JP5845006B2 - Electrical connection structure - Google Patents

Description

  The present invention relates to an electrical connection structure for electrically interconnecting the inside and outside of an airtight chamber defined by a partition wall.

  Conventionally, there is a need to electrically interconnect the inside and outside of an airtight chamber partitioned by a partition wall. For example, in a semiconductor chip process in which an integrated circuit is mounted, a vacuum chamber capable of reducing the pressure to near vacuum is used, and the inside and outside of the vacuum chamber are electrically connected. In the electrical connection between the inside and outside of the chamber in which the pressure is adjusted, airtightness inside the chamber is maintained, and at the same time, reliable electrical connectivity between the inside and outside of the chamber is required.

As a conventional electrical connection structure of this type, for example, the one shown in FIG. 5 is known (see Patent Document 1). FIG. 5 is a schematic diagram of an electrical connection structure that electrically interconnects the inside and outside of a chamber that is partitioned by a partition wall and whose internal pressure is adjusted, according to a conventional example.
The electrical connection structure shown in FIG. 5 electrically connects the interior A side and exterior B side of a chamber (not shown) that is partitioned by a partition wall (not shown) and whose internal pressure is adjusted.

In this electrical connection structure, the partition wall is formed with an opening (not shown) penetrating the inside A side and the outside B side of the chamber, and a first substrate 110 is provided to close the opening.
Here, the first substrate 110 is provided with a plurality of via holes 112 filled with a conductor. Further, a pair of conductive pads 113 a and 113 b interconnected by the conductors of the via holes 112 are provided on the inner surface and the outer surface of the first substrate 110.

A plurality of first connectors 120 </ b> A are disposed inside the first substrate 110, and a plurality of second connectors 120 </ b> B are disposed outside the first substrate 110.
Each first connector 120A is disposed so as to extend in a direction orthogonal to the first substrate 110, and a plurality of the first connectors 120A are disposed along the longitudinal direction (vertical direction in FIG. 5) of the first substrate 110. ing. Each second connector 120B is disposed so as to extend in a direction orthogonal to the first substrate 110, and along the longitudinal direction of the first substrate 110 so that the second connector 120B faces the first connector 120A. Are arranged.

Here, each first connector 120A is arranged so as to extend in a direction orthogonal to the first substrate 110, and the width direction of the second substrate 121 (perpendicular to the paper surface in FIG. 5). And a plurality of contacts 123 arranged at a predetermined pitch along the direction). A plurality of conductive patterns 124 are provided at a predetermined pitch along the width direction of the second substrate 121 on the surface of the second substrate 121 (the upper surface in FIG. 5). Each contact 123 includes a connection portion 123a connected to one end of the conductive pattern 124 , a bending portion 123b that curves from the tip of the connection portion 123a, and an elastic contact portion 123c that extends from the tip of the bending portion 123b toward the first substrate 110. And. The elastic contact portion 123 c protrudes from the front edge of the second substrate 121 and elastically contacts the conductive pad 113 a provided on the inner surface of the first substrate 110. The elastic force of the elastic contact portion 123c is mainly applied by the curved portion 123b. The first connector 120 </ b> A includes a plurality of signal lines 122 arranged at a predetermined pitch along the width direction of the second substrate 121. The core wire 122 a of each signal line 122 is connected to the other end side of the conductive pattern 124.

Each second connector 120B has the same configuration as the first connector 120A.
In the electrical connection structure 101 having such a configuration, the first connector 120A is advanced in the direction of arrow F in FIG. 5, and the elastic contact portion 123c of the contact 123 is attached to the conductive pad 113a provided on the inner surface of the first substrate 110. Make contact. On the other hand, the second connector 120B is advanced in the direction of arrow F ′ in FIG. 5, and the elastic contact portion 123c of the contact 123 is brought into contact with the conductive pad 113b provided on the outer surface of the first substrate 110. Thereby, the signal lines 122 and 122 on the chamber inner side A and the outer side B are connected to the conductive pattern 124 on the chamber inner side A, the contact 123, the conductive pad 113a on the inner surface of the first substrate 110, the via hole 112, and the first substrate. It is electrically connected through the conductive pad 113b on the outer surface 110, the contact 123, and the conductive pattern 124 on the chamber outside B side.

