CN104810153B - Multilayer ceramic electronic component and the plate for being provided with multilayer ceramic electronic component thereon - Google Patents
Multilayer ceramic electronic component and the plate for being provided with multilayer ceramic electronic component thereon Download PDFInfo
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- CN104810153B CN104810153B CN201410185853.7A CN201410185853A CN104810153B CN 104810153 B CN104810153 B CN 104810153B CN 201410185853 A CN201410185853 A CN 201410185853A CN 104810153 B CN104810153 B CN 104810153B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The plate of multilayer ceramic electronic component is installed the present invention relates to a kind of multilayer ceramic electronic component and thereon, the multilayer ceramic electronic component can include：Multilayer ceramic capacitor, including the first ceramic main body, electrode and the first and second external electrodes in multiple first and second；Ceramic chip, including the second ceramic main body, electrode in electrode and the 4th in 3rd, first and second connection terminals and the first and second external terminals, second ceramic main body forms and is arranged at the installation surface of multilayer ceramic capacitor by stacking multiple ceramic layers, first and second connection terminals extend to some parts of the upper surface of ceramic main body from the side surface of the second ceramic main body respectively, and it is connected respectively to the first and second external electrodes of multilayer ceramic capacitor, first and second external terminals are separately positioned on the end of ceramic main body, and it is connected respectively to the part of the exposure of electrode in electrode and the 4th in the 3rd.
Description
This application claims in Korea Spro 10-2014-0009719 for being submitted to Korean Intellectual Property Office on January 27th, 2014
This is incorporated herein by reference in the rights and interests of state's patent application, the disclosure of the Korean application.
Technical field
This disclosure relates to a kind of multilayer ceramic electronic component and a kind of plate for being provided with multilayer ceramic electronic component thereon.
Background technology
Multilayer ceramic capacitor (multilayer sheet type electronic building brick) is mounted in such as display device (for example, liquid crystal display
(LCD), plasma display (PDP) etc.), computer, personal digital assistant (PDA), a variety of electronics of cell phone etc.
Chip capacitor on the circuit board of product, for charge or discharge.
Multilayer ceramic capacitor (MLCC) may be used as respectively due to the advantages of such as size is small, electric capacity is high and is easily installed
The component of kind electronic installation.
Multilayer ceramic capacitor can include multiple dielectric layers and be alternately stacked between dielectric layer and have different
The interior electrode of polarity.
Because dielectric layer has piezoelectric property and electroluminescent shrinkage character, so when direct current (DC) or exchange (AC) voltage are applied
When being added to multilayer ceramic capacitor, there is the phenomenon of piezoelectricity between interior electrode, so as to produce vibration.
These vibrations can be transferred to by the external electrode of multilayer ceramic capacitor is provided with multilayer ceramic capacitor thereon
Circuit board so that whole circuit board plays a part of acoustic radiating surface, so as to produce rattle (noise).
The audible frequency that rattle can correspond in the range of 20Hz to 20,000Hz, so as to cause hearer
It is uncomfortable.The rattle for causing hearer uncomfortable can be referred to as acoustic noise.
Specifically, in the case where electronic installation (such as smart phone etc.) has voice communication function, urgently
Need to reduce this acoustic noise.
The content of the invention
Some embodiments of the present disclosure can provide a kind of multilayer ceramic capacitor for the appearance that can reduce acoustic noise.
According to the one side of the disclosure, a kind of multilayer ceramic electronic component can include：Multilayer ceramic capacitor, including the
One ceramic main body, electrode and the second inner electrode and the first external electrode and the second external electrode in multiple first, the first ceramic main body
In be stacked with multiple dielectric layers, electrode and the second inner electrode are alternately sudden and violent by the side surface of the first ceramic main body in multiple first
Dew, makes each dielectric layer be arranged in first between electrode and the second inner electrode, the first external electrode and the second external electrode respectively from
The side surface of first ceramic main body extends to the part of the installation surface of the first ceramic main body, and is connected respectively to electrode in first
And the second inner electrode；And ceramic chip, including the second ceramic main body, electrode, the first connection end in electrode and the 4th in the 3rd
Son and second connection end and the first external terminal and the second external terminal, the second ceramic main body is by stacking multiple ceramic layers come shape
Into and be arranged at the installation surface of multilayer ceramic capacitor, electrode is arranged on the second ceramic main body in electrode and the 4th in the 3rd
In, with sudden and violent by a side surface of the second ceramic main body and an end surfaces and another side surface and another end surfaces respectively
Dew, and each ceramic layer is arranged in the 3rd in electrode and the 4th between electrode, the first connection terminal and second connection end
The part of the upper surface of the second ceramic main body is extended to from the side surface of the second ceramic main body respectively, and is connected respectively to multilayer
It is main that the first external electrode and the second external electrode of ceramic capacitor, the first external terminal and the second external terminal are separately positioned on the second ceramics
On the end of body, and it is connected respectively to the part of the exposure of electrode in electrode and the 4th in the 3rd.
