CN104756614A - 基板以及基板的制造方法 - Google Patents

基板以及基板的制造方法 Download PDF

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Publication number
CN104756614A
CN104756614A CN201380056539.2A CN201380056539A CN104756614A CN 104756614 A CN104756614 A CN 104756614A CN 201380056539 A CN201380056539 A CN 201380056539A CN 104756614 A CN104756614 A CN 104756614A
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Prior art keywords
metal level
substrate
solder
groove portion
electronic unit
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尾崎公教
小池靖弘
浅野裕明
志满津仁
川口茂树
浅井智朗
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Toyota Industries Corp
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Toyoda Automatic Loom Works Ltd
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Abstract

本发明提供一种基板以及基板的制造方法，基板具备：绝缘基板；金属层，该金属层形成于上述绝缘基板的一面；以及电子部件，该电子部件钎焊于上述金属层的表面。上述金属层由金属板形成。上述金属层的表面具有钎焊区域以及位于该钎焊区域的外周的槽部。

Description

基板以及基板的制造方法
技术领域
本发明的技术涉及基板以及该基板的制造方法，上述基板具备：绝缘基板；形成于绝缘基板的一面的金属层；以及通过钎焊而安装于金属层的表面的电子部件。
背景技术
在通过钎焊将电子部件安装于形成在绝缘基板的一面的金属层的表面的情况下，需要抑制钎料在金属层的表面过度地浸润扩展的情况。通过抑制钎料的浸润扩展而使钎料充分存积在规定的范围内，钎焊的可靠性提高。例如，公知有如下技术：通过将钎焊区域的整体形成为比其他部分低的钎料存积部，抑制钎料从钎焊区域的浸润扩展(参照专利文献1)。
专利文献1:日本特开2011－151368号公报
然而，在通过钎焊将电子部件安装于金属层的表面的情况下，一般使用如下方法：在将具有规定的开口部的掩模重叠于金属层的表面并涂布膏状的钎料后，取下掩模并将电子部件安装在所涂布的钎料上。然而，在相对于将钎焊区域的整体形成为钎料存积部的金属层采用上述安装方法的情况下，在取下掩模时，存在钎料与掩模一起从金属层剥离的情况。
发明内容
本发明的目的在于提供一种能够使用掩模在金属层的表面容易地涂布钎料、且能够抑制钎料的浸润扩展的基板以及该基板的制造方法。
用于达成上述目的的基板具备：绝缘基板；金属层，该金属层形成于上述绝缘基板的一面；以及电子部件，该电子部件钎焊于上述金属层的表面。上述金属层由金属板形成。上述金属层的表面具有：钎焊区域；以及位于该钎焊区域的外周的槽部。
用于达成上述目的的基板的制造方法是制造如下基板的制造方法，该基板具备：绝缘基板；金属层，该金属层形成于上述绝缘基板的一面，且由金属板形成；以及电子部件，该电子部件通过钎焊安装于上述金属层的表面，其中，上述基板的制造方法具有如下步骤：使用掩模在设定于上述金属层的表面的涂布部涂布钎料的步骤；以及在上述钎料上安装上述电子部件的步骤。作为上述金属层，使用在上述涂布部的外侧形成有槽部的金属层。
附图说明
图1是实施方式的基板的俯视图。
图2是沿着图1的2－2线的剖视图。
图3是槽部的放大图。
图4是示出安装电子部件的方法的图。
具体实施方式
以下，根据附图对一个实施方式的基板进行说明。
如图1以及图2所示，基板10具备：绝缘基板11；在绝缘基板11的上表面隔开规定的间隔粘合的一对金属层12；以及以横跨一对金属层12的上表面的方式安装的电子部件13。
金属层12是由具有规定的图案形状的金属板形成的部分，通过利用冲床从金属板材料冲裁出规定的图案形状(冲压加工)而成型。作为形成金属层12的金属板，能够使用铜板、由在钎焊部分镀敷处理的铝等导电性金属材料形成的金属板。金属板的厚度优选为0.4～2.0mm，更优选为0.5～1.0mm。此外，在本实施方式中，使用厚度为0.5mm的铜板。
如图1以及图2所示，在金属层12的上表面设置有俯视观察时呈四边框状的槽部20。槽部20呈环状，换言之呈无接头状。如图3所示，槽部20具有：底面21；内周侧的侧面亦即第1侧面22；以及外周侧的侧面亦即第2侧面23。底面21是与金属层12的上表面平行的平面，第1侧面22以及第2侧面23是将底面21与金属层12的上表面连接的倾斜面。槽部20例如能够通过下述方法形成：在通过冲压加工而形成金属层12时，将具有与槽部20对应的突部的成型模具按压于金属板的上表面，从而使金属板的上表面局部地凹陷。
如图3所示，金属层12的上表面与第1侧面22之间的夹角α、以及金属层12的上表面与第2侧面23之间的夹角β优选分别设定为95～150度的范围。在本实施方式中，将角度α设为135度，并将角度β设为95度，使角度α比角度β大。另外，在本实施方式中，将槽部20的深度设为0.12mm。
