CN105074943A - 具有量子点玻璃安全板的led照明装置 - Google Patents
具有量子点玻璃安全板的led照明装置 Download PDFInfo
- Publication number
- CN105074943A CN105074943A CN201380071147.3A CN201380071147A CN105074943A CN 105074943 A CN105074943 A CN 105074943A CN 201380071147 A CN201380071147 A CN 201380071147A CN 105074943 A CN105074943 A CN 105074943A
- Authority
- CN
- China
- Prior art keywords
- quantum dot
- glass
- light source
- color conversion
- lighting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
- H10H20/8512—Wavelength conversion materials
- H10H20/8513—Wavelength conversion materials having two or more wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Led Device Packages (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261731530P | 2012-11-30 | 2012-11-30 | |
| US61/731,530 | 2012-11-30 | ||
| US13/828,169 | 2013-03-14 | ||
| US13/828,169 US9202996B2 (en) | 2012-11-30 | 2013-03-14 | LED lighting devices with quantum dot glass containment plates |
| PCT/US2013/071947 WO2014085424A1 (en) | 2012-11-30 | 2013-11-26 | Led lighting devices with quantum dot glass containment plates |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105074943A true CN105074943A (zh) | 2015-11-18 |
Family
ID=50824596
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380071147.3A Pending CN105074943A (zh) | 2012-11-30 | 2013-11-26 | 具有量子点玻璃安全板的led照明装置 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9202996B2 (enExample) |
| EP (1) | EP2926381A1 (enExample) |
| JP (1) | JP2016500471A (enExample) |
| KR (1) | KR20150092209A (enExample) |
| CN (1) | CN105074943A (enExample) |
| TW (1) | TWI535072B (enExample) |
| WO (1) | WO2014085424A1 (enExample) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106025044A (zh) * | 2016-04-19 | 2016-10-12 | 苏州星烁纳米科技有限公司 | 波长转换器件、背光单元和显示装置 |
| CN106383420A (zh) * | 2016-08-31 | 2017-02-08 | 张家港康得新光电材料有限公司 | 一种量子点发光器件及背光模组 |
| CN106587641A (zh) * | 2016-12-01 | 2017-04-26 | 天津理工大学 | 低熔点玻璃粉及其制造的激光照明用玻璃陶瓷 |
| CN107248547A (zh) * | 2017-06-21 | 2017-10-13 | 鸿宝科技股份有限公司 | 一种大功率led芯片集成封装结构及其封装方法 |
| WO2017193312A1 (en) * | 2016-05-11 | 2017-11-16 | Huawei Technologies Co., Ltd. | Quantum dot light-emitting device |
| CN109545945A (zh) * | 2018-11-28 | 2019-03-29 | 上海应用技术大学 | 一种白光led用夹层荧光玻璃的制备方法 |
| CN111987206A (zh) * | 2019-05-23 | 2020-11-24 | 易美芯光(北京)科技有限公司 | 量子点led封装器件及制造方法 |
| US10985297B2 (en) | 2018-10-12 | 2021-04-20 | Industrial Technology Research Institute | Package of photoelectric device |
Families Citing this family (74)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9899329B2 (en) | 2010-11-23 | 2018-02-20 | X-Celeprint Limited | Interconnection structures and methods for transfer-printed integrated circuit elements with improved interconnection alignment tolerance |
| US8934259B2 (en) | 2011-06-08 | 2015-01-13 | Semprius, Inc. | Substrates with transferable chiplets |