The first external electrode and the second external electrode of multilayer ceramic capacitor and the first connection terminal of ceramic chip and
Two connection terminals, which can have, is separately positioned on the first conductive adhesive on the first connection terminal and second connection end and the
Two conductive adhesives.
The first external electrode and the second external electrode of multilayer ceramic capacitor can be from two side surfaces of the first ceramic main body
Extend respectively to the part of the upper surface of the first ceramic main body.
The first external electrode and the second external electrode of multilayer ceramic capacitor can be separately positioned on the two of the first ceramic main body
On the core of individual side surface.
Multilayer ceramic capacitor can include the overlying being separately positioned in the upper and lower surface of the first ceramic main body
Cap rock and lower caldding layer.
The both ends of the second ceramic main body can be completely covered respectively for the first external terminal and the second external terminal of ceramic chip.
The first connection terminal and second connection end of ceramic chip and the first external terminal and the second external terminal can divide
There is not include the double-decker of inner conductive resin bed and outside coating layer.
The first external electrode and the second external electrode of multilayer ceramic capacitor can be formed by electroconductive paste, the first connection terminal and
The outside coating layer of two connection terminals and the first external terminal and the second external terminal can have interior nickel (Ni) coating layer respectively
With the double-decker of golden (Au) coating layer in outside.
The first external electrode and the second external electrode of multilayer ceramic capacitor can include respectively interior nickel (Ni) coating layer and
Outside tin (Sn) coating layer, the first connection terminal and second connection end of ceramic chip and the first external terminal and the second outer end
The outside coating layer of son can have the double-decker for including interior nickel (Ni) coating layer and outside tin (Sn) coating layer respectively.
According to some embodiments of the present disclosure, a kind of plate for being provided with multilayer ceramic electronic component thereon can include：Base
Plate, there is the first electrode pad and second electrode pad being arranged on substrate；And multilayer ceramic electronic component, it is arranged on base
On plate, wherein, multilayer ceramic electronic component includes multilayer ceramic capacitor and ceramic chip, and multilayer ceramic capacitor includes first
Ceramic main body, electrode and the second inner electrode and the first external electrode and the second external electrode in multiple first, in the first ceramic main body
It is stacked with multiple dielectric layers, electrode and the second inner electrode are alternately sudden and violent by the side surface of the first ceramic main body in multiple first
Dew, makes each dielectric layer be arranged in first between electrode and the second inner electrode, the first external electrode and the second external electrode respectively from
The side surface of first ceramic main body extends to the part of the installation surface of the first ceramic main body, and is connected respectively to electrode in first
And the second inner electrode, ceramic chip include the second ceramic main body, electrode in electrode and the 4th in the 3rd, the first connection terminal and the
Two connection terminals and the first external terminal and the second external terminal, the second ceramic main body form simultaneously quilt by stacking multiple ceramic layers
It is arranged at the installation surface of multilayer ceramic capacitor, electrode is arranged in the second ceramic main body in electrode and the 4th in the 3rd, with
Exposed respectively by a side surface of the second ceramic main body and an end surfaces and other side surfaces and other end surfaces, and
Each ceramic layer is arranged in the 3rd in electrode and the 4th between electrode, the first connection terminal and second connection end respectively from
The side surface of second ceramic main body extends to the part of the upper surface of the second ceramic main body, and is connected respectively to multi-layer ceramics electricity
The first external electrode and the second external electrode of container, the first external terminal and the second external terminal are separately positioned on the end of the second ceramic main body
In portion, and the part of the exposure of electrode in electrode and the 4th in the 3rd is connected respectively to, the first external terminal and the second external terminal
It is separately mounted on first electrode pad and second electrode pad.
Brief description of the drawings
By the detailed description carried out below in conjunction with the accompanying drawings, above and other aspect, feature and the further advantage of the disclosure
It will be more clearly understood, in the accompanying drawings：
Fig. 1 is the perspective view for the multilayer ceramic electronic component for showing the exemplary embodiment according to the disclosure；
Fig. 2 is the decomposition diagram of Fig. 1 multilayer ceramic electronic component, wherein multilayer ceramic electronic component is shown as point
For multilayer ceramic capacitor and ceramic chip；
Fig. 3 is point of the dielectric layer and interior electrode that show the multilayer ceramic capacitor in Fig. 1 multilayer ceramic electronic component
Solve perspective view；
Fig. 4 is the exploded perspective of the ceramic layer and interior electrode that show the ceramic chip in Fig. 1 multilayer ceramic electronic component
Figure；
Fig. 5 A to Fig. 5 C are the technique for showing the manufacture multilayer ceramic electronic component according to the exemplary embodiment of the disclosure
Perspective view；
Fig. 6 A and Fig. 6 B are to show the manufacture multilayer ceramic electronic component according to the another exemplary embodiment of the disclosure
The perspective view of technique；
Fig. 7 A and Fig. 7 B are to show the manufacture multilayer ceramic electronic component according to the another exemplary embodiment of the disclosure
The perspective view of technique；
Fig. 8 is that the Fig. 1 intercepted along its length multilayer ceramic electronic component is mounted form sectional view onboard.
