CN104947061A - Coating chamber with a moveable shield - Google Patents
Coating chamber with a moveable shield Download PDFInfo
- Publication number
- CN104947061A CN104947061A CN201510442799.4A CN201510442799A CN104947061A CN 104947061 A CN104947061 A CN 104947061A CN 201510442799 A CN201510442799 A CN 201510442799A CN 104947061 A CN104947061 A CN 104947061A
- Authority
- CN
- China
- Prior art keywords
- application chamber
- abschirmblech
- chamber according
- substrate
- substrate support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
- C23C16/4585—Devices at or outside the perimeter of the substrate support, e.g. clamping rings, shrouds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13069—Thin film transistor [TFT]
Abstract
The present invention relates to a coating chamber with a moveable shield. The present invention refers to a method of operating a coating chamber as well as a coating chamber comprising a coating source, a transport device for moving a substrate carrier adapted to be able to carry a substrate to be coated into at least one coating position with respect to the coating source, so that the substrate may be coated, and at least one first shield being arranged in an area between the coating position of the substrate and the coating source to prevent coating of areas other than the surface of the substrate to be coated, wherein the first shield comprises a moving apparatus and a coupling device for coupling the first shield and the substrate carrier, so that first shield and substrate carrier are movable together.
Description
The divisional application of the application's application number in be the applying date be on August 13rd, 2009 to be No. 200980133508.6 denomination of invention be Chinese patent application of " application chamber with removable Abschirmblech ".
Technical field
The present invention relates to the method for application chamber and operation application chamber, and particularly wherein can perform the vacuum coated room of film deposition techniques (such as chemical vapour deposition CVD process, plasma reinforced chemical vapour deposition PECVD process, physical vapor deposition PVD process or sputter process).
Background technology
Coating technique is widely used in industry to manufacture different products.Such as, need appliedly have film for construction applications or for the glass substrate that uses in conjunction with display unit (as thin film transistor TFT display unit, Organic Light Emitting Diode OLED display etc.).
For these products, expect to realize even and consistent coating.In addition, in order to keep cost low and obtain competitive product, high efficiency coating process is necessary.Therefore, various method and apparatus has been proposed in the prior art to obtain high-quality coating under reasonable price.
For implement coating deposition various methods can be divided into three kinds dissimilar.The first type is the static coating of substrate.According to this type, in whole coating process, applied substrate to be maintained at individually coated position.Therefore, the dispensing area limited by coating source must cover wants applied whole surface.Although this method very simply and be therefore that cost is effective, and be also suitable for various application, but this method has following shortcoming: because may be differently coated with due to the region that the steric requirements of substrate surface is different, so the coating deposited may not on the whole surface evenly and consistent.These problems particularly may occur in the edge on surface.
The coating of the second type can be called continuous coating, and feature is such: make to be moved continuously through the dispensing area limited by coating source by applied substrate by removable substrate holder.By doing like this, can equably coating class like the extensive substrate of building glass, because each point on substrate that will be applied is at least advanced through the different zones of dispensing area along transmission direction due to the continuous moving of substrate, make to realize similar application conditions on whole substrate surface.But this method is more required great effort, because the transmitting device allowing substrate continuous moving must be provided.In order to protect expensive equipment (as transmitting device and substrate support) not to be coated with, must Abschirmblech be set.According to prior art, setting must be provided to be used on the substrate holder keeping the Abschirmblech of substrate support and being arranged in application chamber the Abschirmblech being used for protecting transport sector regularly.This is moved to different application place for wherein substrate or the depositing treatment of the third type that swings in painting work is also correct.But, due to extra Abschirmblech, for this coating process equipment costly.In addition, the operation of relevant device may cause the clean relevant problem from the substrate support that must perform after each run is by different coating stations and their Abschirmblech.
Summary of the invention
Object of the present invention
Therefore the object of this invention is to provide a kind of application chamber and the method for operating application chamber (especially for continuous and/or swing coating), it allows making spent energy minimized while, completes the coating deposition of high quality (particularly for homogeneity and the consistence of deposited coatings).In addition, application chamber should Design and manufacture simple and purposes is various.By high purposes diversity, operation should also become easy.
Technical scheme
These objects are realized by the method for operation application chamber of the application chamber with the feature of claim 1 and the feature with claim 29.Other embodiments are themes of dependent claims.
The feature of technical scheme of the present invention is such: have coating source with it for being moved by substrate support in the application chamber by the transmitting device of application chamber, be provided with at least one removable Abschirmblech, this removable Abschirmblech comprises mobile equipment and the linking device for being connected with substrate support by Abschirmblech, and Abschirmblech and substrate support can together be moved.Mobile equipment is restricted to the concrete assembly be associated with removable Abschirmblech, and it allows Abschirmblech to move, and particularly allows Abschirmblech and substrate or substrate support to move independently.Therefore, mobile equipment can comprise at least one assembly be separated different from the transmitting device of substrate support.Due to this design, the Abschirmblech being arranged on substrate support place can be omitted, this appreciably decreases spent energy, because not only can save an Abschirmblech, and can save the multiple Abschirmblechs corresponding with multiple substrate support simultaneously used in corresponding equipment.
In addition, because the operation of all dissimilar or patterns can be performed by this application chamber, so the variability of this application chamber too increases.When Abschirmblech keeps static, static coating can be performed.When half static coating, that is, particularly when swinging coating (wherein substrate when be coated with front, source swing) and when continuous coating, Abschirmblech can want the substrate support of applied substrate together to move with carrying.By coupling device, removable Abschirmblech similarly is that mask is fixed to substrate support like that.But, be connected to substrate support in the coating process of removable Abschirmblech only in this application chamber.Therefore, can by the mobile restriction of Abschirmblech in the region near dispensing area, wherein, dispensing area can be restricted to the region of application rate higher than preset value.Especially, the mobile equipment of Abschirmblech can be designed as and Abschirmblech only at indoor moving, and can not can be moved in room by mobile equipment or move to outdoor.
