CN104979221A - 半导体装置的制造方法及半导体装置 - Google Patents

半导体装置的制造方法及半导体装置 Download PDF

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Publication number
CN104979221A
CN104979221A CN201510087712.6A CN201510087712A CN104979221A CN 104979221 A CN104979221 A CN 104979221A CN 201510087712 A CN201510087712 A CN 201510087712A CN 104979221 A CN104979221 A CN 104979221A
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resin
lead terminal
notch
peristome
case
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CN104979221B (zh
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横山岳
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Fuji Electric Co Ltd
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Fuji Electric Co Ltd
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Abstract

本发明提供能够抑制施加到经嵌件注塑成型的引线框的引线端子上的应力，即便使引线端子的厚度变薄也能够提高引线键合性、提高可靠性的半导体装置的制造方法及半导体装置。使用上下金属模具夹持在引线端子的接合部上形成的夹持部的夹持用突起而将树脂壳体嵌件注塑成型，使在该树脂壳体的开口部内安装了半导体元件的具有布线图案的绝缘基板嵌合到树脂壳体并进行粘接，使半导体元件与引线端子的接合部之间和/或绝缘基板上的上述布线图案与引线端子的接合部之间用键合线进行电连接。

Description

半导体装置的制造方法及半导体装置
技术领域
本发明涉及在通过嵌件注塑成型使引线框一体形成而得的树脂壳体的内侧收纳搭载了半导体元件和/或其它电子部件的绝缘基板的半导体装置的制造方法及半导体装置。
背景技术
作为这种半导体装置，例如己知有专利文献1的图3中记载的现有例。
上述专利文献1的图3是以将连接了键合线的引线框上的外部引出端子的下端端部折弯成L字形状而形成水平部，使该水平部向环状的绝缘壳体的内侧突出的方式进行嵌件注塑成型。对于向环状的绝缘壳体的内侧突出的外部引出端子的水平部而言，在嵌件注塑成型后要切断不需要的部分。
在专利文献2中，以在金属模具内配置上下方向调节用固定销而固定引线框的下表面的状态注射树脂，在树脂为半熔融状态时边使固定销从引线框表面撤走边进行成型。
现有技术文献
专利文献
专利文献1：日本特开平11-330344号公报
专利文献2：日本特开2001-18252号公报
发明内容
技术问题
但是，对于上述专利文献1，因为在嵌件注塑后切断外部引出端子的不需要的部分，所以随着在切断时对外部引出端子施加应力而引线端子的厚度变薄，可能在外部引出端子的键合线的连接部发生变形。另外，可能因切断时的应力而在外部引出端子与绝缘壳体的树脂层之间产生缝隙。由此，在将键合线与外部引出端子接合时，存在引线键合性降低、对半导体装置的可靠性，例如振动试验和/或热循环性等造成影响的课题。
