CN104752636B - System and method for the device and method of glassivation and mask and for loading substrate - Google Patents
System and method for the device and method of glassivation and mask and for loading substrate Download PDFInfo
- Publication number
- CN104752636B CN104752636B CN201410438438.8A CN201410438438A CN104752636B CN 104752636 B CN104752636 B CN 104752636B CN 201410438438 A CN201410438438 A CN 201410438438A CN 104752636 B CN104752636 B CN 104752636B
- Authority
- CN
- China
- Prior art keywords
- substrate
- mask
- magnetic chuck
- pallet
- sheet material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
Abstract
A kind of equipment for glassivation and mask, including：Mask support unit, for supporting the mask formed by metal material；Magnetic chuck, is arranged above mask support unit and produces magnetive attraction to be attached to the mask, substrate is gripped between the magnetic chuck and the mask；Magnetic chuck up/down driver element, is connected to the magnetic chuck and for driving the magnetic chuck up and down；And controller, the operation for controlling the magnetic chuck up/down driver element, to change the position of the magnetic chuck and then prevent from making the mask contact with each other with the magnetic chuck due to the interference of magnetive attraction during the return operation of the mask.
Description
Technical field
Concept of the present invention is related to a kind of device and method for glassivation and mask and is for load substrate
System and method.
Background technology
Panel display apparatus includes liquid crystal display (liquid crystal display；LCD), plasma shows face
Plate (plasma display panel；PDP), Organic Light Emitting Diode (organic light-emitting diode；
OLED) etc..Fig. 1 illustrates the structure of Organic Light Emitting Diode.Reference picture 1, Organic Light Emitting Diode be by substrate sequentially
Layers below is stacked to be formed：Anode, hole injection layer (hole injection layer；HIL), hole transmission layer (hole
transfer layer；HTL), luminescent layer (emitting layer；EL), hole blocking layer, electron transfer layer (electron
transfer layer；ETL), electron injecting layer (electron transfer layer；EIL), negative electrode etc..
In the general introduction of Organic Light Emitting Diode shown in Fig. 1, Organic Light Emitting Diode includes anode, negative electrode and set
Luminescent layer between the anode and the negative electrode.During operation, hole is injected into luminescent layer from anode, and electronics
It is injected into from negative electrode in luminescent layer.The hole and the electronics are coupled to each other in luminescent layer, so as to produce exciton
(exciton).When the exciton self-excitation state fades to ground state, it will light.
Organic Light Emitting Diode can be classified into monochromatic (monochromatic) organic hair according to the color to be reproduced
Optical diode and panchromatic (full-color) Organic Light Emitting Diode.Full-color organic light emitting diode is equipped with according to former as light
The red (R) of color, green (G) and blue (B) and the luminescent layer being patterned, and then reproduce panchromatic.
In full-color organic light emitting diode, luminescent layer can be performed in a variety of ways according to the material for forming luminescent layer
Patterning.
For by the Organic Light Emitting Diode deposition process of luminous pattern layers using fine metal mask (fine
metal mask；FMM level deposition method), using laser induced thermal imaging (laser induced thermal
imaging；LITI) method of technology, the method using colour filter, small mask scanning (small mask scanning；SMS)
Deposition process etc..
Metal mask is generally used for fine metal mask level deposition method.Sunk to perform the fine metal mask level
Product method, can be used the pallet for carrying mask intimate contact with one another and substrate.
In the related art, due to being provided with the position of mask and the magnet for attracting the mask by magnetive attraction
Space between plate (that is, magnetic chuck) is very narrow because of structure limitation, therefore during the return operation of the mask (i.e.,
When the mask return and during without substrate) mask and the magnetic chuck that are formed by metal be likely to due to magnetive attraction that
This interference.
When mask and magnetic chuck are contacted with each other due to the interference of magnetive attraction, can damage mask and magnetic chuck so as to
It is not reused, or particle can be produced to cause substrate defect occur.Therefore, it is possible to decrease yield, thus urgently
Need to carry out structure compensation to these problems.
In-line arrangement (in-line) method refers to that a kind of utilize is arranged at intervals and clear for performing on transmission line with a certain
The various equipment of the techniques such as clean, deposition, etching manufacture product, are placed with multiple substrates while sequentially being transmitted along the transmission line
Pallet method.
In the in-line arrangement method, on the pallet that substrate is loaded into sky using substrate loading system, transmitted
Equipment to being used to perform process above.
According to the substrate loading system of correlation technique, when transmitting empty pallet along substrate transmission line, by using setting
Mechanical arm at the substrate transmission line side and substrate is loaded on the pallet.
However, in aforesaid substrate Load System, with the extension of the substrate transmission line, the area occupied of equipment
(foot print) increase turns into problem.
To solve problem above, it is contemplated that a kind of method for forming two-layer substrate transmission line.However, due in alignment
It can be taken considerable time in the part of substrate, therefore pitch time (tact time) extends, and due to difficult for multilayer architecture
To be safeguarded and be repaired to equipment.
The content of the invention
Concept of the present invention provides a kind of device and method for glassivation and mask, and it can be solved described easily
Due to the damage problem for contacting and occurring between the mask and magnetic chuck during the return operation of mask.It is therefore possible to prevent
Produce particle and can ensure that yield.
Concept of the present invention provides a kind of system and method for being used to load substrate, by using the system and method, with
Existing substrate loading system is improved compared to the substrate rate of loading, and can prevent equipment area occupied from drastically increasing.Therefore,
It can shorten and be loaded and different pitch times with substrate, so as to improve productivity ratio.
According to the one side of concept of the present invention, there is provided a kind of equipment for glassivation and mask, the equipment bag
Include：Mask support unit, the mask that support mask support unit supports are formed by metal material；Magnetic chuck, is arranged at described
Mask support unit top simultaneously produces magnetive attraction to be attached to the mask, sandwiched between the magnetic chuck and the mask
There is substrate；Magnetic chuck up/down driver element, is connected to the magnetic chuck and for driving the magnetic chuck up and down；With
And controller, the operation for controlling the magnetic chuck up/down driver element, to change the position of the magnetic chuck, enter
And prevent from making the mask and the magnetic chuck due to the interference of the magnetive attraction during the return operation of the mask
Contact with each other.