Different deposition techniques can be used to according to application chamber of the present invention, the vacuum chamber performing evaporating deposition technique (similarly being chemical vapour deposition CVD, plasma reinforced chemical vapour deposition PECVD, physical vapor deposition PVD or sputter process especially) can be specially designed for.But also can use other deposition technique, similarly be the vapour deposition by thermal evaporation.Therefore, application chamber can comprise the coating source being designed for this deposition technique.Especially, coating source can comprise processing tool, comprises electrode, magnetron electrode, showerhead electrode, rotatable electrode, two electrodes, microwave source, well heater, sputtering target, gas inlet, evaporation source etc. and combination thereof.Usually, layer is deposited or perform coating process needed for whole processing tools can be included or be fixed in application chamber.Coating source only can comprise single processing tool (display sputter magnetron electrode, so-called linear source), or can comprise several processing tool, to be formed in the coating source that the specific region of application chamber extends.This two-dimentional coating source such as can comprise the array being set to electrode adjacent one another are side by side, to make it possible to achieve larger dispensing area.Especially, can the longitudinal axis of electrode parallel to each other and with the state of the transmission direction traversed by of substrate under electrode is set.Therefore, the substrate that the size that can contrast two-dimentional coating source by static coating process has smaller szie is coated with, and can be coated with the substrate wanting applied surface larger than the expanded range in two dimension coating source in the transmit direction in half static or continuous coating process.
Preferably, coating source expanded range is in the longitudinal direction selected as making in this dimension, the size of applied substrate to be less than coating source.Therefore, ensure that the surface of wanting applied is by the area coverage being coated with source in this direction.Therefore, for half, the transmission direction of static or continuous coating should be selected as the direction with length direction traversed by, to be covered other regions whole of the substrate wanting applied by the suitable movement of substrate.
Transmitting device can comprise driving mechanism and/or guide arrangement.By driving mechanism, the substrate that substrate support is actuated to perform the static or continuous coating for half moves.Mobile in order to contribute to, guide arrangement can guide and support substrates in moving process.
Although the horizontal transport that the present invention had both been suitable for substrate is also suitable for vertical transmission, specific embodiment is designed to transmit plate-shaped substrate vertically, similar glass substrate etc. especially.
The guide arrangement of transmitting device can comprise the strut member and relative guide rail that define for the transmission route that substrate support engages.Strut member can be formed by the supporting roll of substrate support movement thereon.Some supporting rolls can be formed as the driving roll for driving substrate support simultaneously.Guide arrangement can comprise contactless guiding piece, particularly magnetic guiding part, wherein, due to magnetic force, guides substrate support when the wall certain distance of distance rail in guide rail.
According to another embodiment, transmitting device can comprise the several guide arrangements defining several transmission route.Therefore, several substrate support can move in transmitting device simultaneously.In this way, can advantageously increase yield.
Several transmission route can be arranged abreast.By arranging transmission route abreast, contribute to the interaction of the substrate support of movement on the transmit path and other assemblies of application chamber.
Patten's design that can be similar with transmitting device is used for the mobile equipment of removable Abschirmblech.Therefore, mobile equipment at least can comprise a driving mechanism and at least one guiding device.
Mobile equipment is suitable for moving around the ring shielding part of dispensing area or for mobile banded Abschirmblech and/or several Abschirmblech.
The guiding device of mobile equipment can comprise the Abschirmblech strut member and relative Abschirmblech guide rail that define transmission route.
With in transmitting device for the roller that supports and/or drive substrate support similarly, mobile equipment also can comprise for supporting and/or the roller of driven shield part.Therefore, some rollers also can be the driving rolls for driven shield part.
Transmitting device and mobile equipment can have a public driving mechanism or several independently driving mechanism.Single common driver has and can easily realize synchronization-moving advantage.
Different mode of connection for being connected removable Abschirmblech and substrate support can be comprised for connecting removable Abschirmblech and the coupling device of substrate support.A kind ofly the connection of easily manipulation is allowed to be connected by form fit and realize.Therefore, coupling device can comprise formfitting element, is similar to pin and corresponding depression etc.
In order to be connected with substrate support by Abschirmblech, formfitting element can be engaged with each other.At least for the part of these devices and equipment, this can by easily realizing transmitting device and/or mobile equipment relative movement.This movement can be the direction along coating source, namely with the direction of the transmission direction traversed by of substrate support.In order to contribute to transmitting device and/or mobile equipment relative movement, guide rail can be arranged in relatively different from the transmission route of transmitting device and/or mobile equipment levels.Therefore, rail can not be conflicted in relative movement.In this, the guide rail of transmitting device or the guide rail of mobile equipment can be set to compared to another one more away from transmission route.
Except the first removable Abschirmblech, can arrange relative to the fixing secondary shielding part in coating source, be used for protecting mobile equipment and removable Abschirmblech.
Due to the design of application chamber of the present invention, application chamber can be used in a different manner, to strengthen the diversity of purposes.Especially, application chamber can be used to static coating, continuously coating and half static coating.Due to the mobility of Abschirmblech, in each operator scheme, can deposit for homogeneity and conforming high-quality coating.
Accompanying drawing explanation
By the description of embodiment hereinafter with reference to accompanying drawing, other advantage, characteristic sum characteristic of the present invention will become more apparent.Accompanying drawing shows following pure diagrammatic form:
Fig. 1 is the sectional view of the local of application chamber according to the first embodiment of the present invention;
Fig. 2 is the sectional view of the local of the application chamber shown in Fig. 1 in the second operating condition;
Fig. 3 is the sectional view of the local of the application chamber according to Fig. 1 and 2 in the third operating condition;
Fig. 4 is the sectional view of the local of the application chamber according to Fig. 1-3 under the 4th operational stage;
Fig. 5 is the sectional view of application chamber local according to a second embodiment of the present invention;
Fig. 6 is the sectional view of the local of the application chamber according to Fig. 5 in the second operating condition;
Fig. 7 is the sectional view of application chamber local according to the third embodiment of the invention; And
Fig. 8 is the sectional view of the local of the application chamber according to Fig. 7 in the second operating condition.
