CN104810153B - 多层陶瓷电子组件和其上安装有多层陶瓷电子组件的板 - Google Patents

多层陶瓷电子组件和其上安装有多层陶瓷电子组件的板 Download PDF

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Publication number
CN104810153B
CN104810153B CN201410185853.7A CN201410185853A CN104810153B CN 104810153 B CN104810153 B CN 104810153B CN 201410185853 A CN201410185853 A CN 201410185853A CN 104810153 B CN104810153 B CN 104810153B
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CN
China
Prior art keywords
electrode
main body
ceramic
external
multilayer ceramic
Prior art date
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Active
Application number
CN201410185853.7A
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English (en)
Chinese (zh)
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CN104810153A (zh
Inventor
朴祥秀
朴珉哲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electro Mechanics Co Ltd
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Samsung Electro Mechanics Co Ltd
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Publication of CN104810153A publication Critical patent/CN104810153A/zh
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
CN201410185853.7A 2014-01-27 2014-05-05 多层陶瓷电子组件和其上安装有多层陶瓷电子组件的板 Active CN104810153B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020140009719A KR101539884B1 (ko) 2014-01-27 2014-01-27 적층 세라믹 전자 부품 및 그 실장 기판
KR10-2014-0009719 2014-01-27

Publications (2)

Publication Number Publication Date
CN104810153A CN104810153A (zh) 2015-07-29
CN104810153B true CN104810153B (zh) 2018-01-16

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CN201410185853.7A Active CN104810153B (zh) 2014-01-27 2014-05-05 多层陶瓷电子组件和其上安装有多层陶瓷电子组件的板

Country Status (2)

Country Link
KR (1) KR101539884B1 (ko)
CN (1) CN104810153B (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6503943B2 (ja) 2015-07-10 2019-04-24 株式会社村田製作所 複合電子部品および抵抗素子
KR102550165B1 (ko) * 2017-12-26 2023-07-03 삼성전기주식회사 적층형 전자 부품
CN108389912B (zh) * 2018-01-12 2020-02-28 武汉高芯科技有限公司 一种非制冷红外探测器芯片及其封装结构和制备方法
KR102473402B1 (ko) 2018-03-12 2022-12-02 삼성전기주식회사 전자 부품
KR102121579B1 (ko) 2018-10-02 2020-06-10 삼성전기주식회사 적층 세라믹 전자부품
KR102500107B1 (ko) * 2018-10-02 2023-02-15 삼성전기주식회사 적층 세라믹 전자부품

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1506988A (zh) * 2002-10-08 2004-06-23 Tdk��ʽ���� 电子元件与中间基板
CN103443886A (zh) * 2011-03-25 2013-12-11 株式会社村田制作所 电子部件

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4720481B2 (ja) * 2005-04-21 2011-07-13 株式会社デンソー 電子装置の製造方法
JP4561754B2 (ja) * 2007-01-30 2010-10-13 Ｔｄｋ株式会社 積層コンデンサ
KR20100048044A (ko) * 2008-10-30 2010-05-11 조인셋 주식회사 표면 실장 가능한 복합 세라믹 칩 부품
JP5655818B2 (ja) * 2012-06-12 2015-01-21 株式会社村田製作所 チップ部品構造体

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1506988A (zh) * 2002-10-08 2004-06-23 Tdk��ʽ���� 电子元件与中间基板
CN103443886A (zh) * 2011-03-25 2013-12-11 株式会社村田制作所 电子部件

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CN104810153A (zh) 2015-07-29
KR101539884B1 (ko) 2015-07-27

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