CN104755653B - 用于对压板进行等离子体涂覆的装置的应用及相应方法 - Google Patents

用于对压板进行等离子体涂覆的装置的应用及相应方法 Download PDF

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Publication number
CN104755653B
CN104755653B CN201380042267.0A CN201380042267A CN104755653B CN 104755653 B CN104755653 B CN 104755653B CN 201380042267 A CN201380042267 A CN 201380042267A CN 104755653 B CN104755653 B CN 104755653B
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CN
China
Prior art keywords
electrode
energy source
electrodes
energy
segments
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201380042267.0A
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English (en)
Chinese (zh)
Other versions
CN104755653A (zh
Inventor
A·格贝舒伯
D·黑姆
J·莱默
T·米勒
M·普罗舍克
O·施塔德勒
H·施托里
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bendoff Co ltd
Bendover Innovation And Technology Co ltd
Original Assignee
Bei Enduofu Is Permitted Gram Chain Band And Pressing Plate Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bei Enduofu Is Permitted Gram Chain Band And Pressing Plate Technology Co Ltd filed Critical Bei Enduofu Is Permitted Gram Chain Band And Pressing Plate Technology Co Ltd
Publication of CN104755653A publication Critical patent/CN104755653A/zh
Application granted granted Critical
Publication of CN104755653B publication Critical patent/CN104755653B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/06—Platens or press rams
    • B30B15/062—Press plates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/52—Controlling or regulating the coating process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32174—Circuits specially adapted for controlling the RF discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32577—Electrical connecting means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Plasma Technology (AREA)
  • Laminated Bodies (AREA)
  • Physical Vapour Deposition (AREA)
CN201380042267.0A 2012-08-08 2013-08-06 用于对压板进行等离子体涂覆的装置的应用及相应方法 Expired - Fee Related CN104755653B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
ATA877/2012 2012-08-08
ATA877/2012A AT513190B9 (de) 2012-08-08 2012-08-08 Vorrichtung und Verfahren zur Plasmabeschichtung eines Substrats, insbesondere eines Pressblechs
PCT/AT2013/050152 WO2014022872A2 (de) 2012-08-08 2013-08-06 Vorrichtung und verfahren zur plasmabeschichtung eines substrats, insbesondere eines pressblechs

Publications (2)

Publication Number Publication Date
CN104755653A CN104755653A (zh) 2015-07-01
CN104755653B true CN104755653B (zh) 2017-09-19

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380042267.0A Expired - Fee Related CN104755653B (zh) 2012-08-08 2013-08-06 用于对压板进行等离子体涂覆的装置的应用及相应方法

Country Status (18)

Country Link
US (1) US9530624B2 (enExample)
EP (1) EP2882885B8 (enExample)
JP (1) JP6140286B2 (enExample)
KR (1) KR101742744B1 (enExample)
CN (1) CN104755653B (enExample)
AT (1) AT513190B9 (enExample)
AU (1) AU2013302202B2 (enExample)
BR (1) BR112015002657A8 (enExample)
CA (1) CA2881069C (enExample)
CL (1) CL2015000301A1 (enExample)
DK (1) DK2882885T3 (enExample)
ES (1) ES2587929T3 (enExample)
IN (1) IN2015DN01149A (enExample)
MY (1) MY176134A (enExample)
NZ (1) NZ704253A (enExample)
PL (1) PL2882885T3 (enExample)
RU (1) RU2615743C2 (enExample)
WO (1) WO2014022872A2 (enExample)

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JP2017025389A (ja) * 2015-07-24 2017-02-02 株式会社ユーテック プラズマｃｖｄ装置及び成膜方法
US11251019B2 (en) * 2016-12-15 2022-02-15 Toyota Jidosha Kabushiki Kaisha Plasma device
CN107283551B (zh) * 2017-08-21 2018-07-24 阜南盛原木业有限公司 一种具有良好防霉防虫性能的胶合板
JP6863199B2 (ja) * 2017-09-25 2021-04-21 トヨタ自動車株式会社 プラズマ処理装置
CN109055917B (zh) * 2018-09-07 2020-09-08 信阳师范学院 一种单室双面镀膜等离子体化学气相沉积系统
DE102019127659A1 (de) * 2019-10-15 2021-04-15 Hueck Rheinische Gmbh Presswerkzeug und Verfahren zum Herstellen eines Presswerkzeugs
US11884426B2 (en) 2020-07-08 2024-01-30 Hamilton Sundstrand Corporation Compression apparatus and methods of making and using the same

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CN102597306A (zh) * 2009-07-26 2012-07-18 莱博德光学有限责任公司 处理室的清洁

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CN101267708A (zh) * 2007-02-09 2008-09-17 三星电子株式会社 等离子处理装置及等离子处理方法
CN102597306A (zh) * 2009-07-26 2012-07-18 莱博德光学有限责任公司 处理室的清洁

Also Published As

Publication number Publication date
NZ704253A (en) 2016-08-26
CA2881069A1 (en) 2014-02-13
AT513190B1 (de) 2014-03-15
IN2015DN01149A (enExample) 2015-06-26
AT513190A1 (de) 2014-02-15
MY176134A (en) 2020-07-24
PL2882885T3 (pl) 2016-11-30
AU2013302202B2 (en) 2015-12-03
EP2882885B1 (de) 2016-05-25
WO2014022872A2 (de) 2014-02-13
CA2881069C (en) 2017-11-07
RU2615743C2 (ru) 2017-04-11
US9530624B2 (en) 2016-12-27
AU2013302202A1 (en) 2015-02-26
EP2882885A2 (de) 2015-06-17
AT513190B9 (de) 2014-05-15
CL2015000301A1 (es) 2015-09-21
CN104755653A (zh) 2015-07-01
WO2014022872A3 (de) 2014-05-15
ES2587929T3 (es) 2016-10-27
KR20150042817A (ko) 2015-04-21
US20150255254A1 (en) 2015-09-10
RU2015107784A (ru) 2016-09-27
EP2882885B8 (de) 2016-08-31
JP2015531820A (ja) 2015-11-05
KR101742744B1 (ko) 2017-06-01
DK2882885T3 (en) 2016-09-05
BR112015002657A8 (pt) 2019-07-30
JP6140286B2 (ja) 2017-05-31
BR112015002657A2 (pt) 2017-07-04

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EXSB Decision made by sipo to initiate substantive examination
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TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20181128

Address after: Austria Bain Dov

Patentee after: BENDOVER INNOVATION AND TECHNOLOGY Co.,Ltd.

Address before: Austria Bain Dov

Patentee before: Bendoff Co.,Ltd.

Effective date of registration: 20181128

Address after: Austria Bain Dov

Patentee after: Bendoff Co.,Ltd.

Address before: Austria Bain Dov

Patentee before: BERNDORF HUECK BAND-UND PRESSBLECHTECHNIK GmbH

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20170919