CN104752636A - An apparatus and a method for attaching glass and a mask, and a system and a method to load a substrate - Google Patents
An apparatus and a method for attaching glass and a mask, and a system and a method to load a substrate Download PDFInfo
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- CN104752636A CN104752636A CN201410438438.8A CN201410438438A CN104752636A CN 104752636 A CN104752636 A CN 104752636A CN 201410438438 A CN201410438438 A CN 201410438438A CN 104752636 A CN104752636 A CN 104752636A
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- substrate
- pallet
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- loaded
- magnetic chuck
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
An apparatus for attaching glass and a mask includes a mask supporting unit used for supporting a mask formed by a metal material; a magnetic chuck disposed above the mask supporting unit and generating magnetic force so as to be attached to the mask, with a substrate being disposed between the magnetic chuck and the mask; a magnetic chuck up/down driving unit connected to the magnetic chuck and used for driving the magnetic chuck up and down; and a controller used for controlling operation of the magnetic chuck up/down driving unit, so as to change the position of the magnetic chuck to prevent a phenomenon that the mask is in contact with the magnetic chuck due to interference of magnetic force in a return operation period of the mask.
Description
Technical field
Concept of the present invention relates to a kind of for glassivation and the Apparatus and method for of mask and the system and method for mounting substrate.
Background technology
Panel display apparatus comprises liquid crystal display (liquid crystal display; LCD), plasma display (plasma display panel; PDP), Organic Light Emitting Diode (organic light-emittingdiode; OLED) etc.Fig. 1 illustrates the structure of Organic Light Emitting Diode.With reference to Fig. 1, Organic Light Emitting Diode be by substrate sequentially stacking following layer formed: anode, hole injection layer (holeinjection layer; HIL), hole transmission layer (hole transfer layer; HTL), luminescent layer (emittinglayer; EL), hole blocking layer, electron transfer layer (electron transfer layer; ETL), electron injecting layer (electron transfer layer; EIL), negative electrode etc.
In the general introduction of Organic Light Emitting Diode shown in Fig. 1, the luminescent layer that Organic Light Emitting Diode comprises anode, negative electrode and is arranged between described anode and described negative electrode.During operation, hole is injected in luminescent layer from anode, and electrons from cathode is injected in luminescent layer.Described hole and described electronics coupled to each other in luminescent layer, thus produce exciton (exciton).When described exciton self-excitation state fades to ground state, just can be luminous.
Organic Light Emitting Diode can be classified into monochrome (monochromatic) Organic Light Emitting Diode and panchromatic (full-color) Organic Light Emitting Diode according to the color that will reproduce.Full-color organic light emitting diode is equipped with the luminescent layer according to being patterned as the redness (R) of light primary colors, green (G) and blueness (B), and then reproduces panchromatic.
In full-color organic light emitting diode, the patterning of luminescent layer can be performed in every way according to the material for the formation of luminescent layer.
Fine metal mask (fine metal mask is utilized for being comprised by the Organic Light Emitting Diode deposition process of luminescent layer patterning; FMM) level deposition method, employing laser induced thermal imaging (laser inducedthermal imaging; LITI) technology method, utilize the method for colour filter, little mask scan (small maskscanning; SMS) deposition process etc.
Metal mask is generally used for fine metal mask level deposition method.For performing described fine metal mask level deposition method, can use for carrying mask intimate contact with one another and the pallet of substrate.
In the related, due to the position that is provided with mask with for attracting the magnet plates of described mask (namely by magnetive attraction, magnetic chuck) between space very narrow because of structural limitations, therefore described mask return operation during (that is, when described mask returns without substrate time) mask of being formed by metal and magnetic chuck interfering with each other due to magnetive attraction possibly.
When mask and magnetic chuck contact with each other due to the interference of magnetive attraction, mask and magnetic chuck can be damaged thus make it reuse, or can particle be produced thus cause substrate to occur defect.Therefore, yield can be reduced, thus in the urgent need to carrying out structure compensation to these problems.
In-line arrangement (in-line) method refers to that a kind of utilization is arranged with a certain interval on conveyer line and various equipment for performing the techniques such as clean, deposition, etching manufacture a product, while sequentially to transmit the method for the pallet being placed with multiple substrate along described conveyer line.
In described in-line arrangement method, substrate loading system is utilized to be loaded into by substrate on empty pallet, to be sent to the equipment for performing above technique.
According to the substrate loading system of correlation technique, when transmitting empty pallet along substrate conveyer line, being arranged at the mechanical arm at described substrate conveyer line side place by utilization and substrate is loaded on described pallet.
But in aforesaid substrate Load System, along with the expansion of described substrate conveyer line, the area occupied (foot print) of equipment increases and becomes problem.
For overcoming the above problems, a kind of method for the formation of two-layer substrate conveyer line can be considered.But due to can the at substantial time in the part of align substrates, therefore pitch time (tact time) extends, and owing to being multilayer architecture and be difficult to safeguard equipment and repair.
Summary of the invention
Concept of the present invention provides a kind of Apparatus and method for for glassivation and mask, its can solve easily described mask return operation during due to the Contact of described mask and magnetic chuck and the damage problem occurred.Therefore, particle can be prevented and can yield be guaranteed.
Concept of the present invention provides a kind of system and method for mounting substrate, and by utilizing described system and method, the substrate rate of loading is improved compared with existing substrate loading system, and can prevent equipment area occupied from sharply increasing.Therefore, can shorten and load and different pitch times with substrate, thus can boost productivity.
According to an aspect of concept of the present invention, provide a kind of equipment for glassivation and mask, described equipment comprises: mask support unit, supports the mask that mask support unit supports is formed by metal material; Magnetic chuck, to be arranged at above described mask support unit and to produce magnetive attraction to be attached to described mask, between described magnetic chuck and described mask, being gripped with substrate; Magnetic chuck up/down driver element, is connected to described magnetic chuck and for driving described magnetic chuck up and down; And controller, for controlling the operation of described magnetic chuck up/down driver element, to change the position of described magnetic chuck, so prevent described mask return operation during due to the interference of described magnetive attraction, described mask and described magnetic chuck are contacted with each other.
