CN106784394B - System and method for the device and method of glassivation and mask and for loading substrate - Google Patents
System and method for the device and method of glassivation and mask and for loading substrate Download PDFInfo
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- CN106784394B CN106784394B CN201611051220.2A CN201611051220A CN106784394B CN 106784394 B CN106784394 B CN 106784394B CN 201611051220 A CN201611051220 A CN 201611051220A CN 106784394 B CN106784394 B CN 106784394B
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- substrate
- pallet
- loaded
- transmission line
- return
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
Abstract
A kind of substrate loading system, including：Pallet transmission line, the pallet for being mounted with substrate are transmitted along the pallet transmission line；The substrate line of return is set to the side of the pallet transmission line, and after the substrate is loaded on the pallet, and the pallet along pallet transmission line transmission is returned along the substrate line of return；And multiple substrates are directed at and load chamber, it is set to the side of the pallet transmission line and the substrate line of return, with multiple substrate loading positions, the substrate is aligned at the substrate loading position and is loaded into along the pallet that the pallet transmission line transmits, and wherein at a substrate loading position selected from the multiple substrate loading position, the substrate is aligned and is loaded on the pallet.
Description
The application be the applying date be August in 2014 29, application No. is the entitled " for adhering to of " 201410438438.8 "
The divisional application of the patent application of the device and method of glass and mask and the system and method for loading substrate ".
Technical field
Concept of the present invention is related to a kind of device and method for glassivation and mask and for loads substrate
System and method.
Background technology
Panel display apparatus includes liquid crystal display (liquid crystal display；LCD), plasma shows face
Plate (plasma display panel；PDP), Organic Light Emitting Diode (organic light-emitting diode；
OLED) etc..Fig. 1 illustrates the structure of Organic Light Emitting Diode.Referring to Fig.1, Organic Light Emitting Diode be by substrate sequentially
Following layers is stacked to be formed：Anode, hole injection layer (hole injection layer；HIL), hole transmission layer (hole
transfer layer；HTL), luminescent layer (emitting layer；EL), hole blocking layer, electron transfer layer (electron
transfer layer；ETL), electron injecting layer (electron transfer layer；EIL), cathode etc..
In the general introduction of Organic Light Emitting Diode shown in Fig. 1, Organic Light Emitting Diode includes anode, cathode and setting
Luminescent layer between the anode and the cathode.During operation, hole is injected into from anode in luminescent layer, and electronics
It is injected into luminescent layer from cathode.The hole and the electronics are coupled to each other in luminescent layer, to generate exciton
(exciton).When the exciton self-excitation state fades to ground state, will shine.
Organic Light Emitting Diode can be classified into monochromatic (monochromatic) organic hair according to the color to be reproduced
Optical diode and panchromatic (full-color) Organic Light Emitting Diode.Full-color organic light emitting diode is equipped with according to as light original
The red (R) of color, green (G) and blue (B) and the luminescent layer being patterned, and then reproduce panchromatic.
In full-color organic light emitting diode, luminescent layer can be executed in various ways according to the material for being used to form luminescent layer
Patterning.
For by the patterned Organic Light Emitting Diode deposition method of luminescent layer including the use of fine metal mask (fine
metal mask；FMM level deposition method), using laser induced thermal imaging (laser induced thermal
imaging；LITI) method of technology, the method using colour filter, small mask scanning (small mask scanning；SMS)
Deposition method etc..
Metal mask is commonly used in fine metal mask level deposition method.It is heavy to execute the fine metal mask level
Product method, can be used the pallet for carrying mask intimate contact with one another and substrate.
In the related art, the position due to being provided with mask and the magnet for attracting the mask by magnetive attraction
Gap between plate (that is, magnetic chuck) because that structure limits is very narrow, therefore during the return of the mask operates (that is,
When the mask return and when without substrate) mask that is formed by metal and magnetic chuck be likely to due to magnetive attraction and that
This interference.
When mask and magnetic chuck are contacted with each other due to the interference of magnetive attraction, can damage mask and magnetic chuck to
Make it that can not reuse, or particle can be generated and defect occur so as to cause substrate.Therefore, yield can be reduced, thus it is urgent
It needs to carry out structure compensation to these problems.
In-line arrangement (in-line) method refers to that a kind of utilize is arranged with a certain interval on transmission line and is used to execute clearly
The various equipment of the techniques such as clean, deposition, etching are placed with multiple substrates to manufacture product while sequentially be transmitted along the transmission line
Pallet method.
In the in-line arrangement method, substrate is loaded on empty pallet using substrate loading system, is transmitted
To the equipment for executing process above.
According to the substrate loading system of the relevant technologies, when along substrate transmission line transmission empty pallet, by using setting
Mechanical arm at substrate transmission line side and substrate is loaded on the pallet.
However, in aforesaid substrate Load System, with the extension of the substrate transmission line, the area occupied of equipment
(foot print), which increases, becomes problem.
In order to solve the above problem, it is contemplated that a method of being used to form two-layer substrate transmission line.However, due to being aligned
It can be taken considerable time in the part of substrate, therefore pitch time (tact time) extends, and due to difficult for multilayer architecture
To be safeguarded and be repaired to equipment.
Invention content
Concept of the present invention provides a kind of device and method for glassivation and mask, can easily solve described
The damage problem occurred due to being contacted between the mask and magnetic chuck during the return operation of mask.It is therefore possible to prevent
It generates particle and can ensure that yield.