如图1以及图2所示，在金属层12上表面的由槽部20包围的区域涂布有钎料30。换言之，沿着涂布于金属层12的钎料30的外周、即金属层12上表面的施有钎料的区域(钎焊区域)的外周，以包围该钎焊区域的方式设置有槽部20。而且，经由钎料30而在金属层12的上表面安装有半导体元件等电子部件13。
接下来，对通过钎焊将电子部件13安装于金属层12的上表面的方法进行说明，并对本实施方式的基板10的作用进行说明。
如图4所示，在粘合于绝缘基板11的上表面的金属层12的上表面，设定有涂布钎料的涂布部R(图4中的虚线内侧的区域)，槽部20形成为包围涂布部R的无接头状。另外，槽部20沿涂布部R的边缘延伸，并且以与涂布部R的边缘隔开间隔的方式配置。
将具有与涂布部R对应的形状的开口部41的掩模40重叠于该金属层12的上表面(在图4中，用点划线示出掩模40)。此时，形成于涂布部R的外侧的槽部20被掩模40覆盖。而且，在使用刮刀等从掩模40的开口部41对金属层12的上表面涂布膏状的钎料后，将掩模40从金属层12取下。由此，对金属层12的涂布部R的上表面涂布钎料。
在本实施方式中，在涂布钎料的部位亦即涂布部R并未设置槽部20。因此，能够确保平坦的涂布部R的上表面与钎料之间的粘合面，钎料与金属层12充分地粘合。因此，能够抑制钎料与掩模40一同从金属层12剥离的情况。
接下来，将电子部件13载置在涂布于金属层12的涂布部R的钎料上。然后，在对基板10进行加热而使钎料熔融后，进行冷却而使钎料固化。由此，电子部件13通过钎焊被安装于金属层12的上表面。
在钎料熔融时，钎料向涂布部R的外侧浸润扩展，但能够利用设置于涂布部R的周围的槽部20抑制钎料越过槽部20浸润扩展的情况。此外，虽然先于钎料流动的助焊剂容易越过槽部20而扩展至金属层12上，但钎料的浸润扩展由槽部20限制，存在钎料存积于槽部20的内侧的倾向。另外，在金属层12的上表面，钎料从涂布部R浸润扩展至涂布部R与槽部20之间的区域内，结果，由槽部20包围的区域整体成为钎焊区域。而且，槽部20位于该钎焊区域的外周。
根据本实施方式，能够得到以下所记载的效果。
(1)基板10具备：绝缘基板11；金属层12，该金属层12形成于绝缘基板11的上表面；以及电子部件13，该电子部件13通过钎焊安装于金属层12的上表面。金属层12由金属板形成。在金属层12上表面的钎焊区域的外周设置有槽部20。
根据上述结构，并不在钎焊区域本身、而是在钎焊区域的外周设置有槽部20，因此，在使用掩模将钎料涂布于金属层12的表面时，能够确保金属层12的钎焊区域(涂布部R)与钎料之间的粘合面，从而金属层12与钎料充分地粘合。因此，在取下掩模时，所涂布的钎料难以剥离，能够容易地涂布钎料。
另外，在对基板10进行加热以使钎料熔融时，能够抑制钎料越过槽部20而浸润扩展的情况，并且钎料存积于槽部20的内侧。由此，能够在金属层12与电子部件13之间确保足够量的钎料，钎焊的可靠性提高。
(2)槽部20形成为包围钎焊区域的无接头状。换言之，槽部20在钎焊区域的周围整体连续地延伸。根据上述结构，能够抑制钎料30从钎焊区域朝向所有方位的浸润扩展。
(3)槽部20具有：平坦的底面21；内周侧(接近钎焊区域的一方)的侧面亦即第1侧面22；以及外周侧(远离钎焊区域的一方)的侧面亦即第2侧面23。
在通过将具有与槽部20对应的突部的成型模具按压于金属层12而形成槽部20的情况下，伴随着成型模具的反复使用，会在成型模具的突部的前端产生圆角、缺口等缺损。如上，若将槽部20形成为具有平坦的底面21的形状，则设置于成型模具的突部的前端也同样形成为平坦的形状。由此，在形成槽部20时，作用于成型模具的突部的前端的应力得到缓和，从而难以在突部的前端产生缺损。
(4)将槽部20的金属层12的表面与第1侧面22之间的夹角α处于95～150度的范围，并使金属层12的表面与第2侧面23之间的夹角β处于95～150度的范围。
根据上述结构，能够适当地抑制越过槽部20的钎料30的浸润扩展。另外，通过设定为上述角度，在将成型模具按压于金属层12而形成槽部20时，能够抑制金属层12与成型模具之间的咬合，从而使得成型模具从金属层12的脱模性良好。
(5)使金属层12的表面与第1侧面22之间的夹角α比金属层12的表面与第2侧面23之间的夹角β大。根据上述结构，位于外侧的第2侧面23成为更加接近垂直的斜面形状，由此，能够更加适当地抑制越过槽部20的钎料30的浸润扩展。
此外，上述实施方式也可以如下地进行变更。
槽部20并不限定于无接头状、换言之并不限定于连续的槽部，也可以是有端状、换言之为不连续的槽部。例如，存在与金属层12的图案形状等对应而在金属层12的上表面存在多个允许钎料的浸润扩展的部位与不允许钎料的浸润扩展的部位的情况。在这样的情况下，也能够仅在不允许钎料的浸润扩展的部位与钎焊区域(涂布部R)之间设置槽部20。
槽部20的截面形状没有特别限定。例如，也可以将底面21形成为凹曲面状，在这种情况下也能够得到上述(3)的效果。另外，也可以形成为无底面21的截面倒三角形状的槽部20。
也可以使金属层12的表面与第1侧面22之间的夹角α、和金属层12的表面与第2侧面23之间的夹角β相同。另外，也可以使上述角度α比上述角度β小。
在上述实施方式中，以横跨离开配置的两个金属层12的上表面的方式安装有电子部件13，但是也可以仅在一方的金属层12的上表面安装有电子部件13。
基板10也可以是在绝缘基板11的下表面粘合有另外的金属层的双面基板，也可以是还具有内层的多层基板，上述内层具有规定的图案。

Claims (5)

1.一种基板，其特征在于，具备：
绝缘基板；
金属层，该金属层形成于所述绝缘基板的一面；以及
电子部件，所述电子部件钎焊于所述金属层的表面，
所述金属层由金属板形成，
所述金属层的表面具有钎焊区域以及位于所述钎焊区域的外周的槽部。
2.根据权利要求1所述的基板，其特征在于，
所述槽部形成为包围所述钎焊区域的无接头状。
3.根据权利要求2所述的基板，其特征在于，
所述槽部具有底面、第1侧面以及第2侧面，所述第1侧面位于所述钎焊区域与所述第2侧面之间，
所述金属层的表面与所述第1侧面之间的夹角处于95～150度的范围，
所述金属层的表面与所述第2侧面之间的夹角处于95～150度的范围。
4.根据权利要求3所述的基板，其特征在于，
所述金属层的表面与所述第1侧面之间的夹角比所述金属层的表面与所述第2侧面之间的夹角大。
5.一种基板的制造方法，所述基板具备：绝缘基板；形成于所述绝缘基板的一面的由金属板形成的金属层；以及通过钎焊安装于所述金属层的表面的电子部件，
所述基板的制造方法的特征在于，
所述基板的制造方法具有如下步骤：
使用掩模在设定于所述金属层的表面的涂布部涂布钎料的步骤；以及
在所述钎料上安装所述电子部件的步骤，
作为所述金属层，使用在所述涂布部的外侧形成有槽部的金属层。
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