Embodiment
Now, the exemplary embodiment of the disclosure is described in detail with reference to the accompanying drawings.
However, the disclosure can be come for example, and should not be construed as being limited to here in many different forms
The specific embodiment of elaboration.Conversely, there is provided these embodiments so that the disclosure will be thoroughly and completely, and will be to ability
Field technique personnel fully pass on the scope of the present disclosure.
In the accompanying drawings, for the sake of clarity, the shape and size of element can be exaggerated, identical label will be used to refer to all the time
Show same or analogous element.
In order to which the exemplary embodiment of the disclosure is explicitly described, hexahedral direction will be defined.Width represents outer
The direction that electrode is formed along it, length direction represent the direction intersected with width, and thickness direction represents dielectric layer stack institute
The direction (for example, stacking direction) on edge.
In addition, in an exemplary embodiment of the disclosure, for the ease of explaining, the upper and lower surface table of ceramic main body
Show ceramic main body along its thickness direction surfaces opposite to each other, two side surfaces of ceramic main body represent the width along ceramic main body
Direction surfaces opposite to each other are spent, wherein, lower surface is arranged to installation surface.
Multilayer ceramic electronic component
Fig. 1 is the perspective view for the multilayer ceramic electronic component for showing the exemplary embodiment according to the disclosure；Fig. 2 is Fig. 1
Multilayer ceramic electronic component decomposition diagram, wherein multilayer ceramic electronic component is shown as to be divided into multilayer ceramic capacitor
And ceramic chip；Fig. 3 is the dielectric layer for showing the multilayer ceramic capacitor in Fig. 1 multilayer ceramic electronic component and interior electrode
Decomposition diagram；Fig. 4 is that the decomposition of the ceramic layer and interior electrode that show the ceramic chip in Fig. 1 multilayer ceramic electronic component is saturating
View.
Referring to figs. 1 to Fig. 4, multilayer can be included according to the multilayer ceramic electronic component of the exemplary embodiment of the disclosure and made pottery
Porcelain condenser 100 and ceramic chip 200.
Here, the first connection terminal 233 and second connection end 234 for the ceramic chip 200 that will be described below can be with
With the first conductive adhesive 241 and the second conductive adhesive 242 being separately positioned on its upper surface, to contact respectively and attached
The first external electrode 131 of multilayer ceramic capacitor 100 and the installation surface of the second external electrode 132.
Therefore, multilayer ceramic capacitor 100 and ceramic chip 200 can be led by the first conductive adhesive 241 and second
Electric adhesive layer 242 adheres to mechanically to each otherly in the state of they are electrically connected to each other.
Multilayer ceramic capacitor
Multilayer ceramic capacitor 100 can include the first ceramic main body 110, have electrode 121 and second in multiple first
Interior electrode 122 has active layer and extends respectively to the first ceramic main body 110 from two side surfaces of the first ceramic main body 110
Installation surface some parts of the first external electrode 131 and the second external electrode 132.
In an exemplary embodiment of the disclosure, the first external electrode 131 and the second external electrode 132 can be only respectively formed at
On two side surfaces of the first ceramic main body 110 and some parts of installation surface, so as to be installed by multilayer ceramic capacitor
When onboard, the area for contacting the solder of external electrode substantially reduces, so as to significantly reduce the height of solder.
Then first ceramic main body 110 can be sintered to be formed by the way that multiple dielectric layers 111 are overlie one another to it.
What the shape and size of the first ceramic main body 110 and the quantity of the dielectric layer 111 of stacking were not limited to that Fig. 1 shows into Fig. 4 shows
Shape, the size and number of example.
In addition, the multiple dielectric layers 111 for forming the first ceramic main body 110 may be at sintering state and integral with one another
Change, so as to easily distinguish in the case of without using SEM (SEM) between adjacent dielectric layer 111
Border.
First ceramic main body 110 can include helping to be formed the electric capacity of capacitor and including interior electrode have active layer,
And be respectively formed as in the upper and lower surface for have active layer upper rim and lower edge portion upper caldding layer and
Lower caldding layer.
