CN104769781A - Connector - Google Patents
Connector Download PDFInfo
- Publication number
- CN104769781A CN104769781A CN201380057490.2A CN201380057490A CN104769781A CN 104769781 A CN104769781 A CN 104769781A CN 201380057490 A CN201380057490 A CN 201380057490A CN 104769781 A CN104769781 A CN 104769781A
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- China
- Prior art keywords
- basis material
- hole
- plating
- surface side
- connector
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
- H01R9/16—Fastening of connecting parts to base or case; Insulating connecting parts from base or case
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
Abstract
Provided is a connector, whereby airtightnes of an interior part of a chamber is preserved even if an interior part of a through hole which is formed in a substrate is not filled with a conductor such as solder, and simultaneously, reliable electrical connectivity may be obtained between the interior part and an exterior part of the chamber. A connector (1) comprises a multilayered substrate (10) which seals an aperture part (91) which is formed in a partition (90) and which joins an interior part and an exterior part of an airtight chamber (C). In the multilayered substrate (10), the interior surface side of a first through hole (23), which is formed in a first substrate (10), is closed by a second substrate (30), and a first conductive layer (24) which is connected to the interior surface side of a first conductive plating (22) is connected to an exterior surface side of a second conductive plating (32) of the second substrate (30). The exterior surface side of the first through hole (23) is sealed by a third substrate (40), and the second conductive layer (25) which is connected to the exterior surface side of the first conductive plating (22) is connected to the interior surface side of the third conductive plating (42) of the third substrate (40).
Description
Technical field
The present invention relates to for the inner side of the sealed chamber divided with next door and outside are electrically connected mutually, blocking be formed in next door, the connector of the inside and outside peristome of through sealed chamber.
Background technology
All the time, the requirement be electrically connected mutually in the inner side of the sealed chamber divided with next door and outside is had.Such as, adopting in the semiconductor chip process carrying integrated circuit can by the vacuum chamber of inner pressure relief to the state close to vacuum, and by the inside of this vacuum chamber and external electrical connections.In addition, He(helium is also had) gas that the such molecular weight of gas is few is full of the inside of the sealed chamber divided with next door and reduces pressure.When the inside adjusting the sealed chamber of pressure like this and outside electrical connection, the while of holding chamber inside bubble-tight, require the inside of room and outside reliable electrical connectivity.
As existing this electric connection construction, the known electric connection construction described in patent documentation 1 such as shown in Figure 10.Figure 10 is conventional example, divide with next door, the schematic diagram of electric connection construction that the inner side of sealed chamber of adjustment pressure and outside are electrically connected mutually.
Electric connection construction 101 shown in Figure 10 mutually electrical connection divides and the A side, inside of the controlled room of the pressure of inside (not shown) and outside B side with next door (not shown).
In the room using the electric connection construction 101 shown in Figure 10, next door is formed with the A side, inside of through room and the peristome (not shown) of outside B side.And this peristome is connected device 110 and blocks.
At this, be provided with multiple via hole 112 at the basis material of connector 110.Each via hole 112 is that the inside of the through hole be filled between the inner surface of through basis material and outer surface by electric conductor forms.Through hole is by implementing to conduct electricity plating and being formed to the inner peripheral surface of the through hole between the inner surface of through basis material and outer surface.In addition, at inner surface and the outer surface of connector 110, be provided with 1 couple of conductive spacer (pad) 113a, 113b being connected to each other by the electric conductor of via hole 112.
And, for connector 110 at the multiple 1st connector 120A of inner side configuration, and for connector 110 at the multiple 2nd connector 120B of outside configuration.
Each 1st connector 120A configures in the mode extended along the direction orthogonal to connector 110, and configures along the length direction (above-below direction in Figure 10) of connector 110.In addition, each 2nd connector 120B configures in the mode extended along the direction orthogonal to connector 110, and configures with the length direction of the mode opposed with the 1st connector 120A along connector 110.
At this, each 1st connector 120A possesses: the 2nd substrate 121 configured in the mode extended along the direction orthogonal to connector 110; And along multiple contact sites 123 that the Width (in Fig. 10 to the direction that paper is orthogonal) of the 2nd substrate 121 arranges with given pitch.On the surface (upper surface in Figure 10) of the 2nd substrate 121, the Width along the 2nd substrate 121 is provided with multiple conductive pattern 124 with given pitch.Each contact site 123 is connected to the end side of each conductive pattern 124.In addition, in another side of each conductive pattern 124, holding wire 122 is connected with.In addition, each 2nd connector 120B has the structure same with each 1st connector 120A.
