BR112015002657A2 - aparelho e método para o revestimento por plasma de um substrato, em particular de uma placa de prensa. - Google Patents

aparelho e método para o revestimento por plasma de um substrato, em particular de uma placa de prensa.

Info

Publication number
BR112015002657A2
BR112015002657A2 BR112015002657A BR112015002657A BR112015002657A2 BR 112015002657 A2 BR112015002657 A2 BR 112015002657A2 BR 112015002657 A BR112015002657 A BR 112015002657A BR 112015002657 A BR112015002657 A BR 112015002657A BR 112015002657 A2 BR112015002657 A2 BR 112015002657A2
Authority
BR
Brazil
Prior art keywords
substrate
press plate
plasma coating
plasma
coating
Prior art date
Application number
BR112015002657A
Other languages
English (en)
Other versions
BR112015002657A8 (pt
Inventor
Gebeshuber Andreas
Heim Daniel
Störi Herbert
Laimer Johann
Prosckok Michael
Stadler Otto
Müller Thomas
Original Assignee
Berndorf Hueck Band Und Pressblechtechnik Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Berndorf Hueck Band Und Pressblechtechnik Gmbh filed Critical Berndorf Hueck Band Und Pressblechtechnik Gmbh
Publication of BR112015002657A2 publication Critical patent/BR112015002657A2/pt
Publication of BR112015002657A8 publication Critical patent/BR112015002657A8/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/06—Platens or press rams
    • B30B15/062—Press plates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/52—Controlling or regulating the coating process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32174—Circuits specially adapted for controlling the RF discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32577—Electrical connecting means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Vapour Deposition (AREA)
  • Plasma Technology (AREA)
  • Physical Vapour Deposition (AREA)
  • Laminated Bodies (AREA)
BR112015002657A 2012-08-08 2013-08-06 aparelho e método para o revestimento por plasma de um substrato, em particular de uma placa de prensa BR112015002657A8 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
ATA877/2012A AT513190B9 (de) 2012-08-08 2012-08-08 Vorrichtung und Verfahren zur Plasmabeschichtung eines Substrats, insbesondere eines Pressblechs
PCT/AT2013/050152 WO2014022872A2 (de) 2012-08-08 2013-08-06 Vorrichtung und verfahren zur plasmabeschichtung eines substrats, insbesondere eines pressblechs

Publications (2)

Publication Number Publication Date
BR112015002657A2 true BR112015002657A2 (pt) 2017-07-04
BR112015002657A8 BR112015002657A8 (pt) 2019-07-30

Family

ID=49584535

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112015002657A BR112015002657A8 (pt) 2012-08-08 2013-08-06 aparelho e método para o revestimento por plasma de um substrato, em particular de uma placa de prensa

Country Status (18)

Country Link
US (1) US9530624B2 (pt)
EP (1) EP2882885B8 (pt)
JP (1) JP6140286B2 (pt)
KR (1) KR101742744B1 (pt)
CN (1) CN104755653B (pt)
AT (1) AT513190B9 (pt)
AU (1) AU2013302202B2 (pt)
BR (1) BR112015002657A8 (pt)
CA (1) CA2881069C (pt)
CL (1) CL2015000301A1 (pt)
DK (1) DK2882885T3 (pt)
ES (1) ES2587929T3 (pt)
IN (1) IN2015DN01149A (pt)
MY (1) MY176134A (pt)
NZ (1) NZ704253A (pt)
PL (1) PL2882885T3 (pt)
RU (1) RU2615743C2 (pt)
WO (1) WO2014022872A2 (pt)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017025389A (ja) * 2015-07-24 2017-02-02 株式会社ユーテック プラズマｃｖｄ装置及び成膜方法
US11251019B2 (en) * 2016-12-15 2022-02-15 Toyota Jidosha Kabushiki Kaisha Plasma device
CN107283551B (zh) * 2017-08-21 2018-07-24 阜南盛原木业有限公司 一种具有良好防霉防虫性能的胶合板
JP6863199B2 (ja) * 2017-09-25 2021-04-21 トヨタ自動車株式会社 プラズマ処理装置
CN109055917B (zh) * 2018-09-07 2020-09-08 信阳师范学院 一种单室双面镀膜等离子体化学气相沉积系统
DE102019127659A1 (de) * 2019-10-15 2021-04-15 Hueck Rheinische Gmbh Presswerkzeug und Verfahren zum Herstellen eines Presswerkzeugs
US11884426B2 (en) * 2020-07-08 2024-01-30 Hamilton Sundstrand Corporation Compression apparatus and methods of making and using the same