另外，对于上述专利文献2，随着引线端子的厚度变薄，存在在使用固定销固定引线框的位置发生变形，引线键合性降低，对半导体装置的可靠性，例如振动试验和/或热循环性等造成影响的课题。
本发明提供抑制施加到经嵌件注塑成型的引线框的引线端子上的应力，即使将引线端子的厚度变薄也能够提高引线键合性、提高可靠性的半导体装置的制造方法及半导体装置。
技术方案
为了实现上述目的，本发明的半导体装置的制造方法的一个方式是将半导体元件收纳在通过使用至少两个金属模具的嵌件注塑成型而一体成型有引线端子的具有开口部的环状的树脂壳体内的半导体装置的制造方法，包括如下工序：嵌件注塑工序，使具有在引线端子的接合部形成的夹持用突起的夹持部以向上述开口部的内侧突出的方式配置在上述金属模具中的一个金属模具，使用上述一个金属模具和另一个金属模具夹持该夹持用突起而将上述树脂壳体嵌件注塑成型；基板安装工序，使安装了半导体元件的具有布线图案的绝缘基板嵌合到经嵌件注塑成型的上述树脂壳体的上述开口部内并进行粘接；和引线键合工序，使半导体元件与引线端子的接合部之间和/或绝缘基板上的上述布线图案与引线端子的接合部之间用键合线进行电连接。
另外，本发明的半导体装置的一个方式，是将半导体元件收纳在通过嵌件注塑成型而一体成型有引线端子的具有开口部的环状的树脂壳体内的半导体装置，具备：具备接合部和端子部的上述引线端子；在使具有在上述引线端子的接合部形成的夹持用突起的夹持部向上述开口部的内侧突出的状态下，用相互对置的金属模具夹持该夹持用突起来进行上述嵌件注塑成型而得的上述树脂壳体；配置在上述开口部的安装了上述半导体元件的具有布线图案的绝缘基板；和使上述半导体元件与上述引线端子的上述接合部之间以及上述绝缘基板上的上述布线图案与上述引线端子的上述接合部之间电连接的键合线，其中，上述夹持部具备切口部。
有益效果
本发明可以提供抑制施加到经嵌件注塑成型的引线框的引线端子上的应力，即使将引线端子的厚度变薄也能够提高引线键合性、提高可靠性的半导体装置的制造方法及半导体装置。
附图说明
图1A是本发明的实施方式的半导体装置的俯视图，图1B是图1A的B-B剖面图，图1C是图1A的C-C剖面图。
图2是本发明的实施方式的图1A的D部放大图。
图3是本发明的实施方式的图1B的E部放大图。
图4A-图4B是本发明的实施方式的与图1A对应的D部放大图。
图5是表示本发明的实施方式的引线框的俯视图。
图6是表示本发明的实施方式的嵌件注塑的金属模具的剖面图。
图7是表示本发明的实施方式的嵌件注塑后的树脂壳体的俯视图。
图8是表示本发明的实施方式的半导体装置集合体的俯视图。
图9是表示本发明的实施方式的引线框的俯视图。
图10是本发明的实施方式的与图2对应的放大俯视图。
图11是图10的XI-XI线上的剖面图。
图12是本发明的实施方式的与图2对应的放大俯视图。
图13是图12的XIII-XIII线上的剖面图。
图14是本发明的实施方式的与图2对应的放大俯视图。
符号说明
10：半导体装置
11：树脂壳体
11a：树脂层
12：开口部
12a：切口部
12b：端部边缘
13：引线端子插入面
14：方形框状部
15：半导体元件
15a，15b：电极
16：绝缘基板
16a：布线图案
21A～21D：引线端子
21a：接合部
21b：端子部
21c：夹持部
21d，21h，21i，21k：切口部
21e，21f，21g，21j：夹持用突起
22：键合线
31：引线框
32：连接杆
41：下金属模具
42：上金属模具
43：槽
45：树脂壳体集合体
46：半导体装置集合体
51，53：树脂注入空间
52，54：树脂突出层
具体实施方式
以下，根据附图来说明本发明的实施方式。
[实施方式一]
对本发明的实施方式的半导体装置进行说明。
图1A-1C、图2、图3、图4A-4B表示本发明的实施方式的俯视图及其剖面图和放大图。图1A表示俯视图，图1B表示图1A的B-B剖面图，图1C表示图1A的C-C剖面图。图2表示图1A的D部放大图，图3表示图1B的E部放大图，图4A-4B表示与图1A对应的D部放大图。