Concept of the present invention provide it is a kind of for loading the system and method for substrate, by using the system and method, with
Existing substrate loading system is improved compared to the substrate rate of loading, and can prevent equipment area occupied from drastically increasing.Therefore,
It can shorten and be loaded and different pitch times with substrate, to which productivity can be improved.
According to the one side of concept of the present invention, a kind of equipment for glassivation and mask, the equipment packet are provided
It includes：Mask support unit, the mask that support mask support unit supports are formed by metal material；Magnetic chuck is set to described
Above mask support unit and generate magnetive attraction to be attached to the mask, it is sandwiched between the magnetic chuck and the mask
There is substrate；Magnetic chuck up/down driving unit is connected to the magnetic chuck and for driving upside down the magnetic chuck；With
And controller, the operation for controlling the magnetic chuck up/down driving unit, to change the position of the magnetic chuck, into
And it prevents from making the mask and the magnetic chuck due to the interference of the magnetive attraction during the return operation of the mask
It contacts with each other.
According to the another aspect of concept of the present invention, a kind of method for attaching substrates and mask, the method packet are provided
It includes：Mask support operates, wherein the mask formed by metal material is returned and is supported on mask support unit；And it is magnetic
Chuck lock out operation, wherein moving up magnetic chuck to be detached from the mask, the magnetic chuck is arranged at described
Above mask support unit and generate magnetive attraction to be attached to the mask, it is sandwiched between the magnetic chuck and the mask
There is substrate.
According to the another aspect of concept of the present invention, a kind of substrate loading system is provided, the substrate loading system includes：Support
Disk transmission line, the pallet for being mounted with substrate are transmitted along the pallet transmission line；The substrate line of return is set to the pallet transmission line
Side, and after the substrate is loaded on the pallet, along the pallet edge of pallet transmission line transmission
The substrate line of return returns；And multiple substrates are directed at and load chamber, are set to the pallet transmission line and the substrate
There are multiple substrate loading positions, the substrate to be aligned and be loaded at the substrate loading position for the side of the line of return
Along the pallet of pallet transmission line transmission, and wherein in the substrate dress selected from the multiple substrate loading position
It carries at position, the substrate is aligned and is loaded on the pallet.
According to the another aspect of concept of the present invention, a kind of method for loading substrate is provided, the method includes：Pallet
Transfer operation, wherein being mounted with the pallet of substrate along the pallet transmission line transmission for delivery tray；Pallet alignment function,
Wherein the pallet is set to be aligned in a substrate loading position selected from the multiple substrate loading position, the multiple substrate dress
Position is carried to be used for the base plate alignment and be loaded into the pallet transmitted along the pallet transmission line；Base plate alignment and dress
Operation is carried, wherein by the base plate alignment and being loaded on the pallet；And substrate returns to operation, wherein making to be mounted with described
The pallet of substrate is returned along the substrate line of return, and the pallet returns after being loaded the substrate along the substrate line of return
It returns.
Description of the drawings
Following detailed description is read in conjunction with the figure, it will the example embodiments of concept of the present invention are more clearly understood,
In：
Fig. 1 illustrates the structure of Organic Light Emitting Diode (OLED)；
Fig. 2 to Fig. 9 illustrates the example embodiments according to concept of the present invention, utilizes the equipment for attaching substrates and mask
Sequentially to adhere to the process of the substrate and the mask；
Figure 10 is the example embodiments according to concept of the present invention, the control block of the equipment for attaching substrates and mask
Figure；
Figure 11 is the example embodiments according to concept of the present invention, explains the flow of the method for attaching substrates and mask
Figure；
Figure 12 is another example embodiments according to concept of the present invention, is applied to the equipment for attaching substrates and mask
The substrate and the mask assembled view；
Figure 13 is the exploded view of Figure 12；
Figure 14 is the exploded view of mask shown in Figure 13；
Figure 15 is the plan view of the structure of example support mask sheet material；
Figure 16 is the side view according to the substrate loading system of the example embodiments of concept of the present invention；
Figure 17 illustrates the process that the first pallet is sent to first substrate " loaded " position from pallet transmission line；
Figure 18 illustrations make the first pallet for being mounted with substrate in first substrate stowage position be back to the substrate line of return
Process；
Figure 19 illustrates the process that the first pallet is sent to second substrate " loaded " position from pallet transmission line；
Figure 20 illustrations make the second pallet for being mounted with substrate in second substrate stowage position be back to the substrate line of return
Process；
Figure 21 is the plan view according to the substrate loading system of another example embodiments of concept of the present invention；
Figure 22 is the plan view according to the substrate loading system of another example embodiments of concept of the present invention；And
Figure 23 is another example embodiments according to concept of the present invention, explains the flow of the method for loading substrate
Figure.
Main element description of symbols
1：Substrate loading system
100：Mask
130：Magnetic chuck
132：Magnet
134：Pin hole
140：Mask support unit
150：Controller
151：Central processing unit
152：Memory
153：Support circuits
160：Magnetic chuck up/down driving unit
170：Glass support pin
180：Glass fixed pin
200：Mask
201：Substrate supports mask sheet material
202：Substrate contact mask sheet material
203：Mask frame
1100：Pallet transmission line
1200：The substrate line of return
1300、1300a、1300b：Multiple substrates are directed at and load chamber
1311：First substrate " loaded " position
1312：Second substrate " loaded " position
1330：Pallet alignment modules
1340：Base plate alignment and loading module
1350：Pallet delivery module
1351：Curve transmission unit
1400：Pallet dispensed chambers
1500：First passage chamber
1500’：Second channel chamber
1600：Supply substrate unit
1700：Processing chamber housing
G：Glass
H：Hole
R：Manipulator
S11~S18：Operation
S110~S160：Operation
T：Pallet
T1：First pallet
T2：Second pallet
Specific implementation mode
Concept of the present invention and its advantage are fully understood to obtain, please referred to real for illustrating conceptual example of the present invention
Apply the attached drawing of example.
Hereinafter, general by explaining that the example embodiments of concept of the present invention carry out detailed description of the present invention by referring to accompanying drawing
It reads.Identical Ref. No. indicates identical element in schema.
Fig. 2 to Fig. 9 illustrates the example embodiments according to concept of the present invention, utilizes the equipment for attaching substrates and mask
To adhere to the process of the substrate and the mask step by step.Figure 10 is the example embodiments according to concept of the present invention, is used for
The control block of the equipment of attaching substrates and mask.Figure 11 is the example embodiments according to concept of the present invention, and explanation is used for
The flow chart of the method for attaching substrates and mask.
With reference to Fig. 2 to Figure 11, according to the present embodiment setting for attaching substrates (hereinafter, being referred to as glass G) and mask 100
Standby is for solving the problems, such as the contact due to mask 100 or magnetic chuck 130 in the following manner and the damage that occurs：Change magnetic
Property chuck 130 position with prevent mask 100 return operation during make mask 100 and magnetic chuck due to magnetive attraction
130 contact with each other, and the equipment 100 may include that mask support unit 140, magnetic chuck 130, magnetic chuck up/down are driven
Moving cell 160, multiple glass support pins 170, multiple glass fixed pins 180 and the controller for controlling the above element
150。
As reference, be Organic Light Emitting Diode according to the glass G of this example embodiments, and can be size about 2m ×
The large substrates of 2m.
Mask support unit 140 is the structure for being used to support the mask 100 formed by metal material.
Mask support unit 140 can be the structure that mask 100 is used to support in the state of being fixed at a position,
And can be the moveable structure carried out during capable of being carried or from process.
Magnetic chuck 130 is set to above mask support unit 140 to generate magnetive attraction, to be attached to mask 100,
Glass G is gripped between magnetic chuck 130 and mask 100.
Multiple magnets 132 for generating magnetive attraction are set to inside magnetic chuck 130.
Magnet 132 can be permanent magnet.However, when there is no the interference to environment and easily controllable magnetive attraction, it can
Replace magnet 132 using electromagnet.
Multiple pin holes 134 are formed between magnet 132.When glass fixed pin 180 moves back and forth via pin hole 134, glass
Glass G can be fixed.
Although not illustrating in detail in the drawings, step part is additionally formed on magnetic chuck 130, therefore be provided with
The position of mask 100 may be varied from during the return operation of mask 100 or the processing operation of mask 100.It is formed in
Step part on magnetic chuck 130 can be moved partly.
Magnetic chuck up/down driving unit 160 is connected to magnetic chuck 130, and 130 up/down of magnetic chuck is driven to move.
For example, using cylinder or linear motor as magnetic chuck up/down driving unit 160.
In addition, magnetic chuck up/down driving unit 160 can combine shape by motor with ball-screw (ball screw)
At, for convenience of description for the sake of, the motor and the ball-screw are schematically illustrated in the schema of this example embodiments
In.
Glass support pin 170 can be moved relative to 140 up/down of mask support unit, and support glass G with from glass G
Lower section is attached to mask 100.
Since glass support pin 170 is not only moved up but also moved down, glass support pin 170 can be equipped with
Up/down unit.
Glass fixed pin 180 can be moved relative to 130 up/down of magnetic chuck, and as shown in Figure 5 with glass support pin
170 fix the position of glass G.
Since glass fixed pin 180 not only moves up as shown in Figures 4 and 5, but also as shown in Figures 7 and 8 to moving down
It is dynamic, therefore glass fixed pin 180 can be equipped with up/down unit.
Controller 150 controls magnetic chuck up/down driving unit 160, glass support pin 170 and glass fixed pin 180.
Specifically, controller 150 controls the operation of magnetic chuck up/down driving unit 160 to change magnetic chuck 130
Position so that mask 100 and magnetic chuck 130 during the return operation of mask 100 will not due to magnetive attraction interference and
It contacts with each other.
Specifically, in this example embodiments, controller 150 controls the behaviour of magnetic chuck up/down driving unit 160
Make so that magnetic chuck 130 is moved up relative to mask 100 to divide with mask 100 during the return of mask 100 operates
From.
As shown in Figure 10, controller 150 may include central processing unit (central processing unit；CPU)151、
Memory 152 and support circuits (support circuit) 153.
In this example embodiments, central processing unit 151 can be in the various computer processors industrially used
One kind, for control magnetic chuck up/down driving unit 160 operation so that magnetic chuck 130 is relative to mask 100
It moves up to be detached with mask 100 during the return of mask 100 operates.
Memory 152 is connected to central processing unit 151.Memory 152 as computer-readable recording medium can be installed
In the place of Local or Remote.For example, memory 152 can be following readily available at least one of memory：Example
Such as random access storage device (random access memory；RAM), read-only memory (read-only memory；ROM)、
Floppy disk, hard disk or digital storage.
Support circuits 153 are coupled with central processing unit 151 to support the typical operation of processor.Support circuits 153 can wrap
Include Cache (cache), power supply, clock circuit, input/output circuitry, subsystem etc..
In this example embodiments, controller 150 controls the operation of magnetic chuck up/down driving unit 160 so that magnetic
Property chuck 130 relative to mask 100 move up with the return of mask 100 operate during detached with mask 100.This is a series of
Process be storable in memory 152.In general, software routines (software routine) are storable in memory 152.
