Technical background
Organic electroluminescence display device and method of manufacturing same (OELD) is electroluminescent cell (the Electroluminescent Element at the semi-conducting material of ZnS, CaS etc.; Hereinafter referred to as " EL element ") on add electric field, produce luminous display unit, since 74 years Japanese Sharp (SHARP) companies deliver high-light long-life film EL element, through numerous research, to the practicability stage fast development of EL display unit, the Tang (C.W.Tang) of Kodak (Kodak) company has delivered and has utilized organic pigment to make the film EL element, can send after the high brightness green glow, and the research about organic EL of helping reducing driving voltage is become increasingly active.
Because the shortcoming of inorganic el element (GaN, ZnS, SiC) is because the inefficient problem that high driving voltage and blue light-emitting can bring in order to substitute inorganic el element, has been developed display of organic electroluminescence.Display of organic electroluminescence is to be made as the luminescent layer of organic film and the injection type element of carrier (carrier) transfer layer.As the unimolecule organic EL, based on anthracene, Alq3 (aluminic acid oxyquinoline complex compound) and cyclopentadiene derivant, the advantage of such unimolecule element is to have low driving voltage and be thinned to thin-film material near 100nm, and weak point is the problem of the aspects such as molecule reallocation that the circuit heating causes during to the fail safe of heat and power supply.
On the other hand, use PPP (polyparaphenylene poly (p-phenylene)), PPV (polyvinyl benzene poly (phenylene vinylene)) etc. as the macromolecule organic EL, such element has the fail safe of heat and low driving voltage, and shortcoming is that the life-span is short and efficient is undesirable.
The lamination structure of organic EL (OELD) is divided into single-layer type (sing-layer) and multi-layered type (multi-layer) substantially, at first single-layer type is the structure of electrode/luminescent layer/electrode, and the negative electrode of electron injection electrode (cathode) uses work function (workfunction) little metal such as Ca, Mg, Al etc.The reason that the little metal of this work function is used for electron injection electrode is: owing to reduce the barrier potential (barrier) that forms between electrode and the electroluminescence organic substance, can obtain high current density (current density) in the electronics injection.
Anode (Anode) is the electrode of injected hole (hole), uses transparent metal oxide, can improve work function, makes the light that sends outside element, is extensive use of ITO (indium tin oxide, indium tinoxide), the about 30nm of thickness.Using the strong point of ITO is optical clear, and weakness is to be difficult to control.Anode (Anode) uses the metal with high work function (workfunction), is because can prevent that anode from passing through non-luminous compound (recombination) and lowering efficiency.
And substrate (substrate) material uses glass (glass) mostly, luminescent layer (EML) material uses the organic EL of unimolecule, PPV (polyvinyl benzene poly (p-phenylenevinylene)), the PT (polythiophene polythionphene) of Alq3, anthracene (Anthracene) etc.) etc. the organic EL material of macromolecule of complex compound, owing under low driving voltage, emit electric charge, so must be EML layer filmization (100nm).
Multi-layered type is the hole transporting layer of adding the electron supplying layer that is called ETL (Electron transportingLayer) and being called HTL (Hole Transporting Layer) in the structure of single-layer type in addition.ETL Shi Yong oxadiazole (oxadiazole) complex compounds etc., HTL use TPD and high molecular poly-(9-vinyl acrbazole) (poly (9-vinyl acrbazole)) of photoconduction of diamines (diamine) complex compound.
By such transfer layer combination, improve quantum efficiency (photons out par chargeinjected), not that carrier (carrier) directly injects, the process of dividing two sections injections by transfer layer, can reduce driving voltage, inject the electronics and the hole process luminescent layer of luminescent layer, when an opposite lateral electrode moves, because the obstruction of the transfer layer of an opposite side can be regulated synthetic again.Has advantage by such raising luminous efficiency.
In order to improve the tone that luminous efficiency obtains wishing, in common luminescent layer, mix the organic substance of a few percent, for high electricity is led, low work function and anti-corrosion, electrode (cathode) is made of metal alloy, adopts two kinds of common different metals while evaporations to form.
Therefore will be with certain pattern evaporation on glass substrate, what its occlusion method used is planar mask.Carry out evaporation after just making planar mask and substrate contacting, can form the electrode or the luminescent layer of wishing pattern with desirable pattern form.In the present invention, use the substrate that forms anode pattern,, use planar mask for evaporation on it has pattern.