According to the another aspect of concept of the present invention, provide a kind of method for attaching substrates and mask, described method comprises: mask support operates, and is wherein returned by the mask formed by metal material and is supported on mask support unit; And magnetic chuck lock out operation, wherein magnetic chuck is moved up be separated from described mask, described magnetic chuck to be arranged at above described mask support unit and to produce magnetive attraction to be attached to described mask, between described magnetic chuck and described mask, be gripped with substrate.
According to the another aspect of concept of the present invention, provide a kind of substrate loading system, described substrate loading system comprises: pallet conveyer line, is mounted with the pallet of substrate along the transmission of described pallet conveyer line; The substrate line of return, is arranged at the side of described pallet conveyer line, and after described substrate is loaded on described pallet, the described pallet transmitted along described pallet conveyer line returns along the described substrate line of return; And multiple substrates is aimed at and loads chamber, be arranged at the side of described pallet conveyer line and the described substrate line of return, there is multiple substrate loading position, described substrate is aligned at described substrate loading position place and is loaded into along on the described pallet of described pallet conveyer line transmission, and wherein at the substrate loading position place being selected from described multiple substrate loading position, described substrate is aligned and is loaded on described pallet.
According to the another aspect of concept of the present invention, provide a kind of method for mounting substrate, described method comprises: pallet transfer operation, is wherein mounted with the described pallet of substrate along the pallet conveyer line transmission being used for delivery tray; Pallet alignment function, wherein makes described pallet aim in the substrate loading position being selected from described multiple substrate loading position, and described multiple substrate loading position is for being loaded into described base plate alignment the described pallet transmitted along described pallet conveyer line; Base plate alignment and loading operation, be wherein loaded on described pallet by described base plate alignment; And substrate returns operation, wherein make the described pallet being mounted with described substrate return along the substrate line of return, described pallet returns along the described substrate line of return after being loaded described substrate.
Accompanying drawing explanation
Read following detailed description in detail by reference to the accompanying drawings, more clearly will understand the example embodiments of concept of the present invention, wherein:
Fig. 1 illustrates the structure of Organic Light Emitting Diode (OLED);
Fig. 2 to Fig. 9 illustrates the example embodiments according to concept of the present invention, utilizes the equipment being used for attaching substrates and mask sequentially to adhere to the process of described substrate and described mask;
Figure 10 is the example embodiments according to concept of the present invention, for the controlling party block diagram of the equipment of attaching substrates and mask;
Figure 11 is the example embodiments according to concept of the present invention, explains the flow chart of the method being used for attaching substrates and mask;
Figure 12 is another example embodiments according to concept of the present invention, is applied to the described substrate of equipment for attaching substrates and mask and the assembled view of described mask;
Figure 13 is the exploded view of Figure 12;
Figure 14 is the exploded view of mask shown in Figure 13;
Figure 15 is the plane graph of the structure of example support mask sheet material;
Figure 16 is the end view of the substrate loading system of example embodiments according to concept of the present invention;
Figure 17 illustrates the process the first pallet being sent to first substrate " loaded " position from pallet conveyer line;
Figure 18 illustrates the process making the first pallet being mounted with substrate in first substrate stowage position be back to the substrate line of return;
Figure 19 illustrates the process the first pallet being sent to second substrate " loaded " position from pallet conveyer line;
Figure 20 illustrates the process making the second pallet being mounted with substrate in second substrate stowage position be back to the substrate line of return;
Figure 21 is the plane graph of the substrate loading system of another example embodiments according to concept of the present invention;
Figure 22 is the plane graph of the substrate loading system of another example embodiments according to concept of the present invention; And
Figure 23 is another example embodiments according to concept of the present invention, explains the flow chart of the method being used for mounting substrate.
Main element description of symbols
1: substrate loading system
100: mask
130: magnetic chuck
132: magnet
134: pin-and-hole
140: mask support unit
150: controller
151: central processing unit
152: memory
153: support circuit
160: magnetic chuck up/down driver element
170: glass support pin
180: glass steady pin
200: mask
201: base plate supports mask sheet material
202: substrate contacts mask sheet material
203: mask frame
1100: pallet conveyer line
1200: the substrate line of return
1300,1300a, 1300b: multiple substrates is aimed at and loaded chamber
1311: first substrate " loaded " position
1312: second substrate " loaded " position
1330: pallet alignment modules
1340: base plate alignment and loading module
1350: pallet delivery module
1351: curve delivery unit
1400: pallet dispensed chambers
1500: first passage chamber
1500 ': second channel chamber
1600: supply substrate unit
1700: treatment chamber
G: glass
H: hole
R: manipulator
S11 ~ S18: operation
S110 ~ S160: operation
T: pallet
T1: the first pallet
T2: the second pallet
Embodiment
For obtaining fully understanding concept of the present invention and advantage thereof, please refer to the accompanying drawing for illustrating conceptual example embodiment of the present invention.
Below, will explain that by referring to accompanying drawing the example embodiments of concept of the present invention is to describe concept of the present invention in detail.Ref. No. identical in graphic indicates identical element.
Fig. 2 to Fig. 9 illustrates the example embodiments according to concept of the present invention, utilizes the equipment being used for attaching substrates and mask to adhere to the process of described substrate and described mask step by step.Figure 10 is the example embodiments according to concept of the present invention, for the controlling party block diagram of the equipment of attaching substrates and mask.Figure 11 is the example embodiments according to concept of the present invention, explains the flow chart of the method being used for attaching substrates and mask.
With reference to Fig. 2 to Figure 11, attaching substrates is used for (following according to the present embodiment, be called as glass G) be contact for solving in the following manner due to mask 100 or magnetic chuck 130 with the equipment of mask 100 and the damage problem that occurs: the position changing magnetic chuck 130 with prevent mask 100 return operation during due to magnetive attraction, mask 100 and magnetic chuck 130 are contacted with each other, and described equipment 100 can comprise mask support unit 140, magnetic chuck 130, magnetic chuck up/down driver element 160, multiple glass support pin 170, multiple glass steady pin 180, and for controlling the controller 150 of above element.