In the electric connection construction 101 with this spline structure, the 1st connector 120A is advanced along the arrow F direction in Figure 10, and makes contact site 123 touch the conductive spacer 113a of the inner surface being located at connector 110.On the other hand, the 2nd connector 120B is advanced along the arrow F ' direction in Figure 10, and makes contact site 123 touch the conductive spacer 113b of the outer surface being located at connector 110.Thus, chamber interior A side and outside B side holding wire 122,122 via the conductive spacer 113b of the outer surface of the conductive spacer 113a of the inner surface of the conductive pattern 124 of chamber interior A side, contact site 123, connector 110, via hole 112, connector 110, contact site 123, outdoor B side conductive pattern 124 and be electrically connected.
In addition, although not shown, as the bubble-tight airtight terminal guaranteed between electrode pin and packaging part, the known terminal being such as recorded in patent documentation 2.
In the airtight terminal that this patent documentation 2 is recorded, be formed with conduction plating at the inner peripheral surface of the through hole being formed in packaging part.In addition, being configured in the electrode pin in through hole, the lid of the peristome covering through hole is formed with.And, join conduction plating to make the mode in this lid occlusion of openings portion.In addition, to fill with scolding tin and seal arrangement has electrode pin in the through hole of electrode pin and the gap between conduction plating.
Prior art document
Patent documentation
Patent documentation 1: Japanese Unexamined Patent Publication 2004-349073 publication
Patent documentation 2: Japanese Unexamined Patent Publication 11-40223 publication.
Summary of the invention
The problem that invention will solve
But there is following problem points in the electric connection construction 101 that the patent documentation 1 shown in this Figure 10 is recorded and the airtight terminal that patent documentation 2 is recorded.
That is, when electric connection construction 101 of patent documentation 1 record shown in Figure 10, when via hole 112 is formed to the basis material of connector 110, the operation of the inside filled conductive body to the through hole being formed in basis material can be needed.The filling work procedure of this electric conductor is additional process for form the common operation of through hole at basis material for, and also needs special equipment when filled conductive body, and productivity is poor.
In addition, when the airtight terminal that patent documentation 2 is recorded, also need to fill the additional process of scolding tin in the through hole being formed with conduction plating at inner peripheral surface.
Therefore, the present invention is for addressing these problems a little and completing, its object is to provide a kind of connector, even if also can the air-tightness of holding chamber inside with the electric conductor making not fill to the inside of the through hole being formed in basis material scolding tin etc., the inside of room and outside reliable electrical connectivity can be obtained simultaneously.
For solving the scheme of problem
In order to reach above-mentioned purpose, connector among the present invention involved by a certain mode, for being electrically connected mutually with the inner side of the sealed chamber of next door division and outside, blocking be formed in next door, the inside and outside peristome of through sealed chamber, the feature of described connector is: possess the multilager base plate blocking described peristome, this multilager base plate possesses: flat 1st basis material; Be configured in the inner surface side of the 1st basis material and block flat 2nd basis material of described peristome; And be configured in flat 3rd basis material of outer surface side of described 1st basis material, described 1st basis material has the 1st the 1st through hole conducting electricity plating implementing to extend between described inner surface and outer surface to the inner peripheral surface of the through hole between the inner surface of through 1st basis material and outer surface, and possesses: the 1st conductive layer of inner surface side that be located at the inner surface of described 1st basis material, that be connected to described 1st conduction plating; and be located at the outer surface of described 1st basis material, be connected to the 2nd conductive layer of the outer surface side of described 1st conduction plating, described 2nd basis material has the 2nd the 2nd through hole conducting electricity plating implementing to extend between described inner surface and outer surface to the inner peripheral surface of the through hole between the inner surface of through 2nd basis material and outer surface, and possess the inner surface that is located at described 2nd basis material, be connected to the 3rd conductive layer of the inner surface side of described 2nd conduction plating, described 3rd basis material has the 3rd the 3rd through hole conducting electricity plating implementing to extend between described inner surface and outer surface to the inner peripheral surface of the through hole between the inner surface of through 3rd basis material and outer surface, and possess the outer surface that is located at described 3rd basis material, be connected to the 4th conductive layer of the outer surface side of described 3rd conduction plating, configure in the mode making the outer surface of described 2nd basis material connect with the inner surface of described 1st basis material, thus the inner surface side of described 1st through hole is blocked by described 2nd basis material, and the outer surface side of described 1st conductive layer with described 2nd conduction plating is connected, configure in the mode making the inner surface of described 3rd basis material connect with the outer surface of described 1st basis material, thus the outer surface side of described 1st through hole is blocked by described 3rd basis material, and the inner surface side of described 2nd conductive layer with described 3rd conduction plating is connected.
Invention effect
According to connector involved in the present invention, possesses the multilager base plate of inside and the outside peristome blocking through sealed chamber, in this multilager base plate, configure in the mode making the outer surface of the 2nd basis material connect with the inner surface of the 1st basis material, thus the inner surface side of the 1st through hole of the 1st basis material is formed in by the 2nd basis material blocking, and, configure in the mode making the inner surface of the 3rd basis material connect with the outer surface of the 1st basis material, thus the outer surface side of the 1st through hole is blocked by the 3rd basis material, therefore, it is possible to utilize inner surface side and the outer surface side of the 1st through hole of the 2nd basis material and the 3rd basis material blocking the 1st substrate forming multilager base plate, thus can the air-tightness of holding chamber inside.