如图1A所示，对于半导体装置10而言，在中央部形成开口部12，具有引线端子21A～21D和通过嵌件注塑成型来一体形成而得的环状的树脂壳体11。在树脂壳体11嵌入有绝缘基板16，在形成于绝缘基板16上的布线图案16a上安装有半导体元件15。半导体元件15、布线图案16a和引线端子21A～21D分别通过键合线22进行电连接。
如图1B所示，在树脂壳体11的开口部12的上方形成有引线端子插入面13。在该引线端子插入面13的外周侧形成有向上方突出的方形框状部14。
在开口部12的下表面侧形成有切口部12a。在该切口部12a嵌合有安装了半导体元件15的绝缘基板16。绝缘基板16和树脂壳体11通过粘接剂而粘接。
应予说明，也可以在绝缘基板16上的布线图案16a安装半导体元件15以外的电阻和/或电容器等电子部件，形成基于用途的布线图案16a。
如图1A所示，在引线端子插入面13，通过嵌件注塑成型使例如四个引线端子21A～21D在例如左右对称且前后对称的位置与树脂壳体一体形成。各引线端子21A～21D分别具备接合键合线22的接合部21a和与接合部21a连接的端子部21b，并形成L字形状。这里，各个引线端子21A～21D以接合部21a成为开口部12侧的方式配置，端子部21b贯穿方形框状部14而向树脂壳体11的外侧延伸。
应予说明，引线端子21A～21D并不限于左右对称、前后对称的位置，也可以根据需要改变左右、前后的位置。另外，引线端子21A～21D不限于在左右方向贯穿方形框状部14的情况，也可以在方形框状部14内折弯成L字形状并使其从方形框状部14的上表面突出。
如图1C所示，各引线端子21A～21D以上表面从引线端子插入面13露出的状态下与引线端子插入面13成为同一平面的方式被埋入。
如图2所示，引线端子21A～21D在接合部21a的开口部12侧的端部形成有夹持部21c。夹持部21c向开口部12内突出。
另外，如图3所示，在夹持部21c向开口部12内突出的情况下，为了保持键合线22与引线端子21A～21D之间的绝缘距离，需要像虚线图示那样提高键合线22的高度。
因此，如图2所示，在键合线22通过上部的夹持部21c的中央部形成有从向树脂壳体11的开口部12内侧突出的夹持部21c的顶端面到开口部12壁面的凹状的切口部21d。优选凹状的切口部21d的底部的端面与树脂壳体11的开口部12的端部边缘12b在同一平面上。
通过在夹持部21c具备凹状的切口部21d，能够在引线端子21A～21D的各接合部21a与同各接合部21a连接的各个键合线22之间确保绝缘距离。
由此，如图3中实线所示，键合线22的通过位置可以通过形成凹状的切口部21d而降低，从而能够降低半导体装置10的高度。
在夹持部21c的中央部形成凹状的切口部21d的情况下，为了通过后述的嵌件注塑成型的下金属模具41和上金属模具42可靠地进行夹持，夹持部21c的突出长度L1设定为引线端子21A～21D的厚度t(例如0.5mm)以上。
形成凹状的切口部21d的左右两侧边缘部的夹持用突起21e和21f的宽度W1和W2也基于相同的理由而设定为引线端子21A～21D的厚度t以上。此外，将凹状的切口部21d的宽度W3也设定为引线端子21A～21D的厚度t以上，且设定为对于键合线22能够得到必要的绝缘距离的长度。
在半导体元件15的上表面形成的电极15a与引线端子21C和21D的接合部21a之间分别通过键合线22进行电连接。在半导体元件15的下表面形成的电极15b通过未图示的焊料或导电性粘接剂与绝缘基板16上的布线图案16a进行电连接。布线图案16a与引线端子21A和21B之间分别通过键合线22进行电连接。
在上述实施方式中，对引线端子21A～21D形成为L字形状的情况进行了说明，但并不限于此，可以形成为直线形状或者形成为T字形状等，可以形成为任意形状。
