KR101741217B1 - Method for aligning substrate - Google Patents

Method for aligning substrate Download PDF

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Publication number
KR101741217B1
KR101741217B1 KR1020150176072A KR20150176072A KR101741217B1 KR 101741217 B1 KR101741217 B1 KR 101741217B1 KR 1020150176072 A KR1020150176072 A KR 1020150176072A KR 20150176072 A KR20150176072 A KR 20150176072A KR 101741217 B1 KR101741217 B1 KR 101741217B1
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KR
South Korea
Prior art keywords
substrate
mask
holder
alignment
aligning
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KR1020150176072A
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Korean (ko)
Inventor
김형목
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주식회사 선익시스템
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Priority to KR1020150176072A priority Critical patent/KR101741217B1/en
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Publication of KR101741217B1 publication Critical patent/KR101741217B1/en

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    • H01L51/56—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H01L2251/56—

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

According to an aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: a substrate transfer step of lifting a substrate with a robot arm and transferring the substrate into a vacuum chamber; A substrate position measuring step of measuring a position of the substrate transferred by the robot arm; A first alignment step of aligning the substrate holder with respect to the substrate such that the substrate is seated in place according to the measured position of the substrate; Placing a substrate on the substrate holder; A second alignment step of aligning the mask and the substrate placed on the substrate holder; And a mask adhering step of adhering the substrate and the mask to each other.

Description

[0001] METHOD FOR ALIGNING SUBSTRATE [0002]

The present invention relates to a method of aligning a substrate. More particularly, the present invention relates to a method of aligning a substrate that can reduce the number of alignments of a substrate and a mask by minimizing the generation of particles by reducing the alignment time of the substrate by placing the substrate in the correct position of the substrate holder.

BACKGROUND ART Organic light emitting diodes (OLEDs) are self-light emitting devices that emit light by using an electroluminescent phenomenon that emits light when a current flows through a fluorescent organic compound. A backlight for applying light to a non- Therefore, a lightweight thin flat panel display device can be manufactured.

The organic electroluminescent device comprises an organic thin film such as a hole injecting layer, a hole transporting layer, a light emitting layer, an electron transporting layer, and an electron injecting layer which are the remaining constituent layers except for the anode and the cathode. / RTI >

In the vacuum thermal deposition method, a substrate is placed in a vacuum chamber, a mask having a predetermined pattern is aligned with a substrate, heat is applied to an evaporation source containing the evaporation material, and a vaporization material sublimated in the evaporation source is evaporated .

Since the step of aligning the substrate and the mask is a cornerstone in subsequent steps, it is very important to increase the accuracy.

In general, the alignment process between the substrate and the mask is performed by aligning the substrate and the mask, attaching the substrate and the mask, checking the alignment mark formed on the substrate and the mask, separating the substrate and the mask from each other, And then repeat the process of checking the alignment mark again. As the repetitive adhesion and separation of the substrate and the mask occur, particles collide with the substrate due to the collision between the substrate and the mask, and the generated particles adhere to the substrate. When the particles adhere to the substrate, There is a fear that the quality of the substrate is deteriorated due to the influence on the process. In addition, it takes a long time to align the substrate by repeating the alignment process, which may increase the tact time.

Korean Patent No. 10-0759578 (published on September 18, 2007)

The present invention relates to a method of aligning a substrate that can reduce the number of alignments of a substrate and a mask by minimizing the generation of particles by placing the substrate in a correct position on the substrate holder and shortening the alignment time.

According to an aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: a substrate transfer step of lifting a substrate with a robot arm and transferring the substrate into a vacuum chamber; A substrate position measuring step of measuring a position of the substrate transferred by the robot arm; A first alignment step of aligning the substrate holder with respect to the substrate such that the substrate is seated in place according to the measured position of the substrate; Placing a substrate on the substrate holder; A second alignment step of aligning the mask and the substrate placed on the substrate holder; And a mask adhering step of adhering the substrate and the mask to each other.

The substrate position measuring step may measure the position of the substrate using a non-electric part coupled to the vacuum chamber.