This moment is consistent with the pattern of design in advance in order to make, will be planar mask and glass substrate marshalling, the limit is observed the limit with the CCD gamma camera and is moved planar mask for this reason, makes mark (mark) alignment on glass substrate and the planar mask, then planar mask and glass substrate is adjacent to.
With existing manufacturing equipment in order under ordered state, planar mask to be adjacent on organic substrate, utilization makes the erecting device of planar mask oscilaltion, this moment is in order to form circuit pattern, whole of planar mask centre must be close on the glass substrate, so described planar mask erecting device is under the state that only supports with the planar mask edge, is adjacent on the bottom surface of substrate.Therefore the planar mask core of metal sheet is because gravity and sagging.The area of planar mask big more (the OELD size that is to say manufacturing is big more) particularly, the sagging in centre is serious more, can not form correct circuit pattern because cause at the interval of glass substrate surface and planar mask.This is its shortcoming.
In order to overcome this problem, developed at glass substrate top configuration permanent magnet, under the state of glass substrate and planar mask arrangement, make permanent magnet downward, attract to arrange good metal shadow mask plate, make it be adjacent to the device of substrate.Promptly use such device, (before just permanent magnet attracts planar mask) sagging phenomenon of planar mask still exists when substrate and planar mask arrangement, therefore can not overcome to be difficult to correct shortcoming of arranging.
Summary of the invention
In order to overcome this two shortcomings, the inventor has delivered and has used the planar mask that electromagnet and permanent magnet are arranged to lay the planar mask erecting device of workbench, utilizes this device can reach the purpose of correct arrangement.But, can not carry out evaporation owing to lay stationary table below substrate.Therefore in being provided with the arrangement container of described erecting device, substrate and planar mask are arranged, substrate and planar mask are adjacent to after, move on to again and carry out evaporation in the deposited chamber.Therefore the container of evaporation needs will increase, and the time will increase, and whole production efficient reduces the problem that manufacturing cost also will increase so have not only.
The present invention is to be target to overcome such shortcoming, utilize the planar mask that electromagnet and permanent magnet are set simultaneously to lay workbench, glass substrate and planar mask be arranged in parallel during arrangement, lay the method that workbench moves 3 shaft positions by using planar mask, can carry out correct arrangement, arrange the back utilization and comprise that the planar mask anchor clamps of permanent magnet are adjacent to glass substrate and planar mask, then planar mask is laid workbench and move on to outside the operating position, can in same container, carry out evaporation like this.Therefore can realize correct the arrangement and good evaporation efficient simultaneously.
The purpose of this invention is to provide a kind of evaporation coating device that is used to make display of organic electroluminescence that uses the planar mask erecting device of permanent magnet and electromagnet.
Another object of the present invention provides a kind of evaporation coating device and method, and this evaporation coating device can easily be controlled glass substrate and planar mask is correctly arranged and arranged-be adjacent to-position of planar mask during evaporation.
A further object of the present invention provides a kind of evaporation coating device, and is irrelevant with the size of planar mask, can make whole area and glass substrate sturdy, by glass substrate and planar mask keeping parallelism, can come into line substrate and planar mask during arrangement.
Another purpose more of the present invention provides a kind of evaporation coating device and method, after planar mask and glass substrate being arranged be adjacent to, the planar mask of use is laid workbench move on to outside the operating position, carries out evaporation then in same container.
Another object of the present invention provides a kind of evaporation coating method, utilizes described device, by planar mask is carried out Position Control, can improve the evaporating quality and the evaporation efficient of display of organic electroluminescence.
In order to achieve the above object, display of organic electroluminescence evaporation coating device of the present invention is constructed as follows:
It includes vacuum chamber, planar mask anchor clamps, planar mask and lays workbench, optical arrangement decision maker, linear guide, control assembly; The planar mask anchor clamps are contained in vacuum chamber top, have to be used for the planar mask that sequences is close to permanent magnet on the glass substrate; Planar mask is laid workbench and is arranged on planar mask anchor clamps bottom in order to place planar mask, include the 3 shaft position mobile devices of controlling with control assembly, control assembly is used for the upper glass substrate being arranged with the glass substrate that is placed and being connected with the outside; The optical arrangement decision maker is to be used to confirm described glass substrate and planar mask ordered state; Linear guide is used for making in vacuum chamber described planar mask to lay the workbench move left and right; Control assembly is arranged on outside the vacuum chamber, be used for controlling described 3 shaft position mobile devices position, linear guide, be added in current polarity and size on the electromagnet.