| KR20140120541A (ko) * | 2013-04-03 | 2014-10-14 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
| JP6623157B2 (ja) | 2013-08-16 | 2019-12-18 | 三星電子株式会社Samsung Electronics Co.,Ltd. | 光学部品を作製する方法、光学部品、および光学部品を含む製品 |
| GB2517696A (en) * | 2013-08-27 | 2015-03-04 | Ibm | Nanodevice assemblies |
| EP3117267B1 (en) * | 2014-03-11 | 2018-05-02 | Osram Sylvania Inc. | Light converter assemblies with enhanced heat dissipation |
| CN113437054B (zh) | 2014-06-18 | 2025-01-28 | 艾克斯展示公司技术有限公司 | 微组装led显示器 |
| GB201414427D0 (en) | 2014-08-14 | 2014-10-01 | Ibm | Memory device and method for thermoelectric heat confinement |
| WO2016032885A1 (en) * | 2014-08-25 | 2016-03-03 | Corning Incorporated | Sealed device and methods for making the same |
| KR102275615B1 (ko) | 2014-08-26 | 2021-07-09 | 엑스-셀레프린트 리미티드 | 마이크로 어셈블링된 하이브리드 디스플레이들 및 조명 엘리먼트들 |
| TWI609504B (zh) * | 2014-09-04 | 2017-12-21 | 鴻海精密工業股份有限公司 | 量子點封裝結構及其製備方法 |
| CN105470374A (zh) * | 2014-09-05 | 2016-04-06 | 鸿富锦精密工业(深圳)有限公司 | 量子点封装结构及其制备方法 |
| US9799261B2 (en) | 2014-09-25 | 2017-10-24 | X-Celeprint Limited | Self-compensating circuit for faulty display pixels |
| US9991163B2 (en) | 2014-09-25 | 2018-06-05 | X-Celeprint Limited | Small-aperture-ratio display with electrical component |
| US9537069B1 (en) | 2014-09-25 | 2017-01-03 | X-Celeprint Limited | Inorganic light-emitting diode with encapsulating reflector |
| US9818725B2 (en) | 2015-06-01 | 2017-11-14 | X-Celeprint Limited | Inorganic-light-emitter display with integrated black matrix |
| US9799719B2 (en) | 2014-09-25 | 2017-10-24 | X-Celeprint Limited | Active-matrix touchscreen |
| CN104516149B (zh) * | 2015-01-16 | 2018-03-06 | 京东方科技集团股份有限公司 | 一种液晶显示面板及显示装置 |
| US9728687B2 (en) * | 2015-05-13 | 2017-08-08 | Seoul Semiconductor Co., Ltd. | Quantum platelet converter |
| US9871345B2 (en) | 2015-06-09 | 2018-01-16 | X-Celeprint Limited | Crystalline color-conversion device |
| US11061276B2 (en) | 2015-06-18 | 2021-07-13 | X Display Company Technology Limited | Laser array display |
| US10133426B2 (en) | 2015-06-18 | 2018-11-20 | X-Celeprint Limited | Display with micro-LED front light |
| US10255834B2 (en) | 2015-07-23 | 2019-04-09 | X-Celeprint Limited | Parallel redundant chiplet system for controlling display pixels |
| US9640108B2 (en) | 2015-08-25 | 2017-05-02 | X-Celeprint Limited | Bit-plane pulse width modulated digital display system |
| TW201724290A (zh) * | 2015-08-12 | 2017-07-01 | 康寧公司 | 密封裝置以及其製造方法 |
| US10380930B2 (en) | 2015-08-24 | 2019-08-13 | X-Celeprint Limited | Heterogeneous light emitter display system |
| US10230048B2 (en) | 2015-09-29 | 2019-03-12 | X-Celeprint Limited | OLEDs for micro transfer printing |
| JP2017083814A (ja) * | 2015-10-27 | 2017-05-18 | 日本電気硝子株式会社 | 波長変換部材及びその製造方法 |
| WO2017073328A1 (ja) * | 2015-10-27 | 2017-05-04 | 日本電気硝子株式会社 | 波長変換部材及びその製造方法 |