JP 2004-349073 A

However, the electrical connection structure 101 shown in FIG. 5 has the following problems.
That is, each first connector 120 </ b> A and each second connector 120 </ b> B are arranged to extend in a direction orthogonal to the first substrate 110. For this reason, in the electrical connection structure 101, the height in the direction orthogonal to the first substrate 110 is high, and the height cannot be reduced.

  Further, in the electrical connection between the inside A side and the outside B side of the first substrate 110, a large number of electrical connections are made along the longitudinal direction of the first substrate 110 (vertical direction in FIG. 5). Therefore, a plurality of first connectors 120 </ b> A extending in the direction orthogonal to the first substrate 110 are arranged along the longitudinal direction of the first substrate 110. Further, a plurality of second connectors 120B are arranged along the longitudinal direction of the first substrate 110 in the same manner as the first connector 120A. As described above, in order to realize a large number of electrical connections along the longitudinal direction of the first substrate 110 in the electrical connection between the inner A side and the outer B side of the first substrate 110, the first connector 120A and the first connector It is necessary to prepare a plurality of two connectors 120B. Therefore, there is a problem that the number of parts is large and the cost is increased. In addition, it is necessary to connect a plurality of first connectors 120A and second connectors 120B to the first substrate 110, and there is a problem that the number of connection steps is large and workability is extremely poor. That is, when a large number of electrical connections are made along both the width direction and the longitudinal direction of the substrate extending in the width direction and the longitudinal direction, a plurality of first connectors 120A and second connectors 120B are prepared, It is necessary to connect the first connector 120A and the second connector 120B to the first substrate 110.

Therefore, the present invention has been made to solve these conventional problems. The object of the present invention is to have a low-profile structure, which can electrically connect the inside and outside of the hermetic chamber reliably, and the inside of the hermetic chamber. An object of the present invention is to provide an electrical connection structure that can maintain hermeticity.
Another object of the present invention is to realize a large number of electrical connections along the two directions of the width direction and the longitudinal direction of the substrate extending in the width direction and the longitudinal direction in the electrical connection between the inside and the outside of the chamber. Therefore, an object is to provide an electrical connection structure that can be performed with a small number of connectors.

In order to achieve the above object, an electrical connection structure according to claim 1 of the present invention is an electrical connection structure for electrically interconnecting an inner side and an outer side of an airtight chamber partitioned by a partition wall, A substrate formed in a partition wall that closes an opening that penetrates the inside and the outside of the hermetic chamber, and is disposed on at least one of the inner side and the outer side with respect to the substrate, and substantially parallel to the substrate A first connector extending to the substrate, and the substrate is provided on an inner peripheral surface of a through-hole penetrating the inner surface and the outer surface of the substrate and communicates with the inner surface and the outer surface of the substrate. Vias comprising conductive plating portions and fillers filled in the conductive plating portions are provided,
The inner surface and the outer surface of the substrate are provided with a pair of conductive pad portions interconnected by the conductive plating portion of the via, and the first connector is at least one of the inner surface side and the outer surface side of the substrate. A first contact electrically connected to the conductive pad, the first contact having an elastic contact piece elastically contacting the conductive pad to be connected, and the first contact is bent The elastic contact piece is formed of a conductive metal plate and further includes a connection portion, and the elastic contact piece is folded from one end of the connection portion via a curved portion and extends substantially parallel to the substrate.
The term “annular” includes not only an annular shape but also a rectangular shape.

Also, the electrical connection structure according to claim 2 of the present invention, in the electrical connection structure according to claim 1, wherein the substrate is formed to extend in the width direction and the longitudinal direction, the via and the inner surface of the substrate And a plurality of conductive pads provided on the outer surface along the width direction and the longitudinal direction of the substrate, and the first connector disposed substantially parallel to the substrate is provided on the inner surface side of the substrate. A second connector electrically connected to a conductive pad on the outer surface side of the substrate, the second connector having a plurality of the first contacts electrically connected to the substrate and disposed substantially parallel to the substrate; It is characterized by having a plurality of contacts.

3. The first connector or the second connector as “substantially parallel” to the board in claim 1 or 2 allows the first connector or the second connector to be inclined between 0 ° and 10 ° with respect to the board. It means to do. Further, in claim 1 , the phrase “the elastic contact piece is “ substantially parallel ”with respect to the substrate ” means that the elastic contact piece is allowed to tilt between 0 ° and 10 ° with respect to the substrate .