According to the another aspect of concept of the present invention, there is provided a kind of method for attaching substrates and mask, methods described bag
Include：Mask support is operated, wherein returning to and being supported on mask support unit the mask formed by metal material；And magnetic
Chuck lock out operation, wherein magnetic chuck is moved up to be separated from the mask, the magnetic chuck is arranged at described
Mask support unit top simultaneously produces magnetive attraction to be attached to the mask, sandwiched between the magnetic chuck and the mask
There is substrate.
According to the another aspect of concept of the present invention there is provided a kind of substrate loading system, the substrate loading system includes：Support
Disk transmission line, the pallet for being mounted with substrate is transmitted along the pallet transmission line；The substrate line of return, is arranged at the pallet transmission line
Side, and after the substrate is loaded on the pallet, the pallet edge transmitted along the pallet transmission line
The substrate line of return is returned；And multiple substrates alignment and loading chamber, it is arranged at the pallet transmission line and the substrate
The side of the line of return, with multiple substrate loading positions, the substrate is aligned and is loaded at the substrate loading position
On the pallet transmitted along the pallet transmission line, and wherein in the substrate dress selected from the multiple substrate loading position
Carry at position, the substrate is aligned and is loaded on the pallet.
According to the another aspect of concept of the present invention there is provided a kind of method for loading substrate, methods described includes：Pallet
Transfer operation, wherein being mounted with the pallet of substrate along the pallet transmission line transmission for being used for delivery tray；Pallet alignment function,
Wherein it is directed at the pallet in a substrate loading position selected from the multiple substrate loading position, the multiple substrate dress
Carrying position is used for the base plate alignment and is loaded into the pallet transmitted along the pallet transmission line；Base plate alignment and dress
Operation is carried, wherein by the base plate alignment and being loaded on the pallet；And substrate returns to operation, wherein making to be mounted with described
The pallet of substrate is returned along the substrate line of return, and the pallet is returned after the substrate has been loaded along the substrate line of return
Return.
Brief description of the drawings
It is read in conjunction with the figure described further below, it will the example embodiments of concept of the present invention are more clearly understood, its
In：
Fig. 1 illustrates the structure of Organic Light Emitting Diode (OLED)；
Fig. 2 to Fig. 9 illustrates the example embodiments according to concept of the present invention, utilizes the equipment for attaching substrates and mask
Sequentially to adhere to the process of the substrate and the mask；
Figure 10 is the example embodiments according to concept of the present invention, for attaching substrates and the control block of the equipment of mask
Figure；
Figure 11 is the example embodiments according to concept of the present invention, explains the flow of the method for attaching substrates and mask
Figure；
Figure 12 is another example embodiments according to concept of the present invention, using the equipment extremely for attaching substrates and mask
The substrate and the mask assembled view；
Figure 13 is Figure 12 exploded view；
Figure 14 is the exploded view of mask shown in Figure 13；
Figure 15 is the plan of the structure of example support mask sheet material；
Figure 16 is the side view of the substrate loading system of the example embodiments according to concept of the present invention；
Figure 17 illustrates the process that the first pallet is sent to first substrate " loaded " position from pallet transmission line；
Figure 18, which is illustrated, to be made to be back to the substrate line of return in the first pallet that first substrate stowage position is mounted with substrate
Process；
Figure 19 illustrates the process that the first pallet is sent to second substrate " loaded " position from pallet transmission line；
Figure 20, which is illustrated, to be made to be back to the substrate line of return in the second pallet that second substrate stowage position is mounted with substrate
Process；
Figure 21 is the plan of the substrate loading system of another example embodiments according to concept of the present invention；
Figure 22 is the plan of the substrate loading system of another example embodiments according to concept of the present invention；And
Figure 23 is another example embodiments according to concept of the present invention, explains the flow of the method for loading substrate
Figure.
Main element description of symbols
1：Substrate loading system
100：Mask
130：Magnetic chuck
132：Magnet
134：Pin-and-hole
140：Mask support unit
150：Controller
151：Central processing unit
152：Memory
153：Support circuit
160：Magnetic chuck up/down driver element
170：Glass support pin
180：Glass steady pin
200：Mask
201：Substrate supports mask sheet material
202：Substrate contact mask sheet material
203：Mask frame
1100：Pallet transmission line
1200：The substrate line of return
1300、1300a、1300b：Multiple substrates are directed at and loaded chamber
1311：First substrate " loaded " position
1312：Second substrate " loaded " position
1330：Pallet alignment modules
1340：Base plate alignment and loading module
1350：Pallet delivery module
1351：Curve delivery unit
1400：Pallet dispensed chambers
1500：First passage chamber
1500’：Second channel chamber
1600：Supply substrate unit
1700：Processing chamber housing
G：Glass
H：Hole
R：Manipulator
S11~S18：Operation
S110~S160：Operation
T：Pallet
T1：First pallet
T2：Second pallet
Embodiment
Concept of the present invention and its advantage are fully understood to obtain, be refer to real for illustrating conceptual example of the present invention
Apply the accompanying drawing of example.
Hereinafter, the general of the present invention is described in detail the example embodiments of concept of the present invention are explained by referring to accompanying drawing
Read.Identical Ref. No. indicates identical element in schema.
Fig. 2 to Fig. 9 illustrates the example embodiments according to concept of the present invention, utilizes the equipment for attaching substrates and mask
To adhere to the process of the substrate and the mask step by step.Figure 10 is the example embodiments according to concept of the present invention, is used for
The control block of the equipment of attaching substrates and mask.Figure 11 is the example embodiments according to concept of the present invention, and explaining is used for
The flow chart of the method for attaching substrates and mask.
