CN105097719B - 半导体装置、半导体装置的制造装置及半导体装置的制造方法、以及半导体模块 - Google Patents

半导体装置、半导体装置的制造装置及半导体装置的制造方法、以及半导体模块 Download PDF

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Publication number
CN105097719B
CN105097719B CN201510262835.9A CN201510262835A CN105097719B CN 105097719 B CN105097719 B CN 105097719B CN 201510262835 A CN201510262835 A CN 201510262835A CN 105097719 B CN105097719 B CN 105097719B
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package
frame
hole
semiconductor device
semiconductor element
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CN105097719A (zh
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白水政孝
秦浩公
王亚哲
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/461—Leadframes specially adapted for cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN201510262835.9A 2014-05-21 2015-05-21 半导体装置、半导体装置的制造装置及半导体装置的制造方法、以及半导体模块 Active CN105097719B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-105223 2014-05-21
JP2014105223A JP6162643B2 (ja) 2014-05-21 2014-05-21 半導体装置

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CN105097719A CN105097719A (zh) 2015-11-25
CN105097719B true CN105097719B (zh) 2018-02-06

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US (2) US10008430B2 (enExample)
JP (1) JP6162643B2 (enExample)
CN (1) CN105097719B (enExample)

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* Cited by examiner, † Cited by third party
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JP6549466B2 (ja) * 2015-10-22 2019-07-24 ラピスセミコンダクタ株式会社 半導体装置及び半導体装置の製造方法
JP2017170627A (ja) * 2016-03-18 2017-09-28 富士電機株式会社 モールド製品の製造方法およびモールド製品
US10787303B2 (en) 2016-05-29 2020-09-29 Cellulose Material Solutions, LLC Packaging insulation products and methods of making and using same
US11078007B2 (en) 2016-06-27 2021-08-03 Cellulose Material Solutions, LLC Thermoplastic packaging insulation products and methods of making and using same
CN110277362B (zh) * 2018-03-13 2021-10-08 联华电子股份有限公司 半导体结构及其形成方法
CN109047582B (zh) * 2018-07-23 2019-06-28 江苏宝浦莱半导体有限公司 一种用于封装半导体元件用的切筋成型机及其使用方法
CN119156704A (zh) * 2022-11-17 2024-12-17 海信家电集团股份有限公司 功率模块组件和具有其的电子设备

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CN1031446A (zh) * 1987-07-16 1989-03-01 数字设备公司 用带式自动焊接法焊接的半导体芯片管壳
CN1166057A (zh) * 1996-05-17 1997-11-26 Lg半导体株式会社 底部引线半导体芯片堆式封装
JPH1032308A (ja) * 1996-07-17 1998-02-03 Hitachi Ltd 半導体装置
CN1649115A (zh) * 2004-01-19 2005-08-03 上海集通数码科技有限责任公司 一种多芯片集成电路封装方法及其结构
CN102354688A (zh) * 2011-10-11 2012-02-15 深圳市威怡电气有限公司 一种功率模块

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JPS63170949A (ja) 1987-01-09 1988-07-14 Fuji Electric Co Ltd 半導体装置
US5044912A (en) * 1989-12-11 1991-09-03 Motorola, Inc. Mold assembly having positioning means
IT1252624B (it) 1991-12-05 1995-06-19 Cons Ric Microelettronica Dispositivo semiconduttore incapsulato in resina e elettricamente isolato di migliorate caratteristiche di isolamento,e relativo processo di fabbricazione
JP2778608B2 (ja) * 1992-02-10 1998-07-23 日本電気株式会社 樹脂モールド型半導体装置の製造方法
JPH06120374A (ja) * 1992-03-31 1994-04-28 Amkor Electron Inc 半導体パッケージ構造、半導体パッケージ方法及び半導体パッケージ用放熱板
JP3205235B2 (ja) * 1995-01-19 2001-09-04 シャープ株式会社 リードフレーム、樹脂封止型半導体装置、その製造方法及び該製造方法で用いる半導体装置製造用金型
JP3572833B2 (ja) * 1996-12-19 2004-10-06 株式会社デンソー 樹脂封止型半導体装置の製造方法
JP3420057B2 (ja) * 1998-04-28 2003-06-23 株式会社東芝 樹脂封止型半導体装置
JP3051376B2 (ja) 1998-08-24 2000-06-12 松下電子工業株式会社 リードフレーム及びその製造方法並びにリードフレームを用いた半導体装置
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JP5481680B2 (ja) * 2010-04-28 2014-04-23 三菱電機株式会社 半導体装置および半導体装置の製造方法
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KR101711479B1 (ko) * 2010-10-06 2017-03-03 삼성전자 주식회사 반도체 패키지 장치 및 그의 검사 시스템
JP5813963B2 (ja) * 2011-02-28 2015-11-17 ローム株式会社 半導体装置、および、半導体装置の実装構造
JP6028592B2 (ja) * 2013-01-25 2016-11-16 三菱電機株式会社 半導体装置
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CN1031446A (zh) * 1987-07-16 1989-03-01 数字设备公司 用带式自动焊接法焊接的半导体芯片管壳
CN1166057A (zh) * 1996-05-17 1997-11-26 Lg半导体株式会社 底部引线半导体芯片堆式封装
JPH1032308A (ja) * 1996-07-17 1998-02-03 Hitachi Ltd 半導体装置
CN1649115A (zh) * 2004-01-19 2005-08-03 上海集通数码科技有限责任公司 一种多芯片集成电路封装方法及其结构
CN102354688A (zh) * 2011-10-11 2012-02-15 深圳市威怡电气有限公司 一种功率模块

Also Published As

Publication number Publication date
JP6162643B2 (ja) 2017-07-12
CN105097719A (zh) 2015-11-25
US20180254231A1 (en) 2018-09-06
US20150340300A1 (en) 2015-11-26
US10008430B2 (en) 2018-06-26
US11417578B2 (en) 2022-08-16
JP2015220428A (ja) 2015-12-07

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