In addition, the 1st basis material possesses: the 1st conductive layer of the inner surface side of the 1st conduction plating that be located at the inner surface of the 1st basis material, that be connected to the 1st through hole, and be located at the outer surface of the 1st basis material, be connected to the 2nd conductive layer of the outer surface side of the 1st conduction plating, 2nd basis material possesses the inner surface being located at the 2nd basis material, be connected to the 3rd conductive layer of the inner surface side of the 2nd conduction plating of the 2nd through hole, 3rd basis material possesses the outer surface being located at the 3rd basis material, be connected to the 4th conductive layer of the outer surface side of the 3rd conduction plating of the 3rd through hole, the outer surface side of 1st conductive layer with the 2nd conduction plating is connected, and the inner surface side of the 2nd conductive layer with the 3rd conduction plating is connected, therefore in multilager base plate, the 3rd conductive layer is connected successively from inner surface side exterior surface side, 2nd conduction plating, 1st conductive layer, 1st conduction plating, 2nd conductive layer, 3rd conduction plating and the 4th conductive layer.Therefore, it is possible to obtain the inside of room and outside reliable electrical connectivity.
Thus, even if the electric conductor of not filling scolding tin etc. to the inside of the through hole being formed in basis material also can the air-tightness of holding chamber inside, the inside of room and outside reliable electrical connectivity can be obtained simultaneously.Therefore, not needing for form the common operation of through hole at basis material for is the filling work procedure of the electric conductor of the scolding tin of additional process etc., can improve the productivity of connector.
Accompanying drawing explanation
Fig. 1 is the generalized schematic of the electric connection construction using connector involved in the present invention;
Fig. 2 is shown specifically in the electric connection construction of the connector of use shown in Fig. 1, the sectional view of the periphery of connector;
Fig. 3 is the plane graph of the connector shown in Fig. 1;
Fig. 4 is the sectional view along the 4-4 line in Fig. 3;
Fig. 5 is the plane graph of the multilager base plate that the connector shown in Fig. 1 uses;
Fig. 6 is the sectional view along the 6-6 line in Fig. 5;
Fig. 7 is the sectional view of the major part of the 1st variation of multilager base plate;
Fig. 8 is the sectional view of the major part of the 2nd variation of multilager base plate;
Fig. 9 is the sectional view of the major part of the 3rd variation of multilager base plate;
Figure 10 is the schematic diagram of that conventional example, mutually electrical connection divide with next door, the inner side of the controlled sealed chamber of pressure and the electric connection construction in outside.
Embodiment
Below, with reference to accompanying drawing, the execution mode of electric connection construction involved in the present invention is described.
In the electric connection construction shown in Fig. 1, utilize connector 1 mutually electrical connection divide with next door 90 and inside by the inner side of the sealed chamber C of airtight maintenance and outside.The inside of sealed chamber C both can be the state close to vacuum, also can be full of and the state of the pressure lower than outer air pressure that reduces pressure with the gas that the such molecular weight of He gas is few.In addition, the inside of sealed chamber C also can be the state of the pressure higher than outer air pressure.
At this, as shown in Figure 1, next door 90 is formed with the inside and outside peristome 91 of through sealed chamber C.In addition, next door 90 is formed for the gas inject/discharge peristome 92 to injecting gas in the sealed chamber C in next door 90 (or from sealed chamber C Exhaust Gas).This next door 90 is metal.
And as shown in Figures 1 and 2, the peristome 91 in next door 90 is connected device 1 and blocks.
As shown in Figure 2, connector 1 possesses the multilager base plate (in the present embodiment, 4 laminar substrates) 10 in occlusion of openings portion 91.
Shown in as clear in Fig. 2 to Fig. 6, this multilager base plate 10 possesses: flat 1st basis material 20; Be configured in the inner surface 20a side of the 1st basis material 20 and flat 2nd basis material 30 in occlusion of openings portion 91; And be configured in flat 3rd basis material 40 of outer surface 20b side of the 1st basis material 20.
At this, as shown in Figure 5, the 1st basis material 20 is the flat-shaped parts of the rectangular shape that broad ways (left and right directions in Fig. 5) and length direction (above-below direction in Fig. 5) extend.In addition, the 1st basis material 20 also can be circle.As shown in Figures 2 to 6, the 1st basis material 20 has inner surface 20a and the outer surface 20b of the private side being positioned at sealed chamber C.And, at the inner surface 20a of the 1st basis material 20, be formed with the otch 20c of the given width that the periphery along the 1st basis material 20 extends continuously and with non junction shape.1st basis material 20 is such as with the epoxy manufacture adding glass.
In addition, as shown in Figure 6, multiple 1st through holes 23 between inner surface 20a and outer surface 20b being electrically connected mutually the 1st basis material 20 are formed at the 1st basis material 20.Multiple 1st through hole 23 is formed with 2 column-shaped on the Width of the 1st basis material 20.Although not shown, the 1st through hole 23 of each row is formed along fore-and-aft direction with given pitch.And each 1st through hole 23 conducts electricity plating 22 form by implementing the 1st of the ring-type extended between the inner surface 20a and outer surface 20b of the 1st basis material 20 to the inner peripheral surface of the through hole 21 between the inner surface 20a of through 1st basis material 20 and outer surface 20b.1st conduction plating 22 is such as formed with tin plating or golden plating.In addition, resin 26 is filled with in the space of the central authorities of the 1st conduction plating 22 of ring-type.Also can filled conductive body and not potting resin 26 in this space, in addition, as shown in Figure 7, also any object can not be filled to space 27.And, at the inner surface 20a of the 1st basis material 20, be provided with multiple 1st conductive layers 24 of the inner surface 20a side being connected to the 1st conduction plating 22.Each 1st conductive layer 24 conducts electricity the part of surrounding of plating 22 and the mode of part that extends outside this part broad ways formed to comprise encirclement the 1st.In addition, at the outer surface 20b of the 1st basis material 20, be provided with multiple 2nd conductive layers 25 of the outer surface 20b side being connected to the 1st conduction plating 22.Each 2nd conductive layer 25 also conducts electricity the part of surrounding of plating 22 and the mode of part that extends outside this part broad ways formed to comprise encirclement the 1st.
And as shown in Figure 5, the 2nd basis material 30 is the flat-shaped parts of the rectangular shape that broad ways (left and right directions in Fig. 5) and length direction (above-below direction in Fig. 5) extend.2nd basis material 30 has the width identical with the inner surface 20a of the 1st basis material 20 of otch and length.And as shown in Fig. 2, Fig. 4 and Fig. 6, the 2nd basis material 30 has inner surface 30a and the outer surface 30b of the private side being positioned at sealed chamber C.2nd basis material 30 is such as with the epoxy manufacture adding glass.As shown in Figures 5 and 6, at the outer peripheral portion of the part of the otch 20c of the 1st basis material 20, the part of the peripheral end face of the 2nd basis material 30 and the inner surface 30a of the 2nd basis material 30, be formed continuously and the weld layer 11 extended with non junction shape.Weld layer 11 is such as formed with tin plating or golden plating.
In addition, as shown in Figure 6, multiple 2nd through holes 33 between inner surface 30a and outer surface 30b being electrically connected mutually the 2nd basis material 30 are formed at the 2nd basis material 30.Multiple 2nd through hole 33 position more more outward than the 1st through hole 23 on the Width of the 2nd basis material 30 is formed with 2 column-shaped.2nd through hole 33 of each row is formed along fore-and-aft direction with given pitch.And each 2nd through hole 33 the 2nd is conducted electricity plating 32 by what implement to extend between the inner surface 30a and outer surface 30b of the 2nd basis material 30 to the inner peripheral surface of the through hole 31 between the inner surface 30a of through 2nd basis material 30 and outer surface 30b and forms.As shown in Figure 6, the 2nd conduction plating 32 is formed in the mode of the inside of complete landfill through hole 31.But, as shown in Figure 7, the 2nd conduction plating 32 is formed with the ring-type extended between inner surface 30a and outer surface 30b, and also can to form space 35 in central authorities.2nd conduction plating 32 is such as formed with tin plating or golden plating.And, at the inner surface 30a of the 2nd basis material 30, be provided with multiple 3rd conductive layers 34 of the inner surface side being connected to the 2nd conduction plating 32.As shown in Figures 5 and 6, each 3rd conductive layer 34 is to cover the 2nd conduction inner surface side end of plating 32 and the oblong-shaped extended inside broad ways is formed.
And then the 3rd basis material 40 is the flat-shaped parts of the rectangular shape that broad ways (left and right directions in Fig. 5) and length direction (above-below direction in Fig. 5) extend.3rd basis material 40 has the width identical with the outer surface 20b of the 1st basis material 20 and length.And as shown in Fig. 2, Fig. 4 and Fig. 6, the 3rd basis material 40 has inner surface 40a and the outer surface 40b of the private side being positioned at sealed chamber C.The epoxy manufacture of glass such as used by 3rd basis material 40.