Reference picture 2 is used for setting for attaching substrates (following, to be referred to as glass G) and mask 100 to Figure 11 according to the present embodiment
Standby is the damage for solving the problems, such as to occur due to the contact of mask 100 or magnetic chuck 130 in the following manner：Change magnetic
Property chuck 130 position with prevent mask 100 return operation during make mask 100 and magnetic chuck due to magnetive attraction
130 contact with each other, and the equipment 100 may include that mask support unit 140, magnetic chuck 130, magnetic chuck up/down are driven
Moving cell 160, multiple glass support pins 170, multiple glass steady pins 180 and the controller for controlling above element
150。
Organic Light Emitting Diode according to the glass G of this example embodiments as reference, and can be size about 2m ×
2m large substrates.
Mask support unit 140 is the structure for supporting the mask 100 formed by metal material.
Mask support unit 140 can be the structure for being used to support mask 100 in the state of being fixed at a position,
And can be the moveable structure carried out during being carried or from process.
Magnetic chuck 130 is arranged at the top of mask support unit 140 to produce magnetive attraction, so that mask 100 is attached to,
Glass G is gripped between magnetic chuck 130 and mask 100.
Multiple magnets 132 for producing magnetive attraction are arranged inside magnetic chuck 130.
Magnet 132 can be permanent magnet.However, when in the absence of the interference to environment and easily controllable magnetive attraction, can
Replace magnet 132 using electromagnet.
Multiple pin-and-holes 134 are formed between magnet 132.When glass steady pin 180 moves back and forth via pin-and-hole 134, glass
Glass G can be fixed.
Although not illustrating in detail in the drawings, but step part is additionally formed on magnetic chuck 130, therefore be provided with
The position of mask 100 may be varied from during the return operation or the processing of mask 100 operation of mask 100.It is formed at
Step part on magnetic chuck 130 can partly may move.
Magnetic chuck up/down driver element 160 is connected to magnetic chuck 130, and drives the up/down of magnetic chuck 130 to move.
For example, being used as magnetic chuck up/down driver element 160 using cylinder or linear motor.
In addition, magnetic chuck up/down driver element 160 with ball-screw (ball screw) can combine shape by motor
Into, for convenience of description for the sake of, the motor and the ball-screw are schematically illustrated in the schema of this example embodiments
In.
Glass support pin 170 can be moved relative to the up/down of mask support unit 140, and support glass G with from glass G
Lower section is attached to mask 100.
Because glass support pin 170 is not only moved up but also moved down, therefore glass support pin 170 can be equipped with
Up/down unit.
Glass steady pin 180 can be moved relative to the up/down of magnetic chuck 130, and as shown in Figure 5 with glass support pin
170 fix glass G position.
Because glass steady pin 180 is not only moved up as shown in Figures 4 and 5, and as shown in Figures 7 and 8 to moving down
It is dynamic, therefore glass steady pin 180 can be equipped with up/down unit.
The control magnetic chuck up/down of controller 150 driver element 160, glass support pin 170 and glass steady pin 180.
Specifically, controller 150 controls the operation of magnetic chuck up/down driver element 160 to change magnetic chuck 130
Position so that mask 100 and magnetic chuck 130 during the return operation of mask 100 will not due to magnetive attraction interference and
Contact with each other.
Specifically, in this example embodiments, the behaviour of the control magnetic chuck up/down of controller 150 driver element 160
Make so that magnetic chuck 130 relative to mask 100 move up with during the return of mask 100 is operated with 100 points of mask
From.
As shown in Figure 10, controller 150 may include central processing unit (central processing unit；CPU)151、
Memory 152 and support circuit (support circuit) 153.
In this example embodiments, during central processing unit 151 can be the various computer processors industrially used
One kind, for control magnetic chuck up/down driver element 160 operation so that magnetic chuck 130 is relative to mask 100
Move up to separate with mask 100 during the return of mask 100 is operated.
Memory 152 is connected to central processing unit 151.It can be installed as the memory 152 of computer-readable recording medium
In the place of Local or Remote.For example, memory 152 can be at least one of following readily available memory：Example
Such as random access storage device (random access memory；RAM), read-only storage (read-only memory；ROM)、
Floppy disk, hard disk or digital storage.
Circuit 153 is supported to couple to support the typical operation of processor with central processing unit 151.Circuit 153 is supported to wrap
Include Cache (cache), power supply, clock circuit, input/output circuitry, subsystem etc..
In this example embodiments, the operation of the control magnetic chuck up/down of controller 150 driver element 160 so that magnetic
Property chuck 130 relative to mask 100 move up with the return of mask 100 operate during separated with mask 100.This is a series of
Process be storable in memory 152.Generally, software routines (software routine) are storable in memory 152.
Software routines may be alternatively stored in another central processing unit (not shown) or be performed by another central processing unit.
Although being performed according to the process of concept of the present invention by software routines, but the process of concept of the present invention is at least
A part can also be performed by hardware.Consequently, it is possible to can be by the software, such as integrated circuit that perform on the computer systems
Implement the process according to concept of the present invention Deng combining for hardware or software and hardware.
The process of sequentially attaching substrates and mask is described below.
First, as shown in Fig. 2 making the mask 100 formed by metal material return and be supported on mask support unit 140
(S11)。
As shown in Fig. 2 the return operation of mask 100 can be performed in the case of without glass G.
Then, as shown in figure 3, magnetic chuck 130 moves up to separate (S12) with mask 100.
When magnetic chuck 130 is moved up to be separated with mask 100, the distance between magnetic chuck 130 and mask 100
Increase, therefore magnetic chuck 130 will not be contacted with each other with mask 100 due to the interference of magnetive attraction.
In addition, when magnetic chuck 130 is moved up to be separated with mask 100, as shown in figure 3, space is ensured, from
And can be conducive to utilizing manipulator R input glass G.
Then, as shown in figure 4, being inputted glass G using manipulator R in the upper area of mask 100, while by glass G
It is supported on the glass support pin 170 moved up, and then is directed at glass G (S13).
When completing glass G alignment function, as shown in figure 5, being consolidated by the glass moved down relative to magnetic chuck 130
Glass G position (S14) is fixed in rationed marketing 180.
Then, as shown in fig. 6, glass steady pin 180 and glass support pin 170 are moved down, so that glass G be placed on
On mask 100 (S15).