The permanent magnet of described planar mask anchor clamps is by with rule at interval, constitute in that more than one permanent magnet is being set across whole anchor clamps, lay on the workbench at planar mask, be provided with more than one electromagnet-permanent magnet assembly across whole workbench, by change be attached to the electric current on the electromagnet size and (or) polarity, can regulate the magnetic field intensity of laying workbench.
The planar mask anchor clamps of the 1st execution mode of the present invention be by the magnetic patch of big permanent magnet, be fixed on magnetic patch top moves up and down magnetic patch in container supporting rod, with respect to described magnetic patch up and down the substrate carrier of resilient movement constituted.
Substrate carrier is by 4 springs, moves up and down rod, 2 substrate support bars (bar) formation.4 springs insert in the perforation ditch of four jiaos of magnetic patch; Move up and down rod and insert in the spring, can flexibly move up and down with respect to magnetic patch; 2 substrate support bars move up and down excellent the connection with 2, have to be used to limit the restriction protrusion that the glass substrate edge moves.
Magnetic patch is to be made of upper plate, lower plate, a plurality of permanent magnet, insulating frame.Upper plate is that one side has the ditch of laying magnetic patch every predetermined distance in the bottom surface; Lower plate is to leave the interval of regulation with respect to described upper plate; A plurality of permanent magnet horizontal directions are placed between described upper plate and the lower plate; Insulating frame is located between described upper plate and the lower plate, supports its edge.
The 2nd execution mode of the present invention is that described planar mask anchor clamps are made of hollow block, magnetic patch, the 1st support stick, the 2nd support stick, substrate carrier.Magnetic patch is provided in a side of the permanent magnet of hollow block inside; The 1st support stick is fixed on hollow block top, and hollow block is moved up and down in container; The 2nd support stick is fixed on the top of described magnetic patch, moves up and down in magnetic patch inside; Substrate carrier can be with respect to resilient movement about the described hollow block; Described substrate carrier be by 4 springs, 4 move up and down rod, 2 substrate support bars (bar) constitute; 4 springs insert in the perforation ditch of four jiaos of hollow blocks; 4 move up and down excellent the insertion in the spring and flexibly move up and down with respect to magnetic patch; The substrate support bar is to move up and down excellent the connection with 2, has the restriction protrusion that is used to limit substrate edge.
It is to lay plate by electromagnetic block, planar mask to constitute that described planar mask is laid workbench.Electromagnetic block has more than one electromagnet-permanent magnet assembly, moves by 3 shaft position mobile devices; Planar mask is laid plate and is used to lay planar mask.Each electromagnet-permanent magnet assembly is to be made of electromagnet core, permanent magnet iron core, tube, winding.Permanent magnet is contained in the electromagnet core bottom; Tube is around electromagnet core and permanent magnet; Coil is wound on around the tube.3 shaft position mobile devices are to make described planar mask lay workbench to move in x, y, θ direction.
Linear guide is by laying the guide rail on the workbench and along described line slideway the drive unit (drive motors) of laying movable workbench being constituted.
The evaporation coating method that uses described device shows as two kinds of methods by above-mentioned two kinds of execution modes.
At first, utilize the 1st kind of method of device of the 1st execution mode of the present invention by constituting with the next stage.
The 1st execution mode was made up of 5 stages.The 1st stage was: after using the vacuum automatics that described planar mask is placed in to lay on the workbench, laying workbench utilizes linear guide to move to outside the operating position, with the vacuum automatics glass substrate is placed on the planar mask anchor clamps, move on to operating position laying workbench again, feed forward (electromagnet is had and the identical direction of permanent magnet polarity of laying workbench) electric current for described electromagnet, planar mask be close to lay on the workbench after, make it move to glass substrate below.The 2nd stage was: utilize described optical arrangement device limit to judge, the position that lateral dominance is laid workbench with described 3 shaft position mobile devices control, arranged glass substrate and planar mask.The 3rd stage was: described electromagnet is added reverse current, make the magnetic field intensity of the laying workbench magnetic field intensity less than anchor clamps, planar mask moves up and down, and is adjacent to glass substrate.The 4th stage was: utilize described linear guide, make and lay workbench and move on to outside the evaporation operating space.The 5th stage was to carry out evaporation.