In addition, as shown in Figure 6, multiple 3rd through holes 43 between inner surface 40a and outer surface 40b being electrically connected mutually the 3rd basis material 40 are formed at the 3rd basis material 40.Multiple 3rd through hole 43 position more more outward than the 1st through hole 23 on the Width of the 3rd basis material 40 is formed with 2 column-shaped.3rd through hole 43 of each row is formed along fore-and-aft direction with given pitch.And each 3rd through hole 43 the 3rd is conducted electricity plating 42 by what implement to extend between the inner surface 40a and outer surface 40b of the 3rd basis material 40 to the inner peripheral surface of the through hole 41 between the inner surface 40a of through 3rd basis material 40 and outer surface 40b and forms.As shown in Figure 6, the 3rd conduction plating 42 is formed in the mode of the inside of complete landfill through hole 41.But, as shown in Figure 7, the 3rd conduction plating 42 is formed with the ring-type extended between inner surface 40a and outer surface 40b, and also can to form space 45 in central authorities.3rd conduction plating 42 is such as formed with tin plating or golden plating.And, at the outer surface 40b of the 3rd basis material 40, be provided with multiple 4th conductive layers 44 of the outer surface side being connected to the 3rd conduction plating 42.Each 4th conductive layer 44 covers the outer surface side end of the 3rd conduction plating 42 and is formed with the oblong-shaped extended inside broad ways.
And, as shown in Figure 6, configure in the mode making the outer surface 30b of the 2nd basis material 30 connect with the inner surface 20a of the 1st basis material 20, thus be formed in the inner surface side of the 1st through hole 23 of the 1st basis material 20 by the 2nd basis material 30 blocking.In addition, the 1st conductive layer 24 is connected with the outer surface side of the 2nd conduction plating 32.
And then, configure in the mode making the inner surface 40a of the 3rd basis material 40 connect with the outer surface 20b of the 1st basis material 20, thus be formed in the outer surface side of the 1st through hole 23 of the 1st basis material 20 by the 3rd basis material 40 blocking.In addition, the 2nd conductive layer 25 is connected with the inner surface side of the 3rd conduction plating 42.
In this multilager base plate 10, the layer direction of the 2nd basis material 30 from inner surface side towards outer surface side, the 1st basis material 20 and the 3rd basis material 40, be configured with 4 conductive layers of the 3rd conductive layer 34, the 1st conductive layer 24, the 1st conductive layer 25 and the 4th conductive layer 44.Therefore, multilager base plate 10 is configured to 4 laminar substrates.
In addition, as shown in Figures 3 and 4, connector 1 possesses: the 1st connector 50 being configured in the inner surface 30a side of the 2nd basis material 30; And be configured in the 2nd connector 60 of outer surface 40b side of the 3rd basis material 40.
At this, as shown in Figure 4, the 1st connector 50 possesses the shell 51 of insulating properties and is contained in multiple electrical contacts 52 of shell 51.Multiple electrical contacts 52 as shown in Figure 3, corresponding to the 2nd through hole 33 and the 3rd conductive layer 34 that are formed in the 2nd basis material 30, the Width of shell 51 configures with 2 column-shaped.The electrical contacts 52 of each row configures along fore-and-aft direction with given pitch.
And each electrical contacts 52 possesses the connecting portion 52a and elastic contact part 52b that weld with the 3rd conductive layer 34 being formed in the 2nd basis material 30.
On the other hand, as shown in Figure 4, the 2nd connector 60 possesses the shell 61 of insulating properties and is contained in multiple electrical contacts 62 of shell 61.Multiple electrical contacts 62 corresponding to being formed in the 3rd through hole 43 of the 3rd basis material 40 and the 4th conductive layer 44 with 2 column-shaped configurations on the Width of shell 61.The electrical contacts 62 of each row configures along fore-and-aft direction with given pitch.
And each electrical contacts 62 possesses the connecting portion 62a and elastic contact part 62b that weld with the 4th conductive layer 44 being formed in the 3rd basis material 40.
Then, when utilizing connector 1 to be electrically connected mutually inner side and the outside of sealed chamber C, first, as shown in Figure 1, the 1st circuit substrate 70 is configured in sealed chamber C.And, as shown in Figure 2, make the inner surface 30a of the 2nd basis material 30 of formation connector 1 by side, next door 90 towards peristome 91 side.And, utilize scolding tin S that weld layer 11 is connected to next door 90.Thus, connector 1 is fixed on next door 90, and peristome 91 is connected device 1 blocks.In addition, the elastic contact part 52b in the electrical contacts 52 of the 1st connector 50 contacts with the 1st circuit substrate 70.
And, as shown in Figure 1, the 2nd circuit substrate 80 is contacted with the elastic contact part 62c of the electrical contacts 62 in the 2nd connector 60.Thus, the 1st circuit substrate 70 and the 2nd circuit substrate 80 are electrically connected mutually via connector 1.