| TWI624966B (zh) | 2015-11-23 | 2018-05-21 | 隆達電子股份有限公司 | 發光二極體封裝裝置 |
| US10066819B2 (en) | 2015-12-09 | 2018-09-04 | X-Celeprint Limited | Micro-light-emitting diode backlight system |
| US10091446B2 (en) | 2015-12-23 | 2018-10-02 | X-Celeprint Limited | Active-matrix displays with common pixel control |
| US9786646B2 (en) | 2015-12-23 | 2017-10-10 | X-Celeprint Limited | Matrix addressed device repair |
| US9930277B2 (en) | 2015-12-23 | 2018-03-27 | X-Celeprint Limited | Serial row-select matrix-addressed system |
| US9928771B2 (en) | 2015-12-24 | 2018-03-27 | X-Celeprint Limited | Distributed pulse width modulation control |
| JP2017139444A (ja) * | 2016-01-29 | 2017-08-10 | セイコーエプソン株式会社 | 光源装置、光源装置の製造方法およびプロジェクター |
| US10200013B2 (en) | 2016-02-18 | 2019-02-05 | X-Celeprint Limited | Micro-transfer-printed acoustic wave filter device |
| US10361677B2 (en) | 2016-02-18 | 2019-07-23 | X-Celeprint Limited | Transverse bulk acoustic wave filter |
| US10109753B2 (en) | 2016-02-19 | 2018-10-23 | X-Celeprint Limited | Compound micro-transfer-printed optical filter device |
| US10217730B2 (en) | 2016-02-25 | 2019-02-26 | X-Celeprint Limited | Efficiently micro-transfer printing micro-scale devices onto large-format substrates |
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| US10438859B2 (en) | 2016-12-19 | 2019-10-08 | X-Celeprint Limited | Transfer printed device repair |
| US10832609B2 (en) | 2017-01-10 | 2020-11-10 | X Display Company Technology Limited | Digital-drive pulse-width-modulated output system |
| WO2018156718A1 (en) | 2017-02-25 | 2018-08-30 | Anatoly Glass, LLC. | Converter plate for producing polychromatic light |
| US10396137B2 (en) | 2017-03-10 | 2019-08-27 | X-Celeprint Limited | Testing transfer-print micro-devices on wafer |
| US10487390B2 (en) * | 2017-03-10 | 2019-11-26 | Osram Gmbh | Method of bonding a laser activated remote phosphor assembly, method of manufacture and a laser activated remote phosphor assembly |
| US11024608B2 (en) | 2017-03-28 | 2021-06-01 | X Display Company Technology Limited | Structures and methods for electrical connection of micro-devices and substrates |
| WO2019006251A1 (en) * | 2017-06-30 | 2019-01-03 | Corning Incorporated | QUANTUM POINT (QD) LED BACKLIGHT MODULE FOR LED DISPLAYS |
| US10943946B2 (en) | 2017-07-21 | 2021-03-09 | X Display Company Technology Limited | iLED displays with substrate holes |
| KR102561725B1 (ko) * | 2018-08-24 | 2023-08-02 | 주식회사 루멘스 | 발광소자 패키지, 투광 플레이트 바디 및 발광소자 패키지 제조 방법 |
| US11049900B2 (en) | 2018-08-30 | 2021-06-29 | Analog Devices, Inc. | Monolithically integrated nanoemitter light source assembly |
| CN110690357B (zh) * | 2019-09-04 | 2021-01-01 | 武汉华星光电半导体显示技术有限公司 | 显示面板 |
