CN105118857B - 一种沟槽型功率mosfet的制造方法 - Google Patents
一种沟槽型功率mosfet的制造方法 Download PDFInfo
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- CN105118857B CN105118857B CN201510427664.0A CN201510427664A CN105118857B CN 105118857 B CN105118857 B CN 105118857B CN 201510427664 A CN201510427664 A CN 201510427664A CN 105118857 B CN105118857 B CN 105118857B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 29
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims abstract description 29
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 29
- 239000010703 silicon Substances 0.000 claims abstract description 29
- 229920005591 polysilicon Polymers 0.000 claims abstract description 26
- 238000005530 etching Methods 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims abstract description 22
- 238000001259 photo etching Methods 0.000 claims abstract description 18
- 238000000151 deposition Methods 0.000 claims abstract description 6
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 18
- 238000002347 injection Methods 0.000 claims description 13
- 239000007924 injection Substances 0.000 claims description 13
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- 229920002120 photoresistant polymer Polymers 0.000 claims description 12
- 229910052796 boron Inorganic materials 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- 229910052757 nitrogen Inorganic materials 0.000 claims description 6
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- 239000012298 atmosphere Substances 0.000 claims description 5
- 239000012535 impurity Substances 0.000 claims description 5
- 239000002210 silicon-based material Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 4
- 238000010992 reflux Methods 0.000 claims description 4
- 235000012239 silicon dioxide Nutrition 0.000 claims description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 3
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 230000003213 activating effect Effects 0.000 claims description 3
- 229910052785 arsenic Inorganic materials 0.000 claims description 3
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 claims description 3
- 230000007797 corrosion Effects 0.000 claims description 3
- 238000001312 dry etching Methods 0.000 claims description 3
- 239000007789 gas Substances 0.000 claims description 3
- 239000001257 hydrogen Substances 0.000 claims description 3
- 229910052739 hydrogen Inorganic materials 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 claims description 3
- 238000007254 oxidation reaction Methods 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 3
- 230000001737 promoting effect Effects 0.000 claims description 3
- 238000000926 separation method Methods 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical group N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 238000009792 diffusion process Methods 0.000 claims description 2
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 2
- 238000009738 saturating Methods 0.000 claims description 2
- 238000004544 sputter deposition Methods 0.000 claims description 2
- 230000003628 erosive effect Effects 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 230000008569 process Effects 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 11
- 239000004065 semiconductor Substances 0.000 description 6
- 239000013078 crystal Substances 0.000 description 4
- 230000005669 field effect Effects 0.000 description 4
- 239000002019 doping agent Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000407 epitaxy Methods 0.000 description 1
- 238000010237 hybrid technique Methods 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000004151 rapid thermal annealing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66666—Vertical transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42356—Disposition, e.g. buried gate electrode
- H01L29/4236—Disposition, e.g. buried gate electrode within a trench, e.g. trench gate electrode, groove gate electrode
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
Description
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201510427664.0A CN105118857B (zh) | 2015-07-20 | 2015-07-20 | 一种沟槽型功率mosfet的制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510427664.0A CN105118857B (zh) | 2015-07-20 | 2015-07-20 | 一种沟槽型功率mosfet的制造方法 |
Publications (2)
Publication Number | Publication Date |
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CN105118857A CN105118857A (zh) | 2015-12-02 |
CN105118857B true CN105118857B (zh) | 2018-12-25 |
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Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN106298884A (zh) * | 2016-09-27 | 2017-01-04 | 西安后羿半导体科技有限公司 | 优化fom值的沟槽功率mos管器件及其制造方法 |
CN107634008B (zh) * | 2017-07-07 | 2020-02-07 | 成都迈斯派尔半导体有限公司 | 一种高压功率器件的终端结构的制作方法 |
CN111807318A (zh) * | 2020-07-22 | 2020-10-23 | 中国人民解放军国防科技大学 | 基于玻璃回流工艺的tgv衬底制备方法及mems器件封装方法 |
CN112864238B (zh) * | 2021-03-09 | 2023-07-07 | 上海恒灼科技有限公司 | 一种接触孔自对准低压场效应晶体管的制作方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102110687A (zh) * | 2009-12-24 | 2011-06-29 | 上海华虹Nec电子有限公司 | 沟槽mos器件 |
US20130049107A1 (en) * | 2010-02-03 | 2013-02-28 | M-Mos Semiconductor Hk Ltd | Trench semiconductor power device and fabrication method thereof |
CN103187292A (zh) * | 2011-12-29 | 2013-07-03 | 立新半导体有限公司 | 一种制造沟槽型半导体功率器件的方法 |
-
2015
- 2015-07-20 CN CN201510427664.0A patent/CN105118857B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102110687A (zh) * | 2009-12-24 | 2011-06-29 | 上海华虹Nec电子有限公司 | 沟槽mos器件 |
US20130049107A1 (en) * | 2010-02-03 | 2013-02-28 | M-Mos Semiconductor Hk Ltd | Trench semiconductor power device and fabrication method thereof |
CN103187292A (zh) * | 2011-12-29 | 2013-07-03 | 立新半导体有限公司 | 一种制造沟槽型半导体功率器件的方法 |
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CN105118857A (zh) | 2015-12-02 |
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Denomination of invention: A manufacturing method of trench power MOSFET Effective date of registration: 20201116 Granted publication date: 20181225 Pledgee: Qingdao high technology financing Company limited by guarantee Pledgor: QINGDAO JIAEN SEMICONDUCTOR Co.,Ltd. Registration number: Y2020990001351 |
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Denomination of invention: A manufacturing method of grooved power MOSFET Effective date of registration: 20211111 Granted publication date: 20181225 Pledgee: Qingdao high technology financing Company limited by guarantee Pledgor: QINGDAO JIAEN SEMICONDUCTOR Co.,Ltd. Registration number: Y2021370010118 |
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Date of cancellation: 20221128 Granted publication date: 20181225 Pledgee: Qingdao high technology financing Company limited by guarantee Pledgor: QINGDAO JIAEN SEMICONDUCTOR Co.,Ltd. Registration number: Y2021370010118 |