Then, as shown in fig. 7, magnetic chuck 130 is moved downward to glass G, so that glass G and mask 100 are due to magnetic
The magnetive attraction of the magnet 132 of property chuck 130 and be attached to (S16) each other.In other words, due to the magnetic gravitational attraction of magnet 132
Mask 100, therefore glass G and mask 100 can be attached to each other.
After glass G and mask 100 are attached to each other, as shown in figure 8, removing glass support pin 170 and glass steady pin
180 so that be back to its home position (S17).
Then, as shown in figure 9, magnetic chuck 130 is further moved downwardly toward glass G, with reinforcing glass G and mask 100
Between adhesive force (S18).Therefore, glass G can be made to be attached to that by contacting with each other securely and closely with mask 100
This.Operation S18 can not be used in some cases.
According to this example embodiments with above structure and operation, by change the position of magnetic chuck 130 to prevent
Only mask 100 is set to be contacted with each other with magnetic chuck 130 due to the interference of magnetive attraction during the return operation of mask 100, can
The damage caused due to the contact of mask 100 or magnetic chuck 130 is solved the problems, such as easily.It is therefore possible to prevent producing particle
And and then can ensure that yield.
Figure 12 is another example embodiments according to concept of the present invention, using the equipment extremely for attaching substrates and mask
The substrate and the mask assembled view.Figure 13 is Figure 12 exploded view.Figure 14 is the exploded view of mask shown in Figure 13.
Figure 15 is the plan of the structure of example support mask sheet material.
In examples detailed above embodiment, mask 100 is merely described as metal mask.However, mask 200 can have as schemed
Structure shown in 12 to Figure 15.
Reference picture 12 does not have simple sheet form to Figure 15 according to the mask 200 of this example embodiments.
In other words, the mask 100 utilized in examples detailed above embodiment can have single plate shape.
However, may include according to the mask 200 of this example embodiments：Multiple mask sheet materials 201 and 202 are located at multiple layers
In, Come support glass G are simultaneously in close contact glass G；And mask frame 203, it is soldered to mask sheet material 201 and 202.
Mask sheet material 201 and 202 is：Substrate support mask sheet material 201, for supporting glass G；And substrate contact mask
, there is surface with substrate support mask sheet material 201 and contact and be in close contact glass G in sheet material 202.
In other words, in this example embodiments, mask sheet material 201 and 202 has supports mask sheet material 201 by substrate
And the dual structure of the formation of substrate contact mask sheet material 202.
As described above, substrate support mask sheet material 201 supports glass G, and substrate contact mask sheet material 202 is in close contact glass
Glass G is without being lifted.
Therefore, in this example embodiments, the thickness ratio substrate support mask sheet material of substrate contact mask sheet material 202
201 thickness of thin.
In this example embodiments, the thickness of substrate support mask sheet material 201 can be about 0.2mm to about 0.3mm, and base
The thickness of plate contact mask sheet material 202 can be about 0.02mm to about 0.02mm.
Multiple hole H can be formed in the substrate for being made relative thick supports mask sheet material 201, with during attaching process
Bent, i.e. be used as the means for making substrate support mask sheet material 201 to bend and be attached to glass G well.
Hole H has slot form as shown in figure 15 respectively, and along substrate the edge of mask sheet material 201 can be supported sequentially to arrange
Row.
In this example embodiments, substrate support mask sheet material 201 is by Yin with both substrate contact mask sheet materials 202
Steel (Invar) material manufacture is formed and is soldered to each other.
Invar material refers to be formed by the iron by 36.5% nickel added to 63.5% and has low thermal expansion system
Several alloys.Invar material can be used for the machine that error occurs when size changes with temperature change (for example, accurate machine
The parts of device or optical apparatus).
Mask frame 203 is soldered to mask sheet material 201 and 202 in the edge of mask sheet material 201 and 202.Work as mask sheet
, can be by stretching come solder mask sheet material 201 and 202 when material 201 and 202 is soldered to mask frame 203.
Even if when using the mask 200 with above structure, can also obtain the effect of concept of the present invention.
Figure 16 is the side view of the substrate loading system of the example embodiments according to concept of the present invention.Figure 17 is illustrated the
One pallet is sent to the process of first substrate " loaded " position from pallet transmission line.Figure 18, which is illustrated, to be made in first substrate stowage position
The first pallet for being mounted with substrate is back to the process of the substrate line of return.Figure 19, which is illustrated, transmits the first pallet from pallet transmission line
To the process of second substrate " loaded " position.Figure 20, which is illustrated, to be made to return in the second pallet that second substrate stowage position is mounted with substrate
It is back to the process of the substrate line of return.
As shown in Figure 16 to Figure 20, pallet transmission line may include according to the substrate loading system 1 of this example embodiments
1100th, the substrate line of return 1200, multiple substrates alignment and load chamber 1300, pallet dispensed chambers 1400, channel chamber 1500,
And supply substrate unit 1600.
Pallet transmission line 1100 refers to the line for transmitting the pallet T for being mounted with glass G.
After glass G is back to processing chamber housing 1700 and is unloaded, pallet T is empty pallet.In the concept of the present invention,
For the sake of for convenience of explanation, the pallet for being arranged in proximity to each other and being transmitted is referred to as the first pallet T1 and the second pallet T2.
Therefore, the first pallet T1 and the second pallet T2 are sequentially transmitted along pallet transmission line 1100.
The substrate line of return 1200 is arranged at the side of pallet transmission line 1100, and refers to be used to make along pallet transmission line
1100 are transmitted and are mounted with the line that glass G pallet T is returned.
Pallet transmission line 1100 can have sandwich construction, to be arranged at the upside of the substrate line of return 1200 or the side of downside
Place.
In this example embodiments, pallet transmission line 1100 has the multilayer of the lower section of the substrate line of return 1200 to be arranged at
Structure.Different from this example embodiments, pallet transmission line 1100 has the multilayer of the top of the substrate line of return 1200 to be arranged at
Structure.Above sandwich construction can be changed design and is easily modified by the setting according to in-line arrangement technique.