Embodiment
Fig. 1 show in cross section the local of the application chamber according to the first embodiment of the present invention.The application chamber of the embodiment shown in Fig. 1 comprises the locular wall 10 only can seeing part.According to sectional view, locular wall 10 is divided into chamber wall portion 10a and lower chamber wall portion 10b.Chamber wall portion 10a and 10b defines the opening closed by cap 9.At cap 9, place arranges coating source 8, such as, for the portable magnetron negative electrode of sputtering sedimentation.Owing to removably arranging cap 9, so can easily exchange coating source 8.
Relative with coating source 8, the substrate 1 be contained on substrate support 2 can be set via transmitting device 5.
According to sectional view, substrate support 2 is depicted as two part 2a and 2b.But, will be understood that substrate support can be formed as around framework or tabular receptor.Also other embodiments for carrier substrate can be expected.
Transmitting device 5 for supporting also moving substrate support 2 comprises guide arrangement 6 and driving mechanism 13.Guide arrangement 6 comprises guide rail 24 and lower backing roll 15,16.The area supported of supporting roll 15,16 comprises periphery depression, to be meshed with the sliding members 19 of the lower end being arranged on substrate support 2.
As shown in Figure 1, guide arrangement comprises two supporting rolls 15,16 and is set to the guide rail 24 of dual boot rail, and dual boot rail comprises two engaging channel 26 and 27 of the upper end 28 for receiving substrate support.Therefore, guide rail 24 is designed to the profile with E cross-sectional shape.
The upper end 28 of substrate support 2 is engaged in the one in engaging channel 26 and 27.In FIG, substrate support 2 is depicted as and is meshed with the engaging channel 26 of guide rail 24, and engaging channel 27 is not used.
In order to provide contactless guiding, magnet 25 is arranged on the side-walls of engaging channel 26 and 27, keeps the upper end of substrate support 2 to be meshed with engaging channel 26,27 in the position of the sidewall certain distance of distance engaging channel 26,27 to make it.Due to like this, substrate support 2 also can comprise suitable magnet or can be made up of suitable material.
In the embodiment in figure 1, substrate support 2 is supported by supporting roll 16 and is engaged in the engaging channel 26 of guide rail 24.But, second substrate support (not shown) can be arranged on the second supporting roll 16 place and be arranged in engaging channel 27, to make except the first transmission route except being limited by supporting roll 16 and engaging channel 26, limit the second parallel transmission path by supporting roll 15 and engaging channel 27.
Supporting roll 15 and 16 is arranged on the rotatable spindle 14 that driven by driving roll, and wherein driving roll 13 is connected to electric motor (not shown).Therefore, when driving roll 13 rotates, supporting roll 15,16 is also driven by rotatable shaft, with the mobile substrate support 2 be arranged on supporting roll 15,16.
Similar with guide rail 24, be set to adjacent side by side each other along the direction vertical with plotting planes, to support and/or to drive plate-shaped substrate 1 or substrate support 2 along the direction vertical with plotting planes or sectional plane respectively along with multiple supporting rolls 15,16 that plotting planes or the perpendicular direction of cross sectional planes extend.
Although whole supporting rolls can by driver drives, there is no need to drive whole supporting rolls, because due to the extension of substrate support 2, only drive the part in the supporting roll linearly arranged just enough.
By transmitting device 5, substrate support 2 and substrate 1 together can be moved along the direction perpendicular with plotting planes, therefore substrate 1 only can be arranged on the one or more application place place relative with coating source 8 or can move as making substrate pass through coating source 8 one or many.
Because coating source 8 is designed so that the expanded range of alongst 31 is at least identical with the expanded range of substrate 1 that will be applied or even larger, so when being set to relative with coating source 8 by substrate 1, substrate 1 can be completely coated in the direction in which.But due to the expanded range larger on the direction (that is, vertical with plotting planes direction) vertical with the length direction in coating source of substrate 1 that will be applied, substrate 1 may not be completely coated in this direction.Therefore, moving substrate can be carried out by transmitting device 5 in deposition process, make in moving process, the mobile dispensing area by being limited by coating source 8 in whole surface of substrate, and therefore be completely coated.Or, several coating source 8 can be set to array, the dispensing area of coating source entirety is increased, want applied whole substrate surface to cover.Such as, along the direction vertical with plotting planes, multiple processing tools in the coating source forming this amplification can be set to row.In one embodiment, a series of portable magnetron electrode can be arranged side by side adjacent to each other by under the state that length direction 31 is parallel.
Therefore, according to application conditions, substrate support 2 and substrate 1 can be coated with substrate 1 under being maintained at the still-mode of a position or several application place in whole coating process.Or substrate support 2 and substrate 1 can move along a transmission direction continuous moving or the mode of vibrating in the transmission direction replaced in coating process.
In order to prevent the substrate support 2 of application chamber, transmitting device 5 and/or other assemblies to be coated with undesirably, the removable Abschirmblech 3 be associated with application chamber is arranged on and is coated with on locular wall.Abschirmblech 3 has the annular shape around dispensing area, wherein, because Fig. 1 is to the sectional view of 4, only can see top 3a and bottom 3b.Or the Abschirmblech of other shapes can be considerable, it similarly is that there is belt like shape etc., only comprise function of shielding in upper and lower structure.The cross section of the Abschirmblech 3 shown in Fig. 1 is cup-shaped or the flange-like configuration with the opening providing coating aperture.
Although Abschirmblech 3 can be used in static mode, that is, in deposition process, make Abschirmblech keep fixing, Abschirmblech 3 is arranged on the ability that movement is provided in the mobile equipment 11 similar with the transmitting device 5 being used for substrate support 2.
The driving mechanism 13 that mobile equipment comprises Abschirmblech guide arrangement 12 and usually used by transmitting device 5.Abschirmblech guide arrangement 12 comprises and the supporting roll 15 of transmitting device, 16 similar supporting rolls 17 and the Abschirmblech guide rail 21 similar with guide rail 24 part of transmitting device 5.Abschirmblech guide rail 21 only comprises an engaging channel, and wherein the top 23 of Abschirmblech 3 is engaged in this engaging channel in a contactless manner.
In order to this object, Abschirmblech guide rail 21 also comprises magnet 22 in the side-walls of engaging channel.In the sectional views, Abschirmblech guide rail 21 has the shape of U-shaped.By ancon 20, Abschirmblech guide rail 21 is fixed to chamber wall 10.
At bottom place, Abschirmblech 3 is supported on supporting roll 17, and this supporting roll 17 also comprises depression at area supported.Similar with substrate support 2, Abschirmblech 3 comprises the sliding members 18 be meshed with the depression of supporting roll 17.
In case supporting roll 17 is arranged on axle 14 by the mode reversed, supporting roll 17 can be driven by driving roll 13.In addition, supporting roll 17 can slide along the longitudinal axis of axle 14, and axle 14 can be moved according to the double-headed arrow shown in the lower left quarter of Fig. 1.Due to like this, axle is slidably disposed in chamber wall 10.
Similar with the movement of axle 14, the guide rail 24 of the transmitting device 5 of substrate support 2 can move according to the double-headed arrow shown in the upper right quarter of Fig. 1.Because supporting roll 15,16 is arranged on axle 14 place regularly, so when axle 14 moves according to double-headed arrow, supporting roll 15,16 and axle 14 together move.Guide rail 24 is connected on axle 14, to make guide rail 24 and axle 14 synchronizing moving.
As seen from Fig. 1, coupling device 7 is set to be connected with substrate support 2 by Abschirmblech 3.Coupling device 7 comprises the pin 30 that can be meshed with the depression 29 be arranged in substrate support 2, to provide the connection of form fit.Due to the movement of axle 14 and the movement of the supporting roll 16 therefore caused and guide rail 24, substrate support 2 can be moved to and the pin 30 of Abschirmblech 3 is meshed with depression 29.Therefore, the connection of Abschirmblech 3 and substrate support 2 can be realized.When being connected together with Abschirmblech 3 by substrate support 2 by coupling device 7, Abschirmblech 3 and substrate support 2 together can be moved by transmitting device 5 and mobile equipment 11.Therefore, perform the operator scheme of the movement of substrate support 2 and Abschirmblech 3 in coating process under, can be arranged in a straightforward manner only for being coated with the moveable Abschirmblech of process by the connection of Abschirmblech 3 and substrate support 2.Therefore, although the dispensing area limited by coating source 8 does not cover want applied whole surface, the whole surface of coated substrate 1 can still be come by coating source 8.Especially, substrate support and Abschirmblech 3 can swing between position, make it possible to achieve all even consistent coating.Because removable Abschirmblech 3 is associated with application chamber, so Abschirmblech 3 together can not to move to substrate support 2 after deposition outside application chamber and together can not be reintroduced back to wanting applied new substrate.In addition, the number of Abschirmblech can reduce.In addition, removable Abschirmblech not only with therebetween occurring in the operator scheme of substrate movement, but can also may be used for static coating.
In order to protect mobile equipment 11 with the deposition making it not be subject to coating material, secondary shielding part 4 is fixed on chamber wall 10.Similar with Abschirmblech 3, secondary shielding part 4 is not limited to upper and lower shielding arm 4a and 4b as shown in sectional view 1 to 4, but can comprise ring texture.
According to the design of application chamber of the present invention, can have the coating mode that three different, that is: static coating, during coating process, substrate 1 is in an application place; Continuous coating, during being coated with, substrate 1 moves continuously along a direction; And the 3rd operator scheme, wherein substrate 1 (particularly in an oscillatory manner) in coating process moves to different application place.For these three kinds of operator schemes whole; Abschirmblech 3 provides suitable protection; make coating material can not deposit to less desirable region, and realize the deposition of the coating of high quality (particularly about homogeneity and the consistence of deposited coating) simultaneously.Although Abschirmblech 3 is in rest position in static operation process, but Abschirmblech 3 together can move with continuous and semi-quiescent operator scheme and substrate support 2, in continuous and semi-quiescent operator scheme process, substrate 1 moves to several different application place or swings in coating process.
Fig. 2 shows the application chamber identical with Fig. 1 to 4, and its difference is only cap 9 and coating source 8 are not shown in Fig. 2 is to 4.
In addition, Fig. 2 show substrate support 2 and substrate 1 in the second transmission route with the layout of supporting roll 15 and engaging channel 27.Due to the displacement of axle 14 and guide rail 24, substrate support 2 is also connected by coupling device 7 with Abschirmblech 3.
Because while being removed from application place by other substrates, a substrate can be arranged at least one application place, so two parallel transmission paths owing to being provided by transmitting device 5, the substrate of high yield becomes possibility.
Fig. 4 shows this situation, wherein in two transmission routes provided by transmitting device 5, transmits two substrate 1a and 1b by transmitting device 5.Therefore, as shown in Figure 3, in the pin 30 depression 29a that is not engaged on substrate support 2a and 2b and 29b.
Fig. 5 and Fig. 6 shows the sectional view of the second embodiment of the present invention, and the major part of the second embodiment is similar to the embodiment shown in Fig. 1 to 4.Therefore, in order to easy and eliminate the description of the repetition of whole embodiment.Only difference is described hereinafter.