At this, according to the connector 1 involved by present embodiment, possesses the multilager base plate 10 of inside and the outside peristome 91 blocking through sealed chamber C.And, in this multilager base plate 10, configure in the mode making the outer surface 30b of the 2nd basis material 30 connect with the inner surface 20a of the 1st basis material 20, thus be formed in the inner surface side of the 1st through hole 23 of the 1st basis material 20 by the 2nd basis material 30 blocking.In addition, configure in the mode making the inner surface 40a of the 3rd basis material 40 connect with the outer surface 20b of the 1st basis material 20, thus block the outer surface side of the 1st through hole 23 by the 3rd basis material 40.Therefore, it is possible to utilize the 2nd basis material 30 of formation multilager base plate 10 and the 3rd basis material 40 to block inner surface side and the outer surface side of the 1st through hole 23 of the 1st substrate 20, and the air-tightness of the inside of energy holding chamber C.
In addition, the 1st basis material 20 possesses: the 1st conductive layer 24 being connected to the inner surface side of the 1st conduction plating 22 of the 1st through hole 23; And be connected to the 2nd conductive layer 25 of outer surface side of the 1st conduction plating 22.In addition, the 2nd basis material 30 possesses the 3rd conductive layer 34 of the inner surface side of the 2nd conduction plating 32 being connected to the 2nd through hole 33.And then the 3rd basis material 40 possesses the 4th conductive layer 44 of the outer surface side of the 3rd conduction plating 42 being connected to the 3rd through hole 43.And the 1st conductive layer 24 and the 2nd being conducted electricity the outer surface side of plating 32 is connected, and is connected by the 2nd conductive layer 25 with the 3rd inner surface side of conducting electricity plating 42.Therefore, in multilager base plate 10, from inner surface side exterior surface side, connect the 3rd conductive layer 34, the 2nd conduction plating 32, the 1st conductive layer 24, the 1st conduction plating 22, the 2nd conductive layer 25, the 3rd conduction plating 42 and the 4th conductive layer 44 successively.Therefore, it is possible to obtain the inside and outside reliable electrical connectivity of room C.
Thus, even if do not fill the electric conductor of scolding tin etc. to the inside of the through hole (the 1st through hole 23) being formed in basis material (the 1st basis material 20), also can the air-tightness of inside of holding chamber C, the inside of room C and outside reliable electrical connectivity can be obtained simultaneously.Therefore, not needing for form the common operation of through hole at basis material for is the filling work procedure of the electric conductor of the scolding tin of additional process etc., thus can improve the productivity of connector 1.
Then, the multilager base plate 10 of the 1st variation is described with reference to Fig. 7, the multilager base plate 10 of the 2nd variation is described with reference to Fig. 8, the multilager base plate 10 of the 3rd variation is described with reference to Fig. 9.In Fig. 7, Fig. 8 and Fig. 9, have and identical label is marked for the parts identical with the multilager base plate 10 shown in Fig. 6, and the situation that the description thereof will be omitted.
First, the multilager base plate 10 of the 1st variation shown in Fig. 7 is different from the multilager base plate 10 shown in Fig. 6, as previously mentioned, does not fill any object in the space 27 of the central authorities of the 1st conduction plating 22 of the 1st through hole 23 of ring-type.In addition, as previously mentioned, the 2nd conduction plating 32 is formed with the ring-type extended between the inner surface 30a and outer surface 30b of the 2nd basis material 30, and forms space 35 in central authorities.And then, the 3rd conduction plating 42 is formed with the ring-type extended between the inner surface 40a and outer surface 40b of the 3rd basis material 40, and forms space 35 in central authorities.
According to the multilager base plate 10 of the 1st variation, even if do not fill the electric conductor of scolding tin etc. to the inside of the through hole (the 1st through hole 23) being formed in basis material (the 1st basis material 20), also can the air-tightness of inside of holding chamber C.The inside of room C and outside reliable electrical connectivity can be obtained in addition simultaneously.
In addition, multilager base plate 10 is as shown in Figure 6 such, if the space potting resin 26 of the central authorities to the 1st conduction plating 22 of ring-type, or to this space filled conductive body, then the air-tightness that can improve the inside of room C keeps effect.In addition, multilager base plate 10 is as shown in Figure 6 such, and the 2nd conduction plating 32 is formed as the inside of complete landfill through hole 31, the air-tightness that also can improve the inside of room C keeps effect.And then similarly, the 3rd conduction plating 42 is formed as the inside of complete landfill through hole 41, the air-tightness that also can improve the inside of room C keeps effect.
Then, the multilager base plate 10 of the 2nd variation shown in Fig. 8 is different from the multilager base plate 10 shown in Fig. 6, and multiple 2nd through hole 33 is formed in position identical with the 1st through hole 23 on the Width of the 2nd basis material 30.In addition, multiple 3rd through hole 43 is also formed in position identical with the 1st through hole 23 on the Width of the 3rd basis material 40.That is, the 1st through hole 23, the 2nd through hole 33 and the 3rd through hole 43 configure from the Inside To Outside of multilager base plate 10 with linearity.