There is active layer to be formed by the following method, i.e. repeatedly to stack electric in electrode 121 and second in multiple first
Pole 122, so that it alternately passes through two side surfaces exposure of the first ceramic main body 110, and dielectric layer 111 is set to be located at first
Between interior electrode 121 and the second inner electrode 122.
Here, the thickness of dielectric layer 111 can arbitrarily change according to the capacitor design of multilayer ceramic capacitor 100.
For example, dielectric layer 111 can have 0.5 μm to 5.00 μm of thickness after sintering.However, disclosure not limited to this.
In addition, dielectric layer 111 can include the ceramic powders with high k, for example, barium titanate (BaTiO3) class powder or titanium
Sour strontium (SrTiO3) class powder.However, disclosure not limited to this.
Upper caldding layer and lower caldding layer can be formed by the material identical material with dielectric layer 111, and except them
Do not include to have outside interior electrode and constructed with the construction identical of dielectric layer 111.
Upper caldding layer and lower caldding layer can pass through the through-thickness heap in the upper and lower surface for have active layer respectively
Single dielectric layer or two or more dielectric layers are folded to be formed, and can be basically used for preventing due to physically or chemically should
Power and damage electrode 121 and the second inner electrode 122 in first.
Electrode 121 and the second inner electrode 122 (electrode with opposed polarity) can be by dielectric layers 111 in first
Electroconductive paste comprising conducting metal is printed to predetermined thickness to be formed, the can be passed through along the direction that dielectric layer 111 stacks
Two side surfaces of one ceramic main body alternately expose, and can be by the dielectric layer 111 that is disposed there between and each other
Electric insulation.
In addition, electrode 121 and the second inner electrode 122 can include capacitive part 121a and 122a respectively and lead in first
Cross two side surfaces of the first ceramic main body 110 from capacitive part 121a and 122a the extension 121b alternately exposed and
122b, and can be electrically connected respectively to be formed in two sides of the first ceramic main body 110 by extension 121b and 122b
The first external electrode 131 and the second external electrode 132 on surface.
Therefore, when voltage is applied to the first external electrode 131 and the second external electrode 132, electric charge can be facing with each other
First in assemble between electrode 121 and the second inner electrode 122.In this case, the electric capacity of multilayer ceramic capacitor 100 can
With proportional to the area in region that electrode 121 in first in having active layer and the second inner electrode 122 are stacked on top of each other.
The thickness of electrode 121 and the second inner electrode 122 can be determined based on their use in first.For example, it is contemplated that
To the size of the first ceramic main body 110, the thickness of electrode 121 and the second inner electrode 122 can be defined as at 0.2 μm extremely in first
In the range of 1.0 μm.However, disclosure not limited to this.
In addition, can be included in the conducting metal formed in first in the electroconductive paste of electrode 121 and the second inner electrode 122
Nickel (Ni), copper (Cu), palladium (Pd) or their alloy.However, disclosure not limited to this.
In addition, the method for printing electroconductive paste, can use silk screen print method or woodburytype etc..However, this public affairs
Open not limited to this.
The first external electrode 131 and the second external electrode 132 can be formed by the electroconductive paste comprising conducting metal.Here, it is conductive
Metal can be nickel (Ni), copper (Cu), palladium (Pd), golden (Au) or their alloy.However, disclosure not limited to this.
In addition, the first external electrode 131 and the second external electrode 132 can be respectively formed at two of the first ceramic main body 110
On the core of side surface.
Here, the first external electrode 131 and the second external electrode 132 can be by by the conducting pastes comprising glass to first
Ceramic main body 110 simultaneously sinters electroconductive paste to be formed, without coating layer.
In addition, the first external electrode 131 and the second external electrode 132 can be respectively from two side tables of the first ceramic main body 110
Face extends to some parts of the upper surface of the first ceramic main body 110.Therefore, multilayer ceramic capacitor 100 can have vertical
Symmetrical structure, so as to which when multilayer ceramic capacitor 100 is installed on the board, vertical directivity can be eliminated.
The first external electrode 131 and the second external electrode 132 can be used for absorbing outside mechanical stress etc., and prevent in the first pottery
Occurs the damage such as crackle in porcelain main body 110 and first in electrode 121 and the second inner electrode 122.
Ceramic chip
Reference picture 4 and Fig. 5 A to Fig. 5 C, it can be included according to the ceramic chip 200 of the exemplary embodiment of the disclosure：
Second ceramic main body 210, formed by stacking multiple ceramic layers 211；Electrode 222 in electrode 221 and the 4th, is formed in 3rd
In second ceramic main body 210, to pass through the side surface and an end surfaces and other sides of the second ceramic main body 210 respectively
Surface and the exposure of other end surfaces, each ceramic layer 211 are arranged in the 3rd in electrode 221 and the 4th between electrode 222；First
Connection terminal 233 and second connection end 234, extend to the second ceramics from two side surfaces of the second ceramic main body 210 respectively
The some parts of the upper surface of main body 210, and it is connected respectively to the first external electrode 131 and second of multilayer ceramic capacitor 100
External electrode 132；First external terminal 231 and the second external terminal 232, are respectively formed on the both ends of the second ceramic main body 210, and point
The part of the exposure of electrode 222 in electrode 221 and the 4th in the 3rd is not connected to.