Moreover, the electrical connection structure which concerns on Claim 3 among this invention is the electrical connection structure of Claim 1 or 2 , It is characterized by the said filler being a solder paste.
Moreover, the electrical connection structure which concerns on Claim 4 among this invention is the electrical connection structure of Claim 1 or 2 , It is characterized by the said filler being resin which has airtightness.
Furthermore, the electrical connection structure according to claim 5 of the present invention is the electrical connection structure according to claim 1 or 2 , wherein the filler is a rivet-shaped metal member.

  According to the electrical connection structure of the present invention, the substrate that is formed in the partition wall and closes the opening that penetrates the inside and the outside of the hermetic chamber, and is disposed on at least one of the inside and the outside of the substrate. And a first connector extending substantially parallel to the substrate. The inner surface and the outer surface of the substrate are provided with a pair of conductive pads interconnected by a conductive plating portion of the via, and the first connector is at least one of the conductive pads on the inner surface side and the outer surface side of the substrate. And a first contact electrically connected to the. For this reason, the first connector is disposed substantially parallel to the substrate, and the height in the direction orthogonal to the substrate can be reduced. Accordingly, it is possible to provide an electrical connection structure that can reliably connect the inside and the outside of the hermetic chamber with a low profile and can maintain the hermeticity inside the hermetic chamber. The via is provided on the inner peripheral surface of the through-hole penetrating the inner surface and the outer surface of the substrate, and filled in the conductive plating portion and the annular conductive plating portion that communicates the inner surface and the outer surface of the substrate. And made of filler. For this reason, there is no gas leakage from the inside of the hermetic chamber through the via, and the airtightness inside the hermetic chamber on the inner surface side of the substrate can be reliably maintained. The first contact includes an elastic contact piece that elastically contacts the conductive pad to be connected. Thus, even when the first connector having the contact with the elastic contact piece moves in the horizontal direction (parallel direction) with respect to the substrate during or after the electrical connection, the horizontal force acting on the elastic contact piece Is absorbed by the elastic contact piece, and an excessive load is not applied to the conductive pad of the via contacting the elastic contact piece. For this reason, there is no adverse effect on the airtightness maintenance of the inside of the chamber by the via.

  According to the electrical connection structure of the present invention, the substrate is formed to extend in the width direction and the longitudinal direction, and the conductive pads provided on the inner surface and the outer surface of the via and the substrate are arranged in the width direction and the longitudinal direction of the substrate. A plurality of first connectors provided along the substrate and arranged substantially parallel to the substrate have a plurality of first contacts electrically connected to the conductive pads on the inner surface side of the substrate, and are substantially parallel to the substrate. Since the arranged second connector has a plurality of second contacts that are electrically connected to the conductive pads on the outer surface side of the substrate, it extends along both the width direction and the longitudinal direction of the substrate extending in the width direction and the longitudinal direction. Thus, a large number of electrical connections can be realized with a small number of connectors by one first connector and one second connector. For this reason, the cost can be reduced, the number of connection steps can be reduced, and an electrical connection structure with good workability can be obtained.

It is sectional drawing which shows embodiment of the electrical connection structure which concerns on this invention. It is sectional drawing which shows the 1st modification of the electrical-connection structure shown in FIG. It is sectional drawing which shows the 2nd modification of the electrical-connection structure shown in FIG. It is sectional drawing which shows the modification of the filler in the electrical connection structure shown in FIG. It is a schematic diagram of the electrical connection structure which electrically interconnects the inner side and the outer side of the chamber of the example of a prior art which are divided by the partition and whose internal pressure is adjusted.

Embodiments of an electrical connection structure according to the present invention will be described below with reference to the drawings.
The electrical connection structure 1 shown in FIG. 1 electrically interconnects the inside A side and the outside B side of an airtight chamber (not shown) that is partitioned by a partition 40 and is kept airtight. The inside A of the hermetic chamber may be in a state close to a vacuum, or may be in a state lower than the external atmospheric pressure by being filled with helium or nitrogen, or a state in which the pressure is higher than the external atmospheric pressure. It may be. Alternatively, as long as the airtightness of the inside A is maintained, the pressure inside the airtight chamber A may be equal to the external pressure.