本发明的实施方式对如图2所示、在引线端子21A～21D的夹持部21c的中央部形成凹状的切口部21d，并在其两侧形成夹持用突起21e和21f的情况进行了说明。然而，本发明不限于上述结构。
如图4A所示，在键合线22通过与垂直于树脂壳体11的开口部12的内侧的端面的方向平行的引线端子21A～21D的接合部21a的两侧的端面侧的上表面的情况下，也可以在与垂直于树脂壳体11的开口部12的内侧的端面的方向平行的接合部21a的两侧的端面形成切口部21h和21i，并在接合部21a的中央部设置凸状的夹持用突起21g。
另外，如图4B所示，在键合线22通过与垂直于树脂壳体11的开口部12的内侧的端面的方向平行的引线端子21A～21D的接合部21a的一侧的端面侧的上表面的情况下，也可以在键合线22通过接合部21a的一侧的端面形成切口部21k，并在另一侧的接合部21a的端面设置夹持用突起21j。
此时，将夹持用突起21g、21j的突出长度L3和宽度W4设定为引线端子21A～21D的厚度t以上。由此，能够可靠地通过后述的嵌件注塑成型的下金属模具41和上金属模具42来进行夹持。
应予说明，键合线22的根数可以是一根，也可以根据耐压和/或半导体装置的用途等接合所需要的根数。
另外，树脂壳体11的开口部12、引线端子插入面13和方形框状部14通过未图示的绝缘性树脂，例如环氧系铸塑树脂和/或凝胶密封剂等来进行树脂密封。
[实施方式二]
对本发明的实施方式的半导体装置的制造方法进行说明。
图5表示引线框31的俯视图。引线框31以例如四组引线端子21A～21D分别向内侧突出的方式一体形成在长方形框状的连接杆32的内周面。
引线端子21A～21D如上所述，具备接合键合线22的接合部21a和与接合部21a连接的端子部21b，端子部21b与连接杆32连接。
在引线端子21A～21D的接合部21a分别形成有如图2所示的具备凹状的切口部21d的夹持部21c。
图6表示嵌件注塑成型的金属模具的剖面图。如图6所示，引线框31装配在进行嵌件注塑成型的下金属模具41上。在下金属模具41具备具有切口部21d的夹持部21c的夹持用突起21e、21f嵌合的槽43。将引线框31装配到下金属模具41，使上金属模具42下降，引线框31通过用下金属模具41与上金属模具42夹住各引线端子21A～21D的夹持部21c的夹持用突起21e、21f而固定。
应予说明，槽43也可以不形成在下金属模具，而形成在上金属模具42上。
然后，以预定压力向形成于下金属模具41和上金属模具42的腔41a和42a内注入由加热熔融状态的聚苯硫醚(Polyphenylene Sulphide，PPS)和/或聚丁二酸丁二醇酯(Polybutylene Succinate，PBS)等构成的树脂材料并使其固化。
具备由引线框31的各引线端子21A～21D的凹状的切口部21d形成的夹持用突起21e、21f的夹持部21c被上金属模具42和具备与夹持部21c的夹持用突起21e、21f嵌合的槽43的下金属模具41夹住。由此，能够使各引线端子21A～21D固定在正确位置，不会发生引线端子21A～21D从树脂壳体11的树脂层11a上浮而产生缝隙的情况，能够可靠地进行嵌件注塑。
另外，具备凹状的切口部21d的夹持部21c的形状如图2所示，为了可靠地通过嵌件注塑成型的下金属模具41和上金属模具42进行夹持，将夹持部21c的夹持用突起21e、21f的突出长度L1设定为引线端子21A～21D的厚度t(例如0.5mm)以上。形成凹状的切口部21d的左右侧边缘部的夹持用突起21e和21f的宽度W1和W2也基于相同的理由而设定为引线端子21A～21D的厚度t以上。此外，将凹状的切口部21d的宽度W3也设定为引线端子21A～21D的厚度t以上，且设定为对于键合线22能够得到必要的绝缘距离的长度。
