SG11201508204RA - Method of producing semiconductor device - Google Patents
Method of producing semiconductor deviceInfo
- Publication number
- SG11201508204RA SG11201508204RA SG11201508204RA SG11201508204RA SG11201508204RA SG 11201508204R A SG11201508204R A SG 11201508204RA SG 11201508204R A SG11201508204R A SG 11201508204RA SG 11201508204R A SG11201508204R A SG 11201508204RA SG 11201508204R A SG11201508204R A SG 11201508204RA
- Authority
- SG
- Singapore
- Prior art keywords
- semiconductor device
- producing semiconductor
- producing
- semiconductor
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013080601A JP2014204033A (ja) | 2013-04-08 | 2013-04-08 | 半導体装置の製造方法 |
| PCT/JP2014/057175 WO2014167947A1 (ja) | 2013-04-08 | 2014-03-17 | 半導体装置の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201508204RA true SG11201508204RA (en) | 2015-11-27 |
Family
ID=51689361
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201508204RA SG11201508204RA (en) | 2013-04-08 | 2014-03-17 | Method of producing semiconductor device |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP2014204033A (ja) |
| KR (1) | KR20150140340A (ja) |
| CN (1) | CN105122433A (ja) |
| SG (1) | SG11201508204RA (ja) |
| TW (1) | TW201448062A (ja) |
| WO (1) | WO2014167947A1 (ja) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI701097B (zh) * | 2017-09-13 | 2020-08-11 | 新加坡商誠解電子私人有限公司 | 用於以聚合物樹脂鑄模化合物為基底的基板之切割方法及其系統 |
| KR102555601B1 (ko) * | 2018-04-24 | 2023-07-18 | 디스코 하이테크 유럽 게엠베하 | 반도체 웨이퍼의 보호 테이프 부착장치 및 부착방법 |
| KR102555605B1 (ko) * | 2018-04-24 | 2023-07-18 | 디스코 하이테크 유럽 게엠베하 | 얼라인먼트 장치 및 얼라인먼트 방법 |
| CN108601241B (zh) | 2018-06-14 | 2021-12-24 | 环旭电子股份有限公司 | 一种SiP模组及其制造方法 |
| KR20230128565A (ko) * | 2021-02-01 | 2023-09-05 | 나가세케무텍쿠스가부시키가이샤 | 전자 부품 실장 기판의 봉지 방법 및 열경화성 시트 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11251347A (ja) * | 1998-03-03 | 1999-09-17 | Hitachi Cable Ltd | 半導体パッケージの製造方法 |
| KR101169182B1 (ko) * | 2003-06-06 | 2012-07-30 | 히다치 가세고교 가부시끼가이샤 | 반도체 장치의 제조방법 |
| JP4406300B2 (ja) * | 2004-02-13 | 2010-01-27 | 株式会社東芝 | 半導体装置及びその製造方法 |
| JP5435685B2 (ja) * | 2007-02-28 | 2014-03-05 | ナミックス株式会社 | 封止用樹脂フィルム |
-
2013
- 2013-04-08 JP JP2013080601A patent/JP2014204033A/ja active Pending
-
2014
- 2014-03-17 SG SG11201508204RA patent/SG11201508204RA/en unknown
- 2014-03-17 WO PCT/JP2014/057175 patent/WO2014167947A1/ja active Application Filing
- 2014-03-17 KR KR1020157031649A patent/KR20150140340A/ko not_active Application Discontinuation
- 2014-03-17 CN CN201480020186.5A patent/CN105122433A/zh active Pending
- 2014-04-07 TW TW103112647A patent/TW201448062A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CN105122433A (zh) | 2015-12-02 |
| JP2014204033A (ja) | 2014-10-27 |
| TW201448062A (zh) | 2014-12-16 |
| WO2014167947A1 (ja) | 2014-10-16 |
| KR20150140340A (ko) | 2015-12-15 |
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