Software routines may also be stored in another central processing unit (not shown) or be executed by another central processing unit.
Although being executed by software routines according to the process of concept of the present invention, the process of concept of the present invention is at least
A part can also be executed by hardware.Thus, can be by the software, such as integrated circuit that execute on the computer systems
The combination of hardware or software and hardware is waited to implement the process according to concept of the present invention.
The process of sequentially attaching substrates and mask is described below.
First, as shown in Fig. 2, making the mask formed by metal material 100 return and being supported on mask support unit 140
(S11)。
As shown in Fig. 2, the return operation of mask 100 can be executed in the case of no glass G.
Then, as shown in figure 3, magnetic chuck 130 is moved up to detach (S12) with mask 100.
When magnetic chuck 130 is moved up to be detached with mask 100, the distance between magnetic chuck 130 and mask 100
Increase, therefore magnetic chuck 130 will not be contacted with each other with mask 100 due to the interference of magnetive attraction.
In addition, when magnetic chuck 130 is moved up to be detached with mask 100, as shown in figure 3, space is ensured, from
And it can be conducive to utilize manipulator R input glass G.
Then, as shown in figure 4, being inputted glass G in the upper area of mask 100 using manipulator R, while by glass G
It is supported on the glass support pin 170 moved up, and then is directed at glass G (S13).
When completing the alignment function of glass G, as shown in figure 5, being consolidated by the glass moved down relative to magnetic chuck 130
The position (S14) of glass G is fixed in rationed marketing 180.
Then, as shown in fig. 6, glass fixed pin 180 and glass support pin 170 move down, to which glass G is placed on
On mask 100 (S15).
Then, as shown in fig. 7, magnetic chuck 130 is moved downward to glass G, to make glass G with mask 100 due to magnetic
The magnetive attraction of the magnet 132 of property chuck 130 and be attached to (S16) each other.In other words, due to the magnetic gravitational attraction of magnet 132
Mask 100, therefore glass G can be attached to each other with mask 100.
After glass G and mask 100 are attached to each other, as shown in figure 8, removing glass support pin 170 and glass fixed pin
180 so that be back to its home position (S17).
Then, as shown in figure 9, magnetic chuck 130 is further moved downwardly toward glass G, with reinforcing glass G and mask 100
Between adhesive force (S18).Therefore, glass G can be made to be attached to that by contacting with each other securely and closely with mask 100
This.Operation S18 can not be used in some cases.
According to this example embodiments with the above structure and operation, by change the position of magnetic chuck 130 to prevent
Only mask 100 is set to contact with each other with magnetic chuck 130 due to the interference of magnetive attraction during the return of mask 100 operates, it can
Solve the problems, such as the contact due to mask 100 or magnetic chuck 130 easily and caused by damage.It is therefore possible to prevent generating particle
And it can ensure that yield in turn.
Figure 12 is another example embodiments according to concept of the present invention, is applied to the equipment for attaching substrates and mask
The substrate and the mask assembled view.Figure 13 is the exploded view of Figure 12.Figure 14 is the exploded view of mask shown in Figure 13.
Figure 15 is the plan view of the structure of example support mask sheet material.
In examples detailed above embodiment, mask 100 is merely described as metal mask.However, mask 200 can have as schemed
12 to structure shown in figure 15.
Referring to Fig.1 2 to Figure 15, simple sheet form is not had according to the mask 200 of this example embodiments.
In other words, the mask 100 utilized in examples detailed above embodiment can have single plate shape.
However, the mask 200 according to this example embodiments may include：Multiple mask sheet materials 201 and 202 are located at multiple layers
In, Come support glass G are simultaneously in close contact glass G；And mask frame 203, it is soldered to mask sheet material 201 and 202.
Mask sheet material 201 and 202 is：Substrate supports mask sheet material 201, is used to support glass G；And substrate contact mask
Sheet material 202 contacts there are surface with substrate support mask sheet material 201 and is in close contact glass G.
In other words, in this example embodiments, mask sheet material 201 and 202 has by substrate support mask sheet material 201
And the dual structure that substrate contact mask sheet material 202 is formed.
As described above, substrate support mask sheet material 201 supports glass G, and substrate contact mask sheet material 202 is in close contact glass
Glass G is without being lifted.
Therefore, in this example embodiments, the thickness of substrate contact mask sheet material 202 supports mask sheet material than substrate
201 thickness is thin.
In this example embodiments, the thickness of substrate support mask sheet material 201 can be about 0.2mm to about 0.3mm, and base
The thickness of plate contact mask sheet material 202 can be about 0.02mm to about 0.02mm.
Multiple hole H can be formed in the substrate support mask sheet material 201 for being made relatively thick, with during attaching process
It is bent, that is, as the means for making substrate support mask sheet material 201 be bent and be attached to glass G well.
Hole H has slot form as shown in figure 15 respectively, and the edge of mask sheet material 201 can be supported sequentially to arrange along substrate
Row.
In this example embodiments, it is by Yin that substrate support mask sheet material 201, which is in contact with substrate both mask sheet materials 202,
Steel (Invar) material manufacture is formed and is soldered to each other.
Invar material forms by referring to the iron by the way that 36.5% nickel to be added to 63.5% and has low thermal expansion system
Several alloys.Invar material can be used for will appear when size changes with temperature change the machine of error (for example, accurate machine
The parts of device or optical apparatus).
