CN104956782B - 集成电路模块 - Google Patents

集成电路模块 Download PDF

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Publication number
CN104956782B
CN104956782B CN201480003922.6A CN201480003922A CN104956782B CN 104956782 B CN104956782 B CN 104956782B CN 201480003922 A CN201480003922 A CN 201480003922A CN 104956782 B CN104956782 B CN 104956782B
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China
Prior art keywords
lead
leadframe
dap
plane
frame
Prior art date
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Active
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CN201480003922.6A
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English (en)
Chinese (zh)
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CN104956782A (zh
Inventor
L·H·M@E·李
A·F·B·A·阿齐兹
S·G·G·林
N·S·长
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Texas Instruments Inc
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Texas Instruments Inc
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/442—Shapes or dispositions of multiple leadframes in a single chip
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07234—Using a reflow oven
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/29—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/726—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/791—Package configurations characterised by the relative positions of pads or connectors relative to package parts of direct-bonded pads
    • H10W90/796—Package configurations characterised by the relative positions of pads or connectors relative to package parts of direct-bonded pads between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
CN201480003922.6A 2013-01-09 2014-01-09 集成电路模块 Active CN104956782B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/737,697 2013-01-09
US13/737,697 US8884414B2 (en) 2013-01-09 2013-01-09 Integrated circuit module with dual leadframe
PCT/US2014/010860 WO2014110247A1 (en) 2013-01-09 2014-01-09 Integrated circuit module

Publications (2)

Publication Number Publication Date
CN104956782A CN104956782A (zh) 2015-09-30
CN104956782B true CN104956782B (zh) 2018-05-11

Family

ID=51060383

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480003922.6A Active CN104956782B (zh) 2013-01-09 2014-01-09 集成电路模块

Country Status (4)

Country Link
US (2) US8884414B2 (https=)
JP (1) JP6261055B2 (https=)
CN (1) CN104956782B (https=)
WO (1) WO2014110247A1 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105895606A (zh) * 2014-12-29 2016-08-24 飞思卡尔半导体公司 具有带状线的封装半导体器件
JP1537979S (https=) * 2015-04-20 2015-11-16
JP1537980S (https=) * 2015-04-20 2015-11-16
US9922904B2 (en) * 2015-05-26 2018-03-20 Infineon Technologies Ag Semiconductor device including lead frames with downset
US10381293B2 (en) * 2016-01-21 2019-08-13 Texas Instruments Incorporated Integrated circuit package having an IC die between top and bottom leadframes
US10134660B2 (en) * 2017-03-23 2018-11-20 Nxp Usa, Inc. Semiconductor device having corrugated leads and method for forming
US10636729B2 (en) 2017-06-19 2020-04-28 Texas Instruments Incorporated Integrated circuit package with pre-wetted contact sidewall surfaces
US10896869B2 (en) * 2018-01-12 2021-01-19 Amkor Technology Singapore Holding Pte. Ltd. Method of manufacturing a semiconductor device
US10867894B2 (en) * 2018-10-11 2020-12-15 Asahi Kasei Microdevices Corporation Semiconductor element including encapsulated lead frames
DE102019118174B3 (de) * 2019-07-04 2020-11-26 Infineon Technologies Ag Verarbeitung von einem oder mehreren trägerkörpern und elektronischen komponenten durch mehrfache ausrichtung
US11158567B2 (en) 2019-08-09 2021-10-26 Texas Instruments Incorporated Package with stacked power stage and integrated control die
US11715679B2 (en) 2019-10-09 2023-08-01 Texas Instruments Incorporated Power stage package including flexible circuit and stacked die
US11302615B2 (en) 2019-12-30 2022-04-12 Texas Instruments Incorporated Semiconductor package with isolated heat spreader
US11264310B2 (en) 2020-06-04 2022-03-01 Texas Instruments Incorporated Spring bar leadframe, method and packaged electronic device with zero draft angle
US11450593B2 (en) * 2020-07-02 2022-09-20 Infineon Technologies Ag Spacer frame for semiconductor packages
US11611170B2 (en) 2021-03-23 2023-03-21 Amkor Technology Singapore Holding Pte. Ltd Semiconductor devices having exposed clip top sides and methods of manufacturing semiconductor devices
US11848244B2 (en) * 2021-09-30 2023-12-19 Texas Instruments Incorporated Leaded wafer chip scale packages
US12424523B2 (en) * 2021-12-20 2025-09-23 Texas Instruments Incorporated Leadframe strip with complimentary unit design