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3984043A (en) * 1972-07-10 1976-10-05 United Technologies Corporation Method for bonding composite materials
NL8602357A (nl) * 1985-10-07 1987-05-04 Epsilon Ltd Partnership Inrichting en werkwijze voor het chemisch uit damp neerslaan met gebruik van een axiaal symmetrische gasstroming.
US4885074A (en) 1987-02-24 1989-12-05 International Business Machines Corporation Plasma reactor having segmented electrodes
US5156820A (en) * 1989-05-15 1992-10-20 Rapro Technology, Inc. Reaction chamber with controlled radiant energy heating and distributed reactant flow
RU2176681C2 (ru) * 1989-11-22 2001-12-10 Волков Валерий Венедиктович Способ получения покрытий в вакууме, устройство для получения покрытий в вакууме, способ изготовления устройства для получения покрытий в вакууме
JP2901317B2 (ja) * 1990-07-02 1999-06-07 株式会社日立製作所 スパッタ装置及びそれを用いた成膜方法
US5244375A (en) 1991-12-19 1993-09-14 Formica Technology, Inc. Plasma ion nitrided stainless steel press plates and applications for same
DE4202425C2 (de) 1992-01-29 1997-07-17 Leybold Ag Verfahren und Vorrichtung zum Beschichten eines Substrats, insbesondere mit elektrisch nichtleitenden Schichten
US5273588A (en) * 1992-06-15 1993-12-28 Materials Research Corporation Semiconductor wafer processing CVD reactor apparatus comprising contoured electrode gas directing means
DE4443608C1 (de) * 1994-12-07 1996-03-21 Siemens Ag Plasmareaktor und Verfahren zu dessen Betrieb
DE19757141A1 (de) * 1997-12-20 1999-06-24 Philips Patentverwaltung Array aus Diamant/wasserstoffhaltigen Elektroden
US6190514B1 (en) * 1997-12-30 2001-02-20 Premark Rwp Holdings, Inc. Method for high scan sputter coating to produce coated, abrasion resistant press plates with reduced built-in thermal stress
JP3595853B2 (ja) * 1999-03-18 2004-12-02 日本エー・エス・エム株式会社 プラズマｃｖｄ成膜装置
JP4718093B2 (ja) * 2000-03-28 2011-07-06 東京エレクトロン株式会社 複合セグメント電極に供給される電力を制御するための方法並びにシステム
US20020155957A1 (en) * 2001-02-14 2002-10-24 Danly, James C. Sintered anti-friction bearing surface
US6741446B2 (en) * 2001-03-30 2004-05-25 Lam Research Corporation Vacuum plasma processor and method of operating same
DE20113503U1 (de) 2001-08-14 2002-01-17 Espe Rolf Presswerkzeug mit hochabriebfester Oberfläche
US7217471B2 (en) * 2002-05-17 2007-05-15 3M Innovative Properties Company Membrane electrode assembly with compression control gasket
DE10337117A1 (de) * 2003-08-11 2005-03-17 Dieffenbacher Gmbh + Co. Kg Verfahren und Ein- oder Mehretagenpresse zur Herstellung von Holzwerkstoffplatten, insbesondere OSB-Platten
TWI283651B (en) * 2004-04-23 2007-07-11 Bobst Sa Device for transferring a foil matter from outside to inside of a machine
RU2285742C2 (ru) * 2004-07-27 2006-10-20 Евгений Владимирович Берлин Способ нанесения металлического покрытия на диэлектрическую подложку и устройство для его осуществления
EP1814716B1 (en) * 2004-10-22 2011-02-02 Dow Global Technologies Inc. Composite pipes and method making same
JP4704088B2 (ja) 2005-03-31 2011-06-15 東京エレクトロン株式会社 プラズマ処理装置
US20070042131A1 (en) * 2005-08-22 2007-02-22 Applied Materials, Inc., A Delaware Corporation Non-intrusive plasma monitoring system for arc detection and prevention for blanket CVD films
EP1929314B1 (en) * 2005-09-22 2018-12-19 Koninklijke Philips N.V. Two-dimensional adaptive accelerometer based on dielectrophoresis
KR101457449B1 (ko) * 2007-02-08 2014-11-03 훈츠만 어드밴스트 머티리얼스(스위처랜드) 게엠베하 열경화성 조성물
KR101297711B1 (ko) * 2007-02-09 2013-08-20 한국과학기술원 플라즈마 처리장치 및 플라즈마 처리방법
JP4707693B2 (ja) * 2007-05-01 2011-06-22 株式会社アルバック スパッタリング装置及びスパッタリング方法
JP5429771B2 (ja) 2008-05-26 2014-02-26 株式会社アルバック スパッタリング方法
US20100252744A1 (en) * 2009-04-06 2010-10-07 Koninklijke Philips Electronics N.V. Radiation detector with a plurality of electrode systems
US8433401B2 (en) * 2009-07-09 2013-04-30 Incube Labs, Llc Ring electrode assembly and applications thereof
KR20120054023A (ko) 2009-07-26 2012-05-29 레이볼드 압틱스 게엠베하 프로세스 챔버의 세척 방법
JP5496073B2 (ja) * 2010-12-21 2014-05-21 三菱電機株式会社 微結晶半導体薄膜製造装置および微結晶半導体薄膜製造方法
US20120247543A1 (en) * 2011-03-31 2012-10-04 Integrated Photovoltaic, Inc. Photovoltaic Structure