In described the 3rd stage, can also comprise for the 6th stage, promptly utilize the magnetic field intensity of anchor clamps that planar mask and glass substrate are adjacent to after, the anchor clamps that substrate and planar mask are housed are risen to the evaporation position, can also comprise that shielding is added in the stage of the electric current on the electromagnet.This moment, planar mask moved near the anchor clamps, owing in the magnetic field intensity scope of permanent magnet, even flow through current of electromagnet, also can not attracted to and lay workbench one side on anchor clamps.
The mode that makes glass substrate place-fix in the 1st stage is that magnetic patch is moved up, the rod that moves up and down of substrate carrier utilizes brake (stopper) spring of container upper end to insert under the state of moving down, make glass substrate be limited to the restriction protrusion place of substrate support bar, and then magnetic patch is fallen, brake and the releasing that contacts that moves up and down rod, utilize spring to make simultaneously to move up and down rod to move up, the glass substrate that the result inserts closely is fixed on the magnetic patch.Certainly because when inserting glass substrate, magnetic patch reduces downwards again, more near being placed on following planar mask.
In addition, adopt the 2nd kind of method of the device of the 2nd kind of execution mode of the present invention to constitute by 5 stages.
The 1st stage was that described magnetic patch is positioned under the state on hollow block top, glass substrate is placed on the described planar mask anchor clamps fixes, and described planar mask is placed in lays on the workbench.The 2nd stage was to judge with described optical arrangement device on one side, with described 3 shaft position mobile devices control the position of laying workbench, arranged glass substrate and planar mask on one side.The 3rd stage was to make described magnetic patch move to the hollow block bottom, added reverse current for described electromagnet, made the magnetic field intensity of laying workbench littler than the magnetic field intensity of anchor clamps, and planar mask moves up and down, and is adjacent to glass substrate.The 4th stage was to make with described linear guide to lay workbench and move on to outside the evaporation operating space.The 5th stage was to carry out evaporation under vacuum state in described container.
No matter be the 1st kind of method or the 2nd kind of method, after the evaporate process in described the 5th stage was finished, in order to make planar mask and substrate separation, the planar mask separation phase included: 1. make with described linear guide and lay workbench and turn back to the evaporation operating space; After the planar mask anchor clamps are fallen, add forward current, increase the magnetic field intensity of laying workbench, make planar mask drop on planar mask and lay on the workbench by giving the described electromagnet of laying workbench.
In the 2nd kind of method, except the step of described planar mask separation phase, the planar mask separation phase can include: 1. make with described linear guide and lay workbench and turn back to the evaporation operating space; After the planar mask anchor clamps are fallen, make described magnetic patch move on to the top of hollow block, planar mask is separated from substrate, drop on planar mask and lay on the workbench.In above-mentioned process 2., can give described electromagnet additional electric current in the other direction.As described below, this is owing in order to prevent that anchor clamps are strong excessively with the magnetic field intensity of laying workbench, cause the crooked or distortion of thin substrate.
Embodiment
With reference to the accompanying drawings embodiments of the present invention are elaborated.
Fig. 1 is the arrangement of display of organic electroluminescence of prior art (only use permanent magnet) and the structure chart of evaporation coating device, is by container (chamber) l0, is arranged in the container and has planar mask anchor clamps 20, glass substrate carriage 30, planar mask carriage 40, CCD gamma camera 50 and 3 dimension collating units (not expression among the figure) formation of permanent magnet.
Pay close attention to the words of the process of glass substrate and planar mask arrangement, at first be that glass substrate 60 is placed on the glass substrate carriage 30, after being placed on planar mask 70 on the planar mask carriage, start 3 dimension collating units while observing with the CCD gamma camera, make glass substrate carriage 30 and (or) planar mask carriage 40 moves, and is consistent with the arrangement mark (M ') on the planar mask up to the arrangement mark (M) on the glass substrate.Planar mask anchor clamps 20 are moved down, use the magnetic field suction planar mask of permanent magnet then, it is adjacent on glass substrate.Under vacuum state, carry out evaporation subsequently.
In this case, the arrangement stage for wide planar mask owing to merely limit portion is supported on the carriage, mid portion is sagging, is not parastate at cross mark segment glass substrate and planar mask therefore.In order to address this problem, be provided with the device of keeping stretching 80 at tensioned mask plate two ends, but can not deal with problems fully, therefore under the hang of planar mask middle part, permanent magnet descends, it is on glass that planar mask is placed on, and sagging middle part upwarps, and ordered state is bad, even so in the process that keeps tension force, not only planar mask is stretched, and takes place saggingly, and has caused the difficulty of transferring to automatics because of the weight of the device of keeping stretching.
Fig. 2 is the integrally-built sectional drawing of evaporation coating device of the present invention's the 1st execution mode, is to be laid workbench 300, linear guide 400, be positioned at internal tank or outsidely be used to judge that 4 CCD gamma cameras of the Optical devices of substrate and planar mask ordered state constitute by big vacuum tank 100, the planar mask anchor clamps 200, the planar mask that are positioned at vacuum tank inside.
This external container bottom is provided with the vapor deposition source (source or Effusion Cell) that is used for evaporation, and planar mask is arranged the back and moved on to outside the evaporation operating space laying workbench, with the vapor deposition source heating, and the organic substance evaporation in vapor deposition source, evaporation is on substrate.As a reference, wish that substrate and planar mask rotate this moment under the marshalling state.
Be useful on the opening of exchange glass substrate among the figure on the left side wall of container, open and close opening with valve 810.Automatics with the outside can be loaded and unloaded glass substrate automatically on planar mask carriage 200.The drive motors 420 that is arranged on the lower end, right side constitutes linear guide with line slideway 410, plays to make planar mask lay the effect of workbench 300 move left and right.
Comprise that the 3 shaft position mobile devices 340 of laying workbench by being contained in electromagnet block 310 above it in x, y, small the moving of θ direction, carry out planar mask and align with glass substrate.Each part is elaborated with reference to following Fig. 3 and Fig. 4.
The sectional drawing that Fig. 3 amplifies for the evaporation coating device major part has been represented that a part, planar mask anchor clamps 200, the planar mask of vacuum tank 100 laid workbench 300, linear guide 400, has been placed on internal tank or 4 outside CCD gamma cameras 500.In order to simplify, omitted the structure of container bottom.
The structure of planar mask anchor clamps 200 includes: comprise the magnetic patch of permanent magnet, the magnetic patch that is fixed on magnetic patch top, the support stick 220 that moves up and down and with respect to the described magnetic patch substrate carrier 230 of resilient movement up and down in container.
The structure of substrate carrier 230 includes: insert four jiaos of through holes of magnetic patch 4 springs 231, be clipped in the spring 4 and move up and down rod 232, move up and down excellent the connection with 2, with prolong on one side along magnetic patch, there are 2 glass substrate support bars 233 of glass substrate restriction protrusion 234 end.This has 4 substrate carrier brakes (stopper) 110 of projection state above external container with on excellent 232 opposite positions of moving up and down of substrate carrier 230.
The structure that planar mask is laid workbench 300 comprises: carry out change in location with 3 shaft position mobile devices 340, inside has the electromagnetic block 310 of a plurality of electromagnet-permanent magnet assembly, the planar mask of laying planar mask to lay plate (32), can be provided for that planar mask 600 is transplanted on the planar mask that planar mask lays on the plate 320 transfers handle 330.
Being used to make planar mask to lay workbench 300 all linear guides that move 400 below planar mask anchor clamps 200 is by the line slideway 410 that makes electromagnet block 310 move left and right and along line slideway the drive motors (Fig. 2 420) of the mobile drive unit of electromagnet block 310 (planar mask is laid workbench) to be constituted.
Fig. 4 a is the magnetic patch 210 of planar mask anchor clamps 200 and the detailed structure view of substrate carrier 230.
The structure of magnetic patch 210 comprises: upper plate 212, lower plate 213, a plurality of permanent magnet 241, insulating frame 215.Upper plate 212 is to be made of the metal materials such as nickel that have a plurality of magnetic patch to lay ditch 211; Lower plate 213 is parallel with upper plate 212, at a distance of the interval of regulation; A plurality of permanent magnets 241 insert between upper plate and the lower plate in vertical direction; Insulating frame 215 is connected all around with upper plate and lower plate, makes upper plate and lower plate be in isolation.At four jiaos of upper plate, lower plate and support frame, the spring 231 of substrate carrier 230 is arranged and be used for inserting 4 through slots 216 that (inboard) moves up and down rod 232.
The configuration of the permanent magnet 214 on planar mask anchor clamps 200 to the polar orientation of each permanent magnet without limits, on easily manufactured, it is identical to wish that all permanent magnets are configured to polar orientation.(in the drawings, all to be configured to the bottom be that the N utmost point, top are the S utmost points to all permanent magnets.)
The structure of substrate carrier 230 comprises: 4 231,4 on springs move up and down 232, two glass substrate support bars 233 of rod.4 springs insert in the through slot 216 of magnetic patch; 4 move up and down rod 232 and insert in the spring; Two glass substrate support bars 233 are connected with two bottoms that move up and down rod, along one side prolongation of magnetic patch.Having in the end of glass substrate support bar 233 can be to the spacing glass substrate restriction protrusion 234 in substrate one side.Owing to being connected, glass substrate support bar 233 moves up and down on the rod 232 in the drawings, utilize connecting bolt 235, it is bigger than the diameter of spring to move up and down rod 232 head, moves up and down rod when moving down, interact owing to move up and down club head and spring, be subjected to elastic force upwards.Move up and down the stopping means (figure not expression) that the club head utilization is arranged in through slot top and support, make to move up and down rod and do not break away from upper plate.
Fig. 4 a represents that glass substrate 700 usefulness substrate carrier support, and is adjacent to the lower plate 213 of magnetic patch.
Fig. 4 b is the cut-away view that planar mask is laid workbench 300, has represented that the electromagnet block 310, the planar mask that have with described magnetic patch 210 similar structures (upper plate, lower plate, insulating frame) lay plate 320.A plurality of electromagnet-permanent magnet the assembly 340 that has vertical direction to be provided with in the electromagnet block 310.
The structure of each electromagnet-permanent magnet assembly 340 includes: superposed electromagnet core 341, the permanent magnet 342 that is positioned at the electromagnet core bottom, the tube 343 that encases electromagnet core and permanent magnet and the winding 344 around the tube.Electromagnet core is the magnet that energising back produces magnetic field, can use the magnet of ferrite series or nickel etc.Change the size of current and the polarity of the winding of flowing through, the magnetic field intensity of permanent magnet is increased or reduce, so can arbitrarily change the total magnetic intensity of electromagnet block.
Shown in Fig. 4 b, the N utmost point of permanent magnet 342 is made progress, on electromagnet, add forward current, the electromagnet core upside remains the N utmost point, produces the magnetic field of permanent magnet and the magnetic field of electromagnet, and total magnetic field intensity of laying workbench increases.Add electric current in the other direction on the contrary, the electromagnet core upside forms the S utmost point, and the magnetic field intensity of permanent magnet is reduced, and total magnetic field intensity reduces.
Identical with the configuration of the permanent magnet 214 of planar mask anchor clamps 200, when configuration electromagnet-permanent magnet assembly, to the direction of permanent magnet 342 polarity without limits, wish that all same polarity of permanent magnet is set to identical direction.But in this case, must make the winding direction of winding on the electromagnet identical, when adding the electric current of certain polarity, make electromagnet-permanent magnet assembly produce identical magnetic field.
Hope covers the magnetic shield part to around the electromagnet core 341 and bottom, so that the magnetic field intensity maximum of planar mask direction.
Utilize the electromagnet-permanent magnet assembly of aforesaid way in the drawings, do not limited this mode that adopts.So long as more than one permanent magnet is just passable with the more than one electromagnet that is used to that permanent magnet field is increased or reduce, whatsoever mode can.A big tabular permanent magnet and the structure of more than one electromagnet is set on it for example.
Fig. 5 carries out the diagram of the process of arrangement of planar mask and substrate and evaporation simultaneously for expression utilizes evaporation coating device of the present invention in a container.
Fig. 5 a represents the planar mask that planar mask 600 is installed in evaporation coating device of the present invention is laid process on the workbench 300.In order to protect thin planar mask, after planar mask is placed on planar mask and lays on the plate 320, utilize the vacuum automatics, it be contained in planar mask lay workbench 300 above.
Fig. 5 b represents the glass substrate installation process, moves up and down by support stick 220, and magnetic patch 210 is moved up, and the top that moves up and down rod 232 of substrate carrier 230 is subjected to being contained in the effect of the substrate carrier brake 110 above the container 100, moves down.Therefore glass substrate support bar 233 moves down, and is separated from certain distance with magnetic patch 210.In this state, by glass substrate 700 is pressed in the glass substrate restriction protrusion 234 of glass substrate support bar 233, load onto substrate.After installing glass substrate, magnetic patch 210 moves down again, and is identical with Fig. 4 b, relies on the elastic restoring force of spring 231, and glass substrate support bar 233 rises, and is adjacent to below glass substrate and the magnetic patch 210.Identical with Fig. 5 c, the planar mask of placing planar mask is in this case laid workbench 300 and is positioned at the substrate bottom.In the electromagnet core 341 of electromagnet block, must utilize the additional forward current that makes the magnetic field-intensification of permanent magnet 342, make the permanent magnet that is moved down near the magnetic patch 210 of planar mask can not upwards pick up planar mask 600 (mode of Fig. 4 b).
Fig. 5 c represents process that planar mask and glass substrate are arranged.
To the additional forward current of electromagnet, lay under the state that workbench 300 is adjacent to making planar mask and planar mask, the limit is judged with the CCD gamma camera, the limit drives 3 shaft position mobile devices, planar mask is laid workbench 300 finely tune in x, y, θ direction, coincide up to the alignment mark of planar mask and the alignment mark of glass substrate.
Arrange back control section (not expression among the figure) and give electromagnetism Tie Tong reverse current, the magnetic field intensity that makes planar mask lay workbench reduces.Therefore utilize the big magnetic patch of relative magnetic field strength 210 that planar mask is attracted upward, it is close on the substrate.
After substrate and planar mask are adjacent to, wish that substrate and magnetic patch rise to the evaporation position, the additional reverse current of shielding.Even this is because bucking current, planar mask still under the influence in the magnetic field of magnetic patch 210, so be in order not inhale to laying workbench, not equal to be that the heat that generates in order to prevent to continue to switch on causes the evaporation characteristic changing.
In the present embodiment, under the state below substrate is close to magnetic patch 210, the maximum flux of substrate surface is about 300 Gausses, and the magnetic flux of laying the electromagnet block of workbench is 300 Gausses in the energising precontract, be about 400 Gausses when leading to forward current, be about about 200 Gausses when leading to reverse current.Therefore after planar mask and substrate are adjacent to, though bucking current, being close to state and still can remaining unchanged of substrate-planar mask.
Fig. 5 d is the diagram in expression evaporation stage, come into line under the state that is adjacent at glass substrate 700 and planar mask 600, by the drive motors (not expression among the figure) that drives linear guide 400, lay workbench and shift to the right side along line slideway, break away from operating area (evaporation zone).
Under this state, the vapor deposition source of heating container bottom, because the organic substance evaporation in the heating vapor deposition source, evaporation is on substrate.Above-mentioned all stages all are to carry out in a vacuum, and evaporation rotated under the state that comes into line by substrate and planar mask in the stage, realized even evaporation.
After evaporate process is finished,, must separate planar mask from substrate in order to carry out the evaporation of other substrates.Just must separate planar mask, refill new substrate (not having evaporation), arrange and evaporation.
Not having the process of the separation planar mask of expression among the figure, is to carry out with following mode.
At first 1., the workbench of laying outside operating area in the evaporate process is turned back to the evaporation space; 2. after falling the planar mask anchor clamps, increase the magnetic field of laying workbench, planar mask is placed on planar mask lays on the workbench.
Fig. 6 is the evaporation coating device scantling plan of the 2nd kind of execution mode of the present invention.Except the planar mask anchor clamps, other the structure all device with the 1st execution mode is identical, no longer repeat specification.
The structure of the planar mask anchor clamps 200 of the 2nd execution mode includes: hollow block 250, magnetic patch the 260, the 1st support stick the 270, the 2nd support stick 280, substrate carrier 230.Hollow block 250 is cuboids of hollow; Magnetic patch 260 is located in the hollow block and includes permanent magnet; The 1st support stick 270 is fixed on hollow block top, and hollow block is moved up and down; The 2nd support stick 280 inserts the 1st support stick, and an end is fixed on magnetic patch top, and magnetic patch is moved up and down in hollow block; Substrate carrier 230 is with respect to described hollow block resilient movement up and down.The structure of substrate carrier 230 includes: 4 231,4 on springs move up and down 232,2 glass substrate support bars 233 of rod.4 springs 231 insert in the through slot of 250 4 jiaos of hollow blocks; 4 move up and down in the rod 232 insertion springs, can flexibly move up and down with respect to magnetic patch; 2 glass substrate support bars 233 move up and down excellent linking to each other with 2, have the restriction protrusion that is used to limit the glass substrate edge.