Citations (6)

* Cited by examiner, † Cited by third party
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US5686698A (en) * 1994-06-30 1997-11-11 Motorola, Inc. Package for electrical components having a molded structure with a port extending into the molded structure
US5789806A (en) * 1995-08-02 1998-08-04 National Semiconductor Corporation Leadframe including bendable support arms for downsetting a die attach pad
US6268646B1 (en) * 1996-08-27 2001-07-31 Hitachi Cable, Ltd. Lead frame for lead on chip
CN1334603A (zh) * 2000-06-28 2002-02-06 国际商业机器公司 集成电路的平面化塑料封装模块
CN101326636A (zh) * 2005-12-09 2008-12-17 飞兆半导体公司 用于组装顶部与底部暴露的封装半导体的装置和方法
CN102403298A (zh) * 2010-09-07 2012-04-04 飞思卡尔半导体公司 用于半导体器件的引线框

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US5229329A (en) 1991-02-28 1993-07-20 Texas Instruments, Incorporated Method of manufacturing insulated lead frame for integrated circuits
JP3773855B2 (ja) * 2001-11-12 2006-05-10 三洋電機株式会社 リードフレーム
JP2004079760A (ja) * 2002-08-19 2004-03-11 Nec Electronics Corp 半導体装置及びその組立方法
JP4100332B2 (ja) * 2003-11-12 2008-06-11 株式会社デンソー 電子装置およびその製造方法
US7285849B2 (en) * 2005-11-18 2007-10-23 Fairchild Semiconductor Corporation Semiconductor die package using leadframe and clip and method of manufacturing
US20070290303A1 (en) 2006-06-07 2007-12-20 Texas Instruments Deutschland Gmbh Dual leadframe semiconductor device package
US20080036078A1 (en) 2006-08-14 2008-02-14 Ciclon Semiconductor Device Corp. Wirebond-less semiconductor package
US20090057855A1 (en) * 2007-08-30 2009-03-05 Maria Clemens Quinones Semiconductor die package including stand off structures
US8049312B2 (en) 2009-01-12 2011-11-01 Texas Instruments Incorporated Semiconductor device package and method of assembly thereof
US8354303B2 (en) 2009-09-29 2013-01-15 Texas Instruments Incorporated Thermally enhanced low parasitic power semiconductor package
US8222716B2 (en) * 2009-10-16 2012-07-17 National Semiconductor Corporation Multiple leadframe package
US8203199B2 (en) 2009-12-10 2012-06-19 National Semiconductor Corporation Tie bar and mold cavity bar arrangements for multiple leadframe stack package
US8304887B2 (en) 2009-12-10 2012-11-06 Texas Instruments Incorporated Module package with embedded substrate and leadframe
WO2011155165A1 (ja) * 2010-06-11 2011-12-15 パナソニック株式会社 樹脂封止型半導体装置及びその製造方法
JP5410465B2 (ja) * 2011-02-24 2014-02-05 ローム株式会社 半導体装置および半導体装置の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5686698A (en) * 1994-06-30 1997-11-11 Motorola, Inc. Package for electrical components having a molded structure with a port extending into the molded structure
US5789806A (en) * 1995-08-02 1998-08-04 National Semiconductor Corporation Leadframe including bendable support arms for downsetting a die attach pad
US6268646B1 (en) * 1996-08-27 2001-07-31 Hitachi Cable, Ltd. Lead frame for lead on chip
CN1334603A (zh) * 2000-06-28 2002-02-06 国际商业机器公司 集成电路的平面化塑料封装模块
CN101326636A (zh) * 2005-12-09 2008-12-17 飞兆半导体公司 用于组装顶部与底部暴露的封装半导体的装置和方法
CN102403298A (zh) * 2010-09-07 2012-04-04 飞思卡尔半导体公司 用于半导体器件的引线框

Also Published As

Publication number Publication date
US9029194B2 (en) 2015-05-12
JP6261055B2 (ja) 2018-01-17
CN104956782A (zh) 2015-09-30
US20140242755A1 (en) 2014-08-28
WO2014110247A1 (en) 2014-07-17
US20140191381A1 (en) 2014-07-10
US8884414B2 (en) 2014-11-11
JP2016503240A (ja) 2016-02-01

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