And the multilager base plate 10 of the 2nd variation shown in Fig. 8 is different from the multilager base plate 10 shown in Fig. 6, the 1st conductive layer 24 conducts electricity plating 22 in the mode and the 1st of inner surface side end covering the 1st conduction plating 22 being formed as ring-type and is formed with one heart.In addition, the 2nd conductive layer 25 conducts electricity plating 22 in the mode and the 1st of outer surface end covering the 1st conduction plating 22 being formed as ring-type and is formed with one heart.
According to the multilager base plate 10 of the 2nd variation, even if do not fill the electric conductor of scolding tin etc. to the inside of the through hole (the 1st through hole 23) being formed in basis material (the 1st basis material 20), also can the air-tightness of inside of holding chamber C.The inside of room C and outside reliable electrical connectivity can be obtained in addition simultaneously.
In addition, multilager base plate 10 is as shown in Figure 8 such, and multiple 2nd through hole 33 and multiple 3rd through hole 43 are formed in positions different from the 1st through hole 23 on the Width of the 2nd basis material 30, and the air-tightness that more can improve the inside of room C keeps effect.
And then, the basic structure of the multilager base plate 10 of the 3rd variation shown in Fig. 9 is identical with the multilager base plate 10 shown in Fig. 8, but different from the multilager base plate 10 shown in Fig. 8, the 2nd conduction plating 32 is formed with the ring-type extended between inner surface 30a and outer surface 30b, and forms space 35 in central authorities.In addition, the 3rd conduction plating 42 is formed with the ring-type extended between inner surface 40a and outer surface 40b, and forms space 45 in central authorities.
According to the multilager base plate 10 of the 3rd variation, even if do not fill the electric conductor of scolding tin etc. to the inside of the through hole (the 1st through hole 23) being formed in basis material (the 1st basis material 20), also can the air-tightness of inside of holding chamber C.The inside of room C and outside reliable electrical connectivity can be obtained in addition simultaneously.
Above, embodiments of the present invention are illustrated, but the present invention is not limited thereto, can various change, improvement be carried out.
Such as, although the 1st basis material 20, the 2nd basis material 30 and the 3rd basis material 40 are formed with individual layer respectively, formed with multiple layers and also can.
In addition, multilager base plate 10 is not limited to situation about being formed with 4 layers, can be 5 layers, 6 layers etc., as long as formed with more than 4 layers.
And then connector 1 does not necessarily possess the 1st connector 50 and the 2nd connector 60.
Label declaration
1 connector; 10 multilager base plates; 20 the 1st basis materials; 20a inner surface; 20b outer surface; 21 through holes; 22 the 1st conduction platings; 23 the 1st through holes; 24 the 1st conductive layers; 25 the 2nd conductive layers; 30 the 2nd basis materials; 30a inner surface; 30b outer surface; 31 through holes; 32 the 2nd conduction platings; 33 the 2nd through holes; 34 the 3rd conductive layers; 40 the 3rd basis materials; 40a inner surface; 40b outer surface; 41 through holes; 42 the 3rd conduction platings; 43 the 3rd through holes; 44 the 4th conductive layers; 90 next doors; 91 peristomes; C sealed chamber.
Claims (1)
1. a connector, for being electrically connected mutually the inner side of sealed chamber and outside that divide with next door, blocking be formed in next door, the inside and outside peristome of through sealed chamber, the feature of described connector is:
Possess the multilager base plate blocking described peristome,
This multilager base plate possesses: flat 1st basis material; Be configured in the inner surface side of the 1st basis material and block flat 2nd basis material of described peristome; And be configured in flat 3rd basis material of outer surface side of described 1st basis material,
Described 1st basis material has the 1st the 1st through hole conducting electricity plating implementing to extend between described inner surface and outer surface to the inner peripheral surface of the through hole between the inner surface of through 1st basis material and outer surface, and possesses: the 1st conductive layer of inner surface side that be located at the inner surface of described 1st basis material, that be connected to described 1st conduction plating; And be located at described 1st basis material outer surface, the 2nd conductive layer of outer surface side that is connected to described 1st conduction plating,
Described 2nd basis material has the 2nd the 2nd through hole conducting electricity plating implementing to extend between described inner surface and outer surface to the inner peripheral surface of the through hole between the inner surface of through 2nd basis material and outer surface, and possess the 3rd conductive layer of inner surface side that be located at the inner surface of described 2nd basis material, that be connected to described 2nd conduction plating