The planar mask anchor clamps of the 2nd execution mode are except magnetic patch 260, also be provided with hollow block 250, except making the 1st support stick 270 that anchor clamps integral body moves up and down, the 2nd support stick 280 that in hollow block, in addition magnetic patch is moved up and down, this point is different with the 1st execution mode.
Fig. 7 represents to adopt the 2nd execution mode device to carry out the process of evaporation.Different with Fig. 5, the planar mask anchor clamps comprise hollow block and magnetic patch,, describe as the center because the relative position of two pieces changes in each stage.
At first Fig. 7 a utilizes automatics and bell-type conveyer 330 for the diagram in the stage of the planar mask installed and used of expression, planar mask is contained in lays on the workbench.Because magnetic patch 260 is positioned at hollow block 50 tops, the action of a magnetic field of permanent magnet is less than planar mask in this process.
Below with the similar process of Fig. 5 b, move down after being contained in substrate on the anchor clamps, by entering the arrangement stage like that shown in Fig. 7 b.
Identical with the 1st execution mode of Fig. 5 in the arrangement stage, the electromagnet of laying workbench to planar mask applies forward current, and planar mask is close on the workbench.Alignment processes is carried out the centre, and the magnetic patch 260 of planar mask anchor clamps still remains on hollow block 250 tops, and magnetic field can not affact planar mask.Under this state, the limit is observed with the CCD gamma camera, and the limit drives 3 shaft position mobile devices and arranges.
Arrange the back for planar mask is close on the substrate, shown in Fig. 7 c, carry out the process of clamping planar mask.In the time of just to electromagnetism Tie Tong reverse current, magnetic patch 260 is moved to hollow block 250 belows.Compare with the magnetic field of electromagnet, the magnetic field of permanent magnet (magnetic patch) is stronger, so planar mask 600 upwards attracts, is adjacent to glass substrate 700, makes the planar mask anchor clamps rise to the evaporation position after being adjacent to.Distance between evaporation position of sound production workbench and planar mask becomes far away, so lay the almost not influence of magnetic field of workbench.Even also it doesn't matter therefore to remove extra current.
Fig. 7 d is the diagram of expression evaporate process, after the planar mask anchor clamps of mounted substrate+planar mask rise to the evaporation position, utilize linear guide that planar mask is laid workbench 300 and move on to outside (evaporation) operating space,, make the planar mask anchor clamps carry out evaporation while rotating for even evaporation.
Fig. 8 is expression after evaporate process finishes, the diagram of planar mask separating process from the substrate.
The process of representing among the figure is about the 2nd execution mode in above-mentioned substrate-planar mask separation method.
After at first evaporation was finished, planar mask was laid workbench 300 return space (just below the planar mask anchor clamps) again, and (Fig. 8 a) to make the planar mask anchor clamps drop to the height identical with the arrangement stage.Then the magnetic patch 260 in the hollow block 250 is moved on to top (forever), the magnetic field of magnetic patch dies down, and planar mask falls (Fig. 8 b) from the glass substrate separation.The planar mask that falls is placed on again to be laid on the workbench, and the new substrate of packing into carries out the process of Fig. 7 b~Fig. 7 d repeatedly.The magnet (magnetic patch) that this moment, planar mask was laid the magnet (electromagnet+permanent magnet) of workbench and planar mask anchor clamps attracts planar mask with the high-intensity magnetic field of mutual equity, so under the thin situation of planar mask, can be crooked in separation or be out of shape.Therefore in order to prevent bending or distortion, add reverse current, can make field weakening to electromagnet.
Under the situation of not worrying the planar mask distortion, not mobile magnetic patch increases the method in magnetic field for the electromagnet forward current with increasing separately, also can separate planar mask.
Separate the back in order to replace substrate, the planar mask anchor clamps also move on to the top of container, move on to top back shadow mask plate and lay workbench owing to there is not the influence of electromagnet, can maintain planar mask, so also can all remove (Fig. 8 c) to additional reverse current or forward current.