| US20230155075A1 (en) * | 2021-11-16 | 2023-05-18 | Nanosys, Inc. | Light emitting devices including a quantum dot color conversion material and method of making thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100103648A1 (en) * | 2008-10-28 | 2010-04-29 | Gun-Woo Kim | Light emitting diode, backlight assembly having the same and method thereof |
| CN102330914A (zh) * | 2010-06-04 | 2012-01-25 | 三星Led株式会社 | 光源模块、背光单元、显示设备以及照明设备 |
| WO2012012234A1 (en) * | 2010-07-19 | 2012-01-26 | Bridgelux, Inc. | Led array package with a high thermally conductive plate |
| WO2012135744A2 (en) * | 2011-04-01 | 2012-10-04 | Kai Su | White light-emitting device |
Family Cites Families (77)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5089446A (en) | 1990-10-09 | 1992-02-18 | Corning Incorporated | Sealing materials and glasses |
| ATE173520T1 (de) | 1992-10-02 | 1998-12-15 | Cargill Inc | Papier mit einer beschichtung aus schmelzstabilem polymer und dessen verfahren zur herstellung |
| US20010014399A1 (en) | 1997-02-26 | 2001-08-16 | Stanley J. Jasne | Conductive uv-curable epoxy formulations |
| DE19962029A1 (de) * | 1999-12-22 | 2001-06-28 | Philips Corp Intellectual Pty | Plasmabildschirm mit rotem Leuchtstoff |
| DE20216746U1 (de) | 2002-08-19 | 2003-01-16 | Heuken Oliver | Werbeschild mit Beleuchtung mittels LED an einer oder mehreren Seiten des Schildes |
| US6880962B2 (en) | 2002-12-09 | 2005-04-19 | Osram Sylvania, Inc. | LED light source mimicking a filamented lamp |
| DE10341471A1 (de) | 2003-02-04 | 2004-08-19 | Johnson Controls Gmbh | Innenausstattungsteil für ein Fahrzeug und Verfahren zu seiner Herstellung |
| JP2004273798A (ja) * | 2003-03-10 | 2004-09-30 | Toyoda Gosei Co Ltd | 発光デバイス |
| JP2005228996A (ja) * | 2004-02-13 | 2005-08-25 | Matsushita Electric Works Ltd | 発光装置 |
| DE102004011911A1 (de) | 2004-03-11 | 2005-11-10 | Sick Ag | Sendeelement für Lichtschranken, Lichtgitter und dergleichen |
| WO2005101445A1 (en) * | 2004-04-15 | 2005-10-27 | Koninklijke Philips Electronics N.V. | Electrically controllable color conversion cell |
| US7553683B2 (en) | 2004-06-09 | 2009-06-30 | Philips Lumiled Lighting Co., Llc | Method of forming pre-fabricated wavelength converting elements for semiconductor light emitting devices |
| JP5373243B2 (ja) * | 2005-02-24 | 2013-12-18 | 株式会社朝日ラバー | 発光ダイオード用レンズ部品及び発光ダイオード光源装置 |
| DE602005019384D1 (de) | 2005-04-21 | 2010-04-01 | Fiat Ricerche | Durchsichtige LED-Anzeigevorrichtung |
| KR101253381B1 (ko) | 2005-05-11 | 2013-04-11 | 니폰 덴키 가라스 가부시키가이샤 | 형광체 복합 유리, 형광체 복합 유리 그린 시트 및 형광체 복합 유리의 제조 방법 |
| US7829147B2 (en) | 2005-08-18 | 2010-11-09 | Corning Incorporated | Hermetically sealing a device without a heat treating step and the resulting hermetically sealed device |
| US7722929B2 (en) | 2005-08-18 | 2010-05-25 | Corning Incorporated | Sealing technique for decreasing the time it takes to hermetically seal a device and the resulting hermetically sealed device |