即使引线端子21A～21D的厚度t为0.5mm以下，也可以通过在引线端子21A～21D具有具备上述尺寸的凹状的切口部21d的夹持部21c而固定到正确的位置，能够形成不产生引线端子21A～21D的接合部21a变形的树脂壳体11。
此外，由于在引线框31向金属模具的固定中不需要使用固定销，所以能够抑制经嵌件注塑成型的引线端子21A～21D的接合部21a的变形。
通过抑制经嵌件注塑成型的树脂壳体11的接合部21a的变形，能够在不发生剥离的情况下使键合线22牢固地接合到接合部21a，因此能够使引线键合性好的树脂壳体11成型。由此，能够提高半导体装置10的可靠性，例如振动试验和/或热循环性等。
图7表示经嵌件注塑成型的树脂壳体集合体45的俯视图。各个树脂壳体11与连接杆32连结。
图8表示半导体装置集合体46的俯视图。对于构成图7所示的树脂壳体集合体45的各树脂壳体11而言，以将安装了半导体元件15的面置于树脂壳体11的开口部12的内侧的方式使安装了半导体元件15的绝缘基板16嵌合在开口部12的切口部12a内。
应予说明，树脂壳体11与绝缘基板16之间通过粘接剂而粘接。
并且，嵌合了绝缘基板16的树脂壳体集合体45通过引线键合装置在预定位置接合键合线22。
然后，通过切断半导体装置集合体46的引线框31的连接杆32来形成四个半导体装置10。
应予说明，引线框31的连接杆32的切断也可在接合键合线22之前进行。
另外，在键合线22的接合后，树脂壳体11的开口部12、引线端子插入面13和方形框状部14通过未图示的绝缘性树脂，例如环氧系铸塑树脂和/或凝胶密封剂等进行树脂密封。
根据上述的半导体装置的制造方法，向树脂壳体11的开口部12内侧突出的夹持部21c不需要在嵌件注塑成型后进行切断。因此，能够抑制施加于树脂壳体11的引线端子21A～21D的接合部21a的应力，从而抑制接合部21a的变形。另外，能够防止因切断时的应力而在引线端子21A～21D的接合部21a与树脂壳体11的树脂层11a之间产生缝隙。
因此，键合线22能够在不发生剥离的情况下牢固地接合到接合部21a。由此，能够将引线键合性好、可提高半导体装置10的可靠性，例如振动试验和/或热循环性等的树脂壳体11成型。
另外，在引线端子21A～21D的夹持部21c向开口部12内突出的状态下，如图3中虚线所示，为了保持引线端子21A～21D与键合线22的绝缘距离，需要提高键合线22的高度。然而，在本发明的实施方式中，在夹持部21c的与键合线22对置的位置形成有凹状的切口部21d，因此，如图3中实线那样，能够将键合线22的通过位置下降与凹状的切口部21d相当的高度的部分，从而能够降低半导体装置10的高度。
本发明的实施方式对如图2所示在引线端子21A～21D的夹持部21c的中央部形成凹状的切口部21d，并在其两侧形成夹持用突起21e和21f的情况进行了说明。然而，本发明并不限于上述结构。
如图4A所示，在键合线22通过与垂直于树脂壳体11的开口部12的内侧端面的方向平行的引线端子21A～21D的接合部21a的两侧的端面侧的上表面的情况下，也可以在与垂直于树脂壳体11的开口部12的内侧端面的方向平行的接合部21a的两侧的端面形成切口部21h和21i而在接合部21a的中央部设置凸状的夹持用突起21g。
另外，如图4B所示，在键合线22通过与垂直于树脂壳体11的开口部12的内侧端面的方向平行的引线端子21A～21D的接合部21a的一侧的端面侧的上表面的情况下，可以在键合线22通过接合部21a的一侧的端面形成切口部21k，并在另一侧的接合部21a的端面设置夹持用突起21j。
此时，将夹持用突起21g、21j的突出长度L3和宽度W4设定为引线端子21A～21D的厚度t以上。由此，能够可靠地通过后述的嵌件注塑成型的下金属模具41和上金属模具42来进行夹持。