  In this electrical connection structure 1, the partition wall 40 is provided with an opening 41 that penetrates the inside A and the outside B of the hermetic chamber, and the substrate 10 that closes the opening 41 is provided. The partition 40 is made of metal. On the other hand, the substrate 10 is made of glass epoxy, for example. A pad (not shown) is provided on the outer surface of the substrate 10, and the pad and the partition 40 are joined by brazing. The board | substrate 10 is a plate-shaped member extended in the width direction (direction orthogonal to the paper surface in FIG. 1) and a longitudinal direction (left-right direction in FIG. 1).

  Here, the substrate 10 is provided with a plurality of vias 14 along the width direction and the longitudinal direction of the substrate 10. Each via 14 includes an annular conductive plating portion 12 provided on the inner peripheral surface of the through hole 11 penetrating the inner surface and the outer surface of the substrate 10, and a filler 13 filled in the conductive plating portion 12. It is made up of. In the case of this embodiment, the filler 13 is a conductive solder paste. However, the filler 13 does not necessarily need to be electrically conductive, and may be an airtight resin (for example, trade name “Torr Seal” (registered trademark)).

  The space between the inner peripheral surface of the through hole 11 provided in the substrate 10 and the conductive plating portion 12 is sealed, and the space between the conductive plating portion 12 and the filler 13 is also sealed. Thereby, there is no gas leakage from the inside A of the airtight chamber through the via 14, and the airtightness of the inside A of the airtight chamber on the inner surface side of the substrate 10 can be reliably maintained. Whether the solder paste is used or the airtight resin is used as the filler 13, the space between the conductive plating portion 12 and the filler 13 can be sealed.

In order to maintain the airtightness of the inside A of the airtight chamber and to achieve electrical connection between the inside A and the outside B of the airtight chamber, the following methods are conventionally known.
That is, a plate-like member that closes the opening 41 of the partition wall 40 is used, a through-hole is formed in the plate-like member, an electrical connection post is disposed in the through-hole, and the periphery of the electrical connection post is formed. This is a method of filling with glass hermetic.

  However, in this method, it is necessary to heat to around 800 ° C. in order to fill the glass. When the glass is heated, it cannot be rapidly heated, and when it is cooled, it cannot be rapidly cooled. For this reason, this method has a drawback that production efficiency is extremely poor.

Further, in this method, the filled glass is easily brittlely broken.
Furthermore, in this method, since there is a large difference in the coefficient of thermal expansion between the glass and the metal electrical connection post, the elongation amount of the glass and the electrical connection post are different when heated. There are disadvantages. Since the thermal expansion coefficient of glass is small and the thermal expansion coefficient of the electrical connection post is large, there is a drawback that the elongation amount of the electrical connection post is larger than that of glass and the glass is cracked.

  On the other hand, like this embodiment, the cyclic | annular electroconductive plating part 12 provided in the internal peripheral surface of the through-hole 11 which penetrates the inner surface and outer surface of the board | substrate 10 in the board | substrate 10, and an electroconductive plating part When the method using the via 14 composed of the filler 13 filled in the interior of 12 is adopted, there is no such disadvantage.

  A pair of conductive pads 15 and 16 interconnected by the conductive plating portion 12 of the via 14 are provided on the inner surface and the outer surface of the substrate 10. That is, a conductive pad 15 connected to the inner surface side of the conductive plating portion 12 is provided on the inner surface of the substrate 10. In addition, a conductive pad 16 connected to the outer surface side of the conductive plating portion 12 is provided on the outer surface of the substrate 10. These conductive pads 15 and 16 are formed separately from the conductive plating portion 12, but are not necessarily formed separately. That is, the conductive plating portion 12 itself on the inner surface side of the substrate 10 may be the conductive pad 15, and the conductive plating portion 12 itself on the outer surface side of the substrate 10 may be the conductive pad 16.

A first connector 20 is disposed on the inner A side with respect to the substrate 10, and a second connector 30 is disposed on the outer B side with respect to the substrate 10.
The first connector 20 is disposed substantially parallel to the substrate 10. Here, “substantially parallel” means that the first connector 20 is allowed to tilt with respect to the substrate 10 between 0 ° and 10 °.
The first connector 20 includes a flexible circuit board (FPC) 21 and a plurality of first contacts 22 connected to the outer surface (lower surface in FIG. 1) of the flexible circuit board 21.