Consequently, it is possible to because pallet transmission line 1100 and the substrate line of return 1200 have sandwich construction, therefore biography can be reduced
The length of line sending.Sharply increased this prevents equipment area occupied.
Multiple substrates are directed at and loaded the side that chamber 1300 is arranged at pallet transmission line 1100 and the substrate line of return 1200,
With multiple substrate loading positions 1311 and 1312, glass G is aligned and is loaded at substrate loading position 1311 and 1312
On the pallet T transmitted along pallet transmission line 1100, and for a base in selected substrate loading position 1311 and 1312
Plate stowage position, makes glass G be aligned and be loaded on pallet T.
Substrate loading position 1311 and 1312 may include：First substrate " loaded " position 1311, is arranged at and is returned relative to substrate
One of left side and right side of the Return-ing direction of loop line 1200, and transmitted along the first pallet T1 of the transmission of pallet transmission line 1100
To first substrate " loaded " position 1311；And second substrate " loaded " position 1312, it is arranged at and first substrate " loaded " position 1311
Relative side, and the second pallet T2 transmitted along pallet transmission line 1100 is transferred into second substrate " loaded " position 1312.
In this example embodiments, first substrate " loaded " position 1311 is arranged at returning relative to the substrate line of return 1200
The right side in direction is gone back to, and second substrate " loaded " position 1312 is arranged at a left side for the Return-ing direction relative to the substrate line of return 1200
Side.
First substrate " loaded " position 1311 and second substrate " loaded " position 1312 are located at the height of the substrate line of return 1200.
In other words, in this example embodiments, because pallet transmission line 1100 is arranged in first layer, and substrate is returned
Loop line 1200 is arranged in the second layer, therefore first substrate " loaded " position 1311 and second substrate " loaded " position 1312 are arranged at
In two layers.
When first substrate " loaded " position 1311 and second substrate " loaded " position 1312 are located at the height of the substrate line of return 1200
During place, the first pallet T1 and the second pallet T2 can pass through most short route return after glass G is loaded.
Multiple substrates, which are directed at and loaded chamber 1300, may include base plate alignment and loading module 1340, pallet alignment modules
1330 and pallet delivery module 1350.
Base plate alignment and loading module 1340 are arranged at first substrate " loaded " position 1311 and second substrate " loaded " position
1312 side, and it is transferred into first substrate " loaded " position 1311 and second substrate dress for glass G to be aligned and be loaded into
On the pallet T for carrying position 1312.
As shown in figure 16, base plate alignment and loading module 1340 are arranged at multiple substrates base plate alignment and load chamber 1300
Top, although and do not illustrated into Figure 22 in Figure 17, but base plate alignment and loading module 1340 are arranged at first substrate
" loaded " position 1311 and the top of second substrate " loaded " position 1312.
After glass G is received from the supply substrate unit 1600 being then described, base plate alignment and loading module 1340
Glass G is aligned and is loaded on the pallet T being aligned in first substrate " loaded " position 1311 and second substrate " loaded " position 1312
Side.
Pallet alignment modules 1330 are arranged at first substrate " loaded " position 1311 and second substrate " loaded " position 1312 is each
The side of person is simultaneously used in first substrate " loaded " position 1311 and the alignment pallet of second substrate " loaded " position 1312 T.
As Figure 16 is illustrated in detail, pallet alignment modules 1330 are arranged at multiple substrates alignment and loaded under chamber 1300
Side, although not illustrated into Figure 22 in Figure 17, but pallet alignment modules 1330 are arranged at first substrate " loaded " position 1311
And the lower section of second substrate " loaded " position 1312.
Pallet alignment modules 1330 support the pallet T by then being transmitted the pallet delivery module 1350 being described, phase
Pallet T is raised for pallet delivery module 1350, horizontal rotation pallet T is used to supply glass from supply substrate unit 1600 to be aligned
Glass G direction is so as to be positioned at first substrate " loaded " position 1311 or second substrate " loaded " position 1312.
Pallet delivery module 1350 by via first substrate " loaded " position 1311 and second substrate " loaded " position 1312 from
Pallet transmission line 1100 is connected to the substrate line of return 1200 and carrys out delivery tray T.
In the schema of concept of the present invention, the detailed construction of pallet delivery module 1350 is omitted, and only illustrates roller and (is not shown
Go out) track.
In this example embodiments, pallet delivery module 1350 may include curve delivery unit 1351, and curve transmission is single
Member 1351 is used to transmit along curve at each position of first substrate " loaded " position 1311 and second substrate " loaded " position 1312
It is mounted with glass G pallet T.
Due to curve delivery unit 1351 can make to be mounted with glass G pallet T in first substrate " loaded " position 1311 and
Along curve movement at each position of second substrate " loaded " position 1312, as Figure 18 and Figure 20 is illustrated (for example respectively certainly in detail
Position (e) and (e ') are moved to position (f) and (f ')), therefore pallet T can be made to be directed at the substrate line of return by once transmitting
1200 direction of advance, so as to shorten the different pitch time with substrate time of return.
Pallet dispensed chambers 1400 are connected to pallet transmission line 1100 and multiple substrates alignment and load chamber 1300, and to
First substrate " loaded " position 1311 and second substrate " loaded " position 1312 optionally distribute the first pallet T1 and the second pallet T2.
Because the first pallet T1 and the second pallet T2 are alternately sent to the base of first substrate " loaded " position 1311 and second
Plate " loaded " position 1312, therefore before substrate is loaded on pallet, in first substrate " loaded " position 1311 and second
The time that substrate loading position 1312 is directed at the pallet can be reduced due to pallet dispensed chambers 1400, so as to shorten beat
Time.
Channel chamber 1500 and 1500 ' is arranged at pallet dispensed chambers 1400 and chamber 1300 is directed at and loaded with multiple substrates
Between, and pallet T is sent to multiple substrates alignment from pallet dispensed chambers 1400 and chamber 1300 is loaded.
In this example embodiments, channel chamber 1500 and 1500 ' is arranged at the opposite side of pallet dispensed chambers 1400
Place, and may include：First passage chamber 1500, is arranged at the side of first substrate " loaded " position 1311；And second channel chamber
Room 1500 ', is arranged at the side of second substrate " loaded " position 1312.
