CN114557145A - 电子模块的壳体及其制造 - Google Patents
电子模块的壳体及其制造 Download PDFInfo
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Abstract
本发明涉及一种用于制造模块的壳体(1)的方法。在该方法中,每个具有能键合引线表面(13)的引线(9)在注射工具中被利用塑料注塑包封,其中,为每个引线(9)产生管脚凹槽(7),其穿过塑料延伸并包括在引线(9)中的引线凹槽,并且其中每个能键合引线表面(13)的至少一部分不被注塑。在至少一个管脚凹槽(7)中插入导电管脚元件(37),其中,管脚元件(37)被引导穿过管脚凹槽(7)的引线凹槽。
Description
技术领域
本发明涉及一种用于电子模块的壳体以及尤其涉及一种用于制造模块的壳体的方法。
背景技术
电力电子领域越来越需要适应特殊应用的电子模块。这种类型的电子模块一般都是小批量生产,这意味着它们的生产比大批量生产电子模块更复杂、更昂贵。这尤其涉及带有特殊端子设备的电子模块的壳体。
用于电子模块的壳体例如通过注射成型来生产,其中,端子被利用塑料注塑包封。这种制造方法的一个优点是端子的“能键合性”,端子在键合过程中不能自然振荡,因此使得键合结果无法控制,并且由于省略了替代的接合工艺来组装壳体,因此不会通过这种类型的接合工艺造成损坏或污染。然而,缺点是对于端子的每种布置都需要专门的注射工具,该模具匹配端子的位置。
在用于制造电子模块的壳体的另一种方法中,以相对较高的速度和力将端子压入事先制造的塑料框架中。以这种方式引入的摩擦选择性地熔化塑料框架并将端子固定地焊接到其位置,或者塑料框架的材料充分屈服并卡住端子。这种方法的一个优点是端子设备的多样性。即使塑料框架已经存在很长时间,端子也能够以不同的方式布置。然而,缺点是在焊盘下方没有材料配合的连接。只有端子将焊盘牢固和限定地压在塑料框架处时,才能够在焊盘上可靠地进行键合。有限制的工艺窗口和所需的高水平的机械协调增加了故障敏感性。此外,并非所有塑料都能够用于此过程,因为例如,高填充塑料往往会破裂而不是选择性地熔化或变形。
在另一种方法中,首先将内框架和外框架制造为单独的塑料注射成型部件。在组装壳体时,首先将所需的端子插入较大的外框架。然后将粘合剂涂在每个焊盘下方,并将所有壳体部件粘合在一起。这种方法的优点是制造过程中的高度稳健性和可变的端子定位。缺点是加工时间长和第二个塑料部件的成本。
发明内容
本发明的目的是提出一种改进的用于制造模块的壳体的方法。
根据本发明,该目的通过具有权利要求1的特征的方法来实现。
本发明的有利设计方案是从属权利要求的主题。
在根据本发明的用于制造模块的壳体的方法中,每个具有能键合的引线表面的引线在注射工具中被利用塑料注塑包封,其中,为每个引线产生管脚凹槽,该管脚凹槽延伸穿过塑料并且包括在引线中的引线凹槽,并且其中,每个能键合的引线表面的至少一部分不被注塑。将导电的管脚元件插入至少一个管脚凹槽中,其中,管脚元件被引导穿过管脚凹槽的引线凹槽。
本发明能够将壳体的管脚凹槽单独地与管脚元件装配,其中,壳体的具有引线和管脚凹槽的壳体框架能够作为系列产品被制造。由此,将壳体框架的批量生产的优点与可适应相应应用的管脚设备相结合。此外,通过在注射工具中注塑包覆引线,能够实现引线的过程技术的可键合性。与将端子压入壳体框架中相比,该方法提供的优点是在制造壳体时不需要特殊的塑料,其防止壳体在端子被压入时破裂。
在本发明的一个设计方案中,每个管脚元件在插入到管脚凹槽中时都与引线形状配合地连接。例如,每个管脚元件都具有收缩部段,其横截面和大小与引线凹槽一致,并且管脚元件的止挡部段分别在在两侧连接至该收缩部段,该止挡部段的横截面大于引线凹槽的横截面。管脚元件与引线的形状配合的连接是这样产生的,即管脚元件的第一止挡部段被挤压穿过引线的引线凹槽,直到管脚元件的第二止挡部段抵靠在引线处。管脚元件与相应的引线的这种类型的形状配合的可连接性有利地实现了壳体的可靠的和可变的管脚装配。为了便于管脚元件插入和穿过引线凹槽,每个管脚元件能够具有一个端部部段,例如锥形的、特别是圆锥形的端部部段,该端部部段以逐渐减小的横截面从第一止挡部段远离地延伸。
在本发明的另一个设计方案中,用于每个待产生的管脚凹槽的注射工具具有冲压部件和凹模部件,二者在注射工具闭合时将管脚凹槽的引线凹槽在彼此相对的侧上封闭,并且在注射工具闭合后利用塑料注塑包封。在此能够提出,在注射工具闭合时,通过将冲压部件压入到引线中来产生或扩大引线凹槽。特别地,每个冲压部件具有被压入引线中以产生或扩大引线凹槽的逐渐变尖的冲压端部。此外,每个凹模部件都具有凹模端部,该凹模端部具有凹部,该凹部由环形壁界定边缘,该环形壁在注射工具闭合之后抵靠在引线上并在一侧处封闭引线凹槽。由此,能够有利地在注射工具的闭合期间产生或最终完成引线凹槽,并且同时在随后的注射成型期间防止塑料浸入。有利地,当冲压部件的冲压端部被压入引线中时,凹模部件的凹模端部中的凹部能够实现引线变形进入到凹部中。
