TWM468796U - 連接器 - Google Patents
連接器 Download PDFInfo
- Publication number
- TWM468796U TWM468796U TW102215717U TW102215717U TWM468796U TW M468796 U TWM468796 U TW M468796U TW 102215717 U TW102215717 U TW 102215717U TW 102215717 U TW102215717 U TW 102215717U TW M468796 U TWM468796 U TW M468796U
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- conductive
- plating layer
- connector
- layer
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims description 162
- 238000007747 plating Methods 0.000 claims description 86
- 239000000463 material Substances 0.000 claims description 52
- 238000005192 partition Methods 0.000 claims description 23
- 230000002093 peripheral effect Effects 0.000 claims description 13
- 230000000149 penetrating effect Effects 0.000 claims description 11
- 230000000903 blocking effect Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 description 139
- 229910000679 solder Inorganic materials 0.000 description 18
- 239000004020 conductor Substances 0.000 description 14
- 230000004048 modification Effects 0.000 description 14
- 238000012986 modification Methods 0.000 description 14
- 239000007789 gas Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000005429 filling process Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
- H01R9/16—Fastening of connecting parts to base or case; Insulating connecting parts from base or case
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Connector Housings Or Holding Contact Members (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012240799A JP6208935B2 (ja) | 2012-10-31 | 2012-10-31 | コネクタ |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM468796U true TWM468796U (zh) | 2013-12-21 |
Family
ID=50156408
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102215717U TWM468796U (zh) | 2012-10-31 | 2013-08-22 | 連接器 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6208935B2 (https=) |
| CN (1) | CN104769781A (https=) |
| TW (1) | TWM468796U (https=) |
| WO (1) | WO2014068848A1 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9870806B2 (en) | 2016-03-24 | 2018-01-16 | Western Digital Technologies, Inc. | Hermetic sealing with high-speed transmission for hard disk drive |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20190133289A (ko) * | 2015-09-28 | 2019-12-02 | 택토텍 오와이 | 다층 구조체 및 관련 전자 제품의 제조 방법 |
| EP3470681B1 (de) * | 2017-10-10 | 2021-09-22 | Pfeiffer Vacuum Gmbh | Elektrische durchführung für ein vakuumgerät, in der form einer dichtungsplatine |
| JP6768730B2 (ja) * | 2018-03-30 | 2020-10-14 | 株式会社東芝 | 電子機器 |
| US11967796B2 (en) * | 2019-06-07 | 2024-04-23 | Senin Technologies Corporation | Hermetic connector |
| JP7635997B2 (ja) * | 2019-12-17 | 2025-02-26 | センインテクノロジーズ株式会社 | 気密コネクタおよびその製造方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2833642B2 (ja) * | 1994-02-15 | 1998-12-09 | 日立電線株式会社 | 多層配線基板及びその製造方法 |
| JP3648021B2 (ja) * | 1997-07-23 | 2005-05-18 | 株式会社山武 | 気密端子およびその形成方法 |
| JP2003255017A (ja) * | 2002-02-28 | 2003-09-10 | Dainippon Printing Co Ltd | 電子デバイス検査用コンタクトシート |
| JP4266326B2 (ja) * | 2003-05-21 | 2009-05-20 | タイコエレクトロニクスアンプ株式会社 | 電気接続構造および電気接続システム |
| WO2005002121A2 (en) * | 2003-06-26 | 2005-01-06 | Formation, Inc. | Environmental protection of serial ata and other electronic devices |
| JP4214068B2 (ja) * | 2004-03-09 | 2009-01-28 | パナソニック株式会社 | 多層ガラス基板の製造方法 |
| CN101193502B (zh) * | 2006-11-22 | 2012-07-04 | 欣兴电子股份有限公司 | 电路板结构的制作方法 |
| JP4905983B2 (ja) * | 2007-10-03 | 2012-03-28 | 北川工業株式会社 | 表面実装コンタクト |
| US8610001B2 (en) * | 2010-05-21 | 2013-12-17 | Ibiden Co., Ltd. | Printed wiring board and method for manufacturing printed wiring board |
| JPWO2012144326A1 (ja) * | 2011-04-20 | 2014-07-28 | タイコエレクトロニクスジャパン合同会社 | コネクタおよびコネクタの製造方法 |
| JP5845006B2 (ja) * | 2011-06-29 | 2016-01-20 | タイコエレクトロニクスジャパン合同会社 | 電気接続構造 |
-
2012
- 2012-10-31 JP JP2012240799A patent/JP6208935B2/ja active Active
-
2013
- 2013-08-22 TW TW102215717U patent/TWM468796U/zh not_active IP Right Cessation
- 2013-10-03 CN CN201380057490.2A patent/CN104769781A/zh active Pending
- 2013-10-03 WO PCT/JP2013/005909 patent/WO2014068848A1/ja not_active Ceased
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9870806B2 (en) | 2016-03-24 | 2018-01-16 | Western Digital Technologies, Inc. | Hermetic sealing with high-speed transmission for hard disk drive |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6208935B2 (ja) | 2017-10-04 |
| JP2014093121A (ja) | 2014-05-19 |
| CN104769781A (zh) | 2015-07-08 |
| WO2014068848A1 (ja) | 2014-05-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4K | Annulment or lapse of a utility model due to non-payment of fees |