JP2014093121A5 - - Google Patents

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Publication number
JP2014093121A5
JP2014093121A5 JP2012240799A JP2012240799A JP2014093121A5 JP 2014093121 A5 JP2014093121 A5 JP 2014093121A5 JP 2012240799 A JP2012240799 A JP 2012240799A JP 2012240799 A JP2012240799 A JP 2012240799A JP 2014093121 A5 JP2014093121 A5 JP 2014093121A5
Authority
JP
Japan
Prior art keywords
base material
conductive plating
connector
multilayer substrate
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012240799A
Other languages
English (en)
Japanese (ja)
Other versions
JP6208935B2 (ja
JP2014093121A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2012240799A priority Critical patent/JP6208935B2/ja
Priority claimed from JP2012240799A external-priority patent/JP6208935B2/ja
Priority to TW102215717U priority patent/TWM468796U/zh
Priority to PCT/JP2013/005909 priority patent/WO2014068848A1/ja
Priority to CN201380057490.2A priority patent/CN104769781A/zh
Publication of JP2014093121A publication Critical patent/JP2014093121A/ja
Publication of JP2014093121A5 publication Critical patent/JP2014093121A5/ja
Application granted granted Critical
Publication of JP6208935B2 publication Critical patent/JP6208935B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2012240799A 2012-10-31 2012-10-31 コネクタ Active JP6208935B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012240799A JP6208935B2 (ja) 2012-10-31 2012-10-31 コネクタ
TW102215717U TWM468796U (zh) 2012-10-31 2013-08-22 連接器
PCT/JP2013/005909 WO2014068848A1 (ja) 2012-10-31 2013-10-03 コネクタ
CN201380057490.2A CN104769781A (zh) 2012-10-31 2013-10-03 连接器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012240799A JP6208935B2 (ja) 2012-10-31 2012-10-31 コネクタ

Publications (3)

Publication Number Publication Date
JP2014093121A JP2014093121A (ja) 2014-05-19
JP2014093121A5 true JP2014093121A5 (https=) 2015-11-19
JP6208935B2 JP6208935B2 (ja) 2017-10-04

Family

ID=50156408

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012240799A Active JP6208935B2 (ja) 2012-10-31 2012-10-31 コネクタ

Country Status (4)

Country Link
JP (1) JP6208935B2 (https=)
CN (1) CN104769781A (https=)
TW (1) TWM468796U (https=)
WO (1) WO2014068848A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190133289A (ko) * 2015-09-28 2019-12-02 택토텍 오와이 다층 구조체 및 관련 전자 제품의 제조 방법
US9558790B1 (en) * 2016-03-24 2017-01-31 HGST Netherlands B.V. Hermetic sealing with high-speed transmission for hard disk drive
EP3470681B1 (de) * 2017-10-10 2021-09-22 Pfeiffer Vacuum Gmbh Elektrische durchführung für ein vakuumgerät, in der form einer dichtungsplatine
JP6768730B2 (ja) * 2018-03-30 2020-10-14 株式会社東芝 電子機器
US11967796B2 (en) * 2019-06-07 2024-04-23 Senin Technologies Corporation Hermetic connector
JP7635997B2 (ja) * 2019-12-17 2025-02-26 センインテクノロジーズ株式会社 気密コネクタおよびその製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2833642B2 (ja) * 1994-02-15 1998-12-09 日立電線株式会社 多層配線基板及びその製造方法
JP3648021B2 (ja) * 1997-07-23 2005-05-18 株式会社山武 気密端子およびその形成方法
JP2003255017A (ja) * 2002-02-28 2003-09-10 Dainippon Printing Co Ltd 電子デバイス検査用コンタクトシート
JP4266326B2 (ja) * 2003-05-21 2009-05-20 タイコエレクトロニクスアンプ株式会社 電気接続構造および電気接続システム
WO2005002121A2 (en) * 2003-06-26 2005-01-06 Formation, Inc. Environmental protection of serial ata and other electronic devices
JP4214068B2 (ja) * 2004-03-09 2009-01-28 パナソニック株式会社 多層ガラス基板の製造方法
CN101193502B (zh) * 2006-11-22 2012-07-04 欣兴电子股份有限公司 电路板结构的制作方法
JP4905983B2 (ja) * 2007-10-03 2012-03-28 北川工業株式会社 表面実装コンタクト
US8610001B2 (en) * 2010-05-21 2013-12-17 Ibiden Co., Ltd. Printed wiring board and method for manufacturing printed wiring board
JPWO2012144326A1 (ja) * 2011-04-20 2014-07-28 タイコエレクトロニクスジャパン合同会社 コネクタおよびコネクタの製造方法
JP5845006B2 (ja) * 2011-06-29 2016-01-20 タイコエレクトロニクスジャパン合同会社 電気接続構造

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