CN105122433A - 半导体装置的制造方法 - Google Patents

半导体装置的制造方法 Download PDF

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Publication number
CN105122433A
CN105122433A CN201480020186.5A CN201480020186A CN105122433A CN 105122433 A CN105122433 A CN 105122433A CN 201480020186 A CN201480020186 A CN 201480020186A CN 105122433 A CN105122433 A CN 105122433A
Authority
CN
China
Prior art keywords
semiconductor substrate
semiconductor
seal
manufacture method
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201480020186.5A
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English (en)
Chinese (zh)
Inventor
山本雅之
森伸一郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of CN105122433A publication Critical patent/CN105122433A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN201480020186.5A 2013-04-08 2014-03-17 半导体装置的制造方法 Pending CN105122433A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013-080601 2013-04-08
JP2013080601A JP2014204033A (ja) 2013-04-08 2013-04-08 半導体装置の製造方法
PCT/JP2014/057175 WO2014167947A1 (ja) 2013-04-08 2014-03-17 半導体装置の製造方法

Publications (1)

Publication Number Publication Date
CN105122433A true CN105122433A (zh) 2015-12-02

Family

ID=51689361

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480020186.5A Pending CN105122433A (zh) 2013-04-08 2014-03-17 半导体装置的制造方法

Country Status (6)

Country Link
JP (1) JP2014204033A (ja)
KR (1) KR20150140340A (ja)
CN (1) CN105122433A (ja)
SG (1) SG11201508204RA (ja)
TW (1) TW201448062A (ja)
WO (1) WO2014167947A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112020768A (zh) * 2018-04-24 2020-12-01 迪思科高科技(欧洲)有限公司 用于将保护胶带贴附在半导体晶片上的装置和方法
CN112020769A (zh) * 2018-04-24 2020-12-01 迪思科高科技(欧洲)有限公司 对准装置和对准方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI701097B (zh) * 2017-09-13 2020-08-11 新加坡商誠解電子私人有限公司 用於以聚合物樹脂鑄模化合物為基底的基板之切割方法及其系統
CN108601241B (zh) 2018-06-14 2021-12-24 环旭电子股份有限公司 一种SiP模组及其制造方法
KR20230128565A (ko) * 2021-02-01 2023-09-05 나가세케무텍쿠스가부시키가이샤 전자 부품 실장 기판의 봉지 방법 및 열경화성 시트

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11251347A (ja) * 1998-03-03 1999-09-17 Hitachi Cable Ltd 半導体パッケージの製造方法
CN1655353A (zh) * 2004-02-13 2005-08-17 株式会社东芝 叠层mcp及其制造方法
US20060128065A1 (en) * 2003-06-06 2006-06-15 Teiichi Inada Adhesive sheet, dicing tape intergrated type adhesive sheet, and semiconductor device producing method
JP2008218496A (ja) * 2007-02-28 2008-09-18 Namics Corp 封止用樹脂フィルム

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11251347A (ja) * 1998-03-03 1999-09-17 Hitachi Cable Ltd 半導体パッケージの製造方法
US20060128065A1 (en) * 2003-06-06 2006-06-15 Teiichi Inada Adhesive sheet, dicing tape intergrated type adhesive sheet, and semiconductor device producing method
CN1655353A (zh) * 2004-02-13 2005-08-17 株式会社东芝 叠层mcp及其制造方法
JP2008218496A (ja) * 2007-02-28 2008-09-18 Namics Corp 封止用樹脂フィルム

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112020768A (zh) * 2018-04-24 2020-12-01 迪思科高科技(欧洲)有限公司 用于将保护胶带贴附在半导体晶片上的装置和方法
CN112020769A (zh) * 2018-04-24 2020-12-01 迪思科高科技(欧洲)有限公司 对准装置和对准方法
US11935768B2 (en) 2018-04-24 2024-03-19 Disco Hi-Tec Europe Gmbh Device and method for attaching protective tape on semiconductor wafer

Also Published As

Publication number Publication date
JP2014204033A (ja) 2014-10-27
TW201448062A (zh) 2014-12-16
WO2014167947A1 (ja) 2014-10-16
KR20150140340A (ko) 2015-12-15
SG11201508204RA (en) 2015-11-27

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Application publication date: 20151202