因此，键合线22能够在不发生剥离的情况下牢固地接合到接合部21a。由此，能够将引线键合性好、可提高半导体装置10的可靠性，例如振动试验和/或热循环性等的树脂壳体11成型。
应予说明，键合线22的根数可以是一根，也可以根据耐压和/或半导体装置的用途等接合所需要的根数。
此外，在上述实施方式中，对同时嵌件注塑成型四个半导体装置10的情况进行了说明，但本发明并不限于此，同时嵌件注塑成型的半导体装置的数量可以根据金属模具的规格设定为任意数。
图9是表示引线框31的俯视图。
在上述实施方式中，对将构成引线框31的连接杆32形成为长方形框状的情况进行了说明，但本发明并不限于此，如图9所示，也可以切断连接杆32的前后框部，用不同的连接杆部32a和32b将引线端子21A和21B与引线端子21C和21D连结。
[实施方式三]
对本发明的其它实施方式的半导体装置进行说明。
图10表示实施方式一中的与图2对应的放大俯视图，图11表示图10的XI-XI线上的剖面图。
在本实施方式中，改变上述的实施方式一中的引线端子21A～21D的切口部21d的形状，除此以外，具有与实施方式一同样的结构，对与图2对应的部分标注相同符号，并省略对其进行的详细说明。
在本实施方式中，将在引线端子21A～21D的接合部21a形成的切口部21d的形状像图10所示那样进行改变。即，以切口部21d的底边部21n成为在开口部12的端部边缘12b的外侧仅后退距离L4的位置的方式形成。
这样，切口部21d的底边部21n距开口部12的端部边缘12b仅后退了距离L4。因此，如图10所示，在底边部21n与开口部12的端部边缘12b之间形成有长方形的树脂注入空间51。对于树脂注入空间51而言，如上所述通过聚苯硫醚(PPS)和聚丁二酸丁二醇酯(PBS)等构成的树脂材料的注入将树脂壳体11嵌件注塑成型时，可以在树脂注入空间51内注入树脂材料而形成树脂突出层52。
这里，为了能够防止树脂突出层52破损，将切口部21d的底边部21n与开口部12的端部边缘12b之间的距离L4设定为引线端子21A～21D的厚度t(例如0.5mm)以上。
并且，在上述的实施方式三中的半导体装置的制造方法中，在将树脂壳体11嵌件注塑成型时，向在各引线端子21A～21D的接合部21a形成的切口部21d的树脂注入空间51内注入树脂材料而形成如图11所明示的树脂突出层52。
即，在树脂注入工序中，在用下金属模具41和上金属模具42夹住夹持部21c的夹持用突起21e、21f的状态下，在下金属模具41和上金属模具42的腔41a和42a内，以预定压力注入由加热熔融状态的聚苯硫醚(PPS)和聚丁二酸丁二醇酯(PBS)等构成的树脂材料并使其固化。由此，通过在切口部21d的树脂注入空间51内注入树脂材料，该树脂材料固化后，如图11所示，在切口部21d的底边部21n和开口部12的端部边缘12b之间形成树脂突出层52。
因此，在嵌件成型后的树脂材料固化收缩时，引线端子21A的接合部21a如图10所示，变为从四个方向被夹住，所述四个方向是在与上述实施方式一相同的前后侧面和左侧面这三个方向的树脂层11a的基础上加上树脂突出层52这四个方向。因此，能够在不发生剥离的情况下使引线端子的接合部21a更牢固地接合到树脂壳体11，能够将引线键合性好的树脂壳体11成型。由此，能够进一步提高半导体装置10的可靠性，例如振动试验和/或热循环性等。此外，因为在键合线22的下侧形成切口部21d和树脂突出层52，所以能够边充分确保引线端子与键合线22的绝缘距离，边进一步降低键合线22的高度。
并且，即使是板厚t小于0.5mm的薄引线端子21A～21D，也可以通过在引线端子21A～21D具有具备上述尺寸的凹状的切口部21d的夹持部21c而固定到正确位置，能够形成不产生引线端子21A～21D的接合部21a变形的树脂壳体11。
此外，因为将作为树脂突出层52宽度的距离L4设定为引线端子21A～21D的厚度t以上，所以在嵌件成型后能够可靠地防止在通过引线键合装置进行键合线的接合时树脂突出层52破损。