  A backing plate 23 is attached to the flexible circuit board 21. The flexible circuit board 21 and the backing plate 23 are attached to the outer surface side of the plate-like support member 24 by a plurality of attachment screws 25. A plurality of adjustment screws 26 are screwed onto the support member 24. These adjusting screws 26 are screwed into the bottomed screw holes 17 formed in the substrate 10. By adjusting the screwing amount of the adjustment screw 26 into the screw hole 17, the support member 24 comes in contact with and separates from the substrate 10, whereby the first contact 22 contacts the conductive pad 15 on the inner surface side of the substrate 10. Release.

  Each first contact 22 includes a connection portion 22a connected to the conductive portion of the flexible circuit board 21, and is formed by punching and bending a conductive metal plate. The connecting portion 22 a is formed in a plate shape that extends along the outer surface of the flexible circuit board 21. Each first contact 22 includes an elastic contact piece 22 c that is folded back from one end of the connection portion 22 a via a curved portion 22 b and extends substantially parallel to the substrate 10. Here, “substantially parallel” means that the elastic contact piece 22 c is allowed to tilt between 0 ° and 10 ° with respect to the substrate 10. In this way, by extending the elastic contact piece 22 c substantially parallel to the substrate 10, the height of the electrical connection structure 1 in the direction orthogonal to the substrate 10 can be further reduced.

  Here, when the screwing amount of the adjusting screw 26 into the screw hole 17 is increased, the support member 24 and the first connector 20 attached to the support member 24 advance outward (in the direction of arrow G in FIG. 1). To do. When the screwing amount of the adjusting screw 26 into the screw hole 17 is further increased, the elastic contact piece 22 c of the first contact 22 comes into elastic contact with the conductive pad 15 on the inner surface side of the substrate 10. The elastic force of the elastic contact piece 22c is mainly applied by the curved portion 22b. When the elastic contact piece 22c of the first contact 20 contacts the conductive pad 15 of the substrate 10, the first contact 22 and the conductive pad 15 are electrically connected. Thereby, the conductive pad 15, the first contact 22 and the flexible circuit board 21 on the inner surface side of the substrate 10 are electrically connected.

On the other hand, the second connector 30 is disposed substantially parallel to the substrate 10. Here, “substantially parallel” means that the second connector 30 is allowed to tilt between 0 ° and 10 ° with respect to the substrate 10.
The second connector 30 includes a circuit board 31 and a plurality of second contacts 32 connected to the inner surface of the circuit board 31 (upper surface in FIG. 1).
A plurality of adjustment screws 33 are screwed onto the circuit board 31. These adjusting screws 33 are screwed into bottomed screw holes 42 formed in the partition wall 40. By adjusting the screwing amount of the adjusting screw 33 with respect to the screw hole 42, the circuit board 31 comes into contact with and separates from the board 10, so that the second contact 32 comes into contact with the conductive pad 16 on the outer surface side of the board 10. Release.

  Each second contact 32 includes a connection portion 32a connected to the conductive portion of the circuit board 31, and is formed by punching and bending a conductive metal plate. The connecting portion 32 a is formed in a plate shape that extends along the inner surface of the circuit board 31. Each second contact 32 includes an elastic contact piece 32 c that is folded back from one end of the connection portion 32 a via a curved portion 32 b and extends substantially parallel to the substrate 10. Here, “substantially parallel” means that the elastic contact piece 32 c is allowed to tilt between 0 ° and 10 ° with respect to the substrate 10. In this way, by extending the elastic contact piece 32 c substantially parallel to the substrate 10, the height of the electrical connection structure 1 in the direction orthogonal to the substrate 10 can be further reduced.

  Here, when the screwing amount of the adjusting screw 33 into the screw hole 42 is increased, the second connector 30 advances inward (in the direction of arrow H in FIG. 1). When the screwing amount of the adjustment screw 33 into the screw hole 42 is further increased, the elastic contact piece 32c of the second contact 32 comes into elastic contact with the conductive pad 16 on the outer surface side of the substrate 10. The elastic force of the elastic contact piece 32c is mainly applied by the curved portion 32b. When the elastic contact piece 32c of the second contact 32 contacts the conductive pad 16 of the substrate 10, the second contact 32 and the conductive pad 16 are electrically connected. Thereby, the conductive pad 16, the second contact 32, and the circuit board 30 on the outer surface side of the substrate 10 are electrically connected.

  The first contact 22 and the conductive pad 15 are electrically connected, and the second contact 32 and the conductive pad 16 are electrically connected. Then, the flexible circuit board 21 and the circuit board 31 connect the first contact 22, the conductive pad 15 on the inner surface side of the substrate 10, the conductive plating portion 12 of the via 14, the conductive pad 16 on the outer surface side of the substrate 10, and the first The two contacts 32 are electrically connected.

  The electrical connection structure 1 according to the present embodiment includes the substrate 10 that closes the opening 41 that is formed in the partition wall 40 and penetrates the inside A and the outside B of the hermetic chamber. The electrical connection structure 1 is disposed on the inner A side with respect to the substrate 10, and is disposed on the outer B side with respect to the substrate 10 and the first connector 20 extending substantially parallel to the substrate 10. And a second connector 30 extending substantially parallel to the substrate 10. A pair of conductive pads 15 and 16 interconnected by the conductive plating portion 12 of the via 14 are provided on the inner surface and the outer surface of the substrate 10. The first connector 20 includes a first contact 22 that is electrically connected to the conductive pad 15 on the inner surface side of the substrate 10, and the second connector 30 is electrically connected to the conductive pad 16 on the outer surface side of the substrate 10. The second contact 32 is provided. For this reason, the 1st connector 20 and the 2nd connector 30 are arrange | positioned substantially parallel with respect to the board | substrate 10, and can make the height of the direction orthogonal to the board | substrate 10 low. Accordingly, it is possible to provide the electrical connection structure 1 that can reliably connect the inside A and the outside B of the airtight chamber with a low profile and can maintain the airtightness of the inside A of the airtight chamber.

  The via 14 is provided on the inner peripheral surface of the through hole 11 penetrating the inner surface and the outer surface of the substrate 10, and the conductive conductive plate 12 having an annular shape that communicates the inner surface and the outer surface of the substrate 10. It consists of the filler 13 with which the inside of the plating part 12 was filled. For this reason, there is no gas leakage from the inside A of the airtight chamber through the via 14, and the airtightness of the inside A of the airtight chamber on the inner surface side of the substrate 10 can be reliably maintained.

  Further, both the first contact 22 and the second contact 32 have elastic contact pieces 22c and 32c that elastically contact the conductive pads 15 and 16 to be connected. During the electrical connection of the first connector 20 and the second connector 30 or after the electrical connection, the first connector 20 and the second connector 30 may move in the horizontal direction (parallel direction) with respect to the substrate 10. In this case, a horizontal force acts on the elastic contact pieces 22 c and 32 c of the first contact 22 and the second contact 32 that are in contact with the conductive pads 15 and 16. At this time, since the force in the horizontal direction is absorbed by the elastic contact pieces 22c and 32c, an excessive load is not applied to the conductive pads 15 and 16 of the via 14 that are in contact with the elastic contact pieces 22c and 32c. For this reason, there is no adverse effect on the airtightness maintenance of the inside A of the chamber by the via 14.

  Further, according to the electrical connection structure 1 according to the present embodiment, the substrate 10 is formed so as to extend in the width direction and the longitudinal direction, and the conductive pads 15 and 16 provided on the inner surface and the outer surface of the via 14 and the substrate 10 are provided. A plurality of substrates 10 are provided along the width direction and the longitudinal direction of the substrate 10. The first connector 20 disposed substantially parallel to the substrate 10 has a plurality of first contacts 22 that are electrically connected to the conductive pads 15 on the inner surface side of the substrate 10. Further, the second connector 30 disposed substantially parallel to the substrate 10 has a plurality of second contacts 32 that are electrically connected to the conductive pads 16 on the outer surface side of the substrate 10. For this reason, a large number of electrical connections along both the width direction and the length direction of the substrate 10 extending in the width direction and the length direction are reduced, and the number of connectors by one first connector 20 and one second connector 30 is small. Can be realized.

