WO2009069211A1 - プラズマプロセス用電極及びプラズマプロセス装置 - Google Patents
プラズマプロセス用電極及びプラズマプロセス装置 Download PDFInfo
- Publication number
- WO2009069211A1 WO2009069211A1 PCT/JP2007/073061 JP2007073061W WO2009069211A1 WO 2009069211 A1 WO2009069211 A1 WO 2009069211A1 JP 2007073061 W JP2007073061 W JP 2007073061W WO 2009069211 A1 WO2009069211 A1 WO 2009069211A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- plasma process
- grooves
- main face
- electrode
- plasma
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
- H01J37/32449—Gas control, e.g. control of the gas flow
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32541—Shape
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Plasma Technology (AREA)
- Cleaning In General (AREA)
- Gas-Filled Discharge Tubes (AREA)
- Drying Of Semiconductors (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
プラズマにより処理される基板を載置する陽極と、プラズマが生成される空間を挟んで基板と対向し、複数の第1溝(4)が設けられた第1主面(14)、第1主面(14)に対向し、複数の第1溝(4)と交差する、複数の第1溝(4)より狭い幅の複数の第2溝(6)が設けられた第2主面(16)を有する陰極10とを備える。第1溝(4)と第2溝(6)との交点に第1主面(14)から第2主面(16)に貫通する貫通孔(8)が設けられる。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009543615A JP5035352B2 (ja) | 2007-11-29 | 2007-11-29 | プラズマプロセス用電極及びプラズマプロセス装置 |
PCT/JP2007/073061 WO2009069211A1 (ja) | 2007-11-29 | 2007-11-29 | プラズマプロセス用電極及びプラズマプロセス装置 |
TW097123371A TWI367522B (en) | 2007-11-29 | 2008-06-23 | Plasma process electrode and plasma process device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2007/073061 WO2009069211A1 (ja) | 2007-11-29 | 2007-11-29 | プラズマプロセス用電極及びプラズマプロセス装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009069211A1 true WO2009069211A1 (ja) | 2009-06-04 |
Family
ID=40678127
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2007/073061 WO2009069211A1 (ja) | 2007-11-29 | 2007-11-29 | プラズマプロセス用電極及びプラズマプロセス装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5035352B2 (ja) |
TW (1) | TWI367522B (ja) |
WO (1) | WO2009069211A1 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010171244A (ja) * | 2009-01-23 | 2010-08-05 | Fuji Electric Holdings Co Ltd | プラズマ処理装置 |
US20110214812A1 (en) * | 2010-03-08 | 2011-09-08 | Jusung Engineering Co., Ltd. | Gas distributing means and substrate processing apparatus including the same |
WO2013008344A1 (ja) * | 2011-07-14 | 2013-01-17 | 株式会社島津製作所 | プラズマ処理装置 |
JP2013030478A (ja) * | 2011-06-24 | 2013-02-07 | Saga Univ | プラズマ処理装置 |
JP2014227606A (ja) * | 2013-05-24 | 2014-12-08 | 上海和輝光電有限公司Everdisplay Optronics (Shanghai) Limited | 分散板 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04375A (ja) * | 1990-04-16 | 1992-01-06 | Mitsubishi Heavy Ind Ltd | プラスチック基板表面の硬化保護膜製造方法 |
JPH0922798A (ja) * | 1995-07-03 | 1997-01-21 | Anelva Corp | 高周波放電用電極及び高周波プラズマ基板処理装置 |
JP2005150317A (ja) * | 2003-11-14 | 2005-06-09 | Mitsubishi Heavy Ind Ltd | プラズマcvd装置および光電変換装置の製造方法 |
-
2007
- 2007-11-29 WO PCT/JP2007/073061 patent/WO2009069211A1/ja active Application Filing
- 2007-11-29 JP JP2009543615A patent/JP5035352B2/ja not_active Expired - Fee Related
-
2008
- 2008-06-23 TW TW097123371A patent/TWI367522B/zh not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04375A (ja) * | 1990-04-16 | 1992-01-06 | Mitsubishi Heavy Ind Ltd | プラスチック基板表面の硬化保護膜製造方法 |
JPH0922798A (ja) * | 1995-07-03 | 1997-01-21 | Anelva Corp | 高周波放電用電極及び高周波プラズマ基板処理装置 |
JP2005150317A (ja) * | 2003-11-14 | 2005-06-09 | Mitsubishi Heavy Ind Ltd | プラズマcvd装置および光電変換装置の製造方法 |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010171244A (ja) * | 2009-01-23 | 2010-08-05 | Fuji Electric Holdings Co Ltd | プラズマ処理装置 |
US20110214812A1 (en) * | 2010-03-08 | 2011-09-08 | Jusung Engineering Co., Ltd. | Gas distributing means and substrate processing apparatus including the same |
JP2013030478A (ja) * | 2011-06-24 | 2013-02-07 | Saga Univ | プラズマ処理装置 |
WO2013008344A1 (ja) * | 2011-07-14 | 2013-01-17 | 株式会社島津製作所 | プラズマ処理装置 |
CN103493602A (zh) * | 2011-07-14 | 2014-01-01 | 株式会社岛津制作所 | 等离子体处理装置 |
KR101485140B1 (ko) | 2011-07-14 | 2015-01-22 | 시마쯔 코포레이션 | 플라즈마 처리 장치 |
JPWO2013008344A1 (ja) * | 2011-07-14 | 2015-02-23 | 株式会社島津製作所 | プラズマ処理装置 |
CN103493602B (zh) * | 2011-07-14 | 2016-06-08 | 株式会社岛津制作所 | 等离子体处理装置 |
JP2014227606A (ja) * | 2013-05-24 | 2014-12-08 | 上海和輝光電有限公司Everdisplay Optronics (Shanghai) Limited | 分散板 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2009069211A1 (ja) | 2011-04-07 |
TW200924026A (en) | 2009-06-01 |
TWI367522B (en) | 2012-07-01 |
JP5035352B2 (ja) | 2012-09-26 |
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