Channel chamber 1500 and 1500 ' may include pallet risers (not shown), and the pallet risers are used for pallet T
It is raised and lowered from the height corresponding to pallet transmission line 1100 to corresponding to first substrate " loaded " position 1311 and second substrate
The height of " loaded " position 1312.
Although not illustrating pallet risers in schema, however the pallet risers be arranged at channel chamber 1500 and
In 1500 ', the pallet T transmitted from pallet transmission line 1100 via pallet dispensed chambers 1400 is increased to correspond to channel lumens
The height of the first layer of room 1500 and 1500 ', it is increased to height corresponding to the second layer, and is then sent to pallet T multiple
Base plate alignment and the first substrate " loaded " position 1311 and second substrate " loaded " position 1312 for loading chamber 1300.
It is different from the present embodiment, when pallet transmission line is arranged in the second layer and the substrate line of return is arranged in first layer
When, because substrate loading position is arranged in first layer, therefore pallet risers make the support that is transmitted at the height of the second layer
Disk T is reduced to the height of first layer, and pallet T then is sent into multiple substrates alignment and the substrate loading position of chamber 1300 is loaded
Put.
Supply substrate unit 1600 is rotationally arranged at multiple substrates alignment and loads the side of chamber 1300, and the
It is optionally reciprocating between one substrate loading position 1311 and second substrate " loaded " position 1312 simultaneously selectively
Glass G is provided to first substrate " loaded " position 1311 and second substrate " loaded " position 1312.
Because glass G can be alternately loaded into first substrate " loaded " position 1311 and second by supply substrate unit 1600
At substrate loading position 1312 be aligned pallet T1 and T2 on, therefore can reduce load substrate before be used for be aligned pallet when
Between, so as to shorten pitch time.
In the following description, operation and the effect of substrate loading system 1 as configured as above are described.
First, as shown in figure 17, the first pallet T1 is passed from the position (a) of the pallet transmission line 1100 at the first layer height
The position (b) of pallet dispensed chambers 1400 is delivered to, then distributes the first pallet T1 to positioned at first substrate " loaded " position 1311
The position (c) of the channel chamber 1500 of side.
When pallet T is increased to positioned at position (c) place of channel chamber 1500 by pallet risers from the height of first layer
The second layer height and be then sent to multiple substrates alignment and load chamber 1300 when, pallet T transmits mould by pallet
Block 1350 is transferred into multiple substrates alignment and loads the position (d) of chamber 1300.
When being directed at pallet T by pallet alignment modules 1330 at first substrate " loaded " position 1311, pass through substrate
Alignment and loading module 1340 make the glass G supplied by supply substrate unit 1600 be aligned to be loaded on the first pallet T1.
Then, as shown in figure 18, when position (e) place for being directed at and loading chamber 1300 in multiple substrates is single along curve transmission
When the first pallet T1 that member 1351 will be loaded with glass G is sent to position (f), the first pallet T1 is oriented to and the substrate line of return
1200 direction of advance matches and passes through the position (g) of pallet dispensed chambers 1400 and be sent back to the substrate line of return 1200
Position (h).
The second pallet T2 that Figure 19 and Figure 20 illustrates neighbouring first pallet T1 positioning is passed towards second substrate " loaded " position 1312
The process sent and be transferred back to after glass G is mounted with.
Therefore, according to above-described embodiment, because the first pallet T1 and the second pallet T2 is alternately sent to first substrate dress
Position 1311 and second substrate " loaded " position 1312 are carried, therefore can reduce and be respectively aligned to each pallet and for being aligned and loading
The time of substrate, so as to shorten pitch time compared with correlation technique, and then improve productivity ratio.
Figure 21 is the plan of the substrate loading system of another example embodiments according to concept of the present invention.Figure 22 is root
According to the plan of the substrate loading system of another example embodiments of concept of the present invention.
Example embodiments shown in Figure 21 are different from being that not including pallet transmits in place of example embodiments shown in Figure 16
The curve delivery unit 1351 of module 1350.
In this case, although pitch time slightly have extension be unfavorable, but can advantageously reduce equipment cost and
It is easy to be safeguarded and is repaired.Therefore, in this example embodiments, it is contemplated that be designed to the productivity ratio entirely equipped
Change.
Example embodiments shown in Figure 22 be different from example embodiments shown in Figure 16 in place of be, multiple substrates alignment and
Chamber 1300a and 1300b is loaded to be divided into first substrate " loaded " position 1311 and second substrate " loaded " position 1312
Multiple independent chambers, and simple designs are carried out to pallet delivery module 1350.
In this case, although pitch time slightly have extension be unfavorable, but can advantageously reduce equipment cost and
It is easy to be safeguarded and is repaired.Therefore, in this example embodiments, it is contemplated that be designed to the productivity ratio entirely equipped
Change.
Figure 23 is another example embodiments according to concept of the present invention, explains the flow of the method for loading substrate
Figure.
As shown in figure 23, the method for being used to load substrate according to the present embodiment includes pallet transfer operation (S110), pallet
Batch operation (S120), pallet lift operation (S130), pallet alignment function (S140), base plate alignment and loading operation (S150)
And substrate transfer operation (S160).
During pallet transfer operation (S110), when loading glass G, along the pallet transmission line for delivery tray T
1100 delivery tray T.
During pallet batch operation (S120), towards first substrate " loaded " position 1311 and second substrate " loaded " position
1312 optionally distribute the first pallet T1 and the second pallet T2.
Pallet lift operation (S130) during, by pallet T from correspond to pallet transmission line 1100 height rise or
It is reduced to the height corresponding to first substrate " loaded " position 1311 and second substrate " loaded " position 1312.
During pallet alignment function (S140), selected from multiple first substrate " loaded " positions 1311 and second substrate dress
Carrying any one substrate loading position in the substrate loading position of position 1312 is directed at pallet T, the multiple first substrate
" loaded " position 1311 and second substrate " loaded " position 1312 are used to glass G is aligned and is loaded into along pallet transmission line 1100 to transmit
Pallet T on.