The layout being different from the Abschirmblech guide rail 21 of Abschirmblech guide arrangement 12 and the guide rail 24 of transmitting device 5 of the embodiment shown in Fig. 5 and 6 and the embodiment shown in Fig. 1 to 4.According to the embodiment of Fig. 5 and Fig. 6, Abschirmblech guide rail 21 is not arranged side by side along coating direction and guide rail 24, but is in the top of guide rail relative to strut member or axle.Therefore, because guide rail 24 can move moral more near Abschirmblech 3, so achieve the design of joint space-efficient.
Similar embodiment has been shown in Fig. 7 and 8.In this embodiment, guide rail 24 is arranged on above Abschirmblech guide rail 21, makes, particularly when using the engaging channel 27 of guide rail 24, can realize the layout saving very much space-efficient transmitting device 5.
Therefore, the invention is characterized in and comprise following characteristics:
1. an application chamber, comprises
Coating source,
Transmitting device, it is for wanting the substrate support of applied substrate to move at least one application place relative to described coating source by being suitable for carrying, and makes described substrate can be applied, and
At least one first Abschirmblech, it is arranged in the region between the application place of described substrate and described coating source, to prevent the region except the surface of described substrate that will be applied to be coated with,
Wherein,
Described first Abschirmblech comprises mobile equipment and the coupling device for being connected with described substrate support by described first Abschirmblech, and described first Abschirmblech and described substrate support can together be moved.
2. the application chamber according to feature 1,
Wherein, described application chamber is vacuum chamber.
3. the application chamber according to feature 1 or 2,
Wherein, described coating source selects from the group comprising CVD source, PECVD source, PVD source, sputtering source and vapor deposition source.
4. the application chamber according to any one in preceding feature,
Wherein, described coating source defines the dispensing area of sedimentation rate higher than preset value, and described dispensing area is at least less than in a dimension wants applied described substrate surface.
5. the application chamber according to any one in preceding feature,
Wherein, described coating source comprises the one or more processing tools be dispersed in above described coating source.
6. the application chamber according to feature 5,
Wherein, described processing tool selects from the group comprising electrode, magnetron electrode, showerhead electrode, rotatable electrode, two electrodes, microwave source, well heater, sputtering target, gas inlet, evaporation source.
7. the application chamber according to any one in preceding feature,
Wherein, described transmitting device is suitable for described substrate support and wants applied described substrate to be together arranged on several application place relative to described coating source.
8. the application chamber according to any one in preceding feature,
Wherein, described transmitting device is suitable for described substrate support and described substrate are together swung relative to described coating source.
9. the application chamber according to any one in preceding feature,
Wherein, the transmission direction of described transmitting device and the length direction traversed by described coating source.
10. the application chamber according to feature 4,
Wherein, be less than the direction of the described substrate surface wanting applied along this direction parallel for transmission direction and the described dispensing area of described transmitting device.
11. application chamber according to any one in preceding feature,
Wherein, described transmitting device comprises driving mechanism and/or guide arrangement.
12. application chamber according to feature 11,
Wherein, described transmitting device is suitable for uprightly transmitting plate-shaped substrate and/or described guide arrangement comprises the strut member and relative guide rail that define transmission route.
13. application chamber according to feature 11 or 12,
Wherein, described transmitting device comprises the roller for supporting and/or drive described substrate support.
14. application chamber according to feature 11 or 12,
Wherein, described guide arrangement comprises contactless guiding piece or magnetic guiding part.
15. application chamber according to any one in preceding feature,
Wherein, described transmitting device comprises the several guide arrangements defining the several transmission routes being set to parallel to each other.
16. application chamber according to any one in preceding feature,
Wherein, the described mobile equipment for described first Abschirmblech comprises at least one driving mechanism and/or at least one guiding device.
17. application chamber according to feature 16,
Wherein, described mobile equipment is suitable for mobile ring-type Abschirmblech and/or guiding device comprises the Abschirmblech strut member and relative Abschirmblech guide rail that define Abschirmblech transmission route.
18. application chamber according to feature 16 or 17,
Wherein, described mobile equipment comprises the roller for supporting and/or drive described Abschirmblech.
19. application chamber according to feature 16 or 17,
Wherein, described guiding device comprises contactless guiding piece or magnetic guiding part.
20. application chamber according to any one in preceding feature,
Wherein, described transmitting device and described mobile equipment have a public driving mechanism or several independently driving mechanism.
21. application chamber according to any one in preceding feature,
Wherein, described coupling device comprises formfitting element.
22. application chamber according to any one in preceding feature,
Wherein, described transmitting device and/or described mobile equipment relative to each other can move or move relative to described coating source at least in part.
23. application chamber according to any one in preceding feature,
Wherein, described transmitting device and/or described mobile equipment laterally can move with the transmission direction of described substrate support at least in part and/or move along from described coating source to the coating direction of described substrate that will be applied.
24. application chamber according to any one in preceding feature,
Wherein, described transmitting device and/or described mobile equipment comprise guide rail, described guide rail arranges abreast each other and has equal distance with relative strut member, or the one in described guide rail is arranged on the rear of its other and has different distances from relative strut member.
25. application chamber according to any one in preceding feature,
Wherein, arrange at least one secondary shielding part, described secondary shielding part is fixed relative to described coating source.
26. application chamber according to feature 25,
Wherein, described secondary shielding part covers described first Abschirmblech and/or described mobile equipment.
27. application chamber according to any one in preceding feature,
Wherein, described first Abschirmblech cover around the surface of wanting applied described substrate region and/or cover described substrate support.
28. application chamber according to any one in preceding feature,
Wherein, the described mobile equipment of described first Abschirmblech is designed so that described first Abschirmblech is only at described indoor moving.
