CN104769781A - 连接器 - Google Patents
连接器 Download PDFInfo
- Publication number
- CN104769781A CN104769781A CN201380057490.2A CN201380057490A CN104769781A CN 104769781 A CN104769781 A CN 104769781A CN 201380057490 A CN201380057490 A CN 201380057490A CN 104769781 A CN104769781 A CN 104769781A
- Authority
- CN
- China
- Prior art keywords
- base material
- hole
- basis material
- surface side
- connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims abstract description 85
- 239000000463 material Substances 0.000 claims description 153
- 230000002093 peripheral effect Effects 0.000 claims description 14
- 230000005611 electricity Effects 0.000 claims 3
- 230000000903 blocking effect Effects 0.000 claims 2
- 239000000758 substrate Substances 0.000 abstract description 54
- 238000005192 partition Methods 0.000 abstract description 20
- 239000004020 conductor Substances 0.000 abstract description 15
- 229910000679 solder Inorganic materials 0.000 abstract description 15
- 239000010410 layer Substances 0.000 description 63
- 230000000149 penetrating effect Effects 0.000 description 12
- 238000000034 method Methods 0.000 description 9
- 239000007789 gas Substances 0.000 description 7
- 239000011295 pitch Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
- H01R9/16—Fastening of connecting parts to base or case; Insulating connecting parts from base or case
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Connector Housings Or Holding Contact Members (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012240799A JP6208935B2 (ja) | 2012-10-31 | 2012-10-31 | コネクタ |
| JP2012-240799 | 2012-10-31 | ||
| PCT/JP2013/005909 WO2014068848A1 (ja) | 2012-10-31 | 2013-10-03 | コネクタ |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104769781A true CN104769781A (zh) | 2015-07-08 |
Family
ID=50156408
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380057490.2A Pending CN104769781A (zh) | 2012-10-31 | 2013-10-03 | 连接器 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6208935B2 (https=) |
| CN (1) | CN104769781A (https=) |
| TW (1) | TWM468796U (https=) |
| WO (1) | WO2014068848A1 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108029211A (zh) * | 2015-09-28 | 2018-05-11 | 塔科图特科有限责任公司 | 用于电子器件的多层结构和相关制造方法 |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9558790B1 (en) * | 2016-03-24 | 2017-01-31 | HGST Netherlands B.V. | Hermetic sealing with high-speed transmission for hard disk drive |
| EP3470681B1 (de) * | 2017-10-10 | 2021-09-22 | Pfeiffer Vacuum Gmbh | Elektrische durchführung für ein vakuumgerät, in der form einer dichtungsplatine |
| JP6768730B2 (ja) * | 2018-03-30 | 2020-10-14 | 株式会社東芝 | 電子機器 |
| US11967796B2 (en) * | 2019-06-07 | 2024-04-23 | Senin Technologies Corporation | Hermetic connector |
| JP7635997B2 (ja) * | 2019-12-17 | 2025-02-26 | センインテクノロジーズ株式会社 | 気密コネクタおよびその製造方法 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07231165A (ja) * | 1994-02-15 | 1995-08-29 | Hitachi Cable Ltd | 多層配線基板及びその製造方法 |
| US20040264149A1 (en) * | 2003-06-26 | 2004-12-30 | Formation, Inc. | Environmental protection of serial ATA and other electronic devices |
| CN1574466A (zh) * | 2003-05-21 | 2005-02-02 | 安普泰科电子有限公司 | 电连接结构、连接器及电连接系统 |
| JP2005259801A (ja) * | 2004-03-09 | 2005-09-22 | Matsushita Electric Ind Co Ltd | 多層ガラス基板の製造方法 |
| CN101193502A (zh) * | 2006-11-22 | 2008-06-04 | 全懋精密科技股份有限公司 | 电路板结构及其制作方法 |
| JP2011249796A (ja) * | 2010-05-21 | 2011-12-08 | Ibiden Co Ltd | プリント配線板及びプリント配線板の製造方法 |
| WO2012144326A1 (ja) * | 2011-04-20 | 2012-10-26 | タイコエレクトロニクスジャパン合同会社 | コネクタおよびコネクタの製造方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3648021B2 (ja) * | 1997-07-23 | 2005-05-18 | 株式会社山武 | 気密端子およびその形成方法 |
| JP2003255017A (ja) * | 2002-02-28 | 2003-09-10 | Dainippon Printing Co Ltd | 電子デバイス検査用コンタクトシート |
| JP4905983B2 (ja) * | 2007-10-03 | 2012-03-28 | 北川工業株式会社 | 表面実装コンタクト |
| JP5845006B2 (ja) * | 2011-06-29 | 2016-01-20 | タイコエレクトロニクスジャパン合同会社 | 電気接続構造 |
-
2012
- 2012-10-31 JP JP2012240799A patent/JP6208935B2/ja active Active
-
2013
- 2013-08-22 TW TW102215717U patent/TWM468796U/zh not_active IP Right Cessation
- 2013-10-03 CN CN201380057490.2A patent/CN104769781A/zh active Pending
- 2013-10-03 WO PCT/JP2013/005909 patent/WO2014068848A1/ja not_active Ceased
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07231165A (ja) * | 1994-02-15 | 1995-08-29 | Hitachi Cable Ltd | 多層配線基板及びその製造方法 |
| CN1574466A (zh) * | 2003-05-21 | 2005-02-02 | 安普泰科电子有限公司 | 电连接结构、连接器及电连接系统 |
| US20040264149A1 (en) * | 2003-06-26 | 2004-12-30 | Formation, Inc. | Environmental protection of serial ATA and other electronic devices |
| JP2005259801A (ja) * | 2004-03-09 | 2005-09-22 | Matsushita Electric Ind Co Ltd | 多層ガラス基板の製造方法 |
| CN101193502A (zh) * | 2006-11-22 | 2008-06-04 | 全懋精密科技股份有限公司 | 电路板结构及其制作方法 |
| JP2011249796A (ja) * | 2010-05-21 | 2011-12-08 | Ibiden Co Ltd | プリント配線板及びプリント配線板の製造方法 |
| WO2012144326A1 (ja) * | 2011-04-20 | 2012-10-26 | タイコエレクトロニクスジャパン合同会社 | コネクタおよびコネクタの製造方法 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108029211A (zh) * | 2015-09-28 | 2018-05-11 | 塔科图特科有限责任公司 | 用于电子器件的多层结构和相关制造方法 |
| CN108029211B (zh) * | 2015-09-28 | 2019-09-13 | 塔科图特科有限责任公司 | 用于电子器件的多层结构和相关制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6208935B2 (ja) | 2017-10-04 |
| JP2014093121A (ja) | 2014-05-19 |
| WO2014068848A1 (ja) | 2014-05-08 |
| TWM468796U (zh) | 2013-12-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| EXSB | Decision made by sipo to initiate substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150708 |