In addition, electrode 222 can include the both ends table by the second ceramic main body 210 in electrode 221 and the 4th in the 3rd
Capacitive part 221a and 222a that face alternately exposes and respectively by the side surface of the second ceramic main body 210 from capacitive part
The extension 221b and 222b that 221a and 222a alternately expose, electrode 222 can be distinguished in electrode 221 and the 4th in the 3rd
First external terminal 231 and the second external terminal 232 are electrically connected to by the part of capacitive part 221a and 222a exposure, and can
So that to be formed on two side surfaces of the second ceramic main body 210 first is electrically connected to by extension 221b and 222b respectively
Connection terminal 233 and second connection end 234.
In addition, the two of the second ceramic main body 210 can be completely covered respectively for the first external terminal 231 and the second external terminal 232
End.
When the ceramic chip 200 with the construction is mounted onboard, it is attached on the upper surface of ceramic chip 200
Multilayer ceramic capacitor 100 may be at the state that the surface of the first external electrode 131 and the second external electrode 132 is not plated.Cause
This, when ceramic chip 200 is installed on the board, when the amount of solder thereon is relatively more, be also possible to prevent solder along
The phenomenon that the first external electrode 131 and the second external electrode 132 of multilayer ceramic capacitor 100 rise, to prevent piezoelectric stress from passing through
The first external electrode 131 and the second external electrode 132 are directly transferred to plate from multilayer ceramic capacitor 100, so as to further change
Kind acoustic noise reducing effect.
Modified example
Fig. 5 A to Fig. 5 C are the manufacturing process for the multilayer ceramic electronic component for showing the exemplary embodiment according to the disclosure
Perspective view.
The first external electrode 131 and the second external electrode 132 of multilayer ceramic capacitor 100 can have coating layer 133 respectively
With 134.
In addition, the first connection terminal 233 and second connection end 234 of ceramic chip 200 and the He of the first external terminal 231
Second external terminal 232 can have the double-decker for including inner conductive resin bed and outside coating layer respectively.
Here, the coating layer of multilayer ceramic capacitor 100 and ceramic chip 200 can have respectively includes interior nickel (Ni)
The double-decker of coating layer and outside tin (Sn) coating layer.
Reference picture 5A, multilayer ceramic capacitor 100 can be initially mounted on ceramic chip 200.Here, ceramic chip
200 the first connection terminal 233 and second connection end son 234 and the first external terminal 231 and the second external terminal 232 may be at
The state that conductive resin layer is not plated.
Here, the first connection terminal 233 of ceramic chip 200 and second connection end 234 can have respectively is arranged on
The first conductive adhesive 241 and the second conductive adhesive 242 on its upper surface, so as to contact respectively and be attached to multi-layer ceramics
The first external electrode 131 of capacitor 100 and the installation surface of the second external electrode 132.
Then, reference picture 5C, can be then to the first external electrode 131 and the second external electrode of multilayer ceramic capacitor 100
The surface of the exposure on the surface of 132 exposure, the first connection terminal 233 of ceramic chip 200 and second connection end 234 and
The surface of the exposure of first external terminal 231 of ceramic chip 200 and the conductive resin layer of the second external terminal 232 perform nickel plating and
Tin plating.
Therefore, the coating layer 133 and 134 for having interior nickel coating layer and outside tin coating layer can be respectively formed at multilayer
On the first external electrode and the second external electrode of ceramic capacitor 100, and with interior nickel coating layer and outside tin coating layer
Coating layer 251 and 254 can be respectively formed at the second connection end of the first connection terminal 233 234 and the of ceramic chip 200
On one external terminal 231 and the second external terminal 232.
Fig. 6 A and Fig. 6 B are the manufactures for the multilayer ceramic electronic component for showing the another exemplary embodiment according to the disclosure
The perspective view of technique.
Reference picture 6A and Fig. 6 B, have and be alternately formed in the in one surface the 3rd electricity in electrode 221 and the 4th
Multiple ceramic layers 211 of pole 222 can be stacked, extrude and be cut into predetermined size, to prepare the second ceramic main body
210。
It is then possible to electroconductive resin muddle to be layed onto to two side surfaces and both ends of the second ceramic main body 210, with formed by
The first connection terminal 233 and the second connection end son 234 and the first external terminal 231 and the second external terminal that conductive resin layer is formed
232.Electroconductive resin paste can include conducting metal, heat reactive resin etc..
