KR20150140340A - 반도체 장치의 제조 방법 - Google Patents

반도체 장치의 제조 방법 Download PDF

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Publication number
KR20150140340A
KR20150140340A KR1020157031649A KR20157031649A KR20150140340A KR 20150140340 A KR20150140340 A KR 20150140340A KR 1020157031649 A KR1020157031649 A KR 1020157031649A KR 20157031649 A KR20157031649 A KR 20157031649A KR 20150140340 A KR20150140340 A KR 20150140340A
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KR
South Korea
Prior art keywords
semiconductor substrate
sealing sheet
semiconductor device
sheet
semiconductor
Prior art date
Application number
KR1020157031649A
Other languages
English (en)
Korean (ko)
Inventor
마사유키 야마모토
신이치로 모리
Original Assignee
닛토덴코 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 닛토덴코 가부시키가이샤 filed Critical 닛토덴코 가부시키가이샤
Publication of KR20150140340A publication Critical patent/KR20150140340A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020157031649A 2013-04-08 2014-03-17 반도체 장치의 제조 방법 KR20150140340A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013080601A JP2014204033A (ja) 2013-04-08 2013-04-08 半導体装置の製造方法
JPJP-P-2013-080601 2013-04-08
PCT/JP2014/057175 WO2014167947A1 (ja) 2013-04-08 2014-03-17 半導体装置の製造方法

Publications (1)

Publication Number Publication Date
KR20150140340A true KR20150140340A (ko) 2015-12-15

Family

ID=51689361

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157031649A KR20150140340A (ko) 2013-04-08 2014-03-17 반도체 장치의 제조 방법

Country Status (6)

Country Link
JP (1) JP2014204033A (ja)
KR (1) KR20150140340A (ja)
CN (1) CN105122433A (ja)
SG (1) SG11201508204RA (ja)
TW (1) TW201448062A (ja)
WO (1) WO2014167947A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10798814B2 (en) 2018-06-14 2020-10-06 Universal Scientific Industrial (Shanghai) Co., Ltd. SiP module and manufacturing method of the SiP module
KR20210003140A (ko) * 2018-04-24 2021-01-11 디스코 하이테크 유럽 게엠베하 얼라인먼트 장치 및 얼라인먼트 방법

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI701097B (zh) * 2017-09-13 2020-08-11 新加坡商誠解電子私人有限公司 用於以聚合物樹脂鑄模化合物為基底的基板之切割方法及其系統
KR102555601B1 (ko) * 2018-04-24 2023-07-18 디스코 하이테크 유럽 게엠베하 반도체 웨이퍼의 보호 테이프 부착장치 및 부착방법
KR20230128565A (ko) * 2021-02-01 2023-09-05 나가세케무텍쿠스가부시키가이샤 전자 부품 실장 기판의 봉지 방법 및 열경화성 시트

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11251347A (ja) * 1998-03-03 1999-09-17 Hitachi Cable Ltd 半導体パッケージの製造方法
KR101169182B1 (ko) * 2003-06-06 2012-07-30 히다치 가세고교 가부시끼가이샤 반도체 장치의 제조방법
JP4406300B2 (ja) * 2004-02-13 2010-01-27 株式会社東芝 半導体装置及びその製造方法
JP5435685B2 (ja) * 2007-02-28 2014-03-05 ナミックス株式会社 封止用樹脂フィルム

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210003140A (ko) * 2018-04-24 2021-01-11 디스코 하이테크 유럽 게엠베하 얼라인먼트 장치 및 얼라인먼트 방법
US10798814B2 (en) 2018-06-14 2020-10-06 Universal Scientific Industrial (Shanghai) Co., Ltd. SiP module and manufacturing method of the SiP module

Also Published As

Publication number Publication date
CN105122433A (zh) 2015-12-02
JP2014204033A (ja) 2014-10-27
TW201448062A (zh) 2014-12-16
WO2014167947A1 (ja) 2014-10-16
SG11201508204RA (en) 2015-11-27

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