The secondary alignment step may predict the displacement of the substrate due to adhesion of the substrate and the mask, and align the substrate and the mask in consideration of the predicted displacement of the substrate.

The secondary alignment step may predict a displacement of the substrate by forming a database of displacements of the substrate due to adhesion between the substrate and the mask.

The present invention can reduce the number of alignment of the substrate and the mask by minimizing the generation of particles and shortening the alignment time by placing the substrate in the correct position of the substrate holder.

FIG. 1 is a conceptual diagram of a deposition apparatus for explaining an aligning method according to an embodiment of the present invention.
2 is a block diagram illustrating an alignment method according to an embodiment of the present invention.
3 to 6 are schematic views for explaining respective steps of the aligning method according to an embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The present invention is capable of various modifications and various embodiments, and specific embodiments are illustrated in the drawings and described in detail in the detailed description. It is to be understood, however, that the invention is not to be limited to the specific embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

Hereinafter, a method of aligning a substrate according to the present invention will be described in detail with reference to the accompanying drawings. Referring to the accompanying drawings, the same or corresponding components are denoted by the same reference numerals, The description will be omitted.

FIG. 1 is a conceptual diagram of a deposition apparatus for illustrating an aligning method according to an embodiment of the present invention, and FIG. 2 is a block diagram for explaining an aligning method according to an embodiment of the present invention.

1, a substrate 10, a substrate holder 12, a vacuum chamber 14, an evaporation source 16, a substrate alignment mark 17, a heating unit 18, a mask 20, a mask frame holder 22 A mask frame 24, a vision portion 26, a mask alignment mark 27, and a robot arm 28 are shown.

The method of aligning the substrate 10 according to the present embodiment includes a substrate 10 transferring the substrate 10 into the vacuum chamber 14 by lifting the substrate 10 with the robot arm 28; Positioning a substrate (10) to measure the position of the substrate (10) transferred to the robot arm (28); A first alignment step of aligning the substrate holder 12 with respect to the substrate 10 such that the substrate 10 is seated in place according to the measured position of the substrate 10; Placing the substrate (10) on a substrate holder (12); A second alignment step of aligning the mask (20) with the substrate (10) seated on the substrate holder (12); The number of alignment times of the substrate 10 and the mask 20 by placing the substrate 10 in the correct position on the substrate holder 12, including the step of attaching the mask 20 to the substrate 10 and the mask 20, To minimize the generation of particles and to shorten the processing time of the alignment process.

Before describing the method of aligning the substrate 10, a deposition apparatus for aligning the substrate 10 will be described first. A substrate holder 12, a vacuum chamber 14, an evaporation source 16, a substrate alignment mark 17, and a substrate alignment mark 17. The substrate 10, the substrate holder 12, the vacuum chamber 14, A heating section 18, a mask 20, a mask frame holder 22, a mask frame 24, and a vision section 26.

The inside of the vacuum chamber 14 is maintained in a vacuum atmosphere by a vacuum pump (not shown) where the vacuum chamber 14 is subjected to the deposition process with respect to the substrate 10 which is drawn into the internal space.

The substrate 10 is lifted into the robot arm 28 and is drawn into or drawn out of the vacuum chamber 14 and is placed on the substrate holder 12 to be described later.

The evaporation source 16 is disposed below the vacuum chamber 14 and the evaporation material heated by the heating unit 18 is ejected from the evaporation source 16 and deposited on the substrate 10.

The electrification unit 26 is coupled to the upper side of the vacuum chamber 14 to measure the position of the substrate 10 to be taken. The vision unit 26 may be a charge-coupled device (ccd).

The substrate holder 12 is disposed in the transverse direction inside the vacuum chamber 14, and the substrate 10 transported by the robot arm 28 is seated. Specifically, the substrate 10 transferred by the robot arm 28 is seated on the substrate holder 12 while both ends are supported by the substrate holder 12. The substrate holder 12 is rotatably or movably provided so that the substrate 10 is seated in place.

A mask unit (not shown) including a mask frame holder 22, a mask frame 24, and a mask 20 can be elevably coupled into the vacuum chamber 14.

The mask frame holder 22 is coupled to the end of the shaft passing through the upper wall of the vacuum chamber 14 and can rotate or move together with the rotation or movement of the shaft. The mask frame holder 22 supports the mask frame 24 to which the mask 20 is coupled. A mask 20 is coupled to the mask frame 24 to evaporate the evaporated material evaporated in the evaporation source 16 through the pattern formed on the mask 20 to be evaporated on the substrate 10.

Hereinafter, a method of aligning the substrate 10 according to the present embodiment will be described in detail.

Referring to FIG. 3, the substrate 10 is transferred to the inside of the vacuum chamber 14 by lifting the substrate 10 outside the vacuum chamber 14 using the robot arm 28 (S 10). The robot arm 28 moves linearly with respect to the vacuum chamber 14 so that when the substrate 10 is seated in the robot arm 28 in a skewed manner during lifting of the substrate 10, It can be entrained inside. Since the substrate 10 is seated on the substrate holder 12 in a skewed manner so that the deflection amount of the substrate 10 can not be predicted, There is a problem in that it is difficult to estimate the amount of movement of the substrate 10 when the mask 20 is attached and the alignment process of the substrate 10 and the mask 20 is repeated several times.

In this embodiment, the above-described problem can be solved by performing the first alignment step S30 of aligning the substrate 10 and the substrate holder 12. [

Prior to the first alignment step S30, the position of the substrate 10 transferred by the robot arm 28 is measured to determine the position of the substrate 10 (S20). The positioning of the substrate 10 can be done by the vision 26 coupled to the top of the vacuum chamber 14 and the degree and position of the substrate 10 can be determined through the positioning of the substrate 10 have.

Next, referring to FIG. 4, the substrate holder 12 is aligned with respect to the substrate 10 such that the substrate 10 is seated in the correct position according to the measured position of the substrate 10 (S30). This step is a first alignment step S30, which is the step of moving or rotating the substrate holder 12 so that the substrate 10 is seated in the correct position of the substrate holder 12. In this embodiment, the term " fixed position " means that the substrate 10 is correctly seated without being distorted in the substrate holder 12. For example, " May mean that the substrate 10 is evenly supported by the substrate holder 12, and as another example, the " correct position " may mean that both ends of the substrate 10 are supported by the substrate holder 12 You may. Since the substrates 10 mounted on the substrate holder 12 at the predetermined positions exhibit the same amount of deflection, it is easy to predict the movement amount of the substrate 10 when the substrate 10 and the mask 20 are attached together.

After the first alignment step S30, the substrate 10 is placed on the substrate holder 12.

Next, referring to FIG. 5, the mask 20 is aligned with the substrate 10 mounted on the substrate holder 12 (S40). This step is a secondary alignment step in which the substrate alignment marks 17 displayed on the substrate 10 and the mask alignment mark 27 displayed on the mask 20 are used to align the substrate 10 and the mask 20 ).

Referring to FIG. 6, the second alignment step S40 predicts the displacement of the substrate 10 due to the adhesion of the substrate 10 and the mask 20, and considers the displacement of the substrate 10 Thereby aligning the substrate 10 and the mask 20. Fig. When both ends of the substrate 10 are supported by the substrate holder 12, deflection occurs in the central portion of the substrate 10 due to the load of the substrate 10. When the substrate 10 and the mask 20 are attached together Such deflection may cause a change in the position of the substrate 10, and the substrate alignment mark 17 displayed on the substrate 10 also moves due to the change in the position of the substrate 10. [ When the substrate alignment mark 17 is moved, alignment of the first substrate alignment mark 17 and the mask alignment mark 27 is reversed, so that the alignment process of the substrate 10 and the mask 20 may be necessary again have. In the present embodiment, displacement of the substrate 10 is predicted according to the adhesion between the substrate 10 and the mask 20, and according to the predicted amount of displacement, the mask alignment marks 17 are pre- The aligning process can be minimized by moving the mask 27 to align the substrate 10 and the mask 20. 6, when the substrate 10 and the mask 20 are attached together, the substrate alignment marks 17 can be moved from 17a to 17b. In the second alignment step S40, the substrate 10 and the mask 20 The alignment of the substrate 10 and the mask 20 can be minimized by predetermining the amount of displacement of the substrate 10 due to the adhesion of the mask 10 and the mask alignment mark 27 to the point 17b. If such a process is not performed, another alignment process for correcting the displacement amount of the substrate 10 is required. As the alignment process is increased, the number of collisions and spacing between the substrate 10 and the mask 20 is increased There is a high possibility that particles are generated. In this embodiment, it is possible to minimize the alignment process between the substrate 10 and the mask 20 by moving the mask 20 in advance by predicting the amount of displacement of the substrate 10 when the substrate 10 and the mask 20 are attached together will be. In the second alignment step, the displacement prediction of the substrate 10 due to the adhesion of the substrate 10 and the mask 20 is carried out in such a manner that the displacement of the substrate 10 due to the adhesion between the substrate 10 and the mask 20 It can be done based on the database. When the substrate 10 is seated in the correct position of the substrate holder 12, deflection of the central portion of the substrate 10 is the same and when the substrate 10 shows the same deflection, The displacements of the substrate 10 and the mask 20 due to the adhesion of the substrate 10 and the mask 20 are made into a database and are used in advance so that the substrate 10 and the mask 20 And estimates the amount of displacement of the substrate 10 due to adhesion.

The above-described alignment method of the substrate can reduce the number of alignment of the substrate and the mask by minimizing the generation of particles by positioning the substrate in the correct position of the substrate holder, and shorten the alignment time of the substrate and the mask .

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention as defined in the appended claims. And changes may be made without departing from the spirit and scope of the invention.

10: substrate 12: substrate holder
14: vacuum chamber 16: evaporation source
17, 17a, 17b: substrate alignment mark 18:
20: mask 22: mask frame holder
24: mask frame 26: vision part
27: Mask alignment mark 28: Robot arm

Claims (4)

A substrate transfer step of transferring the substrate into the vacuum chamber by lifting the substrate with the robot arm;
A substrate position measuring step of measuring the position of the substrate transferred into the vacuum chamber and lifted by the robot arm;
A first alignment step of aligning the substrate holder with respect to the substrate such that the substrate is seated in the substrate holder at a predetermined position according to the measured position of the substrate;
Placing a substrate on the substrate holder;
A second alignment step of aligning the mask and the substrate placed on the substrate holder;
And a mask attaching step of attaching the substrate and the mask together,
Wherein the second ordering step comprises:
And predicting a displacement of the substrate due to adhesion between the substrate and the mask, and aligning the substrate and the mask in consideration of the predicted displacement of the substrate. The method according to claim 1,
The substrate position measuring step may include:
Characterized in that the position of the substrate is measured using an electromagnet coupled to the vacuum chamber. delete The method according to claim 1,
Wherein the second ordering step comprises:
Wherein displacement of the substrate due to adhesion between the substrate and the mask is converted into a database to predict the displacement of the substrate.
KR1020150176072A 2015-12-10 2015-12-10 Method for aligning substrate KR101741217B1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180136211A (en) * 2017-06-14 2018-12-24 주식회사 에스에프에이 Precision alignment system and alignment method of substrate and mask
KR20220096564A (en) * 2020-12-31 2022-07-07 주식회사 선익시스템 Aligning apparatus in substrate processing equipment and aligning method thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101310336B1 (en) * 2013-03-28 2013-09-23 주식회사 아이.엠.텍 Largest space glass aligner of driving apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101310336B1 (en) * 2013-03-28 2013-09-23 주식회사 아이.엠.텍 Largest space glass aligner of driving apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180136211A (en) * 2017-06-14 2018-12-24 주식회사 에스에프에이 Precision alignment system and alignment method of substrate and mask
KR101966133B1 (en) * 2017-06-14 2019-08-13 주식회사 에스에프에이 Precision alignment system and alignment method of substrate and mask
KR20220096564A (en) * 2020-12-31 2022-07-07 주식회사 선익시스템 Aligning apparatus in substrate processing equipment and aligning method thereof
KR102664485B1 (en) 2020-12-31 2024-05-08 주식회사 선익시스템 Aligning apparatus in substrate processing equipment and aligning method thereof

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