As a reference, the glass G according to this example embodiments is Organic Light Emitting Diode, and can be the large substrates that size is about 2m × 2m.
Mask support unit 140 is the structures for supporting the mask 100 formed by metal material.
Mask support unit 140 can be for supporting the structure of mask 100 under the state being fixed in a position, and can be the moveable structure that can be carried in process or carry out from process.
Magnetic chuck 130 is arranged to produce magnetive attraction above mask support unit 140, thus is attached to mask 100, is gripped with glass G between magnetic chuck 130 and mask 100.
It is inner that multiple magnets 132 for generation of magnetive attraction are arranged at magnetic chuck 130.
Magnet 132 can be permanent magnet.But, when not existing the interference of environment and be easy to control magnetive attraction, electromagnet can be used to replace magnet 132.
Multiple pin-and-hole 134 is formed between magnet 132.When glass steady pin 180 moves around via pin-and-hole 134, glass G can be fixed.
Although do not illustrate in detail in the drawings, however on magnetic chuck 130 other forming station exponent part, the position being therefore provided with mask 100 mask 100 return the process operation of operation or mask 100 during may change to some extent.The step part be formed on magnetic chuck 130 can be partly removable.
Magnetic chuck up/down driver element 160 is connected to magnetic chuck 130, and drives magnetic chuck 130 up/down to move.
Such as, cylinder or linear motor can be utilized as magnetic chuck up/down driver element 160.
In addition, magnetic chuck up/down driver element 160 can be combined to form by motor and ball-screw (ball screw), for convenience of description, described motor and described ball-screw be schematically illustrated in this example embodiments graphic in.
Glass support pin 170 can move relative to mask support unit 140 up/down, and support glass G to be attached to mask 100 below glass G.
Not only move up due to glass support pin 170 but also move down, therefore glass support pin 170 can be equipped with up/down unit.
Glass steady pin 180 can move relative to magnetic chuck 130 up/down, and fixes the position of glass G with glass support pin 170 as shown in Figure 5.
Because glass steady pin 180 not only moves up as shown in Figures 4 and 5, and move down as shown in Figures 7 and 8, therefore glass steady pin 180 can be equipped with up/down unit.
Controller 150 controls magnetic chuck up/down driver element 160, glass support pin 170 and glass steady pin 180.
Specifically, controller 150 controls the operation of magnetic chuck up/down driver element 160 to change the position of magnetic chuck 130, make mask 100 and magnetic chuck 130 mask 100 return operation during can not contact with each other due to the interference of magnetive attraction.
Specifically, in this example embodiments, controller 150 controls the operation of magnetic chuck up/down driver element 160, make magnetic chuck 130 relative to mask 100 move up with mask 100 return operation during be separated with mask 100.
As shown in Figure 10, controller 150 can comprise central processing unit (central processing unit; CPU) 151, memory 152 and support circuit (support circuit) 153.
In this example embodiments, central processing unit 151 can be the one in the various computer processors of industrial use, for the operation controlling magnetic chuck up/down driver element 160, make magnetic chuck 130 relative to mask 100 move up with mask 100 return operation during be separated with mask 100.
Memory 152 is connected to central processing unit 151.Memory 152 as computer-readable recording medium can be installed on the place of Local or Remote.Such as, memory 152 can be following can at least one in easy-to-use memory: such as random access storage device (random access memory; RAM), read-only memory (read-only memory; ROM), floppy disk, hard disk or digital storage.
Support that circuit 153 and central processing unit 151 couple the typical operation supporting processor.Support that circuit 153 can comprise Cache (cache), power supply, clock circuit, input/output circuitry, subsystem etc.
In this example embodiments, controller 150 controls the operation of magnetic chuck up/down driver element 160, make magnetic chuck 130 relative to mask 100 move up with mask 100 return operation during be separated with mask 100.This series of process can be stored in memory 152.Usually, software routines (software routine) can be stored in memory 152.Software routines also can be stored in another central processing unit (not shown) or by another central processing unit and perform.
Although the process according to concept of the present invention is performed by software routines, but also the performing by hardware at least partially of the process of concept of the present invention.Thus, the process according to concept of the present invention is implemented by the combination of the hardware such as the software, the such as integrated circuit that perform on the computer systems or software restraint.
The process of sequentially attaching substrates and mask is below described.
First, as shown in Figure 2, the mask 100 formed by metal material returned and be supported in (S11) on mask support unit 140.
As shown in Figure 2, what can perform mask 100 when not having glass G returns operation.
Then, as shown in Figure 3, magnetic chuck 130 moves up to be separated (S12) with mask 100.
When magnetic chuck 130 moves up to be separated with mask 100, the distance between magnetic chuck 130 and mask 100 increases, and therefore magnetic chuck 130 and mask 100 can not contact with each other due to the interference of magnetive attraction.
In addition, when magnetic chuck 130 moves up to be separated with mask 100, as shown in Figure 3, space is guaranteed, thus can be conducive to utilizing manipulator R to input glass G.
Then, as shown in Figure 4, utilize manipulator R to be inputted in the upper area of mask 100 by glass G, glass G is supported on the glass support pin 170 moved up simultaneously, and then aim at glass G (S13).
When completing the alignment function of glass G, as shown in Figure 5, by the position (S14) of the glass steady pin 180 fixing glass G moved down relative to magnetic chuck 130.
Then, as shown in Figure 6, glass steady pin 180 and glass support pin 170 move down, thus glass G is placed on (S15) on mask 100.
Then, as shown in Figure 7, magnetic chuck 130 is moved downward to glass G, thus glass G and mask 100 are attached to (S16) each other due to the magnetive attraction of the magnet 132 of magnetic chuck 130.In other words, because the magnetive attraction of magnet 132 attracts mask 100, therefore glass G and mask 100 can be attached to each other.