Next, a first modification of the electrical connection structure shown in FIG. 1 will be described with reference to FIG.
The basic structure of the electrical connection structure 1 shown in FIG. 2 is the same as that of the electrical connection structure 1 shown in FIG. 1, but the structure of the first contact in the first connector 20 and the connection structure of the first contact to the substrate 10 are the same. It is different.
That is, unlike the first contact 22 shown in FIG. 1, the first contact 27 in the electrical connection structure 1 shown in FIG. 2 does not have the elastic contact piece 22c, and is formed in a rigid shape having a U-shaped cross section. ing. The first contact 27 is connected to the outer surface of the flexible circuit board 21. The first contact 27 is soldered to the conductive pad 15 on the inner surface side of the substrate 10.
Also in the first modified example of this electrical connection structure, the low profile structure enables the electrical connection between the inside A and the outside B of the airtight chamber with certainty, and the airtightness inside the airtight chamber A can be maintained. The connection structure 1 can be provided.

Further, the second contact 32 has an elastic contact piece 32c that elastically contacts the conductive pad 16 to be connected, like the second contact 32 shown in FIG. For this reason, when the second connector 30 moves in the horizontal direction (parallel direction) with respect to the substrate 10 during or after the electrical connection of the second connector 30, the force acting in the horizontal direction is elastic contact pieces 32c. Is absorbed by. Thus, an excessive load is not applied to the conductive pad 16 of the via 14 that is in contact with the elastic contact piece 32c. For this reason, there is no adverse effect on the airtightness maintenance of the inside A of the chamber by the via 14.

Next, a second modification of the electrical connection structure shown in FIG. 1 will be described with reference to FIG.
The basic structure of the electrical connection structure 1 shown in FIG. 3 is the same as that of the electrical connection structure 1 shown in FIG. 1, but the structure of the first connector 20 is different.
That is, the first connector 20 in the electrical connection structure 1 shown in FIG. 3 is not a flexible circuit board 21 but a plurality of circuit boards 28 connected to a rigid circuit board 28 and an outer surface of the circuit board 28 (lower surface in FIG. 3). The first contact 22 is provided.

  A plurality of adjustment screws 29 are screwed onto the circuit board 28. These adjustment screws 29 are screwed into the bottomed screw holes 18 formed in the substrate 10. By adjusting the screwing amount of the adjusting screw 29 into the screw hole 18, the circuit board 28 contacts and separates from the substrate 10, and thereby the first contact 22 contacts the conductive pad 15 on the inner surface side of the substrate 10. To come apart.

Here, when the screwing amount of the adjusting screw 29 into the screw hole 18 is increased, the first connector 20 advances outward (in the direction of arrow G in FIG. 3). When the screwing amount of the adjusting screw 29 into the screw hole 18 is further increased, the elastic contact piece 22c of the first contact 22 elastically contacts the conductive pad 15 on the inner surface side of the substrate 10. The elastic force of the elastic contact piece 22c is mainly applied by the curved portion 22b. When the elastic contact piece 22c of the first contact 20 contacts the conductive pad 15 of the substrate 10, the first contact 22 and the conductive pad 15 are electrically connected. As a result, the conductive pad 15, the first contact 22 and the circuit board 28 on the inner surface side of the substrate 10 are electrically connected.
Also in the second modified example of the electrical connection structure, the low profile structure enables the electrical connection between the interior A and the exterior B of the airtight chamber with certainty and the airtightness of the airtight chamber interior A can be maintained. The connection structure 1 can be provided.

Next, a modification of the filler in the electrical connection structure shown in FIG. 1 will be described with reference to FIG.
The filler 13 in the electrical connection structure 1 shown in FIG. 1 is a solder paste, whereas the filler 13a shown in FIG. 4 is different in that it is a rivet-like metal member. This metal member is driven into the annular conductive plating part 12 constituting the via 14 from the inner surface side or the outer surface side of the substrate 10, and is held in the conductive plating part 12 by caulking the end part. That is, the region surrounded by the conductive plating part 12 is hermetically sealed by utilizing deformation of the metal.
Even if such a rivet-shaped metal member is used as the filler 13a, the gap between the conductive plating portion 12 and the filler 13a can be sealed. Thereby, there is no gas leakage from the inside A of the airtight chamber through the via 14, and the airtightness of the inside A of the airtight chamber on the inner surface side of the substrate 10 can be reliably maintained.

