
JP2015204420A (ja) * | 2014-04-15 | 2015-11-16 | 株式会社ディスコ | 板状物の搬送装置および切削装置 |
JP6581436B2 (ja) | 2015-08-25 | 2019-09-25 | 株式会社ディスコ | ロボットハンド |
JP6685857B2 (ja) * | 2016-07-04 | 2020-04-22 | 株式会社ディスコ | 加工装置 |
JP6853646B2 (ja) * | 2016-10-04 | 2021-03-31 | 株式会社ディスコ | ロボットハンド及び搬送ロボット |
-
2019
- 2019-06-12 JP JP2019109423A patent/JP7396815B2/ja active Active
-
2020
- 2020-05-26 KR KR1020200063071A patent/KR20200142454A/ko active Search and Examination
- 2020-06-03 CN CN202010493080.4A patent/CN112077830A/zh active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001319960A (ja) | 2000-05-10 | 2001-11-16 | Seiko Epson Corp | 搬送装置、基板搬送方法、および電気光学装置の製造方法 |
JP2007324169A (ja) | 2006-05-30 | 2007-12-13 | Nikon Corp | 搬送アーム、基板搬送装置及び基板検査装置 |
US20150155196A1 (en) | 2013-12-04 | 2015-06-04 | Taiwan Semiconductor Manufacturing Co., Ltd. | Transfer Module for Bowed Wafers |
Also Published As
Publication number | Publication date |
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TW202045325A (zh) | 2020-12-16 |
JP2020202324A (ja) | 2020-12-17 |
CN112077830A (zh) | 2020-12-15 |
KR20200142454A (ko) | 2020-12-22 |
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