Be attached to each other at glass G and mask 100, as shown in Figure 8, remove glass support pin 170 and glass steady pin 180 thus be back to its home position (S17).
Then, as shown in Figure 9, magnetic chuck 130 is downward further to be moved towards glass G, with the adhesive force (S18) between reinforcing glass G and mask 100.Therefore, glass G and mask 100 can be made to pass through securely and closely contact with each other and be attached to each other.Operation S18 can not be adopted in some cases.
According to this example embodiments with above structure and operation, by the position that changes magnetic chuck 130 with prevent mask 100 return operation during to make mask 100 and magnetic chuck 130 contact with each other due to the interference of magnetive attraction, the contact due to mask 100 or magnetic chuck 130 can be solved easily and the damage problem that causes.Therefore, particle can be prevented and and then can yield be guaranteed.
Figure 12 is another example embodiments according to concept of the present invention, is applied to the described substrate of equipment for attaching substrates and mask and the assembled view of described mask.Figure 13 is the exploded view of Figure 12.Figure 14 is the exploded view of mask shown in Figure 13.Figure 15 is the plane graph of the structure of example support mask sheet material.
In above-mentioned example embodiments, mask 100 is only described to metal mask.But mask 200 can have the structure as shown in Figure 12 to Figure 15.
With reference to Figure 12 to Figure 15, the mask 200 according to this example embodiments does not have simple sheet form.
In other words, the mask 100 utilized in above-mentioned example embodiments can have single plate shape.
But the mask 200 according to this example embodiments can comprise: multiple mask sheet material 201 and 202 is arranged in multiple layer, Come support glass G close contact glass G; And mask frame 203, be soldered to mask sheet material 201 and 202.
Mask sheet material 201 and 202 is: base plate supports mask sheet material 201, for support glass G; And substrate contacts mask sheet material 202, there is surface contact and close contact glass G with base plate supports mask sheet material 201.
In other words, in this example embodiments, mask sheet material 201 and 202 has the dual structure formed by base plate supports mask sheet material 201 and substrate contacts mask sheet material 202.
As mentioned above, base plate supports mask sheet material 201 support glass G, and substrate contacts mask sheet material 202 close contact glass G and not being lifting.
Therefore, in this example embodiments, the thickness of the Thickness Ratio base plate supports mask sheet material 201 of substrate contacts mask sheet material 202 is thin.
In this example embodiments, the thickness of base plate supports mask sheet material 201 can be about 0.2mm to about 0.3mm, and the thickness of substrate contacts mask sheet material 202 can be about 0.02mm to about 0.02mm.
Multiple hole H can be formed, to bend during attaching process, that is, as making base plate supports mask sheet material 201 bend well and be attached to the means of glass G being made in relatively thick base plate supports mask sheet material 201.
Hole H has slot form respectively as shown in figure 15, and can arrange in turn along the edge of base plate supports mask sheet material 201.
In this example embodiments, base plate supports mask sheet material 201 and both substrate contacts mask sheet materials 202 are formed by the manufacture of invar (Invar) material and be soldered to each other.
Invar material refers to iron by the nickel of 36.5% being added into 63.5% and is formed and have the alloy of low thermal coefficient of expansion.Invar material can be used for the machine (such as, the parts of precision machinery or optical apparatus) that there will be error when size changes along with variations in temperature.
Mask frame 203 is soldered to mask sheet material 201 and 202 in the edge of mask sheet material 201 and 202.When mask sheet material 201 and 202 is soldered to mask frame 203, by stretching solder mask sheet material 201 and 202.
Even if when utilization has the mask 200 of above structure, the effect of concept of the present invention also can be obtained.
Figure 16 is the end view of the substrate loading system of example embodiments according to concept of the present invention.Figure 17 illustrates the process the first pallet being sent to first substrate " loaded " position from pallet conveyer line.Figure 18 illustrates the process making the first pallet being mounted with substrate in first substrate stowage position be back to the substrate line of return.Figure 19 illustrates the process the first pallet being sent to second substrate " loaded " position from pallet conveyer line.Figure 20 illustrates the process making the second pallet being mounted with substrate in second substrate stowage position be back to the substrate line of return.
As shown in Figure 16 to Figure 20, pallet conveyer line 1100, the substrate line of return 1200, multiple substrates aligning can be comprised according to the substrate loading system 1 of this example embodiments and load chamber 1300, pallet dispensed chambers 1400, channel chamber 1500 and supply substrate unit 1600.
Pallet conveyer line 1100 refers to the line for transmitting the pallet T being mounted with glass G.
After glass G is back to treatment chamber 1700 and is unloaded, pallet T is empty pallet.In the concept of the present invention, for the purpose of explaining, be arranged in proximity to each other and be called as the first pallet T1 and the second pallet T2 by the pallet transmitted.
Therefore, the first pallet T1 and the second pallet T2 is sequentially transmitted along pallet conveyer line 1100.
The substrate line of return 1200 is arranged at the side of pallet conveyer line 1100, and refers to and to be transmitted and the line that returns of the pallet T being mounted with glass G along pallet conveyer line 1100 for making.
Pallet conveyer line 1100 can have sandwich construction, with the side place of the upside or downside that are arranged at the substrate line of return 1200.
In this example embodiments, pallet conveyer line 1100 has the sandwich construction for being arranged at below the substrate line of return 1200.Different from this example embodiments, pallet conveyer line 1100 has the sandwich construction for being arranged at above the substrate line of return 1200.Above sandwich construction by according to in-line arrangement technique arrange change design and revised easily.
Thus, because pallet conveyer line 1100 and the substrate line of return 1200 have sandwich construction, the length of conveyer line can therefore be reduced.Thus, can prevent equipment area occupied from sharply increasing.
The side that chamber 1300 is arranged at pallet conveyer line 1100 and the substrate line of return 1200 is aimed at and loaded to multiple substrates, there is multiple substrate loading position 1311 and 1312, glass G is aligned at substrate loading position 1311 and 1312 place and is loaded into along on the pallet T of pallet conveyer line 1100 transmission, and for a substrate loading position place in selected substrate loading position 1311 and 1312, glass G is aimed at and is loaded on pallet T.