As mentioned above, although embodiment of this invention was described, this invention is not limited to this, A various change and improvement can be performed.
For example, in the electrical connection structure 1 shown in FIG. 1, the plate-like support member 24 is brought into contact with and separated from the substrate 10 by the adjustment screw 26, and the circuit board 31 is brought into contact with and separated from the substrate 10 by the adjustment screw 33. Yes. However, instead of using these adjusting screws, they are connected using a hook, or are welded between the support member 24 and the board 10 using a spacer, or are welded between the circuit board 31 and the board 10. May be.

  In the electrical connection structure 1 shown in FIG. 1, elastic contact pieces 22 c and 32 c are provided on both the first contact 22 and the second contact 32. In the electrical connection structure 1 shown in FIG. 2, the elastic contact piece 32 c is provided only on the second contact 32. However, the elastic contact piece only needs to be provided on at least one of the first contact 22 and the second contact 32. Although not shown, the elastic contact piece 22c is provided only on the first contact 22 and the second contact 32 side is provided. May have the same structure as the first contact 27 shown in FIG.

  In the electrical connection structure 1 shown in FIG. 1, the first connector 20 includes a flexible circuit board 21 and a first contact 22. The second connector 30 includes a circuit board 31 and a second contact 32. In the first connector 20 and the second connector 30, the member connected to the contact is not limited to a flexible circuit board or a circuit board as long as it has conductivity.

Further, in the electrical connection structure 1 shown in FIG. 2, instead of providing the contact 27, the cable core may be directly connected to the conductive pad 15 by soldering or the like.
In the electrical connection structure 1 shown in FIG. 1, the first connector 20 is disposed on the inner A side with respect to the substrate 10, and the second connector 30 is disposed on the outer B side with respect to the substrate 10. However, the second connector 30 is not necessarily arranged, and the first connector 20 may be arranged on at least one of the inner A side and the outer B side with respect to the substrate 10.

DESCRIPTION OF SYMBOLS 1 Electrical connection structure 10 Board | substrate 11 Through-hole 12 Conductive plating part 13 Filler 13a Filler (rivet-shaped metal member)
DESCRIPTION OF SYMBOLS 14 Via 15 Conductive pad 16 Conductive pad 20 1st connector 22 1st contact 22c Elastic contact piece 30 2nd connector 32 2nd contact 32c Elastic contact piece 40 Partition 41 Opening A Inside of airtight chamber B Outside of airtight chamber

Claims (5)

An electrical connection structure for electrically interconnecting an inner side and an outer side of an airtight chamber partitioned by a partition wall,
A substrate formed in the partition wall that closes an opening that penetrates the inside and the outside of the hermetic chamber; and is disposed on at least one of an inner side and an outer side with respect to the substrate; A first connector extending in parallel,
The substrate is provided on an inner peripheral surface of a through-hole penetrating the inner surface and the outer surface of the substrate, and an annular conductive plating portion communicating the inner surface and the outer surface of the substrate; A via made of a filler filled in is provided,
The inner surface and the outer surface of the substrate are provided with a pair of conductive pad portions interconnected by the conductive plating portion of the via,
The first connector includes a first contact electrically connected to at least one conductive pad on the inner surface side and the outer surface side of the substrate,
The first contact has an elastic contact piece that elastically contacts the conductive pad to be connected;
The first contact includes a bent conductive metal plate , and further includes a connection portion,
The electrical contact structure, wherein the elastic contact piece is folded back from one end of the connection portion via a curved portion and extends substantially parallel to the substrate.   The substrate is formed so as to extend in a width direction and a longitudinal direction, and a plurality of conductive pads provided on the inner surface and the outer surface of the via and the substrate are provided along the width direction and the longitudinal direction of the substrate, The first connector arranged substantially in parallel has a plurality of the first contacts electrically connected to the conductive pads on the inner surface side of the substrate, and the first connector arranged substantially parallel to the substrate. 2. The electrical connection structure according to claim 1, wherein the two connectors include a plurality of second contacts that are electrically connected to the conductive pads on the outer surface side of the substrate.   The electrical connection structure according to claim 1, wherein the filler is a solder paste.   The electrical connection structure according to claim 1, wherein the filler is an airtight resin.   The electrical connection structure according to claim 1, wherein the filler is a rivet-like metal member.

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