Mask frame 203 is soldered to mask sheet material 201 and 202 in the edge of mask sheet material 201 and 202.Work as mask sheet
It, can be by stretching come solder mask sheet material 201 and 202 when material 201 and 202 is soldered to mask frame 203.
Even if can get the effect of concept of the present invention if when using the mask 200 with the above structure.
Figure 16 is the side view according to the substrate loading system of the example embodiments of concept of the present invention.Figure 17 is illustrated the
One pallet is sent to the process of first substrate " loaded " position from pallet transmission line.Figure 18 illustrations make in first substrate stowage position
The first pallet for being mounted with substrate is back to the process of the substrate line of return.Figure 19, which is illustrated, transmits the first pallet from pallet transmission line
To the process of second substrate " loaded " position.Figure 20 illustrations make the second pallet for being mounted with substrate in second substrate stowage position return
It is back to the process of the substrate line of return.
As shown in Figure 16 to Figure 20, pallet transmission line may include according to the substrate loading system 1 of this example embodiments
1100, the substrate line of return 1200, multiple substrates alignment and load chamber 1300, pallet dispensed chambers 1400, channel chamber 1500,
And supply substrate unit 1600.
Pallet transmission line 1100 refers to the line for transmitting the pallet T for being mounted with glass G.
After glass G is back to processing chamber housing 1700 and is unloaded, pallet T is the pallet of sky.In the concept of the present invention,
For the sake of for convenience of explanation, it is arranged in proximity to each other and the pallet transmitted is referred to as the first pallet T1 and the second pallet T2.
Therefore, the first pallet T1 and the second pallet T2 are sequentially transmitted along pallet transmission line 1100.
The substrate line of return 1200 is set to the side of pallet transmission line 1100, and refers to for making along pallet transmission line
1100 are transmitted and are mounted with the line that the pallet T of glass G is returned.
Pallet transmission line 1100 can have multilayered structure, to be set to the upside of the substrate line of return 1200 or the side of downside
Place.
In this example embodiments, pallet transmission line 1100 has the multilayer of 1200 lower section of the substrate line of return to be set to
Structure.Different from this example embodiments, pallet transmission line 1100 has the multilayer of 1200 top of the substrate line of return to be set to
Structure.The above multilayered structure can be easily modified by changing design according to the setting of in-line arrangement technique.
Thus, since pallet transmission line 1100 and the substrate line of return 1200 have multilayered structure, biography can be reduced
The length of line sending.This prevents equipment areas occupied to sharply increase.
Multiple substrates are directed at and load the side that chamber 1300 is set to pallet transmission line 1100 and the substrate line of return 1200,
With multiple substrate loading positions 1311 and 1312, glass G is aligned and is loaded at substrate loading position 1311 and 1312
Along the pallet T that pallet transmission line 1100 transmits, and for a base in selected substrate loading position 1311 and 1312
Plate stowage position makes glass G be aligned and is loaded on pallet T.
Substrate loading position 1311 and 1312 may include：First substrate " loaded " position 1311, is set to and is returned relative to substrate
One of left side and right side of the Return-ing direction of loop line 1200, and the first pallet T1 transmitted along pallet transmission line 1100 is transmitted
To first substrate " loaded " position 1311；And second substrate " loaded " position 1312, it is set to and first substrate " loaded " position 1311
Opposite side, and the second pallet T2 transmitted along pallet transmission line 1100 is transferred into second substrate " loaded " position 1312.
In this example embodiments, first substrate " loaded " position 1311 is set to returning relative to the substrate line of return 1200
The right side in direction is gone back to, and second substrate " loaded " position 1312 is set to a left side for the Return-ing direction relative to the substrate line of return 1200
Side.
First substrate " loaded " position 1311 and second substrate " loaded " position 1312 are located at the height of the substrate line of return 1200.
In other words, in this example embodiments, since pallet transmission line 1100 is set in first layer, and substrate returns
Loop line 1200 is set in the second layer, therefore first substrate " loaded " position 1311 and second substrate " loaded " position 1312 are set to
In two layers.
When first substrate " loaded " position 1311 and second substrate " loaded " position 1312 are located at the height of the substrate line of return 1200
When place, the first pallet T1 and the second pallet T2 can be returned after glass G is loaded by shortest route.
Multiple substrates are directed at and load chamber 1300 and may include base plate alignment and loading module 1340, pallet alignment modules
1330 and pallet delivery module 1350.
Base plate alignment and loading module 1340 are set to first substrate " loaded " position 1311 and second substrate " loaded " position
1312 side, and it is transferred into first substrate " loaded " position 1311 and second substrate dress for glass G to be aligned and be loaded into
On the pallet T for carrying position 1312.
As shown in figure 16, base plate alignment and loading module 1340 are set to multiple substrates base plate alignment and load chamber 1300
Top, and although not illustrated in Figure 17 to Figure 22, base plate alignment and loading module 1340 are set to first substrate
1312 top of " loaded " position 1311 and second substrate " loaded " position.
After receiving glass G from the supply substrate unit 1600 being then described, base plate alignment and loading module 1340
Glass G is aligned and is loaded on the pallet T that first substrate " loaded " position 1311 and second substrate " loaded " position 1312 are aligned
Side.
Pallet alignment modules 1330 are set to first substrate " loaded " position 1311 and second substrate " loaded " position 1312 is each
The side of person simultaneously is used to be directed at pallet T in first substrate " loaded " position 1311 and second substrate " loaded " position 1312.
If Figure 16 is illustrated in detail, pallet alignment modules 1330 are set to multiple substrates alignment and load under chamber 1300
Side, although not illustrated in Figure 17 to Figure 22, pallet alignment modules 1330 are set to first substrate " loaded " position 1311
And 1312 lower section of second substrate " loaded " position.
The support of pallet alignment modules 1330 is by the pallet T for then being transmitted the pallet delivery module 1350 being described, phase
Pallet T is increased for pallet delivery module 1350, pallet T is rotated horizontally to be aligned and is used for the supply glass of self-reference substrate supply unit 1600
The direction of glass G is to be positioned at first substrate " loaded " position 1311 or second substrate " loaded " position 1312.
Pallet delivery module 1350 by via first substrate " loaded " position 1311 and second substrate " loaded " position 1312 from
Pallet transmission line 1100 is connected to the substrate line of return 1200 and carrys out delivery tray T.
In the schema of concept of the present invention, the detailed construction of pallet delivery module 1350 is omitted, and only illustrates idler wheel and (does not show
Go out) track.
In this example embodiments, pallet delivery module 1350 may include that curve transmission unit 1351, curve transmission are single
Member 1351 at each position of first substrate " loaded " position 1311 and second substrate " loaded " position 1312 along curve for transmitting
It is mounted with the pallet T of glass G.
Due to curve transmission unit 1351 can make to be mounted with the pallet T of glass G in first substrate " loaded " position 1311 and
Along curve movement at each position of second substrate " loaded " position 1312, as Figure 18 and Figure 20 illustrates in detail (such as respectively from
Position (e) and (e ') are moved to position (f) and (f ')), therefore pallet T can be made to be directed at the substrate line of return by once transmitting
1200 direction of advance, so as to shorten the different pitch time with substrate time of return.
Pallet dispensed chambers 1400 are connected to pallet transmission line 1100 and multiple substrates alignment and load chamber 1300, and to
First substrate " loaded " position 1311 and second substrate " loaded " position 1312 selectively distribute the first pallet T1 and the second pallet T2.
Since the first pallet T1 and the second pallet T2 are alternately sent to first substrate " loaded " position 1311 and the second base
Plate " loaded " position 1312, therefore before substrate is loaded on pallet, in first substrate " loaded " position 1311 and second
The time that substrate loading position 1312 is directed at the pallet can be reduced due to pallet dispensed chambers 1400, so as to shorten beat
Time.
Channel chamber 1500 and 1500 ' is set to pallet dispensed chambers 1400 and is directed at and loads chamber 1300 with multiple substrates
Between, and pallet T is sent to multiple substrates alignment from pallet dispensed chambers 1400 and loads chamber 1300.
In this example embodiments, channel chamber 1500 and 1500 ' is set to the opposite side of pallet dispensed chambers 1400
Place, and may include：First passage chamber 1500 is set to the side of first substrate " loaded " position 1311；And second channel chamber
Room 1500 ' is set to the side of second substrate " loaded " position 1312.
Channel chamber 1500 and 1500 ' may include that pallet risers (not shown), the pallet risers are used for pallet T
It is raised and lowered from the height corresponding to pallet transmission line 1100 to corresponding to first substrate " loaded " position 1311 and second substrate
The height of " loaded " position 1312.
Although not illustrating pallet risers in schema, the pallet risers be set to channel chamber 1500 and
In 1500 ', the pallet T transmitted from pallet transmission line 1100 via pallet dispensed chambers 1400 is increased to correspond to channel lumens
The height of the first layer of room 1500 and 1500 ' is increased to height corresponding to the second layer, and is then sent to pallet T multiple
Base plate alignment and the first substrate " loaded " position 1311 and second substrate " loaded " position 1312 for loading chamber 1300.
It is different from the present embodiment, when pallet transmission line is set in the second layer and the substrate line of return is set in first layer
When, since substrate loading position is set in first layer, pallet risers make the support transmitted at the height of the second layer
Disk T is reduced to the height of first layer, and the substrate that pallet T is then sent to multiple substrates alignment and loads chamber 1300 loads position
It sets.
Supply substrate unit 1600 is rotationally arranged at multiple substrates alignment and loads the side of chamber 1300, and the
Selectively will while selectively reciprocating motion between one substrate loading position 1311 and second substrate " loaded " position 1312
Glass G is provided to first substrate " loaded " position 1311 and second substrate " loaded " position 1312.
Since glass G can be alternately loaded into first substrate " loaded " position 1311 and second by supply substrate unit 1600
At substrate loading position 1312 be aligned pallet T1 and T2 on, therefore can reduce before loading substrate be used for be aligned pallet when
Between, so as to shorten pitch time.
In the following description, operation and the effect of substrate loading system 1 as configured as above are described.
First, as shown in figure 17, the first pallet T1 is passed from the position (a) of the pallet transmission line 1100 at the first layer height
It send to the position (b) of pallet dispensed chambers 1400, then distributes the first pallet T1 to positioned at first substrate " loaded " position 1311
The position (c) of the channel chamber 1500 of side.
When pallet T is increased to from the height of first layer positioned at position (c) place of channel chamber 1500 by pallet risers
The second layer height and be then sent to multiple substrates alignment and load chamber 1300 when, pallet T transmits mould by pallet
Block 1350 is transferred into multiple substrates alignment and loads the position (d) of chamber 1300.
When making pallet T be aligned by pallet alignment modules 1330 at first substrate " loaded " position 1311, pass through substrate
Alignment and loading module 1340 make the glass G supplied by supply substrate unit 1600 be aligned to be loaded on the first pallet T1.
Then, as shown in figure 18, single along curve transmission when being aligned and loading at the position (e) of chamber 1300 in multiple substrates
When the first pallet T1 for being mounted with glass G is sent to position (f) by member 1351, the first pallet T1 is oriented and the substrate line of return
1200 direction of advance matches and passes through the position (g) of pallet dispensed chambers 1400 and be sent back to the substrate line of return 1200
Position (h).
The second pallet T2 that Figure 19 and Figure 20 illustrates neighbouring first pallet T1 positioning is passed towards second substrate " loaded " position 1312
The process sent and be transferred back to after being mounted with glass G.
Therefore, according to above-described embodiment, since the first pallet T1 and the second pallet T2 is alternately sent to first substrate dress
Position 1311 and second substrate " loaded " position 1312 are carried, therefore can reduce and be respectively aligned to each pallet and for being aligned and loading
The time of substrate to shorten pitch time compared with the relevant technologies, and then improves productivity.
Figure 21 is the plan view according to the substrate loading system of another example embodiments of concept of the present invention.Figure 22 is root
According to the plan view of the substrate loading system of another example embodiments of concept of the present invention.
Example embodiments shown in Figure 21 are different from being not include that pallet transmits in place of example embodiments shown in Figure 16
The curve transmission unit 1351 of module 1350.
In this case, although pitch time slightly extend be unfavorable, can advantageously reduce equipment cost and
It is easy to be safeguarded and is repaired.Therefore, in this example embodiments, it is contemplated that be designed to the productivity entirely equipped
Change.
Example embodiments shown in Figure 22 are different from being in place of example embodiments shown in Figure 16, multiple substrates alignment and
Chamber 1300a and 1300b is loaded to be divided into first substrate " loaded " position 1311 and second substrate " loaded " position 1312
Multiple independent chambers, and simple designs are carried out to pallet delivery module 1350.
In this case, although pitch time slightly extend be unfavorable, can advantageously reduce equipment cost and
It is easy to be safeguarded and is repaired.Therefore, in this example embodiments, it is contemplated that be designed to the productivity entirely equipped
Change.
Figure 23 is another example embodiments according to concept of the present invention, explains the flow of the method for loading substrate
Figure.
As shown in figure 23, include pallet transfer operation (S110), pallet according to the method that the present embodiment is used to load substrate
Batch operation (S120), pallet lift operation (S130), pallet alignment function (S140), base plate alignment and loading operation (S150)
And substrate transfer operation (S160).
During pallet transfer operation (S110), when loading glass G, along the pallet transmission line for being used for delivery tray T
1100 delivery tray T.
During pallet batch operation (S120), towards first substrate " loaded " position 1311 and second substrate " loaded " position
1312 selectively distribute the first pallet T1 and the second pallet T2.
Pallet lift operate (S130) during, by pallet T from correspond to pallet transmission line 1100 height increase or
It is reduced to the height corresponding to first substrate " loaded " position 1311 and second substrate " loaded " position 1312.
During pallet alignment function (S140), selected from multiple first substrate " loaded " positions 1311 and second substrate dress
Carrying any one of the substrate loading position of position 1312 substrate loading position makes pallet T be aligned, the multiple first substrate
" loaded " position 1311 and second substrate " loaded " position 1312 are transmitted for being aligned and being loaded by glass G along pallet transmission line 1100
Pallet T on.
During base plate alignment and loading operation (S150), so that glass G is aligned and be loaded on pallet T.
During substrate transfer operation (S160), after so that glass G is loaded on pallet T, along the substrate line of return
1200 transmission are mounted with the pallet T of glass G.
Thus, according to the present embodiment, providing wherein makes base plate alignment and is loaded into the loading of multiple substrates on pallet
Position, and the pallet is alternately sent to these substrate loading positions to be loaded.Therefore, with the substrate of the relevant technologies
Load System is compared, and the substrate rate of loading can be improved and can prevent equipment area occupied from sharply increasing.Generally, can shorten with base
Plate loads and different pitch times, to which productivity can be improved.
According to these example embodiments, can solve easily during the return operation of mask due to mask and magnetic card
Problem is damaged caused by being contacted between disk.It is therefore possible to prevent particle is generated, to can ensure that yield.
In addition, according to these example embodiments, since offer wherein makes base plate alignment and is loaded into multiple on pallet
Substrate loading position, therefore compared with the substrate loading system of the relevant technologies, the substrate rate of loading can be improved, and can prevent from equipping
Area occupied sharply increases.Generally, it can shorten and be loaded and different pitch times with substrate, to which productivity can be improved.
Although the example embodiments with reference to concept of the present invention especially show and describe idea of the invention, answer
Understand, the variation in various forms and details can be made under conditions of without departing substantially from the spirit and scope of following claims.
Claims (10)
1. a kind of substrate loading system, which is characterized in that including：
Pallet transmission line, the pallet for being mounted with substrate are transmitted along the pallet transmission line；
The substrate line of return is set to the side of the pallet transmission line, after the substrate is loaded on the pallet, edge
The pallet of the pallet transmission line transmission is returned along the substrate line of return；And
Multiple substrates are directed at and load chamber, are set to the side of the pallet transmission line and the substrate line of return, have more
A substrate loading position, the substrate are aligned and are loaded at the substrate loading position and transmitted along the pallet transmission line
The pallet on, and wherein at a substrate loading position selected from the multiple substrate loading position, the substrate quilt
It is aligned and is loaded on the pallet, wherein the multiple substrate loading position includes first substrate " loaded " position and the second base
Plate " loaded " position, the first substrate " loaded " position be located relative to the left side of the substrate Return-ing direction of the substrate line of return with
One of right side, wherein the first pallet along pallet transmission line transmission is transmitted, the second substrate " loaded " position is set to
The side opposite with the first substrate " loaded " position, wherein the second pallet along pallet transmission line transmission is transmitted；And
Pallet dispensed chambers are connected to the pallet transmission line and multiple substrates alignment and load chamber, and towards described the
One substrate loading position and the second substrate " loaded " position selectively distribute first pallet and second pallet.
2. substrate loading system as described in claim 1, which is characterized in that further include channel chamber, the channel chamber is set
It is placed between the pallet dispensed chambers are aligned with the multiple substrates and load chamber, and by the pallet from the pallet point
It is sent to the multiple substrates alignment with chamber and loads chamber.
3. substrate loading system as described in claim 1, which is characterized in that further include supply substrate unit, the substrate supplies
It answers unit to be rotationally arranged at the multiple substrates alignment and loads the side of chamber, and in the first substrate " loaded " position
It is selectively supplied with to described while selectively reciprocating motion between the second substrate " loaded " position, by the substrate
First substrate " loaded " position and the second substrate " loaded " position.
4. substrate loading system as described in claim 1, which is characterized in that the multiple substrates alignment and loading chamber packet
It includes：
Base plate alignment and loading module, are set to the side of the multiple substrate loading position, and by the base plate alignment and dress
It is loaded on the pallet for being transferred into the multiple substrate loading position；And
Pallet alignment modules are set to the side of the multiple substrate loading position and are aligned in the multiple substrate loading position
The pallet.
5. substrate loading system as described in claim 1, which is characterized in that the multiple substrates alignment and loading chamber also wrap
Pallet delivery module is included, the pallet delivery module is connected to from the pallet transmission line via the multiple substrate loading position
The substrate line of return, and transmit the pallet.
6. substrate loading system as claimed in claim 5, which is characterized in that the pallet delivery module includes that curve transmission is single
Member, the curve transmission unit are mounted with the substrate at each of the multiple substrate loading position place along curve transmission
The pallet.
7. substrate loading system as claimed in claim 2, which is characterized in that the pallet transmission line has multilayered structure, with
It is arranged at one of upside and the downside of substrate line of return place, and the multiple substrate loading position is located at and the substrate
The corresponding height of the line of return.
8. substrate loading system as claimed in claim 7, which is characterized in that the channel chamber includes pallet risers, institute
It states pallet risers the pallet is raised and lowered from the height for corresponding to the pallet transmission line to corresponding to the multiple
The height of substrate loading position.
9. a kind of method loading substrate, which is characterized in that the method includes：
Pallet transfer operation, wherein being mounted with the pallet of substrate along the pallet transmission line transmission of delivery tray；
Pallet alignment function, wherein so that the pallet is aligned in a substrate loading position selected from multiple substrate loading positions,
By the base plate alignment and it is loaded into the pallet transmitted along the pallet transmission line at the multiple substrate loading position
On, wherein the multiple substrate loading position includes first substrate " loaded " position and second substrate " loaded " position, first base
Plate " loaded " position is located relative to one of left side and right side of the substrate Return-ing direction of the substrate line of return, wherein along the support
First pallet of disk transmission line transmission is transmitted, and the second substrate " loaded " position is set to and the first substrate " loaded " position
Opposite side, wherein the second pallet along pallet transmission line transmission is transmitted；
Base plate alignment and loading operation, wherein by the base plate alignment and being loaded on the pallet；And
Substrate returns to operation, wherein the pallet for being mounted with the substrate is made to be returned along the substrate line of return, the pallet is in quilt
It is returned along the substrate line of return after being mounted with the substrate；
Wherein, the method further includes pallet batch operation after the pallet transfer operation, wherein first pallet and
Second pallet is selectively distributed to the first substrate " loaded " position and the second substrate " loaded " position.
10. method as claimed in claim 9, which is characterized in that the pallet transmission line has multilayered structure, to be arranged at
One of the upside and downside of substrate line of return place, and the multiple substrate loading position is located at and the substrate line of return pair
The height answered, and
The method further includes pallet lift operation after the pallet batch operation, wherein by the pallet from corresponding to institute
The height for stating pallet transmission line is raised and lowered to the height corresponding to the multiple substrate loading position.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2013-0166382 | 2013-12-30 | ||
| KR1020130166385A KR101570074B1 (en) | 2013-12-30 | 2013-12-30 | An apparatus and method to load substrate |
| KR1020130166382A KR101537967B1 (en) | 2013-12-30 | 2013-12-30 | Apparatus and method for attaching glass and mask |
| KR10-2013-0166385 | 2013-12-30 | ||
| CN201410438438.8A CN104752636B (en) | 2013-12-30 | 2014-08-29 | System and method for the device and method of glassivation and mask and for loading substrate |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201410438438.8A Division CN104752636B (en) | 2013-12-30 | 2014-08-29 | System and method for the device and method of glassivation and mask and for loading substrate |
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| Publication Number | Publication Date |
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| CN106784394A CN106784394A (en) | 2017-05-31 |
| CN106784394B true CN106784394B (en) | 2018-10-09 |
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| CN201611051220.2A Active CN106784394B (en) | 2013-12-30 | 2014-08-29 | System and method for the device and method of glassivation and mask and for loading substrate |
| CN201410438438.8A Active CN104752636B (en) | 2013-12-30 | 2014-08-29 | System and method for the device and method of glassivation and mask and for loading substrate |
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| CN104752636A (en) | 2015-07-01 |
| CN106784394A (en) | 2017-05-31 |
| CN104752636B (en) | 2017-08-15 |
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