本发明的实施方式对如图10所示在引线端子21A～21D的夹持部21c的中央部形成凹状的切口部21d，并在其两侧形成夹持用突起21e和21f的情况进行了说明。然而，本发明并不限于上述结构。
如图12和图13所示，在键合线22通过与垂直于树脂壳体11的开口部12的内侧的端面的方向平行的引线端子21A～21D的接合部21a的一侧的端面侧的上表面的情况下，也可以在键合线22通过接合部21a的一侧的端面形成切口部21k，并在另一侧的接合部21a的端面设置夹持用突起21j。此时，使切口部21k的底边部21m在开口部12的端部边缘12b的外侧后退而形成树脂注入空间53，并形成树脂突出层54即可。
此外，如图14所示，在键合线22通过与垂直于树脂壳体11的开口部12的内侧的端面的方向平行的引线端子21A～21D的接合部21a的两侧的端面侧的上表面的情况下，也可以在与垂直于树脂壳体11的开口部12的内侧的端面的方向平行的接合部21a两侧的端面形成切口部21h和21i，并在接合部21a的中央部设置凸状的夹持用突起21g。此时，也使切口部21h和21i的底边部21m、21n向开口部12的端部边缘12b的外侧后退而形成树脂注入空间53，并形成树脂突出层54即可。
应予说明，在上述实施方式中，对切口部21h、21i的底边部21m、21n形成为与开口部12的端部边缘12b平行的直线形状的情况进行了说明，但并不限于此，可以形成为波纹形状、曲线形状、折线形状等任意形状。
另外，在上述实施方式中，对引线端子21A～21D形成为L字形状的情况进行了说明，但并不限于此，可以形成为直线形状或者形成为T字形状等，可以形成为任意形状。

Claims (20)

1.一种半导体装置的制造方法，是将半导体元件收纳在通过使用至少两个金属模具的嵌件注塑成型而一体成型有引线端子的具有开口部的环状的树脂壳体内的半导体装置的制造方法，其特征在于，包括如下工序：
嵌件注塑工序，将具有在引线端子的接合部形成的夹持用突起的夹持部以向所述开口部的内侧突出的方式配置在所述金属模具中的一个金属模具，使用所述一个金属模具和另一个金属模具夹持该夹持用突起而将所述树脂壳体嵌件注塑成型；
基板安装工序，使安装了半导体元件的具有布线图案的绝缘基板嵌合到经嵌件注塑成型的所述树脂壳体的所述开口部内并进行粘接；和
引线键合工序，使半导体元件与引线端子的接合部之间和/或绝缘基板上的所述布线图案与引线端子的接合部之间用键合线进行电连接。
2.一种半导体装置的制造方法，是将半导体元件收纳在通过嵌件注塑成型而一体成型有引线端子的具有开口部的环状的树脂壳体内的半导体装置的制造方法，其特征在于，包括如下工序：
嵌件注塑工序；
基板安装工序，在绝缘基板的主表面上形成布线图案，在所述布线图案上安装所述半导体元件；
粘接工序，使在所述嵌件注塑工序中形成的所述树脂壳体与在所述基板安装工序中安装了所述半导体元件的所述绝缘基板嵌合并进行粘接；和
引线键合工序，在所述粘接工序后，使所述引线端子的所述接合部与所述半导体元件和/或所述引线端子的所述接合部与所述绝缘基板的布线图案之间用键合线进行电连接；
所述嵌件注塑工序包括如下工序：
配置工序，以在所述树脂壳体的所述开口部的内侧配置所述接合部的方式将具有端子部和接合部的所述引线端子配置在一对金属模具中的一个金属模具上；
固定工序，在所述一对金属模具中的所述一个金属模具与所述另一个金属模具之间夹入所述引线端子；和
树脂注入工序，在所述一对金属模具中的所述一个金属模具与所述另一个金属模具中注入树脂而形成所述树脂壳体；
其中，在所述引线端子的所述接合部形成夹持部，所述夹持部具有向所述树脂壳体的所述开口部的内侧突出的夹持用突起，
所述夹持用突起在所述固定工序中被所述一个金属模具和所述另一个金属模具夹持，