Described 3rd basis material has the 3rd the 3rd through hole conducting electricity plating implementing to extend between described inner surface and outer surface to the inner peripheral surface of the through hole between the inner surface of through 3rd basis material and outer surface, and possess the 4th conductive layer of outer surface side that be located at the outer surface of described 3rd basis material, that be connected to described 3rd conduction plating
Configure in the mode making the outer surface of described 2nd basis material connect with the inner surface of described 1st basis material, thus the inner surface side of described 1st through hole is blocked by described 2nd basis material, and the outer surface side of described 1st conductive layer with described 2nd conduction plating is connected
Configure in the mode making the inner surface of described 3rd basis material connect with the outer surface of described 1st basis material, thus blocked the outer surface side of described 1st through hole by described 3rd basis material, and the inner surface side of described 2nd conductive layer with described 3rd conduction plating is connected.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-240799 | 2012-10-31 | ||
| JP2012240799A JP6208935B2 (en) | 2012-10-31 | 2012-10-31 | connector |
| PCT/JP2013/005909 WO2014068848A1 (en) | 2012-10-31 | 2013-10-03 | Connector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104769781A true CN104769781A (en) | 2015-07-08 |
Family
ID=50156408
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380057490.2A Pending CN104769781A (en) | 2012-10-31 | 2013-10-03 | Connector |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6208935B2 (en) |
| CN (1) | CN104769781A (en) |
| TW (1) | TWM468796U (en) |
| WO (1) | WO2014068848A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108029211A (en) * | 2015-09-28 | 2018-05-11 | 塔科图特科有限责任公司 | Sandwich construction and relative manufacturing process for electronic device |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9558790B1 (en) * | 2016-03-24 | 2017-01-31 | HGST Netherlands B.V. | Hermetic sealing with high-speed transmission for hard disk drive |
| EP3470681B1 (en) * | 2017-10-10 | 2021-09-22 | Pfeiffer Vacuum Gmbh | Electric feedthrough for a vacuum device, in the form of a pcb |
| JP6768730B2 (en) * | 2018-03-30 | 2020-10-14 | 株式会社東芝 | Electronics |
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| CN101193502A (en) * | 2006-11-22 | 2008-06-04 | 全懋精密科技股份有限公司 | Circuit board structure and its making method |
| JP2011249796A (en) * | 2010-05-21 | 2011-12-08 | Ibiden Co Ltd | Printed wiring board and its manufacturing method |
| WO2012144326A1 (en) * | 2011-04-20 | 2012-10-26 | タイコエレクトロニクスジャパン合同会社 | Connector and method for manufacturing connector |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP3648021B2 (en) * | 1997-07-23 | 2005-05-18 | 株式会社山武 | Hermetic terminal and method for forming the same |
| JP2003255017A (en) * | 2002-02-28 | 2003-09-10 | Dainippon Printing Co Ltd | Contact sheet for electronic device inspection |
| JP4905983B2 (en) * | 2007-10-03 | 2012-03-28 | 北川工業株式会社 | Surface mount contact |
| JP5845006B2 (en) * | 2011-06-29 | 2016-01-20 | タイコエレクトロニクスジャパン合同会社 | Electrical connection structure |
-
2012
- 2012-10-31 JP JP2012240799A patent/JP6208935B2/en active Active
-
2013
- 2013-08-22 TW TW102215717U patent/TWM468796U/en not_active IP Right Cessation
- 2013-10-03 WO PCT/JP2013/005909 patent/WO2014068848A1/en active Application Filing
- 2013-10-03 CN CN201380057490.2A patent/CN104769781A/en active Pending
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|---|---|---|---|---|
| JPH07231165A (en) * | 1994-02-15 | 1995-08-29 | Hitachi Cable Ltd | Multilayer wiring board and its manufacture |
| CN1574466A (en) * | 2003-05-21 | 2005-02-02 | 安普泰科电子有限公司 | Electric connection structure, connector and electric connecting system |
| US20040264149A1 (en) * | 2003-06-26 | 2004-12-30 | Formation, Inc. | Environmental protection of serial ATA and other electronic devices |
| JP2005259801A (en) * | 2004-03-09 | 2005-09-22 | Matsushita Electric Ind Co Ltd | Manufacturing method of multilayer glass substrate |
| CN101193502A (en) * | 2006-11-22 | 2008-06-04 | 全懋精密科技股份有限公司 | Circuit board structure and its making method |
| JP2011249796A (en) * | 2010-05-21 | 2011-12-08 | Ibiden Co Ltd | Printed wiring board and its manufacturing method |
| WO2012144326A1 (en) * | 2011-04-20 | 2012-10-26 | タイコエレクトロニクスジャパン合同会社 | Connector and method for manufacturing connector |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108029211A (en) * | 2015-09-28 | 2018-05-11 | 塔科图特科有限责任公司 | Sandwich construction and relative manufacturing process for electronic device |
| CN108029211B (en) * | 2015-09-28 | 2019-09-13 | 塔科图特科有限责任公司 | Multilayered structure and relative manufacturing process for electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014068848A1 (en) | 2014-05-08 |
| JP6208935B2 (en) | 2017-10-04 |
| TWM468796U (en) | 2013-12-21 |
| JP2014093121A (en) | 2014-05-19 |
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Application publication date: 20150708 |
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