| JP5219331B2 (ja) * | 2005-09-13 | 2013-06-26 | 株式会社住田光学ガラス | 固体素子デバイスの製造方法 |
| JP4771837B2 (ja) * | 2005-11-28 | 2011-09-14 | 京セラ株式会社 | 波長変換器および発光装置 |
| EP1821070B1 (en) | 2006-02-15 | 2008-04-23 | C.R.F. Societa Consortile per Azioni | Luminous display for automotive satellite navigation systems |
| KR100824716B1 (ko) | 2006-04-07 | 2008-04-24 | 박종길 | 엘이디 칩온보드 타입의 면광원모듈과 이를 이용한액정표시장치 |
| US8941293B2 (en) * | 2006-05-11 | 2015-01-27 | Samsung Electronics Co., Ltd. | Solid state lighting devices comprising quantum dots |
| JP4978886B2 (ja) | 2006-06-14 | 2012-07-18 | 日本電気硝子株式会社 | 蛍光体複合材料及び蛍光体複合部材 |
| JP4802923B2 (ja) | 2006-08-03 | 2011-10-26 | 日本電気硝子株式会社 | 波長変換部材 |
| US20080049164A1 (en) | 2006-08-22 | 2008-02-28 | Samsung Electronics Co., Ltd., | Backlight assembly, manufacturing method thereof, and liquid crystal display device |
| US7723744B2 (en) | 2006-12-08 | 2010-05-25 | Evident Technologies, Inc. | Light-emitting device having semiconductor nanocrystal complexes |
| JP2008169348A (ja) | 2007-01-15 | 2008-07-24 | Nippon Electric Glass Co Ltd | 蛍光体複合材料 |
| EP2120271A4 (en) | 2007-03-01 | 2015-03-25 | Nec Lighting Ltd | LIGHT EMITTING DIODE DEVICE AND LIGHTING APPARATUS |
| JP5104490B2 (ja) | 2007-04-16 | 2012-12-19 | 豊田合成株式会社 | 発光装置及びその製造方法 |
| US20100263723A1 (en) | 2007-07-19 | 2010-10-21 | University Of Cincinnati | Nearly Index-Matched Luminescent Glass-Phosphor Composites For Photonic Applications |
| JP5578597B2 (ja) | 2007-09-03 | 2014-08-27 | 独立行政法人物質・材料研究機構 | 蛍光体及びその製造方法、並びにそれを用いた発光装置 |
| US7741770B2 (en) * | 2007-10-05 | 2010-06-22 | Global Oled Technology Llc | LED device having improved light output |
| US7989236B2 (en) | 2007-12-27 | 2011-08-02 | Toyoda Gosei Co., Ltd. | Method of making phosphor containing glass plate, method of making light emitting device |
| JP5311281B2 (ja) | 2008-02-18 | 2013-10-09 | 日本電気硝子株式会社 | 波長変換部材およびその製造方法 |
| CN102007609B (zh) | 2008-04-18 | 2013-01-23 | 旭硝子株式会社 | 发光二极管封装 |
| GB2462411B (en) * | 2008-07-30 | 2013-05-22 | Photonstar Led Ltd | Tunable colour led module |
| KR100982991B1 (ko) | 2008-09-03 | 2010-09-17 | 삼성엘이디 주식회사 | 양자점 파장변환체, 양자점 파장변환체의 제조방법 및 양자점 파장변환체를 포함하는 발광장치 |
| US20100244286A1 (en) | 2008-10-06 | 2010-09-30 | Lagsa Earl Vincent B | Nanocomposites for optoelectronic devices |
| JP5360370B2 (ja) | 2008-11-14 | 2013-12-04 | 独立行政法人物質・材料研究機構 | 発光装置 |
| JP5641384B2 (ja) | 2008-11-28 | 2014-12-17 | 独立行政法人物質・材料研究機構 | 表示装置用照明装置及び表示装置 |
| CN101749554A (zh) | 2008-12-08 | 2010-06-23 | 厦门市光莆电子有限公司 | 节能超薄led平面显示灯 |
| US9799914B2 (en) | 2009-01-29 | 2017-10-24 | Corning Incorporated | Barrier layer for thin film battery |
| JP5333758B2 (ja) | 2009-02-27 | 2013-11-06 | 東芝ライテック株式会社 | 照明装置および照明器具 |
| TW201041426A (en) | 2009-05-08 | 2010-11-16 | zhi-ming You | LED lamp and manufacturing method thereof |