Substrate loading position 1311 and 1312 can comprise: first substrate " loaded " position 1311, be arranged at one of the left side and right side of the Return-ing direction relative to the substrate line of return 1200, and be transferred into first substrate " loaded " position 1311 along the first pallet T1 that pallet conveyer line 1100 transmits; And second substrate " loaded " position 1312, be arranged at the side relative with first substrate " loaded " position 1311, and be transferred into second substrate " loaded " position 1312 along the second pallet T2 that pallet conveyer line 1100 transmits.
In this example embodiments, first substrate " loaded " position 1311 is arranged at the right side of the Return-ing direction relative to the substrate line of return 1200, and second substrate " loaded " position 1312 is arranged at the left side of the Return-ing direction relative to the substrate line of return 1200.
First substrate " loaded " position 1311 and second substrate " loaded " position 1312 are positioned at the At The Height of the substrate line of return 1200.
In other words, in this example embodiments, because pallet conveyer line 1100 is arranged in ground floor, and the substrate line of return 1200 is arranged in the second layer, and therefore first substrate " loaded " position 1311 and second substrate " loaded " position 1312 are arranged in the second layer.
When first substrate " loaded " position 1311 and second substrate " loaded " position 1312 are positioned at the At The Height of the substrate line of return 1200, the first pallet T1 and the second pallet T2 can be returned by the shortest route after glass G is loaded.
Chamber 1300 is aimed at and loaded to multiple substrates can comprise base plate alignment and loading module 1340, pallet alignment modules 1330 and pallet delivery module 1350.
Base plate alignment and loading module 1340 are arranged at the side of first substrate " loaded " position 1311 and second substrate " loaded " position 1312, and for glass G being aimed at and being loaded into the pallet T being transferred into first substrate " loaded " position 1311 and second substrate " loaded " position 1312.
As shown in figure 16, base plate alignment and loading module 1340 are arranged at multiple substrates base plate alignment and load above chamber 1300, although and do not illustrate in Figure 17 to Figure 22, but base plate alignment and loading module 1340 are arranged at above first substrate " loaded " position 1311 and second substrate " loaded " position 1312.
After receiving glass G from the supply substrate unit 1600 that is described subsequently, glass G aims at and is loaded into above the pallet T that aims in first substrate " loaded " position 1311 and second substrate " loaded " position 1312 by base plate alignment and loading module 1340.
Pallet alignment modules 1330 be arranged at first substrate " loaded " position 1311 and second substrate " loaded " position 1312 each side and for aiming at pallet T in first substrate " loaded " position 1311 and second substrate " loaded " position 1312.
As Figure 16 illustrates in detail, pallet alignment modules 1330 is arranged at multiple substrates and aims at and load below chamber 1300, although do not illustrate in Figure 17 to Figure 22, but pallet alignment modules 1330 is arranged at below first substrate " loaded " position 1311 and second substrate " loaded " position 1312.
Pallet alignment modules 1330 supports by subsequently by pallet T that the pallet delivery module 1350 be described transmits, raise pallet T relative to pallet delivery module 1350, horizontally rotate pallet T to aim at for supplying the direction of glass G from supply substrate unit 1600 thus being positioned first substrate " loaded " position 1311 or second substrate " loaded " position 1312 place.
Pallet delivery module 1350 carrys out delivery tray T by being connected to the substrate line of return 1200 via first substrate " loaded " position 1311 and second substrate " loaded " position 1312 from pallet conveyer line 1100.
Concept of the present invention graphic in, omit the detailed construction of pallet delivery module 1350, and only illustrate the track of roller (not shown).
In this example embodiments, pallet delivery module 1350 can comprise curve delivery unit 1351, and curve delivery unit 1351 is for being mounted with the pallet T of glass G at each position place of first substrate " loaded " position 1311 and second substrate " loaded " position 1312 along curve transmission.
The pallet T that can make to be mounted with glass G due to curve delivery unit 1351 at each position place of first substrate " loaded " position 1311 and second substrate " loaded " position 1312 along curve movement, as Figure 18 and Figure 20 illustrates (such as moving to position (f) and (f ') respectively from position (e) and (e ')) in detail, therefore pallet T can be made by once transmitting and the direction of advance of the align substrates line of return 1200, thus shorten with substrate return time different pitch times.
Pallet dispensed chambers 1400 is connected to pallet conveyer line 1100 and multiple substrates is aimed at and loads chamber 1300, and optionally distributes the first pallet T1 and the second pallet T2 to first substrate " loaded " position 1311 and second substrate " loaded " position 1312.
Because the first pallet T1 and the second pallet T2 is alternately sent to first substrate " loaded " position 1311 and second substrate " loaded " position 1312, therefore before substrate is loaded on pallet, time for aiming at described pallet in first substrate " loaded " position 1311 and second substrate " loaded " position 1312 can reduce due to pallet dispensed chambers 1400, thus can shorten pitch time.
Channel chamber 1500 and 1500 ' is arranged at pallet dispensed chambers 1400 and aims at multiple substrates and load between chamber 1300, and pallet T is sent to multiple substrates from pallet dispensed chambers 1400 aims at and load chamber 1300.
In this example embodiments, channel chamber 1500 and 1500 ' is arranged at the opposite side place of pallet dispensed chambers 1400, and can comprise: first passage chamber 1500, is arranged at the side of first substrate " loaded " position 1311; And second channel chamber 1500 ', be arranged at the side of second substrate " loaded " position 1312.
Channel chamber 1500 and 1500 ' can comprise pallet risers (not shown), and described pallet risers is used for the height that pallet T is raised from the height corresponding to pallet conveyer line 1100 or is reduced to corresponding to first substrate " loaded " position 1311 and second substrate " loaded " position 1312.