在所述一个金属模具形成有供所述夹持用突起嵌入的槽。
3.根据权利要求1或2所述的半导体装置的制造方法，其特征在于，所述夹持用突起的向所述树脂壳体的所述开口部的内侧突出的长度为所述引线端子的厚度以上。
4.根据权利要求1或2所述的半导体装置的制造方法，其特征在于，所述夹持部在与所述键合线对置的位置形成有切口部。
5.根据权利要求4所述的半导体装置的制造方法，其特征在于，所述切口部以所述切口部的底边部与所述开口部的端部边缘对齐的方式形成。
6.根据权利要求4所述的半导体装置的制造方法，其特征在于，所述切口部在所述切口部的底边部和所述开口部的端部边缘之间形成有通过所述嵌件注塑工序注入树脂材料而形成树脂突出层的树脂注入空间。
7.根据权利要求4～6中任一项所述的半导体装置的制造方法，其特征在于，所述切口部以所述夹持用突起的与所述树脂壳体的所述开口部的端面平行的方向的宽度为所述引线端子的厚度以上的方式形成。
8.根据权利要求4～6中任一项所述的半导体装置的制造方法，其特征在于，所述切口部形成在所述夹持部的中央，在该切口部的两侧形成有所述夹持用突起。
9.根据权利要求4～6中任一项所述的半导体装置的制造方法，其特征在于，所述切口部以在所述夹持部的中央部保留所述夹持用突起的方式形成。
10.根据权利要求4～6中任一项所述的半导体装置的制造方法，其特征在于，
所述切口部以在与垂直于所述树脂壳体的所述开口部的端面的方向平行的所述夹持部的一个端部保留所述夹持用突起的方式形成。
11.根据权利要求1～10中任一项所述的半导体装置的制造方法，其特征在于，所述引线端子的端子部与连接杆连结。
12.一种半导体装置，是将半导体元件收纳在通过嵌件注塑成型而一体成型有引线端子的具有开口部的环状的树脂壳体内的半导体装置，具备：
具备接合部和端子部的所述引线端子；
在使具有在所述引线端子的接合部形成的夹持用突起的夹持部向所述开口部的内侧突出的状态下，用相互对置的金属模具夹持该夹持用突起来进行所述嵌件注塑成型而得的所述树脂壳体；
配置在所述开口部的安装了所述半导体元件的具有布线图案的绝缘基板；和
使所述半导体元件与所述引线端子的所述接合部之间以及所述绝缘基板上的所述布线图案与所述引线端子的所述接合部之间电连接的键合线；
其中，所述夹持部具备切口部。
13.根据权利要求12所述的半导体装置，其特征在于，所述切口部设置在将所述引线端子的所述接合部与所述半导体元件和所述绝缘基板上的所述布线图案中的至少一个电连接的与所述键合线对置的位置。
14.根据权利要求12或13所述的半导体装置，其特征在于，所述切口部以所述切口部的底边部与所述开口部的端部边缘对齐的方式形成。
15.根据权利要求12或13所述的半导体装置，其特征在于，所述切口部在所述切口部的底边部与所述开口部的端部边缘之间形成有通过注入形成所述树脂壳体的树脂材料而形成树脂突出层的树脂注入空间。
16.根据权利要求12所述的半导体装置，其特征在于，所述夹持部的夹持用突起的向所述树脂壳体的所述开口部的内侧突出的长度为所述引线端子的厚度以上。
17.根据权利要求12或13所述的半导体装置，其特征在于，所述切口部以所述夹持部的夹持用突起中的与所述树脂壳体的所述开口部的端面平行的方向的宽度为所述引线端子的厚度以上的方式形成。
18.根据权利要求13～17中任一项所述的半导体装置，其特征在于，所述切口部设置在所述夹持部的中央，并在两侧形成有所述夹持用突起。
19.根据权利要求13～17中任一项所述的半导体装置，其特征在于，所述切口部以在所述夹持部的中央部保留夹持用突起的方式设置。
20.根据权利要求13～17中任一项所述的半导体装置，其特征在于，所述切口部以在与垂直于所述树脂壳体的所述开口部的端面的方向平行的所述夹持部的一个端部保留夹持用突起的方式设置。
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