在本发明的另一个设计方案中,每个管脚元件都具有至少一个加厚部段,该加厚部段相对于与其邻接的管脚元件的区域具有扩大的直径,该扩大的直径在引线凹槽外部与管脚凹槽的直径一致。由此,管脚元件有利地稳定在管脚凹槽中。
在本发明的另一设计方案中,每个管脚元件被设计成,使得管脚元件的接触端在插入管脚凹槽之后从管脚凹槽伸出。由此,能够容易地从外部接触管脚元件。
在本发明的另一设计方案中,管脚元件在插入到管脚凹槽中之前布置在印刷电路板处并且同时插入到管脚凹槽中。以这种方式,管脚元件不必单独插入管脚凹槽中并且随后以复杂的方式与印刷电路板连接。此外,能够提出,壳体被制造为具有至少一个固定元件,例如具有螺纹凹槽、卡钩和/或锁定凸起,其设计用于将印刷电路板固定到壳体处。如果印刷电路板能够固定在壳体上,则能够省略上述引脚元件与引线的形状配合的连接,因为引脚元件通过印刷电路板被保持在引脚元件的位置,由此,能够利用引脚设备替换印刷电路板。
在本发明的另一个设计方案中,引线以引线框的形式被制造,其中,引线框具有引线保持部,并且引线保持部在引线的注塑包封之后从引线上被分离或移除。由此,简化了将引线插入到注射工具中。例如,能够制造具有预设断裂位置的引线框,用于将引线保持部与引线分离。由此,有利地简化了引线保持部与引线的分离。
使用根据本发明的方法制造根据本发明的壳体。根据本发明的电子模块具有使用根据本发明的方法制造的壳体。根据本发明的壳体和根据本发明的电子模块的优点对应于根据本发明的方法的上述优点。
附图说明
根据结合附图对实施例的描述,更清楚地解释本发明的上述特性、特征和优点以及如何实现它们的方式和方法。图中示出:
图1以立体图示出了引线框架和引脚凹槽,
图2以立体图示出了引线框架、壳体框架的一个部段以及注射工具的冲压部件和凹模部件,
图3以立体图示出了引线以及在注射成型后、和分离和移除引线框架的引线保持部后壳体框架的一个部段,
图4以立体图和局部剖视图示出了当注射工具在注射成型之前闭合时处于第一位置的引线、冲压部件的冲压端部和凹模部件的凹模端部,
图5以类似于图3的图示示出了在注射成型之前当注射工具闭合时处于第二位置的引线、冲压端部和凹模端部,
图6以类似于图3的图示示出了在注射成型期间处于一个位置的引线、冲压端部和凹模端部,
图7以类似于图3的图示示出了在注射成型之后打开注射工具时处于一个位置的引线、冲压端部和凹模端部,
图8以立体图示出电子模块的壳体的一个部段,
图9以剖视图示出了电子模块的壳体的截面,
图10以立体图和局部剖视图示出了当将管脚元件插入管脚凹槽中时处于第一位置的管脚元件的引线侧端部和引线,
图11以立体图和局部剖视图示出了在管脚元件插入到管脚凹槽中之后的管脚元件的引线侧端部和引线,
图12以立体图示出了在将印刷电路板安装到壳体的壳体框架处之前的具有壳体和印刷电路板的电子模块。
相应的部件在图中具有相同的附图标记。
具体实施方式
图1至11示出了根据本发明的用于制造壳体1的方法的实施例的在壳体1制造的不同阶段中电子模块3的壳体1的部件。
图1以立体图示出了引线框架5和引脚凹槽7。引线框架5包括多个彼此间隔开的引线9和其处布置有引线9的引线保持部11。每个引线9例如由铜制成,具有镀镍的能键合的引线表面13。引线框架5具有用于每个引线9的预设断裂位置15,预设断裂位置用于将引线保持部11与引线9分离。每个引线9具有引线凹槽17,引线凹槽是穿过壳体1的壳体框架19延伸的管脚凹槽7的一部分。壳体框架19在注射工具20中通过注射成型由塑料制成。
图2以立体图示出了引线框架5、壳体框架19的一个部段以及注射工具20的冲压部件21和凹模部件23。为清楚起见,注射工具20的其他部件未被示出并且常规地实施。为了制造壳体框架19,将引线框架5插入注射工具20中。注射工具20闭合,其中,每个引线凹槽17由冲压部件21和凹模部件23扩大和闭合,见图5和6。在注射工具20闭合后,引线9、冲压部件21以及凹模部件23用塑料注塑包覆,其中,引线9之间的中间空间被填充有塑料,并且每个引线表面13的一部分不被注塑,以便能够随后在该部分上键合。注射成型后,打开注射工具20,在预设断裂位置15处将引线保持部11与引线9分离并移除。
图3以立体图示出了在注射成型和分离和移除引线保持部11之后的引线9和壳体框架19的一个部段。
图4至7以立体图示出了由冲压部件21和凹模部件23扩大和封闭引线9的引线凹槽17,其中,引线9以截面示出。
图4示出了当注射工具20在第一位置闭合时的引线9、冲压部件21的冲压端部25和凹模部件23的凹模端部27,而冲压端部25和凹模端部27在引线9的相对两侧上向着引线9的预制引线凹槽17移动。冲压端部25构造成锥形的,具有移动到引线凹槽17中的尖端。凹模端部27具有凹部29,该凹部由环形壁31界定边缘并且具有比引线凹槽17更大的横截面。除了冲压端部25和凹模端部27之外,冲压部件21和凹模部件23设计成圆柱形并且沿着共同的圆柱轴线33对准,该圆柱轴线穿过引线凹槽17延伸,并且在注射工具20关闭和打开时,冲压部件21和凹模部件23沿着该圆柱轴线移动。
图5示出了当注射工具20在第二位置闭合时的引线9、冲压端部25和凹模端部27,在第二位置中,冲压端部25和凹模端部27的壁31在相对侧上抵靠在引线9上。然后,将具有力方向35的力施加在冲压部件21上,由此,将冲压端部25沿圆柱轴线33压入引线9中,使得引线凹槽17被扩大,并且使引线9在引线凹槽17的区域中变形进入到凹模端部27的凹部29中。
图6示出了在注射成型期间在一个位置中的变形的引线9、冲压端部25和凹模端部27,在该位置中,引线凹槽17被冲压端部25和凹模端部27封闭。
图7示出了在注射成型后注射工具20打开期间在一个位置中的变形的引线9、冲压端部25和凹模端部27,其中,冲压部件21和凹模部件23沿着圆柱轴线33在彼此相反的方向上从引线9移开(喷射注塑的塑料未示出)。
在图4至图7所示的实施例中,引线9的引线凹槽17已经在引线框5的制造期间被预制,并且在注射工具20闭合时如所描述的那样被扩大和封闭。在另一个实施例中,首先通过在注塑模具20闭合时将冲压端部25压入引线9中来产生引线凹槽17。在另一实施例中,引线凹槽17在引线框5的制造期间完全被预制,并且仅在注射工具20闭合时分别通过冲压部件21和凹模部件23来封闭。
在喷射注塑之后,管脚元件37被插入管脚凹槽7中,其中,它们各自以形状配合的方式锚定在引线9的引线凹槽17处(见图10和11)。
图8和图9示出了在管脚元件37插入管脚凹槽7之后的壳体1。在此,图8示出了壳体1的一个部段的立体图,并且图9示出了壳体1的截面图。每个管脚元件37具有两个加厚部段39,加厚部段分别具有与管脚元件37的相邻区域相比扩大的直径,该直径与引线凹槽17外部的管脚凹槽7的直径一致。管脚元件37通过加厚部段39稳定在管脚凹槽7中。每个管脚元件37的接触端41在其被插入管脚凹槽7中之后从管脚凹槽7中伸出。
图10和图11以立体图示出了当将管脚元件37插入管脚凹槽17中时的管脚元件37的引线侧端部和引线9,其中,引线9以剖面图示出。管脚元件37的引线侧端部具有收缩部段43,该收缩部段在其横截面和其伸展方面与引线凹槽17一致,并且在两侧连接有止挡部段45、47,止挡部段的横截面大于引线凹槽17的横截面。通过管脚元件37的第一止挡部段45沿力方向35压穿过引线凹槽17直到管脚元件37的第二止挡部段47抵靠在引线9处,使得建立管脚元件37与引线9形状配合的连接。管脚元件37具有锥形端部部段49,该锥形端部部段以逐渐减小的横截面积从第一止动部45远离地延伸,并且简化了将管脚元件37压入到引线凹槽17中。图10示出了管脚元件37在与引线9连接之前的位置。图11示出了与引线9连接之后的管脚元件37。止挡部段45、47用作为倒钩,其防止管脚元件37与引线9的连接松脱。
图12(图12)示出了在将印刷电路板51安装在壳体1的壳体框架19的上侧处之前的具有壳体1和印刷电路板51的电子模块3的实施例的立体图。利用根据图1至图11描述的方法制造壳体1,其中,管脚元件37在被插入到管脚凹槽7(例如通过焊接)之前被布置在印刷电路板51处,并且同时被插入到壳体框架19的管脚凹槽7中。壳体框架19被制造为具有螺纹凹槽53,螺纹凹槽被设计用于将壳体框架19与印刷电路板51拧紧。电子模块3能够具有其他部件(未示出),例如布置在壳体框架19的下侧处的基板和/或布置在壳体框架19下方的散热器。此外,电子模块3具有布置在印刷电路板51、基板和/或散热器上的电子模块,这些同样未示出。
尽管已经通过优选实施例对本发明进行了详细说明和描述,但是本发明不被所公开的示例限制,并且本领域技术人员能够在不脱离本发明的保护范围的情况下从中得出其他变体方案。
Claims (15)
1.一种用于制造电子模块(3)的壳体(1)的方法,其中
-分别具有能键合的引线表面(13)的引线(9)在注射工具(20)中被利用塑料注塑包封,其中,为每个所述引线(9)产生一个管脚凹槽(7),所述管脚凹槽穿过塑料延伸并且包括在所述引线(9)中的引线凹槽(17),并且其中,每个所述能键合的引线表面(13)的至少一部分不被注塑,并且
-在至少一个所述管脚凹槽(7)中插入导电的管脚元件(37),其中,所述管脚元件(37)被引导穿过所述管脚凹槽(7)的所述引线凹槽(17)。
2.根据权利要求1所述的方法,其中,每个所述管脚元件(37)在插入管脚凹槽(7)中时与所述引线(9)形状配合地连接。
3.根据权利要求2所述的方法,其中,每个所述管脚元件(37)具有收缩部段(43),所述收缩部段在所述收缩部段的横截面和所述收缩部段的伸展方面与所述引线凹槽(17)一致,并且在所述收缩部段处在两侧分别连接所述管脚元件(37)的止挡部段(45,47),所述止挡部段的横截面大于所述引线凹槽(17)的横截面,并且其中,通过将所述管脚元件(37)的第一止挡部段(45)挤压穿过所述引线(9)的所述引线凹槽(17)直到所述管脚元件(37)的第二止挡部段(47)抵靠在所述引线(9)处,产生所述管脚元件(37)与所述引线(9)的形状配合的连接。
4.根据前述权利要求中任一项所述的方法,其中,每个所述管脚元件(37)具有端部部段(49),所述端部部段以逐渐减小的横截面积从第一止挡部段(45)远离地延伸。
5.根据前述权利要求中任一项所述的方法,其中,用于每个待产生的管脚凹槽(7)的所述注射工具(20)具有冲压部件(21)和凹模部件(23),在所述注射工具(20)闭合时,所述冲压部件和所述凹模部件将所述管脚凹槽(7)的所述引线凹槽(17)在彼此相对的侧上封闭,并且在所述注射工具(20)闭合后利用塑料注塑包封。
6.根据权利要求5所述的方法,其中,在所述注射工具(20)闭合时,通过将所述冲压部件(21)压入到所述引线(9)中来产生或扩大所述引线凹槽(17)。
7.根据权利要求5或6所述的方法,其中,每个所述冲压部件(21)具有逐渐变尖的冲压端部(25),所述冲压端部被压入引线(9)中以用于产生或扩大引线凹槽(17)。
8.根据权利要求5至7中任一项所述的方法,其中,每个所述凹模部件(23)具有凹模端部(27),所述凹模端部具有凹部(29),所述凹部由环形壁(31)界定边缘,所述环形壁在所述注射工具(20)闭合之后抵靠在所述引线(9)处并在一侧处封闭所述引线凹槽(17)。
9.根据前述权利要求中任一项所述的方法,其中,每个所述管脚元件(37)都具有至少一个加厚部段(39),所述加厚部段具有相对于所述管脚元件(37)的与所述加厚部段邻接的区域扩大的直径,所述扩大的直径在所述引线凹槽(17)外部与管脚凹槽(7)的直径一致。
10.根据前述权利要求中任一项所述的方法,其中,每个所述管脚元件(37)被设计成,使得所述管脚元件(37)的接触端(41)在插入管脚凹槽(7)之后从所述管脚凹槽(7)伸出。
11.根据前述权利要求中任一项所述的方法,其中,管脚元件(37)在插入到管脚凹槽(7)中之前布置在印刷电路板(51)处并且同时插入到管脚凹槽(7)中。
12.根据权利要求11所述的方法,其中,所述壳体(1)被制造为具有至少一个固定元件,所述固定元件被设计用于将所述印刷电路板(51)固定在所述壳体(1)处。
13.根据前述权利要求中任一项所述的方法,其中,所述引线(9)以引线框(5)的形式制造,其中,所述引线框具有引线保持部(11),所述引线(9)布置在所述引线保持部处,并且在所述引线(9)的注塑包封之后,所述引线保持部(11)从所述引线(9)被分离和移除。
14.一种壳体(1),所述壳体通过根据前述权利要求中任一项所述的方法制造。
15.一种电子模块(3),具有通过根据权利要求1至13中任一项所述的方法生产的壳体(1)。
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Citations (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63314841A (ja) * | 1987-06-17 | 1988-12-22 | Nec Yamagata Ltd | 半導体装置の樹脂封止用金型 |
US4857019A (en) * | 1988-02-29 | 1989-08-15 | Molex Incorporated | Terminal pin with s-shaped complaint portion |
JPH0251260A (ja) * | 1988-08-12 | 1990-02-21 | Mitsui Petrochem Ind Ltd | 半導体装置の製造方法 |
US5168432A (en) * | 1987-11-17 | 1992-12-01 | Advanced Interconnections Corporation | Adapter for connection of an integrated circuit package to a circuit board |
US5647767A (en) * | 1995-02-06 | 1997-07-15 | The Whitaker Corporation | Electrical connector jack assembly for signal transmission |
DE19729486A1 (de) * | 1997-07-10 | 1999-01-14 | Kroma Metall Und Kunststoffver | Verfahren zur Herstellung eines Kunststoffteiles und Vorrichtung zur Durchführung des Verfahrens |
US6155886A (en) * | 1999-06-24 | 2000-12-05 | Hon Hai Precision Ind. Co., Ltd. | Electrical connector and method for making the same |
EP1559531A1 (de) * | 2004-01-30 | 2005-08-03 | Kramer AG | Einsatz für ein Spritzgusswerkzeug und Spritzgusswerkzeug mit diesem Einsatz |
US20060061010A1 (en) * | 2004-09-13 | 2006-03-23 | Hans-Georg Huonker | Process for manufacturing hybrid components as well as components manufactured according to this process |
US20080001278A1 (en) * | 2006-06-29 | 2008-01-03 | Mitsubishi Electric Corporation | Semiconductor device having terminals |
CN101197334A (zh) * | 2007-09-27 | 2008-06-11 | 厦门宏发电声有限公司 | 一种功率半导体模块及其制作方法 |
CN101359645A (zh) * | 2007-07-31 | 2009-02-04 | 雅马哈株式会社 | 半导体装置、预模制封装结构及其制造方法 |
US7494389B1 (en) * | 2008-03-10 | 2009-02-24 | Infineon Technologies Ag | Press-fit-connection |
CN101587849A (zh) * | 2008-04-04 | 2009-11-25 | 捷敏服务公司 | 具有通过冲压形成的特征的半导体器件封装 |
DE102008037165A1 (de) * | 2008-08-05 | 2010-02-25 | Walter Esser Kunststoff-Spritzgießerei GmbH & Co KG | Anschlussteil und Verfahren zum Herstellen eines Anschlussteils |
CN102299084A (zh) * | 2010-06-23 | 2011-12-28 | 深圳市华龙精密模具有限公司 | 一种塑封模具及其中的上引线条和下引线条 |
CN102456652A (zh) * | 2010-10-20 | 2012-05-16 | 三菱电机株式会社 | 功率半导体装置 |
CN102623428A (zh) * | 2011-07-04 | 2012-08-01 | 三菱电机株式会社 | 半导体模块 |
CN102891129A (zh) * | 2012-08-30 | 2013-01-23 | 无锡永阳电子科技有限公司 | 预塑封引线框架及其封装工艺 |
CN103515364A (zh) * | 2012-06-29 | 2014-01-15 | 三星电机株式会社 | 电源模块封装和用于制造电源模块封装的方法 |
CN103887273A (zh) * | 2012-12-19 | 2014-06-25 | 富士电机株式会社 | 半导体模块 |
CN104979221A (zh) * | 2014-04-01 | 2015-10-14 | 富士电机株式会社 | 半导体装置的制造方法及半导体装置 |
CN105047639A (zh) * | 2015-08-26 | 2015-11-11 | 扬州虹扬科技发展有限公司 | 一种功率半导体模块引线端子的加工方法 |
CN105074919A (zh) * | 2013-02-26 | 2015-11-18 | 三菱电机株式会社 | 电力用半导体装置 |
CN105161478A (zh) * | 2014-01-08 | 2015-12-16 | 大陆汽车系统公司 | 用于电子互连器的柔性引线框架连接 |
DE102015113438A1 (de) * | 2015-08-14 | 2017-02-16 | Osram Opto Semiconductors Gmbh | Trägersubstrat für ein optoelektronisches Halbleiterbauteil |
-
2019
- 2019-09-30 EP EP19200557.7A patent/EP3797962A1/de not_active Withdrawn
-
2020
- 2020-06-18 US US17/764,437 patent/US20220407275A1/en active Pending
- 2020-06-18 EP EP20735092.7A patent/EP3996894B1/de active Active
- 2020-06-18 CN CN202080068740.2A patent/CN114557145B/zh active Active
- 2020-06-18 WO PCT/EP2020/066844 patent/WO2021063551A1/de unknown
Patent Citations (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63314841A (ja) * | 1987-06-17 | 1988-12-22 | Nec Yamagata Ltd | 半導体装置の樹脂封止用金型 |
US5168432A (en) * | 1987-11-17 | 1992-12-01 | Advanced Interconnections Corporation | Adapter for connection of an integrated circuit package to a circuit board |
US4857019A (en) * | 1988-02-29 | 1989-08-15 | Molex Incorporated | Terminal pin with s-shaped complaint portion |
JPH0251260A (ja) * | 1988-08-12 | 1990-02-21 | Mitsui Petrochem Ind Ltd | 半導体装置の製造方法 |
US5647767A (en) * | 1995-02-06 | 1997-07-15 | The Whitaker Corporation | Electrical connector jack assembly for signal transmission |
DE19729486A1 (de) * | 1997-07-10 | 1999-01-14 | Kroma Metall Und Kunststoffver | Verfahren zur Herstellung eines Kunststoffteiles und Vorrichtung zur Durchführung des Verfahrens |
US6155886A (en) * | 1999-06-24 | 2000-12-05 | Hon Hai Precision Ind. Co., Ltd. | Electrical connector and method for making the same |
EP1559531A1 (de) * | 2004-01-30 | 2005-08-03 | Kramer AG | Einsatz für ein Spritzgusswerkzeug und Spritzgusswerkzeug mit diesem Einsatz |
US20060061010A1 (en) * | 2004-09-13 | 2006-03-23 | Hans-Georg Huonker | Process for manufacturing hybrid components as well as components manufactured according to this process |
US20080001278A1 (en) * | 2006-06-29 | 2008-01-03 | Mitsubishi Electric Corporation | Semiconductor device having terminals |
CN101359645A (zh) * | 2007-07-31 | 2009-02-04 | 雅马哈株式会社 | 半导体装置、预模制封装结构及其制造方法 |
CN101197334A (zh) * | 2007-09-27 | 2008-06-11 | 厦门宏发电声有限公司 | 一种功率半导体模块及其制作方法 |
US7494389B1 (en) * | 2008-03-10 | 2009-02-24 | Infineon Technologies Ag | Press-fit-connection |
CN101587849A (zh) * | 2008-04-04 | 2009-11-25 | 捷敏服务公司 | 具有通过冲压形成的特征的半导体器件封装 |
DE102008037165A1 (de) * | 2008-08-05 | 2010-02-25 | Walter Esser Kunststoff-Spritzgießerei GmbH & Co KG | Anschlussteil und Verfahren zum Herstellen eines Anschlussteils |
CN102299084A (zh) * | 2010-06-23 | 2011-12-28 | 深圳市华龙精密模具有限公司 | 一种塑封模具及其中的上引线条和下引线条 |
CN102456652A (zh) * | 2010-10-20 | 2012-05-16 | 三菱电机株式会社 | 功率半导体装置 |
CN102623428A (zh) * | 2011-07-04 | 2012-08-01 | 三菱电机株式会社 | 半导体模块 |
CN103515364A (zh) * | 2012-06-29 | 2014-01-15 | 三星电机株式会社 | 电源模块封装和用于制造电源模块封装的方法 |
CN102891129A (zh) * | 2012-08-30 | 2013-01-23 | 无锡永阳电子科技有限公司 | 预塑封引线框架及其封装工艺 |
CN103887273A (zh) * | 2012-12-19 | 2014-06-25 | 富士电机株式会社 | 半导体模块 |
CN105074919A (zh) * | 2013-02-26 | 2015-11-18 | 三菱电机株式会社 | 电力用半导体装置 |
CN105161478A (zh) * | 2014-01-08 | 2015-12-16 | 大陆汽车系统公司 | 用于电子互连器的柔性引线框架连接 |
CN104979221A (zh) * | 2014-04-01 | 2015-10-14 | 富士电机株式会社 | 半导体装置的制造方法及半导体装置 |
DE102015113438A1 (de) * | 2015-08-14 | 2017-02-16 | Osram Opto Semiconductors Gmbh | Trägersubstrat für ein optoelektronisches Halbleiterbauteil |
CN105047639A (zh) * | 2015-08-26 | 2015-11-11 | 扬州虹扬科技发展有限公司 | 一种功率半导体模块引线端子的加工方法 |
Non-Patent Citations (2)
Title |
---|
唐家霖;崔洁;柳青;: "键合引线悬空的引线键合工艺研究", 电子工业专用设备, no. 08 * |
曹阳根;李晓林;张恩霞;苗烨麟;舒;吴磊;: "SOP系列IC塑封工艺及通用MGP模具设计", 半导体技术, no. 11 * |
Also Published As
Publication number | Publication date |
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CN114557145B (zh) | 2024-03-15 |
EP3996894B1 (de) | 2023-01-18 |
US20220407275A1 (en) | 2022-12-22 |
EP3797962A1 (de) | 2021-03-31 |
EP3996894A1 (de) | 2022-05-18 |
WO2021063551A1 (de) | 2021-04-08 |
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