Although do not illustrate pallet risers in graphic, but described pallet risers is arranged in channel chamber 1500 and 1500 ', with by via pallet dispensed chambers 1400 from the pallet T that pallet conveyer line 1100 transmits be increased to corresponding to channel chamber 1500 and 1500 ' ground floor height, be increased to height corresponding to the second layer, and then pallet T is sent to first substrate " loaded " position 1311 and the second substrate " loaded " position 1312 that chamber 1300 was aimed at and loaded to multiple substrates.
Different from the present embodiment, when pallet conveyer line is arranged in the second layer and the substrate line of return is arranged in ground floor, because substrate loading position is arranged in ground floor, therefore pallet risers makes the At The Height at the second layer be reduced to the height of ground floor by the pallet T transmitted, and then pallet T is sent to the substrate loading position that multiple substrates is aimed at and loaded chamber 1300.
Supply substrate unit 1600 is rotatably arranged at multiple substrates and aims at and load the side of chamber 1300, and optionally glass G is provided to first substrate " loaded " position 1311 and second substrate " loaded " position 1312 while of optionally reciprocating between first substrate " loaded " position 1311 and second substrate " loaded " position 1312.
Because glass G can alternately be loaded on pallet T1 and T2 aimed in first substrate " loaded " position 1311 and second substrate " loaded " position 1312 place by supply substrate unit 1600, therefore can reduce for aiming at the time of pallet before mounting substrate, thus can pitch time be shortened.
In the following description, operation and the effect of as above configured substrate loading system 1 are described.
First, as shown in figure 17, first pallet T1 is sent to the position (b) of pallet dispensed chambers 1400 from the position (a) of the pallet conveyer line 1100 of ground floor At The Height, then the first pallet T1 is dispensed to the position (c) of the channel chamber 1500 being positioned at first substrate " loaded " position 1311 side.
When pallet T is increased to the height of the second layer at position (c) place being positioned at channel chamber 1500 by pallet risers from the height of ground floor and is then transferred into multiple substrates aligning and loads chamber 1300, pallet T is transferred into multiple substrates aligning by pallet delivery module 1350 and loads the position (d) of chamber 1300.
When making pallet T on time at first substrate " loaded " position 1311 place by pallet alignment modules 1330, by base plate alignment and loading module 1340, the glass G supplied by supply substrate unit 1600 is aimed to be loaded on the first pallet T1.
Then, as shown in figure 18, when aiming at and load position (e) place of chamber 1300 at multiple substrates, along curve delivery unit 1351, the first pallet T1 being mounted with glass G being sent to position (f), the first pallet T1 is oriented to match with the direction of advance of the substrate line of return 1200 and passes the position (g) of pallet dispensed chambers 1400 and be sent back to the position (h) of the substrate line of return 1200.
The second pallet T2 that Figure 19 and Figure 20 illustrates contiguous first pallet T1 location transmits and the process be transferred back to after being mounted with glass G towards second substrate " loaded " position 1312.
Therefore, according to above-described embodiment, because the first pallet T1 and the second pallet T2 is alternately sent to first substrate " loaded " position 1311 and second substrate " loaded " position 1312, therefore can reduce and aim at each pallet respectively and for aiming at and time of mounting substrate, thus compared with correlation technique shortening pitch time, and then to boost productivity.
Figure 21 is the plane graph of the substrate loading system of another example embodiments according to concept of the present invention.Figure 22 is the plane graph of the substrate loading system of another example embodiments according to concept of the present invention.
Example embodiments shown in Figure 21 is different from the curve delivery unit 1351 that the part of example embodiments shown in Figure 16 is not comprise pallet delivery module 1350.
In this case, although it is disadvantageous that pitch time slightly extends, but advantageously can reduces equipment cost and be easy to carry out safeguarding and repairing.Therefore, in this example embodiments, the productivity ratio of whole equipment can be considered and carry out change in design.
Example embodiments shown in Figure 22 is different from the part of example embodiments shown in Figure 16 and is, multiple substrates is aimed at and is loaded chamber 1300a and 1300b and is divided into the multiple independent chamber with first substrate " loaded " position 1311 and second substrate " loaded " position 1312, and carries out simple designs to pallet delivery module 1350.
In this case, although it is disadvantageous that pitch time slightly extends, but advantageously can reduces equipment cost and be easy to carry out safeguarding and repairing.Therefore, in this example embodiments, the productivity ratio of whole equipment can be considered and carry out change in design.
Figure 23 is another example embodiments according to concept of the present invention, explains the flow chart of the method being used for mounting substrate.
As shown in figure 23, be used for the method for mounting substrate according to the present embodiment and comprise pallet transfer operation (S110), pallet batch operation (S120), pallet descending operation (S130), pallet alignment function (S140), base plate alignment and loading operation (S150) and substrate transfer operation (S160).
In pallet transfer operation (S110) process, when loading glass G, along the pallet conveyer line 1100 delivery tray T being used for delivery tray T.
In pallet batch operation (S120) process, optionally distribute the first pallet T1 and the second pallet T2 towards first substrate " loaded " position 1311 and second substrate " loaded " position 1312.
In pallet descending operation (S130) process, by the height that pallet T raises from the height corresponding to pallet conveyer line 1100 or is reduced to corresponding to first substrate " loaded " position 1311 and second substrate " loaded " position 1312.
In pallet alignment function (S140) process, any one substrate loading position in the substrate loading position being selected from multiple first substrate " loaded " position 1311 and second substrate " loaded " position 1312 makes pallet T aim at, and described multiple first substrate " loaded " position 1311 and second substrate " loaded " position 1312 are for aiming at glass G and being loaded into the pallet T transmitted along pallet conveyer line 1100.
In base plate alignment and loading operation (S150) process, glass G is aimed at and is loaded on pallet T.
In substrate transfer operation (S160) process, making after glass G is loaded on pallet T, to transmit the pallet T being mounted with glass G along the substrate line of return 1200.
Thus, according to the present embodiment, provide and wherein make base plate alignment and the multiple substrate loading position be loaded on pallet, and described pallet is alternately sent to these substrate loading position to load.Therefore, compared with the substrate loading system of correlation technique, the substrate rate of loading can be improved and can prevent equipment area occupied from sharply increasing.Generally, can shorten and load and different pitch times with substrate, thus can boost productivity.