29. 1 kinds of methods operating application chamber, comprise the following steps:
There is provided substrate on the substrate holder,
An operator scheme is selected, wherein from different operator schemes
Under the removable Abschirmblech that first operator scheme is included in described application chamber keeps static state in coating process, described substrate support continuously moves through the dispensing area of described application chamber,
Second operator scheme comprises
Described substrate support and described substrate are together moved to link position,
Described substrate support is connected with the removable Abschirmblech be arranged in described application chamber, and
Described substrate support and described removable Abschirmblech are moved at least one other position, described substrate is coated with in the position different relative at least two of coating source, and
The described removable Abschirmblech that 3rd operator scheme is included in described application chamber carries out static coating to described substrate keep static state during being coated with under.
30. methods according to feature 29,
Wherein, in described second operator scheme, described substrate support and described removable Abschirmblech swing, and make described substrate support and the described removable Abschirmblech repeatedly mobile dispensing area by described application chamber.
Although describe the present invention with reference to specific embodiment, but it will be apparent to those skilled in the art that the present invention is not limited to these embodiments, but change and amendment (such as by omitting single feature or the different combination by shown feature) can be covered and do not exceed the scope of claims.Especially, the present invention covers whole combination of feature described herein.
Claims (30)
1. an application chamber, comprises
Coating source,
Transmitting device, it is for moving to the substrate support being suitable for carrying the substrate wanting applied at least one application place relative to described coating source, makes described substrate can be applied, and
At least one first Abschirmblech, it is arranged in the region between the application place of described substrate and described coating source, to prevent the region except the surface of described substrate that will be applied to be coated with,
Wherein,
Described first Abschirmblech comprises mobile equipment for described first Abschirmblech that moves up in the side being parallel to described substrate and the coupling device for being connected with described substrate support by described first Abschirmblech, described first Abschirmblech and described substrate support can together be moved
Wherein, described mobile equipment is designed to allow described first Abschirmblech and described substrate support to move independently.
2. application chamber according to claim 1,
Wherein, described application chamber is vacuum chamber.
3. application chamber according to claim 1 and 2,
Wherein, described coating source selects from the group comprising CVD source, PECVD source, PVD source, sputtering source and vapor deposition source.
4. the application chamber according to any one in aforementioned claim,
Wherein, described coating source defines the dispensing area of sedimentation rate higher than preset value, and described dispensing area is at least less than in a dimension wants applied described substrate surface.
5. the application chamber according to any one in aforementioned claim,
Wherein, described coating source comprises the one or more processing tools be distributed in above described coating source.
6. application chamber according to claim 5,
Wherein, described processing tool selects from the group comprising electrode, magnetron electrode, showerhead electrode, rotatable electrode, two electrodes, microwave source, well heater, sputtering target, gas inlet, evaporation source.
7. the application chamber according to any one in aforementioned claim,
Wherein, described transmitting device is suitable for described substrate support and wants applied described substrate to be together arranged on several application place relative to described coating source.
8. the application chamber according to any one in aforementioned claim,
Wherein, described transmitting device is suitable for described substrate support and described substrate are together swung relative to described coating source.
9. the application chamber according to any one in aforementioned claim,
Wherein, the transmission direction of described transmitting device and the length direction traversed by described coating source.
10. application chamber according to claim 4,
Wherein, the transmission direction of described transmitting device is parallel with the direction that described dispensing area is less than the described substrate surface wanting applied.
11. application chamber according to any one in aforementioned claim,
Wherein, described transmitting device comprises driving mechanism and/or guide arrangement.
12. application chamber according to claim 11,
Wherein, described transmitting device is suitable for uprightly transmitting plate-shaped substrate and/or described guide arrangement comprises the strut member and relative guide rail that define transmission route.
13. application chamber according to claim 11 or 12,
Wherein, described transmitting device comprises the roller for supporting and/or drive described substrate support.
14. application chamber according to claim 11 or 12,
Wherein, described guide arrangement comprises contactless guiding piece or magnetic guiding part.
15. application chamber according to any one in aforementioned claim,
Wherein, described transmitting device comprises the several guide arrangements defining the several transmission routes being set to parallel to each other.
16. application chamber according to any one in aforementioned claim,
Wherein, the described mobile equipment for described first Abschirmblech comprises at least one driving mechanism and/or at least one guiding device.
17. application chamber according to claim 16,
Wherein, described mobile equipment is suitable for mobile ring-type Abschirmblech and/or guiding device and comprises the Abschirmblech strut member and relative Abschirmblech guide rail that limit Abschirmblech transmission route.
18. application chamber according to claim 16 or 17,
Wherein, described mobile equipment comprises the roller for supporting and/or drive described Abschirmblech.
19. application chamber according to claim 16 or 17,
Wherein, described guiding device comprises contactless guiding piece or magnetic guiding part.
20. application chamber according to any one in aforementioned claim,
Wherein, described transmitting device and described mobile equipment have a public driving mechanism or several independently driving mechanism.
21. application chamber according to any one in aforementioned claim,
Wherein, described coupling device comprises formfitting element.
22. application chamber according to any one in aforementioned claim,
Wherein, described transmitting device and/or described mobile equipment relative to each other can move or move relative to described coating source at least in part.
23. application chamber according to any one in aforementioned claim,
Wherein, described transmitting device and/or described mobile equipment laterally can move with the transmission direction of described substrate support at least in part and/or move along from described coating source to the coating direction of described substrate that will be applied.
24. application chamber according to any one in aforementioned claim,
Wherein, described transmitting device and/or described mobile equipment comprise guide rail, described guide rail arranges abreast each other and has equal distance with relative strut member, or the one in described guide rail is arranged on the rear of its other and has different distances from relative strut member.
25. application chamber according to any one in aforementioned claim,
Wherein, arrange at least one secondary shielding part, described secondary shielding part is fixed relative to described coating source.