Also Published As

Publication number Publication date
JP2015531820A (ja) 2015-11-05
EP2882885A2 (de) 2015-06-17
WO2014022872A2 (de) 2014-02-13
NZ704253A (en) 2016-08-26
PL2882885T3 (pl) 2016-11-30
JP6140286B2 (ja) 2017-05-31
AU2013302202B2 (en) 2015-12-03
US20150255254A1 (en) 2015-09-10
CN104755653A (zh) 2015-07-01
IN2015DN01149A (pt) 2015-06-26
US9530624B2 (en) 2016-12-27
BR112015002657A8 (pt) 2019-07-30
RU2615743C2 (ru) 2017-04-11
RU2015107784A (ru) 2016-09-27
KR20150042817A (ko) 2015-04-21
KR101742744B1 (ko) 2017-06-01
ES2587929T3 (es) 2016-10-27
AT513190B1 (de) 2014-03-15
MY176134A (en) 2020-07-24
AU2013302202A1 (en) 2015-02-26
EP2882885B8 (de) 2016-08-31
CN104755653B (zh) 2017-09-19
EP2882885B1 (de) 2016-05-25
CA2881069C (en) 2017-11-07
DK2882885T3 (en) 2016-09-05
AT513190B9 (de) 2014-05-15
CL2015000301A1 (es) 2015-09-21
AT513190A1 (de) 2014-02-15
CA2881069A1 (en) 2014-02-13
WO2014022872A3 (de) 2014-05-15