According to these example embodiments, can solve easily mask return operation during due to the Contact of mask and magnetic chuck and the damage problem caused.Therefore, can particle be prevented, thus can yield be guaranteed.
In addition, according to these example embodiments, wherein make base plate alignment and the multiple substrate loading position be loaded on pallet, therefore compared with the substrate loading system of correlation technique owing to providing, the substrate rate of loading can be improved, and can prevent equipment area occupied from sharply increasing.Generally, can shorten and load and different pitch times with substrate, thus can boost productivity.
Although show especially with reference to the example embodiments of concept of the present invention and describe concept of the present invention, but should be understood that the change can made under the condition of the spirit and scope that do not deviate from following claims in various forms and details.
Claims (31)
1., for an equipment for glassivation and mask, it is characterized in that, comprising:
Mask support unit, supports the mask formed by metal material;
Magnetic chuck, to be arranged at above described mask support unit and to produce magnetive attraction to be attached to described mask, between described magnetic chuck and described mask, being gripped with substrate;
Magnetic chuck up/down driver element, is connected to described magnetic chuck and drives described magnetic chuck up and down; And
Controller, controls the operation of described magnetic chuck up/down driver element, to change the position of described magnetic chuck, and then prevent described mask return operation during due to the interference of described magnetive attraction, described mask and described magnetic chuck are contacted with each other.
2. equipment as claimed in claim 1, it is characterized in that, described controller controls the operation of described magnetic chuck up/down driver element, and to make during returning operation described in described mask, described magnetic chuck moves up to be separated from described mask relative to described mask.
3. equipment as claimed in claim 1, it is characterized in that, also comprise the multiple glass support pins controlled by described controller, described multiple glass support pin is configured to move up and down relative to described mask support unit and from described substrate supported underneath for being attached to the described substrate of described mask.
4. equipment as claimed in claim 3, it is characterized in that, also comprise the multiple glass steady pins controlled by described controller, described multiple glass steady pin is configured to move up and down relative to described magnetic chuck and fix the position of described substrate with multiple base plate supports pin.
5. equipment as claimed in claim 1, it is characterized in that, described magnetic chuck comprises multiple magnet, and multiple pin-and-hole is formed between described multiple magnet.
6. equipment as claimed in claim 5, it is characterized in that, described multiple magnet is permanent magnet.
7. equipment as claimed in claim 1, it is characterized in that, described mask comprises mask sheet material, and described mask sheet material is formed multiple layers of form, supports described substrate and substrate described in close contact.
8. equipment as claimed in claim 7, it is characterized in that, described mask also comprises mask frame, and described mask frame is soldered to the described mask sheet material in multiple layers of form.
9. equipment as claimed in claim 7, it is characterized in that, the described mask sheet material in multiple layers of form comprises:
Base plate supports mask sheet material, supports described substrate; And
, there is surface contact and substrate described in close contact with described base plate supports mask sheet material in substrate contacts mask sheet material.
10. equipment as claimed in claim 9, it is characterized in that, the thickness of described substrate contacts mask sheet material is less than the thickness of described base plate supports mask sheet material.
11. equipment as claimed in claim 9, is characterized in that, the thickness of described base plate supports mask sheet material is about 0.2mm to about 0.3mm, and the thickness of described substrate contacts mask sheet material is about 0.02mm to about 0.02mm.
12. equipment as claimed in claim 9, is characterized in that, described base plate supports mask sheet material and described substrate contacts mask sheet material are formed by invar material and be soldered to each other.
13. equipment as claimed in claim 9, is characterized in that, in described base plate supports mask sheet material, form multiple hole to bend.
14. equipment as claimed in claim 13, is characterized in that, described multiple hole has slot form respectively and edge along described base plate supports mask sheet material arranges in turn.
15. equipment as claimed in claim 1, it is characterized in that, described substrate is Organic Light Emitting Diode, and described substrate is size is about the large substrates of 2m × 2m.
16. 1 kinds of methods for attaching substrates and mask, it is characterized in that, described method comprises:
Mask support operates, and is wherein returned by the mask formed by metal material and is supported on mask support unit; And
Magnetic chuck lock out operation, wherein magnetic chuck is moved up be separated from described mask, described magnetic chuck to be arranged at above described mask support unit and to produce magnetive attraction to be attached to described mask, between described magnetic chuck and described mask, be gripped with substrate.
17. methods as claimed in claim 16, is characterized in that, also comprise after described magnetic chuck lock out operation:
Base plate supports and alignment function, to be wherein arranged at described substrate above described mask and to support and in alignment with on the multiple base plate supports pins moved up;
Substrate position fixing operation, the multiple substrate steady pins wherein by moving down relative to described magnetic chuck fix the position of described substrate;
Substrate holds operation, and wherein said multiple substrate steady pin and described multiple base plate supports pin move down and be thus contained on described mask by described substrate; And
Substrate and mask adhesion operate, and wherein said magnetic chuck is moved downward on described substrate, and thus by the magnetive attraction of described magnetic chuck by described substrate and described mask adhesion to each other.
18. methods as claimed in claim 17, is characterized in that, also comprise after described substrate and mask adhesion operate:
Pin removes operation, wherein removes described multiple base plate supports pin and described multiple substrate steady pin; And
Additional attach operation, wherein said magnetic chuck moves down further towards described substrate, and thus increases the adhesive force between described substrate and described mask.
19. 1 kinds of substrate loading system, is characterized in that, comprising:
Pallet conveyer line, is mounted with the pallet of substrate along the transmission of described pallet conveyer line;
The substrate line of return, is arranged at the side of described pallet conveyer line, and after described substrate is loaded on described pallet, the described pallet transmitted along described pallet conveyer line returns along the described substrate line of return; And
Multiple substrates is aimed at and is loaded chamber, be arranged at the side of described pallet conveyer line and the described substrate line of return, there is multiple substrate loading position, described substrate is aligned at described substrate loading position place and is loaded into along on the described pallet of described pallet conveyer line transmission, and wherein at the substrate loading position place being selected from described multiple substrate loading position, described substrate is aligned and is loaded on described pallet.