During base plate alignment and loading operation (S150), glass G is set to be aligned and be loaded on pallet T.
During substrate transfer operation (S160), after glass G is loaded on pallet T, along the substrate line of return
1200 transmission are mounted with glass G pallet T.
Consequently, it is possible to according to the present embodiment, there is provided wherein make base plate alignment and be loaded into multiple substrates on pallet to load
Position, and the pallet is alternately sent to these substrate loading positions to be loaded.Therefore, with the substrate of correlation technique
Load System is compared, and can be improved the substrate rate of loading and can be prevented equipment area occupied from sharply increasing.Generally, it can shorten with base
Plate is loaded and different pitch times, so as to improve productivity ratio.
According to these example embodiments, it can solve easily during the return operation of mask due to mask and magnetic card
Problem is damaged caused by being contacted between disk.It is therefore possible to prevent particle is produced, so as to can ensure that yield.
In addition, according to these example embodiments, because offer wherein makes base plate alignment and is loaded into multiple on pallet
Substrate loading position, therefore compared with the substrate loading system of correlation technique, the substrate rate of loading can be improved, and equipment can be prevented
Area occupied is sharply increased.Generally, it can shorten and be loaded and different pitch times with substrate, so as to improve productivity ratio.
Although the example embodiments with reference to concept of the present invention especially show and describe idea of the invention, but should
Understand, the change in various forms and details can be made under conditions of the spirit and scope without departing substantially from claims below.
Claims (14)
1. a kind of equipment for attaching substrates and mask, it is characterised in that including：
Mask support unit, supports the mask formed by metal material；
Magnetic chuck, is arranged above the mask support unit and produces magnetive attraction to be attached to the mask, in the magnetic
Substrate is gripped between property chuck and the mask；
Magnetic chuck up/down driver element, is connected to the magnetic chuck and drives the magnetic chuck up and down；And
Controller, controls the operation of the magnetic chuck up/down driver element, to change the position of the magnetic chuck, and then
Prevent from making the mask and the magnetic chuck phase due to the interference of the magnetive attraction during the return operation of the mask
Mutually contact；
Characterized in that, the mask includes mask sheet material, the mask sheet material is formed multiple layers of form, supports the base
Plate is simultaneously in close contact the substrate；
Include substrate in the mask sheet material of multiple layers of form and support mask sheet material, support the substrate；
Characterized in that, forming multiple holes to be bent in substrate support mask sheet material；
Characterized in that, the multiple hole has slot form and supports the edge of mask sheet material sequentially to arrange along the substrate respectively
Row.
2. equipment as claimed in claim 1, it is characterised in that the controller controls the magnetic chuck up/down driving single
The operation of member, make it that the magnetic chuck is relative to the mask to moving up during the return operation of the mask
Move to separate from the mask.
3. equipment as claimed in claim 1, it is characterised in that also multiple glass supports including being controlled by the controller
Pin, the multiple glass support pin is configured to move up and down relative to the mask support unit and from the substrate
Supported underneath is intended to be attached to the substrate of the mask.
4. equipment as claimed in claim 3, it is characterised in that also multiple glass including being controlled by the controller are fixed
Pin, the multiple glass steady pin is configured to move up and down relative to the magnetic chuck and supported with multiple substrates
The position of the fixed substrate of pin.
5. equipment as claimed in claim 1, it is characterised in that the magnetic chuck includes multiple magnets, and multiple pin-and-hole shapes
Into between the multiple magnet.
6. equipment as claimed in claim 5, it is characterised in that the multiple magnet is permanent magnet.
7. equipment as claimed in claim 1, it is characterised in that the mask also includes mask frame, the mask frame quilt
It is soldered to the mask sheet material in multiple layers of form.
8. equipment as claimed in claim 1, it is characterised in that further included in the mask sheet material of multiple layers of form：
, there is surface with substrate support mask sheet material and contact and be in close contact the substrate in substrate contact mask sheet material.
9. equipment as claimed in claim 8, it is characterised in that the thickness of the substrate contact mask sheet material is less than the substrate
Support the thickness of mask sheet material.
10. equipment as claimed in claim 8, it is characterised in that the thickness of the substrate support mask sheet material for 0.2mm extremely
0.3mm, and the thickness of the substrate contact mask sheet material is 0.02mm.
11. equipment as claimed in claim 8, it is characterised in that the substrate support mask sheet material is contacted with the substrate to be covered
Matrix material is formed and is soldered to each other by invar material.
12. equipment as claimed in claim 1, it is characterised in that the substrate is Organic Light Emitting Diode, and the substrate is
Size 2m × 2m large substrates.
13. a kind of method for attaching substrates and mask, it is characterised in that methods described includes：
Mask support is operated, wherein returning to and being supported on mask support unit the mask formed by metal material；
Magnetic chuck lock out operation, wherein magnetic chuck is moved up to be separated from the mask, the magnetic chuck is set
It is placed in above the mask support unit and produces magnetive attraction to be attached to the mask, in the magnetic chuck and the mask
Between be gripped with substrate；
Substrate is supported and alignment function, wherein the substrate to be arranged above the mask and support and in alignment with moving up
Multiple substrate supporting pins on；
Substrate position fixes operation, wherein being fixed by the multiple substrate steady pins moved down relative to the magnetic chuck
The position of the substrate；
Substrate accommodates operation, wherein the multiple substrate steady pin and the multiple substrate supporting pin move down and thus by institute
Substrate is stated to be contained on the mask；And
Substrate and mask adhesion are operated, wherein the magnetic chuck is moved downward on the substrate, and thus pass through the magnetic
Property chuck magnetive attraction by the substrate and the mask adhesion to each other.