Similar Documents

Publication Publication Date Title
IL266509B (en) Metrological method and device, substrate, lithographic system and method for manufacturing the device
EP2839968A4 (en) ORIGINAL PLATE FOR A LITHOGRAPHIC PRINTING PLATE AND PRINTING METHOD THEREFOR
BR112015002657A2 (pt) aparelho e método para o revestimento por plasma de um substrato, em particular de uma placa de prensa.
IL245795B (en) Method, device and substrates for lithographic metrology
TWI561672B (en) Film deposition apparatus, substrate processing apparatus and film deposition method
BR112013019984A2 (pt) método para controlar um aparelho eletrônico, e aparelho eletrônico.
EP2808173A4 (en) LITHOGRAPHIC PRINTING PLATE CARRIER, METHOD FOR MANUFACTURING LITHOGRAPHIC PRINTING PLATE CARRIER, AND ORIGINAL LITHOGRAPHIC PRINTING PLATE
EP2781955A4 (en) METHOD OF MAKING A MAIN PALLET ORIENTATION FILM, A TRANSFER PLATE, AND A LAYER FLUID
EP3088201A4 (en) Lithographic printing plate precursor, manufacturing method therefor, plate manufacturing method for lithographic printing plate, and printing method
BR112014014587A8 (pt) método para processar uma mensagem, e, computador de servidor
EP2878452A4 (en) SCOPE FOR LITHOGRAPHIC PRINTING PLATE AND METHOD FOR MANUFACTURING SAME, AND ORIGINAL LITHOGRAPHIC PRINTING PLATE
PL2677365T3 (pl) Kompozycja wywoływacza do płyty drukarskiej, wywoływacz i sposób wytwarzania płyty drukarskiej
GB2523270B (en) Micro-channel plate, method for manufacturing micro-channel plate, and image intensifier
BR112014016107A2 (pt) método para detecção de contexto, dispositivo de computação e mídia legível por máquina
EP2905144A4 (en) ORIGINAL LITHOGRAPHIC PRINTING PLATE AND PLATE MANUFACTURING METHOD
BR112014016799A8 (pt) aparelho transdutor para comunicações acústicas, método para arranjar uma unidade transdutora em um substrato para comunicações acústicas, e, placa
EP2899034A4 (en) ORIGINAL FLAT PRINTING PLATE AND PLATE MANUFACTURING METHOD
EP3112178A4 (en) On-machine development type lithographic printing plate precursor processing method and printing method
EP2821854A4 (en) LITHOGRAPHIC PRINTING PLATE PRECURSOR, AND MANUFACTURING METHOD FOR LITHOGRAPHIC PRINTING PLATE
EP3202586A4 (en) Lithographic printing plate master, manufacturing method therefor, and printing method using same
BR112014016284A2 (pt) dispositivos, sistemas e métodos de mecanismo de travamento de placa / parafuso
EP3257685A4 (en) Lithographic printing original plate, method for manufacturing same, and printing method using same
EP2980647A4 (en) METHOD FOR PRODUCING A FLEXODRUCK PLATE
EP2902198A4 (en) METHOD FOR PRODUCING AN ORIGINAL PLATE FOR A CYLINDRICAL PRESSURE PLATE, CYLINDRICAL PRESSURE PLATE AND PLATE MANUFACTURING METHOD THEREFOR
EP2915558A4 (en) CONVEYOR DEVICE FOR SHEET-TREATED THERAPEUTICS AND METHOD FOR FIXING SHEET-TREATED THERAPEUTIC MEANS

Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06I Publication of requirement cancelled [chapter 6.9 patent gazette]

Free format text: ANULADA A PUBLICACAO CODIGO 6.6.1 NA RPI NO 2462 DE 13/03/2018 POR TER SIDO INDEVIDA.

B25D Requested change of name of applicant approved

Owner name: BERNDORF AKTIENGESELLSCHAFT (AT)

B25A Requested transfer of rights approved

Owner name: BERNDORF INNOVATIONS UND TECHNOLOGIE GMBH (AT)

B06U Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 8A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2631 DE 08-06-2021 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.