26. application chamber according to claim 25,
Wherein, described secondary shielding part covers described first Abschirmblech and/or described mobile equipment.
27. application chamber according to any one in aforementioned claim,
Wherein, described first Abschirmblech cover around the surface of wanting applied described substrate region and/or cover described substrate support.
28. application chamber according to any one in aforementioned claim,
Wherein, the described mobile equipment of described first Abschirmblech is designed so that described first Abschirmblech only can at described indoor moving.
29. 1 kinds of methods operating application chamber, said method comprising the steps of:
There is provided substrate on the substrate holder,
An operator scheme is selected, wherein from different operator schemes
Under the removable Abschirmblech that first operator scheme is included in described application chamber keeps static state in coating process, described substrate support continuously moves through the dispensing area of described application chamber,
Second operator scheme comprises
Described substrate support and described substrate are together moved to link position,
Described substrate support is connected with the removable Abschirmblech be arranged in described application chamber, and
Described substrate support and described removable Abschirmblech are moved at least one other position, described substrate is coated with in the position different relative at least two of coating source, and
The described removable Abschirmblech that 3rd operator scheme is included in described application chamber carries out static coating to described substrate keep static state during being coated with under.
30. methods according to claim 29,
Wherein, in described second operator scheme, described substrate support and described removable Abschirmblech swing, and make described substrate support and the described removable Abschirmblech repeatedly mobile dispensing area by described application chamber.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/197,605 US20100044213A1 (en) | 2008-08-25 | 2008-08-25 | Coating chamber with a moveable shield |
| EP08162906.5 | 2008-08-25 | ||
| EP08162906.5A EP2159302B1 (en) | 2008-08-25 | 2008-08-25 | Coating chamber with a moveable shield |
| US12/197,605 | 2008-08-25 | ||
| CN2009801335086A CN102131955A (en) | 2008-08-25 | 2009-08-13 | Coating chamber with a moveable shield |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009801335086A Division CN102131955A (en) | 2008-08-25 | 2009-08-13 | Coating chamber with a moveable shield |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104947061A true CN104947061A (en) | 2015-09-30 |
| CN104947061B CN104947061B (en) | 2017-08-29 |
Family
ID=41119553
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510442799.4A Active CN104947061B (en) | 2008-08-25 | 2009-08-13 | Application chamber with removable shielding part |
| CN2009801335086A Pending CN102131955A (en) | 2008-08-25 | 2009-08-13 | Coating chamber with a moveable shield |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009801335086A Pending CN102131955A (en) | 2008-08-25 | 2009-08-13 | Coating chamber with a moveable shield |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5554779B2 (en) |
| KR (1) | KR20110056392A (en) |
| CN (2) | CN104947061B (en) |
| TW (1) | TWI491762B (en) |
| WO (1) | WO2010023109A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108456856A (en) * | 2017-02-22 | 2018-08-28 | 萨特隆股份公司 | The box coating apparatus of vacuum coated for base material, particularly eyeglass |
| CN114457313A (en) * | 2022-04-12 | 2022-05-10 | 常州欣盛半导体技术股份有限公司 | Shielding device for vacuum sputtering machine |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2432008B1 (en) * | 2010-09-17 | 2015-06-24 | Applied Materials, Inc. | Substrate processing system comprising a replaceable substrate masking on carrier and method for processing a substrate |
| DE102010052761A1 (en) * | 2010-11-30 | 2012-05-31 | Leybold Optics Gmbh | Device for coating a substrate |
| EP2650135A1 (en) * | 2012-04-12 | 2013-10-16 | KBA-NotaSys SA | Intaglio printing plate coating apparatus |
| US9640372B2 (en) * | 2012-11-15 | 2017-05-02 | Applied Materials, Inc. | Method and system for maintaining an edge exclusion shield |
| CN105849310B (en) * | 2013-12-23 | 2018-11-27 | 应用材料公司 | For keeping the holding equipment of substrate during vacuum technology, for the equipment of sedimentary on substrate and for conveying the method for keeping equipment |
| CN104073764B (en) * | 2014-06-17 | 2016-05-18 | 京东方科技集团股份有限公司 | A kind of rotary evaporation source apparatus for OLED evaporation |
| CN107492478B (en) * | 2016-06-12 | 2019-07-19 | 北京北方华创微电子装备有限公司 | The film build method of semiconductor equipment and the aluminium nitride film build method of semiconductor equipment |
| US10643843B2 (en) | 2016-06-12 | 2020-05-05 | Beijing Naura Microelectronics Equipment Co., Ltd. | Film forming method and aluminum nitride film forming method for semiconductor apparatus |
| CN109563610A (en) * | 2017-07-24 | 2019-04-02 | 应用材料公司 | For the equipment and system of processing substrate in vacuum chamber and for making substrate carrier relative to the method for mask carrier alignment |
| WO2020001751A1 (en) * | 2018-06-26 | 2020-01-02 | Applied Materials, Inc. | Magnetic levitation system for transporting a carrier, carrier for a magnetic levitation system, apparatus for transportation of a carrier, processing system for vertically processing a substrate, and method of switching a transport path of a carrier |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1139957A (en) * | 1993-10-25 | 1997-01-08 | 维拉泰克薄膜股份有限公司 | Method and apparatus for thin film coating an article |
| CN1426118A (en) * | 2001-12-10 | 2003-06-25 | 高级网络服务公司 | Device for producing electroluminescence display and steam coating using electromagnet and steam coating method for said device |