14. method as claimed in claim 13, it is characterised in that also include after the substrate with mask adhesion operation：
Pin removes operation, wherein removing the multiple substrate supporting pin and the multiple substrate steady pin；And
Additional attachment operation, wherein the magnetic chuck is moved further downward towards the substrate, and thus increase the substrate
With the adhesive force between the mask.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611051220.2A CN106784394B (en) | 2013-12-30 | 2014-08-29 | System and method for the device and method of glassivation and mask and for loading substrate |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2013-0166382 | 2013-12-30 | ||
| KR1020130166385A KR101570074B1 (en) | 2013-12-30 | 2013-12-30 | An apparatus and method to load substrate |
| KR10-2013-0166385 | 2013-12-30 | ||
| KR1020130166382A KR101537967B1 (en) | 2013-12-30 | 2013-12-30 | Apparatus and method for attaching glass and mask |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611051220.2A Division CN106784394B (en) | 2013-12-30 | 2014-08-29 | System and method for the device and method of glassivation and mask and for loading substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104752636A CN104752636A (en) | 2015-07-01 |
| CN104752636B true CN104752636B (en) | 2017-08-15 |
Family
ID=53592000
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611051220.2A Active CN106784394B (en) | 2013-12-30 | 2014-08-29 | System and method for the device and method of glassivation and mask and for loading substrate |
| CN201410438438.8A Active CN104752636B (en) | 2013-12-30 | 2014-08-29 | System and method for the device and method of glassivation and mask and for loading substrate |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611051220.2A Active CN106784394B (en) | 2013-12-30 | 2014-08-29 | System and method for the device and method of glassivation and mask and for loading substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN106784394B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104862664B (en) * | 2015-05-19 | 2017-12-01 | 南通大学 | A kind of preparation method of patterned alumina ultrathin film |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100422487B1 (en) * | 2001-12-10 | 2004-03-11 | 에이엔 에스 주식회사 | Evaporation Apparatus for Manufacturing Organic Electro-Luminescent Display Device using Electromagnet and Evaporation Method using the same |
| US8668422B2 (en) * | 2004-08-17 | 2014-03-11 | Mattson Technology, Inc. | Low cost high throughput processing platform |
| US20060102078A1 (en) * | 2004-11-18 | 2006-05-18 | Intevac Inc. | Wafer fab |
| EP1715078A1 (en) * | 2005-04-20 | 2006-10-25 | Applied Films GmbH & Co. KG | Continuous OLED coating apparatus |
| JP2008007857A (en) * | 2006-06-02 | 2008-01-17 | Sony Corp | Alignment device, alignment method, and manufacturing method of display device |
| JP2008075165A (en) * | 2006-09-25 | 2008-04-03 | Toppan Printing Co Ltd | Method for forming transparent conductive film, method for producing organic electroluminescence diode and magnetron sputtering apparatus |
| US20080075563A1 (en) * | 2006-09-27 | 2008-03-27 | Mclane James R | Substrate handling system and method |
| KR101401516B1 (en) * | 2007-05-23 | 2014-06-09 | 주성엔지니어링(주) | Tray aligner and solar cell manufacturing device comprising the same and tray aligning method using the same |
| JP2010087226A (en) * | 2008-09-30 | 2010-04-15 | Fujitsu Ltd | Substrate processing system, apparatus and method of managing pallet |
| US8289496B2 (en) * | 2009-01-30 | 2012-10-16 | Semes Co., Ltd. | System and method for treating substrate |
| US8808402B2 (en) * | 2009-04-03 | 2014-08-19 | Osram Opto Semiconductors Gmbh | Arrangement for holding a substrate in a material deposition apparatus |
| TWI451521B (en) * | 2010-06-21 | 2014-09-01 | Semes Co Ltd | Substrate treating apparatus and substrate treating method |
| KR20130004830A (en) * | 2011-07-04 | 2013-01-14 | 삼성디스플레이 주식회사 | Apparatus for thin layer deposition and method for manufacturing of organic light emitting display apparatus using the same |
| CN103400789B (en) * | 2013-08-01 | 2018-01-26 | 上海集成电路研发中心有限公司 | Equipment platform system and its wafer transfer method |
-
2014
- 2014-08-29 CN CN201611051220.2A patent/CN106784394B/en active Active
- 2014-08-29 CN CN201410438438.8A patent/CN104752636B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN106784394B (en) | 2018-10-09 |
| CN106784394A (en) | 2017-05-31 |
| CN104752636A (en) | 2015-07-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102482760B (en) | Vapor deposition method and vapor deposition apparatus | |
| JP5686185B2 (en) | Thin film deposition equipment | |
| CN103255371A (en) | Organic layer deposition apparatus, and method of manufacturing organic light emitting display apparatus using the same | |
| KR102426712B1 (en) | Apparatus and method of manufacturing display apparatus | |
| US20210036225A1 (en) | Segmented print bar for large-area ovjp deposition | |
| US10998531B2 (en) | Segmented OVJP print bar | |
| CN104752636B (en) | System and method for the device and method of glassivation and mask and for loading substrate | |
| KR20150025842A (en) | Thin layers deposition apparatus | |
| KR20060075110A (en) | Substrate align device | |
| KR101473833B1 (en) | Substrate deposition system | |
| KR101666805B1 (en) | Apparatus for rotating substrate | |
| KR101407421B1 (en) | Substrate deposition system | |
| KR102371101B1 (en) | Deposition apparatus | |
| KR20050049844A (en) | Vertical deposition method of organic electro luminescence element and apparatus thereof | |
| KR101537967B1 (en) | Apparatus and method for attaching glass and mask | |
| JP2004238688A (en) | Apparatus for manufacturing organic light emitting device and system for manufacturing display device | |
| KR20110128578A (en) | Thin layers deposition apparatus for manufacturing oled | |
| KR100842182B1 (en) | Substrate align appauatus and method using the same | |
| KR101514214B1 (en) | Apparatus for attaching glass and mask | |
| KR100635512B1 (en) | Align apparatus and its operating method for the same | |
| KR20120004071A (en) | Thin layers deposition apparatus for manufacturing oled | |
| KR101441484B1 (en) | Deposition system for manufacturing oled | |
| KR101436904B1 (en) | Deposition system for manufacturing oled | |
| KR101508309B1 (en) | Apparatus and method for attaching glass and mask | |
| JP2019060027A (en) | Substrate mounting device, film formation device, substrate mounting method, film formation method, and method for producing electronic device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |