CN104517925B - 半导体器件引线框架 - Google Patents
半导体器件引线框架 Download PDFInfo
- Publication number
- CN104517925B CN104517925B CN201410488506.1A CN201410488506A CN104517925B CN 104517925 B CN104517925 B CN 104517925B CN 201410488506 A CN201410488506 A CN 201410488506A CN 104517925 B CN104517925 B CN 104517925B
- Authority
- CN
- China
- Prior art keywords
- film
- pedestal
- lead wire
- lead
- connecting lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 51
- 238000000034 method Methods 0.000 claims abstract description 45
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 30
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 7
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 61
- 238000000465 moulding Methods 0.000 claims description 35
- 230000008569 process Effects 0.000 claims description 27
- 239000002131 composite material Substances 0.000 claims description 23
- 238000005538 encapsulation Methods 0.000 claims description 10
- 230000008878 coupling Effects 0.000 claims description 7
- 238000010168 coupling process Methods 0.000 claims description 7
- 238000005859 coupling reaction Methods 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000002955 isolation Methods 0.000 claims description 4
- 238000004806 packaging method and process Methods 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 1
- 239000010408 film Substances 0.000 description 37
- 238000007789 sealing Methods 0.000 description 18
- 238000007667 floating Methods 0.000 description 14
- 238000005516 engineering process Methods 0.000 description 6
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 229920000106 Liquid crystal polymer Polymers 0.000 description 4
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 4
- 210000000080 chela (arthropods) Anatomy 0.000 description 4
- 230000001419 dependent effect Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 210000003205 muscle Anatomy 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000003550 marker Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
- H01L21/566—Release layers for moulds, e.g. release layers, layers against residue during moulding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4334—Auxiliary members in encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
- H01L23/49551—Cross section geometry characterised by bent parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
Claims (13)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP13186180.9 | 2013-09-26 | ||
EP13186180.9A EP2854161B1 (en) | 2013-09-26 | 2013-09-26 | Semiconductor device leadframe |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104517925A CN104517925A (zh) | 2015-04-15 |
CN104517925B true CN104517925B (zh) | 2018-09-28 |
Family
ID=49230653
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410488506.1A Active CN104517925B (zh) | 2013-09-26 | 2014-09-23 | 半导体器件引线框架 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9190350B2 (zh) |
EP (1) | EP2854161B1 (zh) |
CN (1) | CN104517925B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2854162B1 (en) * | 2013-09-26 | 2019-11-27 | Ampleon Netherlands B.V. | Semiconductor device leadframe |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6165819A (en) * | 1992-10-20 | 2000-12-26 | Fujitsu Limited | Semiconductor device, method of producing semiconductor device and semiconductor device mounting structure |
CN1755907A (zh) * | 2004-09-30 | 2006-04-05 | 株式会社瑞萨科技 | 半导体器件的制造方法 |
EP2631941A2 (en) * | 2012-02-23 | 2013-08-28 | Freescale Semiconductor, Inc. | Method for forming die assembly with heat spreader |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU2001272814A1 (en) * | 2000-07-25 | 2002-02-05 | Chan-Ik Park | Plastic package base, air cavity type package and their manufacturing methods |
NL1019042C2 (nl) | 2001-09-26 | 2003-03-27 | Europ Semiconductor Assembly E | Werkwijze voor het inkapselen van een chip en/of ander voorwerp. |
US6841854B2 (en) * | 2002-04-01 | 2005-01-11 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device |
NL1021266C2 (nl) | 2002-08-13 | 2004-02-17 | Otb Group Bv | Werkwijze en inrichting voor het geheel of ten dele bedekken van ten minste één elektronische component met een compound. |
SG157957A1 (en) * | 2003-01-29 | 2010-01-29 | Interplex Qlp Inc | Package for integrated circuit die |
WO2007007239A2 (en) * | 2005-07-08 | 2007-01-18 | Nxp B.V. | Semiconductor device |
US8564968B1 (en) * | 2011-05-10 | 2013-10-22 | Triquint Semiconductor, Inc. | Air cavity package including a package lid having at least one protrusion configured to facilitate coupling of the package lid with a package wall |
-
2013
- 2013-09-26 EP EP13186180.9A patent/EP2854161B1/en active Active
-
2014
- 2014-09-05 US US14/478,683 patent/US9190350B2/en active Active
- 2014-09-23 CN CN201410488506.1A patent/CN104517925B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6165819A (en) * | 1992-10-20 | 2000-12-26 | Fujitsu Limited | Semiconductor device, method of producing semiconductor device and semiconductor device mounting structure |
CN1755907A (zh) * | 2004-09-30 | 2006-04-05 | 株式会社瑞萨科技 | 半导体器件的制造方法 |
EP2631941A2 (en) * | 2012-02-23 | 2013-08-28 | Freescale Semiconductor, Inc. | Method for forming die assembly with heat spreader |
Also Published As
Publication number | Publication date |
---|---|
CN104517925A (zh) | 2015-04-15 |
US9190350B2 (en) | 2015-11-17 |
EP2854161A1 (en) | 2015-04-01 |
EP2854161B1 (en) | 2019-12-04 |
US20150084175A1 (en) | 2015-03-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20151028 Address after: Holland Ian Deho Finn Applicant after: NXP BV Address before: Holland Ian Deho Finn Applicant before: NXP BV |
|
CB02 | Change of applicant information |
Address after: Holland Ian Deho Finn Applicant after: AMPLEON NETHERLANDS B.V. Address before: Holland Ian Deho Finn Applicant before: NXP BV |
|
COR | Change of bibliographic data | ||
CB02 | Change of applicant information |
Address after: Nijmegen Applicant after: AMPLEON NETHERLANDS B.V. Address before: Holland Ian Deho Finn Applicant before: AMPLEON NETHERLANDS B.V. |
|
COR | Change of bibliographic data | ||
GR01 | Patent grant | ||
GR01 | Patent grant |