It is then possible to nickel (Ni) plating and gold are performed to the first conductive resin layer 231a and the second conductive resin layer 232a
(Au) plating, to complete the ceramic chip 200 with coating layer 261 to 264.
It is then possible to using being separately positioned on leading on the upper surface of the first connection terminal 233 and second connection end 234
Multilayer ceramic capacitor 100 is arranged on ceramic chip 200 by electric adhesive layer 241 and 242.
Here, the first external electrode 131 of multilayer ceramic capacitor 100 and the second external electrode 132 may be at they not by
The state of plating.
Fig. 7 A and Fig. 7 B are the manufactures for the multilayer ceramic electronic component for showing the another exemplary embodiment according to the disclosure
The perspective view of technique.
Reference picture 7A, the first external electrode and the second external electrode of multilayer ceramic capacitor 100 can be plated with nickel with respectively
Form nickel coating layer 135 and 136.In addition, the first connection terminal of ceramic chip 200, second connection end are sub, the first external terminal and
Second external terminal can be plated with nickel to form nickel coating layer 271 to 274.
Here, the nickel coating layer 273 and 274 of the first connection terminal of ceramic chip 200 and second connection end can have
Have the first conductive adhesive 241 and the second conductive adhesive 242 being separately positioned on its upper surface, so as to respectively contact and it is attached
The installation surface of the first external electrode of multilayer ceramic capacitor 100 and the coating layer 135 and 136 of the second external electrode.
Then, reference picture 7B, multilayer ceramic capacitor 100 can utilize the first conductive adhesive 241 and second conductive viscous
Layer 242 is closed to be arranged on ceramic chip 200.
Then, the nickel coating layer 135 and 136 of the first external electrode of multilayer ceramic capacitor 100 and the second external electrode is sudden and violent
The surface of the exposure of the surface of dew and the nickel coating layer 271 to 274 of ceramic chip 200 can be plated with tin, to exist respectively
Tin coating layer 133 and 134 is formed on the first external electrode and the second external electrode of multilayer ceramic capacitor 100, and is being made pottery respectively
Tin coating layer 251 is formed on first connection terminal of porcelain core piece 200, second connection end, the first external terminal and the second external terminal
To 254.
The plate of multilayer ceramic electronic component is installed thereon
Fig. 8 is that the multilayer ceramic electronic component for the Fig. 1 for showing to intercept along its length is mounted cuing open for form onboard
View.
Reference picture 8, can be with according to the plate for being provided with multilayer ceramic electronic component thereon of the exemplary embodiment of the disclosure
Including：Substrate 310, there is the multilayer ceramic electronic component being horizontally mounted at thereon；First electrode pad 311 and second electrode
Pad 312, formed on substrate 310 with separated from one another.
Here, multilayer ceramic electronic component can be arranged on the bottom of multilayer ceramic electronic component in its ceramic chip 200
And the first external terminal 231 and the second external terminal 232 respectively on first electrode pad 311 and second electrode pad 312 with
Adhere in the state of being contacted respectively with first electrode pad 311 and second electrode pad 312 and be electrically connected to plate 310.
Multilayer ceramic electronic component is applied a voltage in the state of being arranged in multilayer ceramic electronic component on plate 310
When, it is possible to create acoustic noise.
Here, the size of first electrode pad 311 and second electrode pad 312 can be used to determine respectively by outside first
The external terminal 232 of terminal 231 and second is connected to the index of the amount of the solder of first electrode pad 311 and second electrode pad 312,
And the size of acoustic noise can be controlled based on the amount of solder.
According to the exemplary embodiment of the disclosure, can be mitigated by hard ceramic chip due to multilayer ceramic capacitor
Stress caused by piezoelectric property or vibration, to reduce the size of caused acoustic noise in the circuit board.
, will be obvious for those skilled in the art although having been described above that exemplary embodiment has shown and described
It is that, in the case where not departing from spirit and scope of the present disclosure as defined by the appended claims, can modify and change.
Claims (18)
1. a kind of multilayer ceramic electronic component, the multilayer ceramic electronic component includes：
Multilayer ceramic capacitor, including the first ceramic main body, electrode and the second inner electrode and the first external electrode in multiple first
And the second external electrode, it is stacked with multiple dielectric layers in the first ceramic main body, electrode and the second inner electrode pass through in multiple first
The side surface of one ceramic main body alternately exposes, and each dielectric layer is arranged in first between electrode and the second inner electrode, the
One external electrode and the second external electrode extend to the installation surface of the first ceramic main body from the side surface of the first ceramic main body respectively
Some parts, and it is connected respectively to electrode and the second inner electrode in first；And
Ceramic chip, including the second ceramic main body, electrode, the first connection terminal and second connection end in electrode and the 4th in the 3rd
Son and the first external terminal and the second external terminal, the second ceramic main body are more to be formed and be arranged at by stacking multiple ceramic layers
The installation surface of layer ceramic capacitor, electrode is arranged in the second ceramic main body in electrode and the 4th in the 3rd, to pass through respectively
One side surface of the second ceramic main body and an end surfaces and another side surface and the exposure of another end surfaces, and make each pottery
Enamel coating is arranged in the 3rd in electrode and the 4th between electrode, and the first connection terminal and second connection end are respectively from the second ceramics
The side surface of main body extends to some parts of the upper surface of the second ceramic main body, and is connected respectively to multilayer ceramic capacitor
The first external electrode and the second external electrode, the first external terminal and the second external terminal are separately positioned on the end of the second ceramic main body
On, and it is connected respectively to the part of the exposure of electrode in electrode and the 4th in the 3rd.
2. multilayer ceramic electronic component as claimed in claim 1, wherein, the first external electrode of multilayer ceramic capacitor and second
The first connection terminal and second connection end of external electrode and ceramic chip, which have, is separately positioned on the first connection terminal and the
The first conductive adhesive and the second conductive adhesive on two connection terminals.
3. multilayer ceramic electronic component as claimed in claim 1, wherein, the first external electrode of multilayer ceramic capacitor and second
External electrode extends respectively to some parts of the upper surface of the first ceramic main body from two side surfaces of the first ceramic main body.
4. multilayer ceramic electronic component as claimed in claim 1, wherein, the first external electrode of multilayer ceramic capacitor and second
External electrode is separately positioned on the core of two side surfaces of the first ceramic main body.
5. multilayer ceramic electronic component as claimed in claim 1, wherein, multilayer ceramic capacitor includes being separately positioned on first
Upper caldding layer and lower caldding layer in the upper and lower surface of ceramic main body.
6. multilayer ceramic electronic component as claimed in claim 1, wherein, the first external terminal and the second external terminal of ceramic chip
The both ends of the second ceramic main body are completely covered respectively.
7. multilayer ceramic electronic component as claimed in claim 1, wherein, the first connection terminal of ceramic chip and the second connection
Terminal and the first external terminal and the second external terminal are respectively provided with the double-decker including inner conductive resin bed and outside coating layer.
8. multilayer ceramic electronic component as claimed in claim 7, wherein, the first external electrode of multilayer ceramic capacitor and second
External electrode is formed by electroconductive paste,
In first connection terminal and second connection end and the outside coating layer of the first external terminal and the second external terminal are respectively provided with
The double-decker of portion's nickel coating layer and outside golden coating layer.
9. multilayer ceramic electronic component as claimed in claim 7, wherein, the first external electrode of multilayer ceramic capacitor and second
External electrode includes interior nickel coating layer and outside tin coating layer,
The first connection terminal and second connection end and the outside plating of the first external terminal and the second external terminal of ceramic chip
Layer is respectively provided with the double-decker including interior nickel coating layer and outside tin coating layer.
10. a kind of plate for being provided with multilayer ceramic electronic component thereon, the plate include：
Substrate, there is the first electrode pad and second electrode pad being arranged on substrate；And
Multilayer ceramic electronic component, it is arranged on substrate,
Wherein, multilayer ceramic electronic component includes multilayer ceramic capacitor and ceramic chip,
Multilayer ceramic capacitor includes the first ceramic main body, in multiple first electrode and the second inner electrode and the first external electrode and
The second external electrode, is stacked with multiple dielectric layers in the first ceramic main body, and electrode and the second inner electrode pass through first in multiple first
The side surface of ceramic main body alternately exposes, and each dielectric layer is arranged in first between electrode and the second inner electrode, and first
External electrode and the second external electrode extend to the one of the installation surface of the first ceramic main body from the side surface of the first ceramic main body respectively
A little parts, and electrode and the second inner electrode in first are connected respectively to,
Ceramic chip includes electrode, the first connection terminal and second connection end in electrode and the 4th in the second ceramic main body, the 3rd
Son and the first external terminal and the second external terminal, the second ceramic main body are more to be formed and be arranged at by stacking multiple ceramic layers
The installation surface of layer ceramic capacitor, electrode is arranged in the second ceramic main body in electrode and the 4th in the 3rd, to pass through respectively
One side surface of the second ceramic main body and an end surfaces and another side surface and the exposure of another end surfaces, and make each pottery
Enamel coating is arranged in the 3rd in electrode and the 4th between electrode, and the first connection terminal and second connection end are respectively from the second ceramics
The side surface of main body extends to some parts of the upper surface of the second ceramic main body, and is connected respectively to multilayer ceramic capacitor
The first external electrode and the second external electrode, the first external terminal and the second external terminal are separately positioned on the end of the second ceramic main body
On, and the part of the exposure of electrode in electrode and the 4th in the 3rd is connected respectively to,
First external terminal and the second external terminal are separately mounted on first electrode pad and second electrode pad.
11. plate as claimed in claim 10, wherein, the first external electrode and the second external electrode and pottery of multilayer ceramic capacitor
The first connection terminal and second connection end of porcelain core piece, which have, to be separately positioned on the first connection terminal and second connection end
The first conductive adhesive and the second conductive adhesive.
12. plate as claimed in claim 10, wherein, the first external electrode and the second external electrode of multilayer ceramic capacitor are from first
Two side surfaces of ceramic main body extend respectively to some parts of the upper surface of the first ceramic main body.
13. plate as claimed in claim 10, wherein, the first external electrode and the second external electrode of multilayer ceramic capacitor are set respectively
Put on the core of two side surfaces of the first ceramic main body.
14. plate as claimed in claim 10, wherein, multilayer ceramic capacitor includes being separately positioned on the upper of the first ceramic main body
Upper caldding layer and lower caldding layer on surface and lower surface.
15. plate as claimed in claim 10, wherein, the first external terminal and the second external terminal of ceramic chip are completely covered respectively
The both ends of second ceramic main body.
16. plate as claimed in claim 10, wherein, the first connection terminal and second connection end of ceramic chip and first
External terminal and the second external terminal are respectively provided with the double-decker including inner conductive resin bed and outside coating layer.
17. plate as claimed in claim 16, wherein, the first external electrode and the second external electrode of multilayer ceramic capacitor are by conduction
Paste is formed,
In first connection terminal and second connection end and the outside coating layer of the first external terminal and the second external terminal are respectively provided with
The double-decker of portion's nickel coating layer and outside golden coating layer.
18. plate as claimed in claim 16, wherein, the first external electrode and the second external electrode of multilayer ceramic capacitor include
Interior nickel coating layer and outside tin coating layer,
The first connection terminal and second connection end and the outside plating of the first external terminal and the second external terminal of ceramic chip
Layer is respectively provided with the double-decker including interior nickel coating layer and outside tin coating layer.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020140009719A KR101539884B1 (en) | 2014-01-27 | 2014-01-27 | Multi-layered ceramic electroic components and mounting circuit thereof |
| KR10-2014-0009719 | 2014-01-27 |
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| CN104810153A CN104810153A (en) | 2015-07-29 |
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| CN201410185853.7A Active CN104810153B (en) | 2014-01-27 | 2014-05-05 | Multilayer ceramic electronic component and the plate for being provided with multilayer ceramic electronic component thereon |
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| JP6503943B2 (en) | 2015-07-10 | 2019-04-24 | 株式会社村田製作所 | Composite electronic component and resistor |
| KR102550165B1 (en) * | 2017-12-26 | 2023-07-03 | 삼성전기주식회사 | Multi-layered electronic component |
| CN108389912B (en) * | 2018-01-12 | 2020-02-28 | 武汉高芯科技有限公司 | Uncooled infrared detector chip and packaging structure and preparation method thereof |
| KR102473402B1 (en) | 2018-03-12 | 2022-12-02 | 삼성전기주식회사 | Electronic component |
| KR102500107B1 (en) * | 2018-10-02 | 2023-02-15 | 삼성전기주식회사 | Multi-layered ceramic electronic component |
| KR102121579B1 (en) * | 2018-10-02 | 2020-06-10 | 삼성전기주식회사 | Multi-layered ceramic electronic component |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1506988A (en) * | 2002-10-08 | 2004-06-23 | Tdk��ʽ���� | Electronic element and inter base plate |
| CN103443886A (en) * | 2011-03-25 | 2013-12-11 | 株式会社村田制作所 | Electronic component |
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| JP4720481B2 (en) * | 2005-04-21 | 2011-07-13 | 株式会社デンソー | Manufacturing method of electronic device |
| JP4561754B2 (en) * | 2007-01-30 | 2010-10-13 | Ｔｄｋ株式会社 | Multilayer capacitor |
| KR20100048044A (en) * | 2008-10-30 | 2010-05-11 | 조인셋 주식회사 | Complex ceramic chip component capable for surface-mounting |
| JP5655818B2 (en) * | 2012-06-12 | 2015-01-21 | 株式会社村田製作所 | Chip component structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1506988A (en) * | 2002-10-08 | 2004-06-23 | Tdk��ʽ���� | Electronic element and inter base plate |
| CN103443886A (en) * | 2011-03-25 | 2013-12-11 | 株式会社村田制作所 | Electronic component |
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