| US8465177B2 (en) | 2009-06-19 | 2013-06-18 | Chih-Ming Yu | Heat dissipation enhanced LED lamp |
| WO2011002509A1 (en) | 2009-06-30 | 2011-01-06 | Tiecheng Alex Qiao | Semiconductor nanocrystals used with led sources |
| US8278841B2 (en) | 2009-07-02 | 2012-10-02 | Innovations In Optics, Inc. | Light emitting diode light engine |
| WO2011004795A1 (ja) * | 2009-07-07 | 2011-01-13 | シーシーエス株式会社 | 発光装置 |
| WO2011013505A1 (ja) | 2009-07-27 | 2011-02-03 | コニカミノルタオプト株式会社 | 蛍光体分散ガラス及びその製造方法 |
| JP2011040315A (ja) | 2009-08-14 | 2011-02-24 | Cybernet Systems Co Ltd | 矩形領域を照射するled照明モジュール |
| HUP0900578A2 (en) | 2009-09-15 | 2011-03-28 | Bela Boldoghy | Low energy demand for heating, cooling, surface radiator and air changing building system, and for passive energy-saving buildings |
| US20110068354A1 (en) | 2009-09-19 | 2011-03-24 | SHILED Group International | High power LED lighting device using high extraction efficiency photon guiding structure |
| JP2011119292A (ja) | 2009-11-06 | 2011-06-16 | Shin-Etsu Astech Co Ltd | 発光装置(cobモジュール) |
| WO2011065322A1 (ja) | 2009-11-30 | 2011-06-03 | コニカミノルタオプト株式会社 | 発光ダイオードユニットの製造方法 |
| JP2011187798A (ja) | 2010-03-10 | 2011-09-22 | Nippon Electric Glass Co Ltd | 波長変換部材およびそれを用いた光学デバイス |
| WO2011132402A1 (ja) | 2010-04-19 | 2011-10-27 | パナソニック株式会社 | ガラス組成物、光源装置および照明装置 |
| JP5828065B2 (ja) | 2010-04-19 | 2015-12-02 | パナソニックIpマネジメント株式会社 | 光源装置および照明装置 |
| US8563113B2 (en) | 2010-04-20 | 2013-10-22 | Corning Incorporated | Multi-laminate hermetic barriers and related structures and methods of hermetic sealing |
| CN102782082A (zh) | 2010-07-14 | 2012-11-14 | 日本电气硝子株式会社 | 荧光体复合部件、led器件和荧光体复合部件的制造方法 |
| US20130188354A1 (en) | 2010-07-19 | 2013-07-25 | Huizhou Light Engine Limited (a Chinese limited company) | Phosphor coating films and lighting apparatuses using the same |
| US20120028011A1 (en) | 2010-07-27 | 2012-02-02 | Chong Pyung An | Self-passivating mechanically stable hermetic thin film |
| JP5678509B2 (ja) | 2010-08-02 | 2015-03-04 | 日本電気硝子株式会社 | 波長変換部材の製造方法、波長変換部材及び光源 |
| CN201748222U (zh) | 2010-08-07 | 2011-02-16 | 温州科迪光电科技有限公司 | 具有良好散热性能的模块式led日光灯 |
| CN201884988U (zh) | 2010-10-26 | 2011-06-29 | 康陈德 | 一种可拆解的大功率led照明灯具 |
| CN103189326B (zh) | 2010-10-28 | 2015-12-02 | 康宁股份有限公司 | 用于led照明应用的含磷光体玻璃料材料 |
| US10158057B2 (en) * | 2010-10-28 | 2018-12-18 | Corning Incorporated | LED lighting devices |
| CN102097545B (zh) | 2010-11-19 | 2012-10-24 | 东南大学 | 发光二极管的玻璃-硅圆片级板上芯片封装方法 |
| WO2012100132A1 (en) | 2011-01-21 | 2012-07-26 | Osram Sylvania Inc. | Luminescent converter and led light source containing same |
| JP2012158494A (ja) | 2011-01-31 | 2012-08-23 | Ohara Inc | ガラス組成物 |
| JP5724461B2 (ja) | 2011-03-03 | 2015-05-27 | 日本電気硝子株式会社 | 波長変換部材の製造方法およびそれにより作製された波長変換部材、ならびに波長変換素子 |
| CN202074366U (zh) | 2011-03-07 | 2011-12-14 | 吴明番 | 一种嵌入式led面板灯 |
| JP5760655B2 (ja) * | 2011-04-28 | 2015-08-12 | 三菱化学株式会社 | 半導体発光装置用樹脂パッケージ及び該樹脂パッケージを有してなる半導体発光装置並びにそれらの製造方法 |
| JP2013010661A (ja) | 2011-06-29 | 2013-01-17 | Ohara Inc | ガラス組成物 |
| CN202216097U (zh) | 2011-08-18 | 2012-05-09 | 深圳市华朗电子有限公司 | 外置电源led工矿灯 |
| CN202221016U (zh) | 2011-09-20 | 2012-05-16 | 苏州晶能科技有限公司 | 防眩光的led光源隧道灯照明系统 |
| CN102437271A (zh) | 2011-12-12 | 2012-05-02 | 秦会斌 | 一种基于cob技术的集成化led封装方法 |
| US9368546B2 (en) * | 2012-02-15 | 2016-06-14 | Microsoft Technology Licensing, Llc | Imaging structure with embedded light sources |
-
2013
- 2013-03-14 US US13/828,169 patent/US9202996B2/en not_active Expired - Fee Related
- 2013-11-26 EP EP13812256.9A patent/EP2926381A1/en not_active Withdrawn
- 2013-11-26 WO PCT/US2013/071947 patent/WO2014085424A1/en not_active Ceased
- 2013-11-26 JP JP2015545181A patent/JP2016500471A/ja active Pending
- 2013-11-26 KR KR1020157017217A patent/KR20150092209A/ko not_active Withdrawn
- 2013-11-26 CN CN201380071147.3A patent/CN105074943A/zh active Pending
- 2013-11-28 TW TW102143463A patent/TWI535072B/zh not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100103648A1 (en) * | 2008-10-28 | 2010-04-29 | Gun-Woo Kim | Light emitting diode, backlight assembly having the same and method thereof |
| CN102330914A (zh) * | 2010-06-04 | 2012-01-25 | 三星Led株式会社 | 光源模块、背光单元、显示设备以及照明设备 |
| WO2012012234A1 (en) * | 2010-07-19 | 2012-01-26 | Bridgelux, Inc. | Led array package with a high thermally conductive plate |
| WO2012135744A2 (en) * | 2011-04-01 | 2012-10-04 | Kai Su | White light-emitting device |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106025044A (zh) * | 2016-04-19 | 2016-10-12 | 苏州星烁纳米科技有限公司 | 波长转换器件、背光单元和显示装置 |
| WO2017193312A1 (en) * | 2016-05-11 | 2017-11-16 | Huawei Technologies Co., Ltd. | Quantum dot light-emitting device |
| CN106383420A (zh) * | 2016-08-31 | 2017-02-08 | 张家港康得新光电材料有限公司 | 一种量子点发光器件及背光模组 |
| WO2018040780A1 (zh) * | 2016-08-31 | 2018-03-08 | 张家港康得新光电材料有限公司 | 一种量子点发光器件及背光模组 |
| CN106587641A (zh) * | 2016-12-01 | 2017-04-26 | 天津理工大学 | 低熔点玻璃粉及其制造的激光照明用玻璃陶瓷 |
| CN106587641B (zh) * | 2016-12-01 | 2019-05-07 | 天津理工大学 | 低熔点玻璃粉及其制造的激光照明用玻璃陶瓷 |
| CN107248547A (zh) * | 2017-06-21 | 2017-10-13 | 鸿宝科技股份有限公司 | 一种大功率led芯片集成封装结构及其封装方法 |
| US10985297B2 (en) | 2018-10-12 | 2021-04-20 | Industrial Technology Research Institute | Package of photoelectric device |
| CN109545945A (zh) * | 2018-11-28 | 2019-03-29 | 上海应用技术大学 | 一种白光led用夹层荧光玻璃的制备方法 |
| CN111987206A (zh) * | 2019-05-23 | 2020-11-24 | 易美芯光(北京)科技有限公司 | 量子点led封装器件及制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US9202996B2 (en) | 2015-12-01 |
| WO2014085424A1 (en) | 2014-06-05 |
| KR20150092209A (ko) | 2015-08-12 |
| JP2016500471A (ja) | 2016-01-12 |
| US20140151729A1 (en) | 2014-06-05 |
| TW201424051A (zh) | 2014-06-16 |
| EP2926381A1 (en) | 2015-10-07 |
| TWI535072B (zh) | 2016-05-21 |
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