20. substrate loading system as claimed in claim 19, it is characterized in that, described multiple substrate loading position comprises:
First substrate " loaded " position, is positioned at one of the left side and right side of the substrate Return-ing direction relative to the described substrate line of return, and the first pallet wherein transmitted along described pallet conveyer line is transmitted; And
Second substrate " loaded " position, is arranged at the side relative with described first substrate " loaded " position, and the second pallet wherein transmitted along described pallet conveyer line is transmitted.
21. substrate loading system as claimed in claim 20, it is characterized in that, also comprise pallet dispensed chambers, described pallet dispensed chambers is connected to described pallet conveyer line and described multiple substrates is aimed at and loads chamber, and optionally distributes described first pallet and described second pallet towards described first substrate " loaded " position and described second substrate " loaded " position.
22. substrate loading system as claimed in claim 21, it is characterized in that, also comprise channel chamber, described channel chamber is arranged at described pallet dispensed chambers and aims at described multiple substrates and load between chamber, and described pallet is sent to described multiple substrates aligning from described pallet dispensed chambers and loads chamber.
23. substrate loading system as claimed in claim 20, it is characterized in that, also comprise supply substrate unit, described supply substrate unit is rotatably arranged at described multiple substrates and aims at and load the side of chamber, and the while of optionally reciprocating between described first substrate " loaded " position and described second substrate " loaded " position, described substrate is optionally supplied to described first substrate " loaded " position and described second substrate " loaded " position.
24. substrate loading system as claimed in claim 19, is characterized in that, described multiple substrates is aimed at and loaded chamber and comprises:
Base plate alignment and loading module, be arranged at the side of described multiple substrate loading position, and by described base plate alignment and be loaded into be transferred into described multiple substrate loading position described pallet on; And
Pallet alignment modules, is arranged at the side of described multiple substrate loading position and aims at described pallet in described multiple substrate loading position.
25. substrate loading system as claimed in claim 19, it is characterized in that, described multiple substrates is aimed at and is loaded chamber and also comprises pallet delivery module, described pallet delivery module is connected to the described substrate line of return from described pallet conveyer line via described multiple substrate loading position, and transmits described pallet.
26. substrate loading system as claimed in claim 25, it is characterized in that, described pallet delivery module comprises curve delivery unit, and each place of described curve delivery unit in described multiple substrate loading position is mounted with the described pallet of described substrate along curve transmission.
27. substrate loading system as claimed in claim 22, it is characterized in that, described pallet conveyer line has sandwich construction, and to be arranged at one of upside and the downside place of the described substrate line of return, and described multiple substrate loading position is positioned at the height corresponding with the described substrate line of return.
28. substrate loading system as claimed in claim 27, it is characterized in that, described channel chamber comprises pallet risers, the height that described pallet raises from the height corresponding to described pallet conveyer line or is reduced to corresponding to described multiple substrate loading position by described pallet risers.
The method of 29. 1 kinds of mounting substrates, is characterized in that, described method comprises:
Pallet transfer operation, is wherein mounted with the described pallet of substrate along the pallet conveyer line transmission of delivery tray;
Pallet alignment function, wherein makes described pallet aim in the substrate loading position being selected from multiple substrate loading position, is loaded on the described pallet that transmits along described pallet conveyer line at described multiple substrate loading position place by described base plate alignment;
Base plate alignment and loading operation, be wherein loaded on described pallet by described base plate alignment; And
Substrate returns operation, and wherein make the described pallet being mounted with described substrate return along the substrate line of return, described pallet returns along the described substrate line of return after being loaded described substrate.
30. methods as claimed in claim 29, it is characterized in that, described multiple substrate loading position comprises:
First substrate " loaded " position, is arranged at one of the left side and right side of the substrate Return-ing direction relative to the described substrate line of return, and the first pallet wherein transmitted along described pallet conveyer line is transmitted; And
Second substrate " loaded " position, is arranged at the side relative with described first substrate " loaded " position, and the second pallet wherein transmitted along described pallet conveyer line is transmitted, and
Described method also comprises pallet batch operation after described pallet transfer operation, and wherein said first pallet and described second pallet are optionally dispensed to described first substrate " loaded " position and described second substrate " loaded " position.
31. methods as claimed in claim 30, it is characterized in that, described pallet conveyer line has sandwich construction, to be arranged at one of upside and the downside place of the described substrate line of return, and described multiple substrate loading position is positioned at the height corresponding with the described substrate line of return, and
Described method also comprises pallet descending operation after described pallet batch operation, the height that the height wherein described pallet being corresponded to described pallet conveyer line certainly raises or is reduced to corresponding to described multiple substrate loading position.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201611051220.2A CN106784394B (en) | 2013-12-30 | 2014-08-29 | System and method for the device and method of glassivation and mask and for loading substrate |
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| Application Number | Priority Date | Filing Date | Title |
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| KR1020130166382A KR101537967B1 (en) | 2013-12-30 | 2013-12-30 | Apparatus and method for attaching glass and mask |
| KR10-2013-0166385 | 2013-12-30 | ||
| KR10-2013-0166382 | 2013-12-30 | ||
| KR1020130166385A KR101570074B1 (en) | 2013-12-30 | 2013-12-30 | An apparatus and method to load substrate |
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| CN201611051220.2A Division CN106784394B (en) | 2013-12-30 | 2014-08-29 | System and method for the device and method of glassivation and mask and for loading substrate |
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| CN104752636B CN104752636B (en) | 2017-08-15 |
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| CN201410438438.8A Active CN104752636B (en) | 2013-12-30 | 2014-08-29 | System and method for the device and method of glassivation and mask and for loading substrate |
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| CN104862664A (en) * | 2015-05-19 | 2015-08-26 | 南通大学 | Preparation method of ultrathin graphical aluminium oxide film |
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| CN106784394B (en) | 2018-10-09 |
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