| US20060249372A1 (en) * | 2005-04-11 | 2006-11-09 | Intematix Corporation | Biased target ion bean deposition (BTIBD) for the production of combinatorial materials libraries |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5855687A (en) * | 1990-12-05 | 1999-01-05 | Applied Materials, Inc. | Substrate support shield in wafer processing reactors |
| KR100243784B1 (en) * | 1990-12-05 | 2000-02-01 | 조셉 제이. 스위니 | Passive shield for cvd wafer processing which provides front side edge exclusion and prevents backside depositions |
| US5304248A (en) * | 1990-12-05 | 1994-04-19 | Applied Materials, Inc. | Passive shield for CVD wafer processing which provides frontside edge exclusion and prevents backside depositions |
| JP3119669B2 (en) * | 1991-02-22 | 2000-12-25 | コニカ株式会社 | Vapor deposition equipment |
| US5738767A (en) * | 1994-01-11 | 1998-04-14 | Intevac, Inc. | Substrate handling and processing system for flat panel displays |
| JP4034860B2 (en) * | 1997-10-31 | 2008-01-16 | キヤノンアネルバ株式会社 | Tray transfer film forming apparatus and auxiliary chamber |
| JPH11317438A (en) * | 1997-11-12 | 1999-11-16 | Intevac Inc | Substrate support apparatus utilizing magnetic support of substrate carrier |
| US6837974B2 (en) * | 2002-02-01 | 2005-01-04 | Tokyo Electron Limited | Single piece pod shield for vertical plenum wafer processing machine |
| US20060105182A1 (en) * | 2004-11-16 | 2006-05-18 | Applied Materials, Inc. | Erosion resistant textured chamber surface |
| EP1788112B1 (en) * | 2005-10-26 | 2011-08-17 | Applied Materials GmbH & Co. KG | Vapour deposition apparatus |
| JP5035499B2 (en) * | 2005-12-13 | 2012-09-26 | 大日本印刷株式会社 | Sputtering apparatus and carrier for substrate transfer |
| JP5116525B2 (en) * | 2008-03-25 | 2013-01-09 | 株式会社アルバック | Sputtering equipment |
-
2009
- 2009-08-13 CN CN201510442799.4A patent/CN104947061B/en active Active
- 2009-08-13 JP JP2011524314A patent/JP5554779B2/en active Active
- 2009-08-13 WO PCT/EP2009/060516 patent/WO2010023109A1/en active Application Filing
- 2009-08-13 CN CN2009801335086A patent/CN102131955A/en active Pending
- 2009-08-13 KR KR1020117006807A patent/KR20110056392A/en active Search and Examination
- 2009-08-24 TW TW098128421A patent/TWI491762B/en active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1139957A (en) * | 1993-10-25 | 1997-01-08 | 维拉泰克薄膜股份有限公司 | Method and apparatus for thin film coating an article |
| CN1426118A (en) * | 2001-12-10 | 2003-06-25 | 高级网络服务公司 | Device for producing electroluminescence display and steam coating using electromagnet and steam coating method for said device |
| US20060249372A1 (en) * | 2005-04-11 | 2006-11-09 | Intematix Corporation | Biased target ion bean deposition (BTIBD) for the production of combinatorial materials libraries |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108456856A (en) * | 2017-02-22 | 2018-08-28 | 萨特隆股份公司 | The box coating apparatus of vacuum coated for base material, particularly eyeglass |
| CN108456856B (en) * | 2017-02-22 | 2021-10-22 | 萨特隆股份公司 | Box type coating equipment for vacuum coating of substrate |
| CN114457313A (en) * | 2022-04-12 | 2022-05-10 | 常州欣盛半导体技术股份有限公司 | Shielding device for vacuum sputtering machine |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2012500900A (en) | 2012-01-12 |
| KR20110056392A (en) | 2011-05-27 |
| WO2010023109A1 (en) | 2010-03-04 |
| CN104947061B (en) | 2017-08-29 |
| CN102131955A (en) | 2011-07-20 |
| JP5554779B2 (en) | 2014-07-23 |
| TW201016885A (en) | 2010-05-01 |
| TWI491762B (en) | 2015-07-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104947061A (en) | Coating chamber with a moveable shield | |
| US20100044213A1 (en) | Coating chamber with a moveable shield | |
| US8740205B2 (en) | Conveyor and deposition apparatus, and maintenance method thereof | |
| CN105814231B (en) | Evaporation source for organic material, deposition apparatus for depositing organic material in vacuum chamber, and method of evaporating organic material | |
| US7918940B2 (en) | Apparatus for processing substrate | |
| CN104781448B (en) | For safeguarding the method and system of edge exclusion shielding part | |
| EP2159302B1 (en) | Coating chamber with a moveable shield | |
| CN102157708B (en) | Apparatus and method for manufacturing organic el device, and apparatus and method for forming film | |
| US20140116337A1 (en) | Apparatus of depositing organic material | |
| US20210269912A1 (en) | Evaporation source for organic material, deposition apparatus for depositing organic materials in a vacuum chamber having an evaporation source for organic material, and method for evaporating organic material | |
| TW201843860A (en) | Material deposition arrangement, vacuum deposition system and methods therefor | |
| KR102158652B1 (en) | Deposition System, Deposition Apparatus, and Method of Operating Deposition System | |
| CN107002223B (en) | Material deposition system and method for the deposition materials in material deposition system | |
| WO2017101971A1 (en) | Processing system for two-side processing of a substrate and method of two-side processing of a substrate | |
| KR101609185B1 (en) | Unit for transferring deposition source, apparatus of deposition having the same and method of deposition | |
| KR101984345B1 (en) | Plane source evaporator deposition equipments having plane evaporation source for OLED device production | |
| JP6605073B2 (en) | Evaporation source for organic material, deposition apparatus for depositing organic material in a vacuum chamber having an evaporation source for organic material, and method for evaporating organic material | |
| EP3722458B1 (en) | Film forming device | |
| JP7439253B2 (en) | Idle Shield, Deposition Apparatus, Deposition System, and Methods of Assembling and Operating | |
| CN219010447U (en) | Vertical PVD oblique deposition silicon wafer loading device | |
| CN116240513A (en) | Vertical PVD oblique deposition silicon wafer loading device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |